一种系统级芯片管脚分配方法、装置、电子设备及存储介质

By performing directional decomposition and intersection calculation on the module sequence based on the physical path topology in SoC physical design, a common boundary is generated, which solves the problem of traditional pin assignment relying on manual experience, realizes efficient and automated pin assignment, reduces maintenance costs and improves design efficiency.

CN121881966BActive Publication Date: 2026-07-17CIX TECH (SHANGHAI) CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
CIX TECH (SHANGHAI) CO LTD
Filing Date
2026-03-23
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

In system-on-chip (SoC) physical design, traditional pin assignment relies on manual experience or local heuristic rules, resulting in low efficiency, long cycles, and inconsistent results, making it difficult to maintain consistency and reusability in large-scale designs.

Method used

By performing directional decomposition on the module sequence based on physical path topology, calculating the intersection of the allocatable regions of the module boundaries, generating common boundaries, and achieving consistent pin mapping between reused modules under physical constraints, the common boundaries of reused modules are processed using logical AND operations, and manual intervention is reduced by combining iterative allocation processes.

Benefits of technology

It improves the success rate and automation of pin assignment, reduces subsequent maintenance and ECO costs, and enhances the overall efficiency and feasibility of SoC physical design.

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Abstract

本公开提供了一种系统级芯片管脚分配方法、装置、电子设备及存储介质,可基于物理路径拓扑对模块序列进行方向分解,并通过对相关模块边界可分配区域求交得到共同边界,提高管脚分配的成功率与自动化程度,同时,通过对复用模块各实例共同边界执行逻辑与运算获得通用共同边界,可在满足物理约束的前提下实现复用实例间管脚映射一致,降低后续维护与ECO成本,并在共同边界资源不足时,通过重新确定物理路径拓扑并迭代分配,实现可回退、可收敛的分配流程,减少人工介入,提升SoC物理设计的整体效率与可实现性。
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