Heat spreader and electronic equipment

By covering the capillary channels of the heat exchanger with thin metal sheets with good thermal conductivity, the problem of space occupation by the capillary structure is solved, enabling rapid vapor diffusion and efficient reflux of liquid working fluid, thus improving heat transfer efficiency.

CN121908533BActive Publication Date: 2026-06-30SHANGHAI MORUAN COMM TECH

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SHANGHAI MORUAN COMM TECH
Filing Date
2026-03-18
Publication Date
2026-06-30

AI Technical Summary

Technical Problem

The capillary structure formed by copper powder sintering or copper mesh stacking will occupy a large amount of the effective space inside the vacuum chamber, reduce the cross-sectional area of ​​the steam flow channel, and hinder the rapid diffusion and condensation reflux of steam.

Method used

A thin metal sheet with good thermal conductivity is used as the first heat-conducting foil, which is covered on the capillary channel to form a capillary structure. This avoids filling the vacuum cavity, significantly expands the cross-sectional area of ​​the vapor flow channel, and provides capillary driving force through micropores to guide the reflux of the liquid working fluid in a directional manner.

Benefits of technology

It improves the rapid diffusion capability of steam and the reflux efficiency of liquid working fluid, reduces flow resistance, and enhances the heat transfer efficiency of the heat spreader.

✦ Generated by Eureka AI based on patent content.

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  • Figure CN121908533B_ABST
    Figure CN121908533B_ABST
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Abstract

This application provides a vapor chamber and electronic device, relating to the field of vapor chamber technology. The vapor chamber includes a housing, a first thermally conductive foil, and a working fluid. The housing has an evaporation zone and a condensation zone, and a receiving cavity with multiple capillary channels on its inner wall. The first thermally conductive foil has multiple first micropores spaced apart and is disposed within the receiving cavity. The first thermally conductive foil is a thin metal sheet extended from a metal with good thermal conductivity. The first thermally conductive foil covers the capillary channels to form a capillary structure, without filling or crowding the receiving cavity, significantly increasing the cross-sectional area of ​​the vapor flow channel to ensure smooth vapor flow within the receiving cavity, reducing flow resistance, and thereby improving the rapid diffusion capability of the vapor. The first thermally conductive foil absorbs and distributes liquid through the first micropores, providing capillary driving force, while the capillary channels directionally guide the liquid working fluid back to the evaporation zone; both work together to ensure reflux efficiency.
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