一种用于TEC散热系统的冷凝水处理结构
By utilizing the humidity gradient and temperature difference between the water absorption component and the heat sink component in the TEC heat dissipation system, passive and continuous elimination of condensate is achieved, solving the problem of difficult condensate removal in TEC systems and improving the reliability and heat dissipation efficiency of electronic devices.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SOUTHERN POWER GRID DIGITAL GRID RESEARCH INSTITUTE CO LTD
- Filing Date
- 2026-03-19
- Publication Date
- 2026-07-17
AI Technical Summary
In existing technologies, the condensate generated during the operation of TEC is difficult to remove effectively, leading to electrical short circuits, corrosion, and decreased insulation performance of electronic devices, affecting long-term reliability. Furthermore, traditional methods are complex in structure, costly, and difficult to maintain long-term stability.
In the TEC cooling system, a water-absorbing component is attached to the outer surface of the chip and connected to the heat sink. The humidity gradient and temperature difference inside the water-absorbing component are used to achieve passive and continuous elimination of condensate. The water-absorbing component transfers the condensate from the chip surface to the high-temperature heat sink for evaporation. The heat sink then carries away some of the heat, improving the heat dissipation efficiency.
It achieves continuous elimination of condensate, reduces the impact of condensate on chip packaging and electrical performance, improves the long-term reliability of the system, has a simple structure, requires no additional devices, and is suitable for various electronic device packaging and heat dissipation systems.
Smart Images
Figure CN121865922B_ABST
Abstract
Citation Information
Patent Citations
Heat dissipation module and ray machine
CN121604351A
Semiconductor Package
US20250079425A1