Electronic device cooling module

Abstract

An electronic device cooling module (1) comprising: a container (2) housing at least one first electronic device (5); a liquid coolant reservoir (4); and a pump (3) located within the liquid coolant reservoir (4) arranged to pump liquid coolant from the liquid coolant reservoir (4) to the at least one first electronic device (5) via a liquid coolant conduit (6) to provide cooling of the device. The liquid coolant reservoir (4) comprises a heating element (7) communicatively connectable to a controller (8). The controller (8) is communicatively connectable to a temperature sensor (9) disposed within the liquid coolant reservoir (4).

Description

Technical Field

[0001] This disclosure relates to a cooling system, and more particularly to a cooling system for electronic devices and boards. The cooling system provides a container for housing heat-generating components requiring active or fluid cooling, such as motherboards, memory modules, or servers, and a reservoir for a liquid coolant. The cooling system may also provide a heating element for heating the liquid coolant. Background Technology

[0002] Many types of electrical components generate heat during operation. In particular, electrical computer components such as motherboards, central processing units (CPUs), and memory modules dissipate a significant amount of heat during use. Heating electrical components to high temperatures can cause damage, impair performance, or create safety hazards. Therefore, considerable effort has been devoted to finding effective, high-performance systems for cooling electrical components efficiently and safely.

[0003] One type of cooling system uses liquid cooling. Although different liquid cooling components have been demonstrated, typically, electrical components are immersed in a coolant liquid to provide a large surface area for heat exchange between the heat-generating electrical components and the coolant.

[0004] An example of a conventional cooling system in which heat-generating electronic components are immersed in liquid coolant can be found in WO-A-2018 / 096362.

[0005] In the aforementioned electronic device cooling modules, the cooling methods all rely on the pumping and circulation of liquid coolant within the cooling system. However, in some cases, it is desirable or necessary to operate the cooling system over a wide temperature range, including very cold temperatures. In some applications, temperatures can drop as low as -40°C. This can make the operation of electronic devices more difficult.

[0006] Therefore, it is desirable to allow computer systems to operate at very low temperatures. Summary of the Invention

[0007] In view of this, an electronic device cooling module is typically provided that provides liquid cooling for components within a module housing over a wide range of external temperatures, particularly in extremely cold environments. A method is also provided for ensuring that the liquid coolant continues to provide effective cooling to electronic components at cold ambient temperatures.

[0008] In a first aspect, an electronic device cooling module according to claim 1 is provided. Further features of this aspect are described in detail in the dependent claims and herein.

[0009] An electronic device cooling module includes a container housing at least one first electronic device and a liquid coolant reservoir. A pump is located within the liquid coolant reservoir and configured to pump liquid coolant from the liquid coolant reservoir to the first electronic device via a liquid coolant conduit, thereby providing cooling to the at least one first electronic device. The liquid coolant reservoir also includes a heating element communicatively connected to a controller, and the controller is communicatively connected to a temperature sensor disposed within the liquid coolant reservoir.

[0010] Very low temperatures can cause the viscosity of liquid coolants (e.g., dielectric fluids) used in such systems to increase, potentially making them difficult or impossible to pump. If the coolant cannot be effectively pumped to the electronic components, the device's performance may degrade, and the device may malfunction.

[0011] Advantageously, this arrangement allows the cooling module to be placed in an environment with very low ambient temperatures, because the liquid coolant can be heated to a temperature where its viscosity is no longer high enough to be pumped into the electronic equipment. This also allows the computing devices contained within the electronic equipment's cooling module to be turned on and off without the risk of damage due to insufficient cooling.

[0012] In some embodiments, the container may include a coolant manifold (or coolant distribution manifold) configured to receive liquid coolant from a liquid coolant reservoir via a pump. The coolant manifold may be configured to distribute liquid coolant to a plurality of first electronic devices disposed within the container, each electronic device being connected to the coolant manifold via a corresponding liquid coolant conduit. This advantageously allows for the efficient cooling of more than one first electronic device using the same pump and liquid coolant reservoir.

[0013] Optionally, the pump can be communicatively connected to the controller. This advantageously allows the controller to begin pumping the coolant when it has sufficient fluidity to be effectively pumped. It also allows the controller to stop pumping the coolant if its viscosity is too high to be effectively pumped, thereby preventing damage to the cooling equipment.

[0014] In some embodiments, the first electronic device, or each of the first electronic devices, may be thermally coupled to a corresponding cooling block assembly. The cooling block assembly may be in fluid communication with the liquid coolant conduit, or each of the liquid coolant conduits. Optionally, the cooling block assembly may be configured to receive liquid coolant from the corresponding liquid coolant conduit. This provides the benefit of improved cooling of the first electronic device by delivering coolant to a dedicated cooling block assembly (e.g., a heat sink), which can effectively transfer heat from the first electronic device to the liquid coolant, thereby enabling heat removal.

[0015] In some implementations, the cooling block assembly, or each cooling block assembly, can be configured to allow liquid coolant to overflow from inside the cooling block assembly into the container. This advantageously allows the liquid coolant to flow back along the base of the container to the source liquid coolant reservoir, thereby eliminating the need for a separate return conduit, which would increase the complexity and cost of the system.

[0016] Optionally, liquid coolant overflowing from the cooling block assembly or each cooling block assembly can be directed to at least one adjacent second electronic device. This advantageously allows electronic devices other than the first electronic device to be cooled without the need for further conduits to guide coolant to them. This is particularly useful when the second electronic device does not require the same level of cooling as the first electronic device, and the liquid coolant does not need to be as cold as when cooling the first electronic device.

[0017] Optionally, liquid overflowing from the cooling block assembly or each cooling block assembly can be directed to the at least one adjacent second electronic device via a porous dispensing tray. This advantageously allows for better distribution of liquid coolant to the second electronic device, thereby allowing for more efficient cooling of the second electronic device, since the liquid coolant can be directly directed to the at least one second electronic device.

[0018] Optionally, the porous dispensing tray can be in direct liquid contact with the corresponding cooling block assembly. This advantageously allows for more efficient cooling of the at least one second electronic device, as the liquid coolant can directly remove heat from the second electronic device.

[0019] In some implementations, the first electronic device may be a central processing unit (CPU) or a graphics processing unit (GPU). This is advantageous because these components are common in computer systems and typically generate the most heat.

[0020] In some implementations, the at least one adjacent second electronic device may be a dual in-line memory module (DIMM). This is advantageous because these components are common in computer systems and are typically located close to the CPU or GPU for operational reasons. Furthermore, DIMMs generally generate less heat than CPUs or GPUs.

[0021] In some implementations, the cooling block assembly may be a heat sink or a coolant cold plate device. These components advantageously provide effective cooling, allowing for better removal of heat from the first electronic device.

[0022] In some embodiments, the container may include a base configured to direct liquid coolant within the container toward a liquid coolant reservoir. This advantageously allows liquid coolant to flow back along the base of the container to the source liquid coolant reservoir, thereby eliminating the need for a separate return conduit, which would increase system complexity and cost.

[0023] Alternatively, the liquid coolant reservoir is a collection tank formed in the base of the container. This advantageously allows the liquid coolant to be returned to the reservoir by gravity, eliminating the need for an additional pump.

[0024] In some implementations, the controller can be configured to receive a temperature indication of the liquid coolant in the liquid coolant reservoir from a temperature sensor and control the heating element based on the received temperature indication. This advantageously allows the heating element to be controlled as a direct result of the coolant temperature. Therefore, the coolant temperature will not drop below a preset temperature during operation.

[0025] In some implementations, the controller can be configured to activate the heating element if the received temperature indication is at or below a preset activation temperature, and deactivate the heating element when the liquid coolant is at or above a preset deactivation temperature. By setting different threshold temperatures for activating and deactivating the heating element, the coolant temperature can be maintained within a specific range, for example, within which the coolant has sufficient fluidity to be effectively pumped, but is cold enough to adequately cool the at least one electronic device. It can also utilize hysteresis to prevent excessively frequent power switching of the heating element.

[0026] In some further embodiments, the controller may also be configured to activate the pump to direct liquid coolant from the liquid coolant reservoir to the at least one electronic device if the received temperature indication reaches at least a preset pumping temperature. This advantageously allows for a delay in the pumping of coolant until the coolant temperature is sufficiently high to have adequate fluidity for effective pumping without damaging the pump or other equipment.

[0027] In a second aspect, a method for cooling an electronic device according to claim 14 is provided. Further features of this aspect are described in detail in the dependent claims and herein. This aspect may be combined with the first aspect and / or any optional features of the first aspect disclosed herein.

[0028] A method for cooling an electronic device is provided, the electronic device being enclosed within an electronic device cooling module, the electronic device cooling module including a container housing at least one first electronic device and a liquid coolant reservoir. The method includes the following steps: The temperature of the liquid coolant in the liquid coolant reservoir is monitored by a temperature sensor installed inside the liquid coolant reservoir; If the temperature of the liquid coolant is lower than the preset activation temperature, the heating element in the liquid coolant reservoir is activated, and the heating element is deactivated when the liquid coolant is at or above the preset shutdown temperature. If the temperature of the liquid coolant reaches at least the preset pumping temperature, the pump located in the liquid coolant reservoir is activated to guide the liquid coolant from the liquid coolant reservoir to the at least one electronic device. The at least one electronic device is cooled by liquid coolant received from a liquid coolant reservoir via a liquid coolant conduit.

[0029] Advantageously, this method allows the cooling module to be placed in an environment with very low ambient temperatures, because the liquid coolant can be heated to a temperature where its viscosity is no longer high enough to be pumped into the electronic device. This also allows the computing devices contained within the electronic device's cooling module to be turned on and off without the risk of damage due to insufficient cooling.

[0030] In some implementations, one or more of temperature monitoring, heating element activation, heating element deactivation, pump activation, and pump deactivation can be controlled by a control device located within the electronic device cooling module. This advantageously allows for precise control of the coolant temperature and / or flow rate, ensuring that attempts are not made to pump incorrectly conditioned coolant through the system, which could potentially damage components of the electronic device cooling module.

[0031] In some embodiments, the liquid coolant received by the at least one first electronic device, after cooling the at least one first electronic device, is directed to at least one adjacent second electronic device. This advantageously allows electronic devices other than the first electronic devices to be cooled without the need for further conduits to guide coolant to them. This is particularly useful when the second electronic device does not require the same level of cooling as the first electronic device, and the liquid coolant does not need to be as cold as when cooling the first electronic device.

[0032] In some embodiments, liquid coolant received from a liquid coolant reservoir via a liquid coolant conduit is recycled by returning to the liquid coolant reservoir under gravity. This advantageously eliminates the need for additional conduits or pumps to return the coolant to the reservoir.

[0033] Features of manufacturing and / or operating methods corresponding to any and all aspects disclosed herein, and corresponding to any one or more electronic device cooling modules disclosed herein, may also be provided. Combinations of aspects are also possible. Furthermore, where compatible, combinations of specific features of one aspect with features of another aspect are disclosed. Specific embodiments of these combinations are suggested herein by way of example. Attached Figure Description

[0034] This disclosure can be implemented in a variety of ways, but preferred embodiments will now be described by way of example only and with reference to the accompanying drawings, as follows.

[0035] Figure 1 A plan view of an embodiment of an electronic device cooling module that encloses a single first electronic device is shown.

[0036] Figure 2 It shows Figure 1 The side view of the cooling module of the electronic device shown.

[0037] Figure 3 A side view of the electronic device cooling module that encloses the first and second electronic devices is shown.

[0038] Figure 4 A plan view of an electronic device cooling module enclosing multiple first electronic devices is shown.

[0039] Figure 5 It shows Figure 4 The side view of the cooling module of the electronic device shown.

[0040] Figure 6 A side view of an electronic device cooling module that encloses multiple first and second electronic devices is shown.

[0041] Figure 7A A perspective view of the arrangement of the cooling blocks and the prior art arrangement of the first and second electronic devices is shown.

[0042] Figure 7B It shows Figure 7A The diagram shows a plan view of the existing technology layout. Detailed Implementation

[0043] refer to Figure 1The diagram illustrates an electronic device cooling module according to a first embodiment. Module 1 includes a container 2, preferably liquid-tight, more preferably a (metal) tank, optionally with a removable lid (not shown). The module also includes: a pump 3; a liquid coolant reservoir 4; a first electronic device 5; a liquid coolant conduit 6; a heating element 7; a control device 8; a temperature sensor 9; a substrate 10; and a cooling block assembly 13. Container 2 houses the substrate or printed circuit board (PCB) 10, on which the first electronic device 5 is mounted. PCB 10 may be a computer server motherboard, but may also be any substrate on which electronic equipment can be mounted. The first electronic device 10 may be any heat-generating electronic component, such as a central processing unit (CPU) or a graphics processing unit (GPU). Cooling block assembly 13 is mounted on top of the first electronic device. Cooling block assembly 13 may be a cooling module heatsink, such as those disclosed and described in WO-A-2019 / 048864 or WO-A-2022 / 112799. In an alternative arrangement, cooling block assembly 13 may be configured as a cold plate device.

[0044] Container 2 also includes a liquid coolant reservoir 4, which can hold a certain amount of dielectric liquid coolant. The dielectric coolant in the liquid coolant reservoir 4 can be guided towards the first electronic device 5 by a pump 3 via a liquid coolant conduit 6. The arrows shown on the liquid coolant conduit 6 are merely symbolic and are used to clearly illustrate the direction of coolant flow. The liquid coolant conduit 6 can be formed as a tube or hose and can be rigid or flexible, depending on the requirements of the specific application.

[0045] Container 2 also includes a heating element 7 and a temperature sensor 9 located within a liquid coolant reservoir 4. A controller 8 is communicatively connected to the heating element 7, the temperature sensor 9, and the pump 3. The controller 8 can be connected to the heating element 7, the temperature sensor 9, and the pump 3 via any known data transmission method, such as electrical, wireless, optical, or mechanical. The controller 8 can be a microprocessor, a microcontroller, a field-programmable gate array, or any other similar processing device.

[0046] Now for reference Figure 2 It shows Figure 1 A side view of the embodiment shows that the liquid coolant reservoir 4 is formed as a collection trough or recess in the base 19 of the container 2. The liquid level of the liquid coolant 18 in the reservoir 4 will be determined at least in part by the actual depth of the reservoir 4.

[0047] refer to Figure 1 and Figure 2The illustrated embodiment describes a typical operating example of the electronic device cooling module 1. Temperature sensor 9 monitors the temperature of the liquid coolant in reservoir 4 and provides a feedback signal to controller 8 representing or indicating the temperature of the liquid coolant in reservoir 4. If the measured temperature of the liquid coolant in reservoir 4 is lower than or equal to a preset activation temperature, controller 8 can activate heating element 7 to heat the liquid coolant. Additionally or alternatively, if the measured temperature of the liquid coolant in reservoir 4 is lower than a preset pumping temperature, controller 8 can deactivate pump 3 to prevent coolant pumping.

[0048] When controller 8 detects that the temperature of the liquid coolant in reservoir 4, as measured by temperature sensor 9, reaches or exceeds a preset pumping temperature, controller 8 can activate pump 3 to pump the coolant. Alternatively or additionally, if the measured temperature of the liquid coolant in reservoir 4 is higher than or equal to a preset shutdown temperature, controller 8 can deactivate heating element 7. Deactivation of heating element 7 can be complete or partial. For example, it can gradually reduce the power of heating element 7 to provide a smooth operational transition for the liquid coolant pumped within the system.

[0049] The preset activation temperature may be equal to or different from the preset shutdown temperature. Preferably, the preset activation temperature may be lower than the preset shutdown temperature.

[0050] The pumping temperature can be the same as, or both of, the activation temperature and the shutdown temperature, or different from both. Specifically, the pumping temperature can be equal to the shutdown temperature. Alternatively, the pumping temperature can be between the activation temperature and the shutdown temperature.

[0051] When pump 3 is activated, liquid coolant is pumped from liquid coolant reservoir 4 through liquid coolant conduit 6 to cooling block assembly 13. Cooling block assembly 13 then cools the first electronic device 5, for example, by distributing liquid coolant onto the first electronic device 5, thereby allowing improved performance and extended lifespan of the first electronic device 5. After cooling, the liquid coolant flows out of cooling block assembly 13, for example, by overflowing the outer peripheral wall, and enters the interior of container 2. The liquid coolant then flows under gravity along base 19 back to liquid coolant reservoir 4.

[0052] Now for reference Figure 3 This illustrates an alternative implementation of a cooling module for an electronic device. This implementation includes information regarding... Figure 1 and Figure 2All the features discussed are added, but with the addition of multiple second electronic devices 16 located near the cooling block assembly 13. Overflow 11 from the cooling block assembly 13 is also shown in the figure. The second electronic devices 16 may include at least one electronic component that generates heat and therefore requires cooling. Typically, the second electronic device 16 will be a memory module, such as a dual in-line memory module (DIMM) card. In this embodiment, when the pump 3 is activated, liquid coolant is pumped from the reservoir 4 to the cooling block assembly 13 via the liquid coolant conduit 6 and overflows 11 from the cooling block assembly 13, thereby providing cooling for the second electronic devices 16. Cooling of the second electronic devices 16 by the liquid coolant can be provided through direct contact between the liquid coolant and the second electronic devices 16, or through a thermal interface (e.g., a heat sink) between the second electronic devices 16 and the overflowing liquid coolant 11. After cooling the second electronic devices 16, the liquid coolant then flows along the base 19 to the liquid coolant reservoir 4 under gravity.

[0053] In some implementations, there may be multiple first electronic devices. This can be derived from... Figure 4 see, Figure 4 It shows Figure 1 and Figure 2 The embodiment shown is modified by adding multiple first electronic devices 5 and associated cooling block assemblies 13. A liquid coolant conduit 6 connects the pump 3 to a coolant distribution manifold 17 (or coolant manifold). The coolant distribution manifold 17 distributes liquid coolant from the liquid coolant conduit 6 into multiple individual branch conduits 6a, 6b, 6c, and 6d. The liquid coolant can be distributed uniformly or non-uniformly among the individual branch conduits 6a, 6b, 6c, and 6d, depending on the requirements of the specific implementation. Figure 4 The diagram shows four separate branch conduits 6a, 6b, 6c, and 6d, four first electronic devices 5, and four cooling block assemblies 13. However, any number of separate branch conduits 6a, 6b, 6c, and 6d, first electronic devices 5, and cooling block assemblies 13 may be present. Figure 5 It shows Figure 4 Side view of the implementation. For clarity, only the two first electronic devices 5, the cooling block assembly 13, and the separate branch conduits 6a and 6b are shown. Figure 4 and Figure 5 The functions and operations of the illustrated embodiments are related to... Figure 1 and Figure 2 The descriptions are the same.

[0054] Now for reference Figure 6 It describes one implementation method, which is Figure 3 The embodiments shown are the same as Figure 4 and Figure 5 Combinations of the embodiments shown. Figure 6It shows Figure 5 The diagram shows multiple first electronic devices 5, a cooling block assembly 13, and separate branch conduits 6a and 6b, and includes additional... Figure 3 The second electronic device 16 is shown. The second electronic device 16 is located near the first electronic device 5 and the cooling block assembly 13. The second electronic device 16 is cooled by direct or via thermal interface contact with liquid coolant 11 overflowing from the cooling block assembly 13. The coolant then flows along the base 19 of the container 2 and returns to the liquid coolant reservoir 4, thereby allowing for the recycling or reuse of the coolant. Each of the plurality of first electronic devices 5 may have at least one corresponding associated second electronic device 16 cooled in this manner. Alternatively, only some of the first electronic devices 5 may have associated second electronic devices 16 cooled in this manner, while other first electronic devices 5 may not have second electronic devices 16 disposed nearby. Additionally or alternatively, some first electronic devices 5 may have second electronic devices 16 nearby, but these second electronic devices 16 are not cooled by liquid coolant 11 overflowing from the cooling block assembly 13.

[0055] Now for reference Figure 7A and Figure 7B The method for directing the overflow 11 liquid coolant from the cooling block assembly 13 to the second electronic device 16 will be described (e.g. Figure 3 and Figure 6 (As used in the illustrated embodiment). As described above, the cooling block assembly 13 may be a heat sink 21. The heat sink 21 is located on a substrate or PCB 10, above the first electronic device 5. A perforated dispensing tray 20 is located on at least one side of the heat sink 21 or the cooling block assembly 13, such that they are in direct fluid communication, and is further positioned such that it is located above one or more second electronic devices 16. The perforated dispensing tray 20 includes a plurality of orifices 22, which are substantially located directly above the one or more second electronic devices 16. Liquid coolant is delivered from a liquid coolant reservoir 4 (not shown) to the heat sink 21 via a pump 3 (not shown) in the flow direction 6'. The liquid coolant may flow directly from the pump 3 (not shown) or via a coolant dispensing manifold 17 (not shown). Figure 7A and Figure 7B In the diagram, radiator 21 is shown as having four main sides and two perforated distribution trays; however, the radiator can be of any shape and have any number of sides, and any number of perforated distribution trays can be located at the edge of radiator 21.

[0056] After the liquid coolant is delivered to radiator 21, it overflows from radiator 21 and flows into one or more porous dispensing trays 20. The liquid coolant then flows or drips through multiple orifices 22 onto one or more second electronic devices 16, providing cooling to them. The liquid coolant then flows under gravity along the base 19 of container 2 to liquid coolant reservoir 4 for reuse.

[0057] Although specific embodiments have now been described, those skilled in the art will understand that various modifications and changes can be made. The design of container 2 may differ in shape and / or structure from that shown (e.g., it may not be a cuboid). Alternative electronic devices different from the first electronic device 5 and / or the second electronic device 16 shown may be used, for example, with different shapes, structures, or applications. In some embodiments, a PCB 10 with a different design may be present (or there may be no PCB at all), or any number of PCBs may be present (including only one). Furthermore, different types of boards, such as strip boards, may be used. The layout of PCB 10, electronic devices 5, 16, and other components can vary significantly. Those skilled in the art are aware of various methods for removing heat from liquid coolants, any of which can be used with any embodiment of the present invention.

[0058] The design and layout of the conduit 6 and coolant distribution manifold 17 may differ significantly from those shown in the figures, but they will still perform the same function. Furthermore, the cooling block assembly 13 and / or radiator 21 can vary, for example, by having different sizes and / or shapes. The cooling block assembly 13 and / or radiator 21 can be thermally coupled to the first electronic device 5. This can be achieved, for example, using thermal paste. The radiator 21 can have pins, fins, or other structures of any arrangement to increase surface area. Such fins or pins can have different arrangements than those shown, for example, different sizes and / or shapes. The radiator 21 can have any number of perforated distribution trays 20 connected to any number of sides of the radiator 21. Any number or combination of first electronic devices 5 and second electronic devices 16, and different cooling block assemblies 13 with different numbers of sides and / or perforated distribution trays 20, can be used. Alternative methods of securing the components together can be provided, such as adhesives, rivets, or other forms of connection.

[0059] The coolant distribution manifold 17 can also be replaced by any other method of distributing liquid coolant to multiple sources. For example, multiple liquid coolant conduits 6 can be directly connected to pumps 3, or multiple pumps 3 can each be connected to a separate liquid coolant conduit 6. The base 19 can be angled or otherwise arranged to guide or facilitate the return of used liquid coolant to the liquid coolant reservoir 4 under gravity for recycling or reuse. Alternatively, additional pumps and conduits can be provided to return liquid coolant to the liquid coolant reservoir 4.

[0060] A method for manufacturing and / or operating any of the devices disclosed herein is also provided. This method may include the steps of providing each disclosed feature and / or configuring the respective feature for its stated function.

[0061] All features disclosed herein can be combined in any combination, except for combinations in which at least some of such features and / or steps are mutually exclusive. In particular, preferred features of each aspect generally apply to all aspects of this disclosure, and features of all aspects can be used in any combination. Similarly, features described in non-essential combinations can be used alone (without combination).

Claims

1. A cooling module for an electronic device, comprising: A container that houses at least one first electronic device; Liquid coolant storage tank; A pump, located within the liquid coolant reservoir, is configured to pump liquid coolant from the liquid coolant reservoir to the at least one first electronic device via a liquid coolant conduit to provide cooling for the device; The liquid coolant reservoir includes a heating element that is communicatively connected to a controller, which is communicatively connected to a temperature sensor disposed within the liquid coolant reservoir.

2. The electronic device cooling module according to claim 1, wherein, The container includes a coolant manifold configured to receive liquid coolant from the liquid coolant reservoir via the pump, and the coolant manifold is configured to distribute the liquid coolant to a plurality of first electronic devices disposed within the container, each electronic device being connected to the coolant manifold via a corresponding liquid coolant conduit.

3. The electronic device cooling module according to claim 1 or 2, wherein, The pump is communicatively connected to the controller.

4. The electronic device cooling module according to any one of the preceding claims, wherein, The first electronic device or each of the first electronic devices is thermally coupled to a corresponding cooling block assembly, the cooling block assembly being in fluid communication with the liquid coolant conduit or each of the liquid coolant conduits.

5. The electronic device cooling module according to claim 4, wherein, The cooling block assembly or each cooling block assembly is configured to allow liquid coolant to overflow from inside the cooling block assembly into the container.

6. The electronic device cooling module according to claim 5, wherein, Liquid coolant overflowing from the cooling block assembly or each cooling block assembly is directed to at least one adjacent second electronic device.

7. The electronic device cooling module according to claim 6, wherein, Liquid coolant overflowing from the cooling block assembly or each cooling block assembly is directed via a porous dispensing tray to the at least one adjacent second electronic device.

8. The electronic device cooling module according to claim 7, wherein, The porous distribution tray is in direct liquid contact with the corresponding cooling block assembly.

9. The electronic device cooling module according to any one of the preceding claims, wherein, The at least one first electronic device is a central processing unit (CPU) or a graphics processing unit (GPU).

10. The electronic device cooling module according to any one of claims 6 to 8, wherein, The at least one adjacent second electronic device is a dual in-line memory module (DIMM).

11. The electronic device cooling module according to claim 5, wherein, The cooling block assembly is a radiator or a coolant cold plate device.

12. The electronic device cooling module according to any one of the preceding claims, wherein, The container includes a base configured to cause liquid coolant within the container to flow to the liquid coolant reservoir.

13. The electronic device cooling module according to claim 12, wherein, The liquid coolant reservoir is a collection tank formed in the base of the container.

14. The electronic device cooling module according to any one of the preceding claims, wherein, The controller is configured to receive a temperature indication of the liquid coolant in the liquid coolant reservoir from the temperature sensor, and to control the heating element based on the received temperature indication.

15. The electronic device cooling module according to claim 14, wherein, The controller is configured to activate the heating element when the received temperature indication is lower than the preset activation temperature, and deactivate the heating element when the liquid coolant temperature is higher than the preset shutdown temperature.

16. The electronic device cooling module according to claim 14 or 15, wherein, when it is subordinate to claim 3, The controller is also configured to activate the pump when the received temperature indication reaches at least a preset pumping temperature, so as to guide the liquid coolant from the liquid coolant reservoir to the at least one electronic device.

17. A method for cooling an electronic device, the electronic device being enclosed within an electronic device cooling module, the electronic device cooling module comprising a container housing at least one first electronic device and a liquid coolant reservoir, wherein the method comprises: The temperature of the liquid coolant in the liquid coolant reservoir is monitored by a temperature sensor installed inside the liquid coolant reservoir; When the temperature of the liquid coolant is lower than the preset activation temperature, the heating element in the liquid coolant reservoir is activated, and when the liquid coolant is at or above the preset shutdown temperature, the heating element is deactivated. When the temperature of the liquid coolant reaches at least the preset pumping temperature, the pump located in the liquid coolant reservoir is activated to guide the liquid coolant from the liquid coolant reservoir to the at least one electronic device; The at least one electronic device is cooled by liquid coolant received from the liquid coolant reservoir via a liquid coolant conduit.

18. The method for cooling electronic equipment according to claim 17, wherein, Temperature monitoring, heating element activation / deactivation, and pump activation / deactivation are controlled by a control device located within the cooling module of the electronic device.

19. The method for cooling electronic equipment according to claim 17 or 18, wherein, The liquid coolant received by the at least one first electronic device is directed to at least one adjacent second electronic device after cooling the at least one first electronic device.

20. The method for cooling an electronic device according to any one of claims 17 to 19, wherein, Liquid coolant received from the liquid coolant reservoir via the liquid coolant conduit is recycled by returning to the liquid coolant reservoir under gravity.

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