A separation device applied to a semiconductor bonding sheet after unpackaging

Abstract

This invention discloses a separation device for semiconductor bonded wafers after unpacking, relating to the field of semiconductor bonded wafer technology. Specifically, it discloses a separation device for semiconductor bonded wafers after unpacking, comprising a wafer, a graphite ring, a graphite disk, and a graphite support after unpacking. The separation device includes a housing, a rotating mechanism, a positioning mechanism, a lifting mechanism, and a cleaning mechanism. The rotating mechanism drives the semiconductor bonded wafer to rotate; the positioning mechanism positions the graphite ring; the lifting mechanism is located at the lower end of the graphite support and, with the graphite ring positioned, lifts the graphite support to move the wafer away from the graphite disk. This invention solves the problems of high equipment cost and cumbersome operation in existing technologies, which are not conducive to large-scale production applications.

Description

Technical Field

[0001] This invention relates to the field of semiconductor bonding technology, and more specifically to a separation device applied to semiconductor bonding sheets after unpacking. Background Technology

[0002] In the semiconductor manufacturing field, the separation of bonded wafers is one of the key processes. Referring to patent CN119560432A and a SiC epitaxial merging detection method and system, efficient separation and merging of wafers with graphite rings and disks are achieved through the use of laser sensors, a correction platform, and a merging / splitting module. This effectively improves wafer positioning accuracy, reduces manual intervention, and enhances automation and product quality. However, the solutions in the aforementioned patents still have some shortcomings in practical applications. The laser sensors and complex correction platforms used result in high equipment costs and cumbersome operation, which is not conducive to large-scale production applications. Based on the above analysis, there is a need for a separation device applied to semiconductor bonded wafers after unpacking. Summary of the Invention

[0003] The technical problem to be solved by this invention is that the existing equipment is expensive and the operation process is cumbersome, which is not conducive to large-scale production applications. The purpose is to provide a separation device for semiconductor bonding wafers after unpacking. By optimizing the structural design, the separation process is simplified, the equipment cost is reduced, and the wafer positioning accuracy and separation efficiency are guaranteed, thereby improving production efficiency and product quality, and having a wider range of application prospects.

[0004] This invention is achieved through the following technical solution:

[0005] A separation device for semiconductor bonding wafers after unpacking, the semiconductor bonding wafer including a wafer after unpacking, a graphite ring, a graphite disk, and a graphite support plate; the graphite support plate is disposed in the inner hole at the center of the graphite disk; the wafer is disposed on one side of the graphite support plate and the graphite disk; the graphite ring is disposed around the graphite disk and the wafer; the separation device includes a housing, a rotating mechanism, a positioning mechanism, a lifting mechanism, and a cleaning mechanism; the rotating mechanism is used to support and drive the semiconductor bonding wafer to rotate; the positioning mechanism is disposed around the semiconductor bonding wafer and is used to position the graphite ring; the lifting mechanism is disposed at the lower end of the graphite support plate and is used to lift the graphite support plate when the graphite ring is positioned, thereby driving the wafer to detach from the graphite disk.

[0006] The cleaning mechanism includes a cleaning motor, a cleaning coupling assembly, a spiral lifting pair, and a cleaning suction cup assembly; the spiral lifting pair is vertically mounted on the housing; the cleaning coupling assembly is mounted on the movable end of the spiral lifting pair and is located above the semiconductor bonding sheet; the cleaning motor is used to drive the spiral lifting pair; the cleaning suction cup assembly is located on the cleaning coupling assembly and is used to adsorb and clean the coating that has fallen off the graphite ring and graphite disk.

[0007] The cleaning suction cup assembly includes a suction cup and a vacuum amplifier; the cleaning coupling assembly extends along the surface of the semiconductor bonded wafer; the suction cup is disposed in the cleaning coupling assembly with its adsorption end facing the semiconductor bonded wafer; the cleaning coupling assembly is provided with a vacuum pipeline communicating with the suction cup; the vacuum pipeline is connected to an exhaust gas treatment pipeline; the vacuum amplifier is used to generate negative pressure air connected to the suction cup to adsorb and clean the coating on the upper surface of the graphite ring and the graphite disk.

[0008] The spiral lifting pair includes a rotating shaft and a nut seat; the nut seat is installed on the housing and its internal thread extends along the height direction; the rotating shaft is threadedly matched with the nut seat; the sweeping coupling assembly is connected to the rotating shaft; the sweeping coupling assembly is inserted into the rotating shaft through a coupling adapter; the coupling adapter is connected to the motor shaft of the sweeping motor through a coupling clamp.

[0009] The housing includes multiple support beams, an upper sealing plate, a base plate, and a bottom plate; the upper sealing plate is located on the upper part of the multiple support beams; the base plate is located in the middle of the multiple support beams; the bottom plate is located on the lower part of the multiple support beams; the positioning mechanism and the cleaning mechanism are located on the upper sealing plate; the rotating mechanism is located on the base plate; and the lifting mechanism is located on the bottom plate.

[0010] The rotating mechanism includes a rotary motor, a rotating disk, and multiple support columns; the rotating disk is rotatably mounted on the housing; the multiple support columns are disposed on the upper surface of the rotating disk; the multiple support columns are used to support the semiconductor bonding wafer; the rotary motor is used to drive the rotating disk to rotate.

[0011] The positioning mechanism includes a positioning motor, a synchronous pulley pair, and multiple swing arm assemblies; the multiple swing arm assemblies are distributed around the circumference of the semiconductor bonding wafer; the synchronous pulley pair is used to drive the multiple swing arm assemblies to rotate in the same direction, so as to clamp or release the graphite ring through the movable end; the positioning motor is used to drive the multiple synchronous pulley pairs.

[0012] The synchronous pulley pair includes multiple synchronous shafts and a conveyor belt; the multiple synchronous shafts are rotatably connected to the housing and are distributed around the circumference of the semiconductor bonding wafer; multiple swing arm assemblies are installed one-to-one with the multiple synchronous shafts; the multiple synchronous shafts are provided with synchronous pulleys; the synchronous pulleys of the multiple synchronous shafts are connected by the conveyor belt; the positioning motor is connected to any one of the synchronous shafts.

[0013] Each of the aforementioned swing arm assemblies includes a mechanical swing arm, a roller pressing shaft, and a roller; one end of the mechanical swing arm is located on the synchronous rotating shaft; the movable end of the mechanical swing arm is connected to the roller via the roller pressing shaft, so that the roller abuts against or disengages from the graphite ring as the synchronous rotating shaft rotates.

[0014] The lifting mechanism includes a lifting motor, a joint shaft, a lifting ball spline assembly, and a lifting shaft; the lifting ball spline assembly is mounted on the housing, and its internal thread extends along the height direction; the lifting shaft is threaded onto the lifting ball spline assembly; the lifting motor drives the lifting shaft to rotate; one end of the joint shaft is connected to the lifting shaft, and the other end of the joint shaft is connected to the flange of the lifting motor.

[0015] Compared with the prior art, the present invention has the following advantages and beneficial effects:

[0016] This application provides a separation device for semiconductor bonded wafers after unpacking, including a housing. The housing is equipped with a rotating mechanism, a positioning mechanism, and a lifting mechanism. The rotating mechanism drives the semiconductor bonded wafer to rotate, facilitating subsequent separation operations. After the positioning mechanism fixes the graphite disk with a graphite ring, the lifting mechanism is located at the center of the graphite disk, thereby lifting the wafer to detach it from the graphite disk. The separation device of this application, through the cooperation of the rotating mechanism, positioning mechanism, and lifting mechanism, can accurately and stably complete the separation of the debonded wafer from the graphite disk, improving the efficiency and accuracy of separation. It also has the function of cleaning the coating on the surface of the graphite ring and graphite disk, simplifying the operation process and reducing production costs. Attached Figure Description

[0017] The accompanying drawings, which are included to provide a further understanding of embodiments of the invention and form part of this application, do not constitute a limitation thereof. In the drawings:

[0018] Figure 1 This is a schematic diagram of the separation device applied to the semiconductor bonding wafer after unpacking, according to an embodiment of this application;

[0019] Figure 2 This is a schematic diagram of the structure of the semiconductor bonding wafer according to an embodiment of this application;

[0020] Figure 3This is a cross-sectional schematic diagram of the semiconductor bonding wafer according to an embodiment of this application;

[0021] Figure 4 This is a schematic diagram of the rotating mechanism in an embodiment of this application;

[0022] Figure 5 This is a schematic diagram of the positioning mechanism in an embodiment of this application;

[0023] Figure 6 This is a schematic diagram of the cleaning mechanism in an embodiment of this application;

[0024] Figure 7 This is a connection diagram of the rotating shaft and the connecting adapter.

[0025] The attached diagram shows the markings and corresponding component names:

[0026] 1. Housing; 2. Top sealing plate; 3. Graphite ring; 4. Wafer; 5. Support column; 6. Rotary reducer; 7. Cleaning coupling assembly; 8. Suction cup; 9. Mechanical swing arm; 10. Graphite support plate; 11. Graphite disk; 12. Substrate; 13. Positioning motor; 14. Roller; 15. Synchronous shaft; 16. Synchronous pulley; 17. Conveyor belt; 18. Coupling clamp; 19. Coupling adapter; 20. Raised shaft; 21. Cleaning motor; 22. Cleaning reducer; 23. Positioning motor; 24. Nut seat; 25. Rotating shaft. Detailed Implementation

[0027] To make the objectives, technical solutions, and advantages of the present invention clearer, the present invention will be further described in detail below with reference to the embodiments and accompanying drawings. The illustrative embodiments and descriptions of the present invention are only used to explain the present invention and are not intended to limit the present invention.

[0028] Example

[0029] like Figures 1-7 As shown, this embodiment provides a separation device applied to semiconductor bonded wafers after unpacking. The semiconductor bonded wafer includes a wafer 4 after unpacking, a graphite ring 3, a graphite disk 11, and a graphite support 10. The graphite support 10 is disposed in the inner hole at the center of the graphite disk 11. The wafer 4 is disposed on one side of the graphite support 10 and the graphite disk 11. The graphite ring 3 is disposed around the graphite disk 11 and the wafer 4. The separation device includes a housing 1, a rotating mechanism, a positioning mechanism, a lifting mechanism, and a cleaning mechanism. The rotating mechanism is used to support and drive the semiconductor bonded wafer to rotate. The positioning mechanism is used to position the graphite ring 3. The lifting mechanism is disposed at the lower end of the graphite support 10 and is used to lift the graphite support 10 upward when the graphite ring 3 is positioned, thereby driving the wafer 4 to detach from the graphite disk 11.

[0030] The center of wafer 4 is concentric with the centers of graphite ring 3, graphite disk 11, and graphite support plate 10; the diameter of graphite disk 11 is larger than that of wafer 4; graphite support plate 10 is movably disposed at the inner hole in the center of graphite disk 11, the inner hole is trapezoidal, so that graphite support plate 10 can move along the trapezoidal inner hole toward the side closer to wafer 4.

[0031] This application provides a separation device for semiconductor bonded wafers after unpacking, capable of separating the graphite ring 3 and graphite disk 11 from the wafer 4 in the unbonded semiconductor bonded wafer. First, the semiconductor bonded wafer is rotated to a fixed position by a rotating mechanism. Then, a positioning mechanism positions the graphite ring 3 around the perimeter of the semiconductor bonded wafer, thereby limiting the graphite disk 11. A lifting mechanism is then used to lift the wafer 4 out of the center of the graphite disk 11 by the graphite support plate 10 at the center of the graphite disk 11, achieving the separation of the wafer 4 from the graphite ring 3 and graphite disk 11. Finally, a cleaning mechanism removes the coating from the graphite ring 3 and graphite disk 11.

[0032] The cleaning suction cup group 8 includes a suction cup 8 and a vacuum amplifier; the cleaning coupling group 7 extends along the surface of the semiconductor bonding sheet; the suction cup 8 is disposed in the cleaning coupling group 7, and the suction end faces the semiconductor bonding sheet; the cleaning coupling group 7 is provided with a vacuum pipeline communicating with the suction cup 8; the vacuum pipeline is connected to an exhaust gas treatment pipeline; the vacuum amplifier is used to generate negative pressure air connected to the suction cup 8 to adsorb and clean the coating on the upper surface of the graphite ring 3 and the graphite disk 11.

[0033] The cleaning suction cups 8 are positioned above the semiconductor bonded wafer and extend along the surface of the wafer to the center, cleaning as the wafer rotates. Multiple suction cups 8 pass through the upper end of the cleaning assembly and connect to the vacuum pipeline, which in turn connects to the vacuum amplifier and the exhaust gas treatment pipeline. Optionally, the cleaning coupling assembly 7 can also be equipped with positioning elements for locating or detecting the graphite ring 3.

[0034] The spiral lifting pair includes a rotating shaft 25 and a nut seat 24; the nut seat 24 is installed on the housing 1 and its internal thread extends along the height direction; the rotating shaft 25 is threadedly matched with the nut seat 24; the sweeping coupling assembly 7 is connected to the rotating shaft 25; the sweeping coupling assembly 7 is inserted into the rotating shaft 25 through a coupling adapter 19; the coupling adapter 19 is connected to the motor shaft of the sweeping motor 21 through a coupling clamp 18.

[0035] The housing 1 includes multiple support beams, an upper sealing plate 2, a base plate 12, and a bottom plate; the upper sealing plate 2 is disposed on the upper part of the multiple support beams; the base plate 12 is disposed on the middle part of the multiple support beams; the bottom plate is disposed on the lower part of the multiple support beams; the positioning mechanism and the cleaning mechanism are disposed on the upper sealing plate 2; the rotating mechanism is disposed on the base plate 12; and the lifting mechanism is disposed on the bottom plate.

[0036] Specifically, the housing 1 has four support beams, with an upper sealing plate 2 on the upper part of the four support beams, a substrate 12 in the middle, and a bottom plate at the bottom. A rotation mechanism is provided on the substrate 12 to place the semiconductor bonding wafer; a positioning mechanism is provided on the upper sealing plate 2 to position the graphite ring 3 around the semiconductor bonding wafer; a cleaning mechanism is provided on the upper sealing plate 2 to adsorb and clean the coating from above the semiconductor bonding wafer. A lifting mechanism is provided on the bottom plate to rise from the lower part of the graphite disk 11 corresponding to the center of the wafer 4 to lift the wafer 4 and detach it from the graphite disk 11.

[0037] The rotating mechanism includes a rotary motor, a rotating disk, and three support columns 5; the rotating disk is rotatably mounted on the housing 1; the multiple support columns 5 are disposed on the upper surface of the rotating disk; the multiple support columns 5 are used to support the semiconductor bonding wafer; the rotary motor is used to drive the rotating disk to rotate.

[0038] Specifically, the rotating mechanism includes a rotary motor, a rotating disk, and three support columns 5 mounted on the substrate 12. The rotary motor is mounted on the bottom of the substrate 12, and the rotating disk is mounted on the rotary motor. A rotary reducer 6 is also used with the rotary motor. Three support columns 5 are evenly mounted on the upper surface of the rotating disk. The semiconductor bonding wafer is placed on the support columns 5 and rotated by the rotary motor.

[0039] The upper surface of the housing 1 is the upper sealing plate 2, and a rotating hole is provided in the middle, so that the rotating disk of the rotating mechanism passes through the rotating hole and extends out of the rotating hole through three support columns 5 to support the semiconductor bonding sheet on the outside of the upper sealing plate 2. This facilitates the installation of the positioning mechanism around the semiconductor bonding sheet corresponding to the upper sealing plate 2, and the installation of the suction cup 8 mechanism on the upper side of the semiconductor bonding sheet corresponding to the upper sealing plate 2.

[0040] In application, one end of the cleaning coupling assembly 7 clamps the shaft of the cleaning motor 21, and the other end is inserted into the rotating shaft 25 of the spiral lifting pair. This drives the rotating shaft 25 to rise and fall along the internal thread guide groove of the spiral lifting pair nut seat 24, thereby driving the cleaning suction cup 8 assembly to rise and fall to the designated positions of the graphite ring 3 and graphite disk 11. The cleaning suction cup 8 assembly then adsorbs and cleans the coating on the surface of the graphite ring 3 and graphite disk 11. The cleaning motor 21 can be mounted on the substrate 12 via the cleaning reducer 22. The coupling clamp 18 and coupling adapter 19 on the cleaning coupling assembly 7 drive the rotating shaft 25 to rotate along the internal thread guide groove of the nut seat 24, causing it to rise and fall along the length of the nut seat 24. This allows it to move closer to the semiconductor bonding wafer when descending and further away from the semiconductor bonding wafer when rising. Optionally, the upper surface of the semiconductor bonding wafer can be cleaned during rotation, or the graphite ring 3 and graphite disk 11 can be cleaned after the wafer 4 is separated from the graphite disk 11. Optionally, the two protruding shafts 20 on the coupling adapter 19 are inserted into the corresponding shaft holes at the bottom of the rotating shaft 25 of the screw lifting pair, the nut seat 24 of the screw lifting pair is fixed to the upper part of the housing 1, and the cleaning suction cup 8 is installed on the top of the rotating shaft 25.

[0041] The sweeping motor 21 is not fixed to the auger lifting assembly; they only contact each other by inserting two protruding shafts 20 of the coupling adapter 19 into the holes of the rotating shaft 25. This causes the rotating shaft 25 to move along the thread inside the nut seat 24, thus achieving the lifting and lowering of the shaft as it rotates. This structure saves on the power source, reduces the number of actuators, lowers costs, and requires relatively little space, making it suitable for compact structures.

[0042] The positioning mechanism includes a positioning motor 2313, a synchronous pulley pair, and multiple swing arm assemblies; the multiple swing arm assemblies are distributed around the circumference of the semiconductor bonding wafer; the synchronous pulley pair is used to drive the multiple swing arm assemblies to rotate in the same direction, so as to clamp or release the graphite ring 3 through the movable end; the positioning motor 2313 is used to drive the multiple synchronous pulley pairs.

[0043] The synchronous pulley pair includes multiple synchronous shafts 15 and a conveyor belt 17; the multiple synchronous shafts 15 are rotatably connected to the housing 1 and are distributed around the circumference of the semiconductor bonding wafer; multiple swing arm assemblies are installed one-to-one with the multiple synchronous shafts 15; the multiple synchronous shafts 15 are provided with synchronous pulleys 16; the multiple synchronous pulleys 16 of the synchronous shafts are connected by transmission through the conveyor belt 17; the positioning motor 2313 is connected to any one of the synchronous shafts 15.

[0044] Each of the aforementioned swing arm assemblies includes a mechanical swing arm 9, a roller pressing shaft, and a roller 14; one end of the mechanical swing arm 9 is disposed on the synchronous rotating shaft 15; the movable end of the mechanical swing arm 9 is provided with the roller 14 through the roller pressing shaft, so that the roller 14 abuts against or disengages from the graphite ring 3 as the synchronous rotating shaft 15 rotates.

[0045] Specifically, the positioning motor 2313 can simultaneously employ a positioning reducer. The positioning motor 2313 is connected to a synchronous pulley pair via a shaft, driving multiple mechanical swing arms 9 mounted on the synchronous pulley. The circular motion of the positioning motor 2313 causes the synchronous pulley pair to rotate, which in turn causes the rollers 14 on the three mechanical swing arms 9 mounted on the synchronous pulley to clamp the outer circumference of the graphite ring 3. Similarly, the synchronous pulley pair rotates in the opposite direction, causing the rollers 14 on the three mechanical swing arms 9 to move away from the graphite ring 3. The three mechanical swing arms 9 are rotatably mounted with a lower pressure roller 14 via an upper roller shaft. The side of the lower pressure roller 14 corresponding to the graphite ring 3 protrudes. Multiple support columns 5 of the rotating mechanism ensure that the graphite ring 3 of the semiconductor bonding wafer is at the same height as the three mechanical swing arms 9, thereby correspondingly clamping or loosening the outer circumference of the graphite ring 3.

[0046] The lifting mechanism includes a lifting motor, a joint shaft, a lifting ball spline assembly, and a lifting shaft; the lifting ball spline assembly is mounted on the housing 1, and its internal thread extends along the height direction; the lifting shaft is threaded onto the lifting ball spline assembly; the lifting motor is used to drive the lifting shaft to rotate; one end of the joint shaft is connected to the lifting shaft, and the other end of the joint shaft is connected to the flange of the lifting motor.

[0047] The lifting motor can be used in conjunction with a lifting reducer. The lifting motor and the lifting ball spline assembly are mounted on the base plate, and the lifting shaft is threaded onto the lifting ball spline assembly. One end of the joint shaft is mounted on the flange of the lifting motor, and the other end is mounted on the lifting shaft. The lifting motor drives the lifting ball spline assembly and the lifting shaft to achieve linear lifting by rotating the joint shaft.

[0048] In summary, this application provides a separation device for semiconductor bonded wafers after unpacking, including a housing 1. The housing 1 is equipped with a rotating mechanism, a positioning mechanism, and a lifting mechanism. The rotating mechanism drives the semiconductor bonded wafer to rotate, facilitating subsequent separation operations. After the positioning mechanism fixes the graphite disk 11 through the graphite ring 3, the lifting mechanism is located at the center of the graphite disk 11, thereby lifting the wafer 4 to detach it from the graphite disk 11. The separation device of this application, through the cooperation of the rotating mechanism, the positioning mechanism, and the lifting mechanism, can accurately and stably complete the separation of the debonded wafer 4 from the graphite disk 11, improving the efficiency and accuracy of separation. It also has the function of cleaning the coating on the upper surface of the graphite ring 3 and the graphite disk 11, simplifying the operation process and reducing production costs.

[0049] The specific embodiments described above further illustrate the purpose, technical solution, and beneficial effects of the present invention. It should be understood that the above description is only a specific embodiment of the present invention and is not intended to limit the scope of protection of the present invention. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the scope of protection of the present invention.

Claims

1. A separation device applied to a semiconductor bonded wafer after unpacking, the semiconductor bonded wafer comprising a unpacked wafer, a graphite ring, a graphite disk, and a graphite support plate; the graphite support plate being disposed in an inner hole at the center of the graphite disk; the wafer being disposed on one side of the graphite support plate and the graphite disk; the graphite ring being disposed around the perimeter of the graphite disk and the wafer; characterized in that, The separation device includes a housing, a rotating mechanism, a positioning mechanism, a lifting mechanism, and a cleaning mechanism; the rotating mechanism is used to support and drive the semiconductor bonding wafer to rotate; the positioning mechanism is located around the semiconductor bonding wafer and is used to position the graphite ring; the lifting mechanism is located at the lower end of the graphite support and is used to push the graphite support upward when the graphite ring is positioned, thereby driving the wafer to detach from the graphite disk; The cleaning mechanism includes a cleaning motor, a cleaning coupling assembly, a spiral lifting pair, and a cleaning suction cup assembly; the spiral lifting pair is vertically mounted on the housing; the cleaning coupling assembly is mounted on the movable end of the spiral lifting pair and is located above the semiconductor bonding sheet; the cleaning motor is used to drive the spiral lifting pair; the cleaning suction cup assembly is located on the cleaning coupling assembly and is used to adsorb and clean the coating that has fallen off the graphite ring and graphite disk; The cleaning suction cup assembly includes a suction cup and a vacuum amplifier; the cleaning coupling assembly extends along the surface of the semiconductor bonded wafer; the suction cup is disposed in the cleaning coupling assembly with its adsorption end facing the semiconductor bonded wafer; the cleaning coupling assembly is provided with a vacuum pipeline communicating with the suction cup; the vacuum pipeline is connected to an exhaust gas treatment pipeline; the vacuum amplifier is used to generate negative pressure air connected to the suction cup to adsorb and clean the coating on the upper surface of the graphite ring and the graphite disk.

2. The apparatus for separating a semiconductor die from a semiconductor die attach film according to claim 1, wherein, The spiral lifting pair includes a rotating shaft and a nut seat; the nut seat is installed on the housing and its internal thread extends along the height direction; the rotating shaft is threadedly matched with the nut seat; the sweeping coupling assembly is connected to the rotating shaft; the sweeping coupling assembly is inserted into the rotating shaft through a coupling adapter; the coupling adapter is connected to the motor shaft of the sweeping motor through a coupling clamp.

3. The apparatus for separating a semiconductor die from a semiconductor die attach film according to claim 1, wherein, The housing includes multiple support beams, an upper sealing plate, a base plate, and a bottom plate; the upper sealing plate is located on the upper part of the multiple support beams; the base plate is located in the middle of the multiple support beams; the bottom plate is located on the lower part of the multiple support beams; the positioning mechanism and the cleaning mechanism are located on the upper sealing plate; the rotating mechanism is located on the base plate; and the lifting mechanism is located on the bottom plate.

4. The apparatus for separating a semiconductor die from a semiconductor die attach film according to claim 1, wherein, The rotating mechanism includes a rotary motor, a rotating disk, and three support columns; the rotating disk is rotatably mounted on the housing; multiple support columns are disposed on the upper surface of the rotating disk; the multiple support columns are used to support the semiconductor bonding wafer; the rotary motor is used to drive the rotating disk to rotate.

5. The apparatus for separating a semiconductor die from a semiconductor die attach film according to claim 1, wherein, The positioning mechanism includes a positioning motor, a synchronous pulley pair, and multiple swing arm assemblies; the multiple swing arm assemblies are distributed around the circumference of the semiconductor bonding wafer; the synchronous pulley pair is used to drive the multiple swing arm assemblies to rotate in the same direction, so as to clamp or release the graphite ring through the movable end; the positioning motor is used to drive the multiple synchronous pulley pairs.

6. The apparatus for separating a semiconductor die from a semiconductor die attach film according to claim 5, wherein, The synchronous pulley pair includes multiple synchronous shafts and a conveyor belt; the multiple synchronous shafts are rotatably connected to the housing and are distributed around the circumference of the semiconductor bonding wafer; multiple swing arm assemblies are installed one-to-one with the multiple synchronous shafts; the multiple synchronous shafts are provided with synchronous pulleys; the synchronous pulleys of the multiple synchronous shafts are connected by the conveyor belt; the positioning motor is connected to any one of the synchronous shafts.

7. The apparatus for separating a semiconductor die from a semiconductor die attach film according to claim 6, wherein, Each of the aforementioned swing arm assemblies includes a mechanical swing arm, a roller pressing shaft, and a roller; one end of the mechanical swing arm is located on the synchronous rotating shaft; the movable end of the mechanical swing arm is connected to the roller via the roller pressing shaft, so that the roller abuts against or disengages from the graphite ring as the synchronous rotating shaft rotates.

8. The apparatus for separating a semiconductor die from a semiconductor die attach film according to claim 1, wherein, The lifting mechanism includes a lifting motor, a joint shaft, a lifting ball spline assembly, and a lifting shaft; the lifting ball spline assembly is mounted on the housing, and its internal thread extends along the height direction; the lifting shaft is threaded onto the lifting ball spline assembly; the lifting motor drives the lifting shaft to rotate; one end of the joint shaft is connected to the lifting shaft, and the other end of the joint shaft is connected to the flange of the lifting motor.

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