Grinding tool and machining method of plasma confinement ring

CN121893166APending Publication Date: 2026-04-21CHANGSHA HUASHI SEMICON CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
CHANGSHA HUASHI SEMICON CO LTD
Filing Date
2026-03-26
Publication Date
2026-04-21

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Abstract

The invention discloses a grinding tool and a machining method of a plasma confinement ring, the grinding tool is used for grinding an annular cavity in the plasma confinement ring, the grinding tool comprises a tool handle, a mounting part and a grinding wheel, and the tool handle is used for being connected with a rotating shaft of an external driving mechanism; the first side face and the second side face are oppositely arranged in the axial direction of the mounting part, and the first side face is connected with the cutter handle; the grinding wheel is arranged on the peripheral side of the mounting part in a sleeving mode and provided with a first end and a second end which are oppositely arranged in the axial direction of the mounting part, the first end protrudes out of the first side face, the end face of the first end is obliquely arranged relative to the first side face, the second end protrudes out of the second side face, and the end face of the second end is obliquely arranged relative to the second side face. According to the embodiment of the invention, the problem of large fluctuation of the grinding roughness of the inner wall surface of the plasma confinement ring can be reduced, and the uniform and consistent surface roughness with low numerical value can be stably and reliably obtained.
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Citation Information

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