Heat spreader and electronic equipment
By covering the capillary channels of the heat exchanger with thin metal sheets with good thermal conductivity, the problem of space occupation by the capillary structure is solved, enabling rapid vapor diffusion and efficient reflux of liquid working fluid, thus improving heat transfer efficiency.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI MORUAN COMM TECH
- Filing Date
- 2026-03-18
- Publication Date
- 2026-06-30
AI Technical Summary
The capillary structure formed by copper powder sintering or copper mesh stacking will occupy a large amount of the effective space inside the vacuum chamber, reduce the cross-sectional area of the steam flow channel, and hinder the rapid diffusion and condensation reflux of steam.
A thin metal sheet with good thermal conductivity is used as the first heat-conducting foil, which is covered on the capillary channel to form a capillary structure. This avoids filling the vacuum cavity, significantly expands the cross-sectional area of the vapor flow channel, and provides capillary driving force through micropores to guide the reflux of the liquid working fluid in a directional manner.
It improves the rapid diffusion capability of steam and the reflux efficiency of liquid working fluid, reduces flow resistance, and enhances the heat transfer efficiency of the heat spreader.
Smart Images

Figure CN121908533B_ABST