PCB processing etching spraying device

Abstract

The application relates to the technical field of PCB processing, in particular to a PCB processing etching and spraying device, which comprises a device main body, an upper spraying mechanism and a lower spraying mechanism, the upper spraying mechanism and the lower spraying mechanism both comprise a mounting frame, a plurality of spraying pipes are rotationally installed on the inner side of the mounting frame, a spray head is installed on the side of the spraying pipe facing a conveying mechanism, a connecting frame is installed on one side of the mounting frame, a plurality of connecting blocks are hingedly connected on the two sides of the connecting frame, a first driving mechanism is installed at the top of the upper spraying mechanism, a second driving mechanism is installed on the right side of the lower spraying mechanism, and the first driving mechanism and the second driving mechanism respectively drive the corresponding connecting frames. The PCB processing etching and spraying device, the first driving mechanism controls the spray head on the upper spraying mechanism to swing left and right, the falling points of etching liquid are expanded, etching liquid starts to flow at multiple positions on the plate surface, new etching liquid is timely supplemented, reacted etching liquid is discharged, and the etching efficiency is improved.

Description

Technical Field

[0001] This invention relates to the field of PCB board processing technology, specifically to an etching spray device for PCB board processing. Background Technology

[0002] With the upgrading and rapid expansion of the global electronics market, the miniaturization, high precision, and ultra-fine line printed circuit board (PCB) technology for electronic products is entering a period of rapid development. In order to meet the ever-increasing market demands, especially for ultra-fine line PCB technology, only by developing and improving process capabilities in advance can we enhance our market competitiveness. PCB boards are important electronic components, serving as the support for electronic components and the carrier for the electrical interconnection of electronic components. In PCB manufacturing, etching spraying is a key step in the etching process. It removes the copper foil not protected by the resist layer through a combination of chemical solutions and physical spraying, forming circuit patterns.

[0003] In the process of PCB spray etching, there is a pool effect, which refers to the phenomenon that the flow of etching solution in a local area of ​​the PCB surface is stagnant and slow due to the board structure or chemical dynamics. This is like a stagnant pool. As a result, the chemical reactants (fresh etching solution) in this area cannot be replenished in time, and the products (waste liquid containing dissolved copper) cannot be discharged in time, thus resulting in uneven etching rate.

[0004] To address the aforementioned issues, we have made improvements and proposed an etching spray device for PCB board processing. Summary of the Invention

[0005] To solve the above-mentioned technical problems, the present invention provides the following technical solution:

[0006] This invention provides a PCB board etching spraying device, comprising a main body, a conveying mechanism mounted in the middle of the main body, an upper spraying mechanism and a lower spraying mechanism mounted on the upper and lower sides of the conveying mechanism respectively, a suction pipe mounted on the outer side of the upper spraying mechanism, and multiple suction nozzles mounted on the suction pipe, both the upper and lower spraying mechanisms including a mounting frame, multiple spraying pipes rotatably mounted on the inner side of the mounting frame, a nozzle mounted on the side of the spraying pipe facing the conveying mechanism, a connecting frame mounted on one side of the mounting frame, multiple connecting blocks hinged to both sides of the connecting frame, and the connecting blocks fixedly mounted on the ends of the spraying pipes, a first driving mechanism mounted at the top of the upper spraying mechanism, and a second driving mechanism mounted on the right side of the lower spraying mechanism, the first driving mechanism and the second driving mechanism respectively driving the corresponding connecting frame.

[0007] As a preferred embodiment of the present invention, the first driving mechanism includes a connecting pipe and a side passage pipe. The connecting pipe and the side passage pipe are installed at the end of the suction pipe, and the end of the side passage pipe away from the suction pipe is connected to the connecting pipe. An insert is fixedly installed inside the side passage pipe, and a closing block is provided inside the insert. A limit rod is fixedly connected to the middle of the closing block, and the limit rod extends through to the right side of the side passage pipe. A connector is fixedly connected to the right end of the limit rod, and the connector is hinged to the connecting frame.

[0008] As a preferred embodiment of the present invention, a spring is sleeved on the outer side of the limiting rod, and the two ends of the spring are fixedly connected to the outer wall of the connector and the side tube, respectively.

[0009] As a preferred embodiment of the present invention, a guide rod is fixedly connected inside the side tube, and the guide rod is inserted into the interior of the limiting rod.

[0010] As a preferred embodiment of the present invention, the second driving mechanism includes a connecting rod, which is hinged to the right side of the connecting frame and slidably installed at the bottom end of the lower spray mechanism. A fixing frame is fixedly installed at the bottom end of the lower spray mechanism, and a gear is rotatably installed at the end of the fixing frame. A rack is meshed with the top end of the gear, and the rack is fixedly installed at the bottom end of the connecting rod.

[0011] As a preferred embodiment of the present invention, a rocker arm is fixedly mounted on the front end of the gear, and a drive rod is hinged to the end of the rocker arm.

[0012] As a preferred embodiment of the present invention, a liquid collection tank is installed at the bottom of the lower spraying mechanism, an inlet pipe is installed at the bottom of the liquid collection tank, a cylinder is installed at the end of the inlet pipe, a partition block is slidably installed inside the cylinder, and the top of the partition block is hinged to the drive rod, an outlet pipe is installed at the bottom of the cylinder, and an elastic telescopic rod is installed at the bottom of the partition block.

[0013] As a preferred embodiment of the present invention, the inner diameter of the connecting pipe gradually increases from the position where it communicates with the side pipe.

[0014] As a preferred embodiment of the present invention, the top end of the cylinder is provided with a through hole, and the drive rod passes through the through hole.

[0015] As a preferred embodiment of the present invention, the nozzle on the lower spray mechanism is flat, and the direction of the flatness is perpendicular to the movement direction of the connecting frame.

[0016] The beneficial effects of this invention are:

[0017] 1. A PCB board etching spraying device, wherein the etching solution flows slowly on the board surface, the suction pipe draws in a portion of the etching solution from the board surface through the suction nozzle, providing a position for the flow of the etching solution, and the first drive mechanism controls the nozzle on the upper spraying mechanism to swing left and right, expanding the landing point of the etching solution, so that the etching solution begins to flow at multiple positions on the board surface, further promoting the flow of the etching solution on the board surface, timely replenishing new etching solution, and draining the etching solution after the reaction, thereby improving the etching efficiency and ensuring the etching effect of the PCB board, avoiding severe side etching in some areas and incomplete etching in some areas.

[0018] 2. A PCB board processing etching spraying device, wherein etching solution is collected in a collection tank, then enters a cylinder through an inlet pipe, and concentrates on the top of a separator block. As the etching solution accumulates, the total mass on the separator block increases, gradually compressing the elastic telescopic rod until the separator block moves below the outlet pipe, the etching solution is discharged from the outlet pipe, the mass on the separator block decreases again, and the elastic telescopic rod returns to its original position. During this process, the up and down movement of the separator block causes the drive rod to reciprocate up and down. The reciprocating up and down movement of the drive rod drives the rocker arm to swing, thereby controlling the reciprocating rotation of the gear. The rotating gear drives the rack to move the connecting rod at the bottom of the lower spraying mechanism, thereby driving the connecting frame on the lower spraying mechanism to move, causing the nozzle on the lower spraying mechanism to swing left and right, expanding the landing point of the etching solution. Attached Figure Description

[0019] The accompanying drawings are provided to further illustrate the invention and form part of the specification. They are used in conjunction with embodiments of the invention to explain the invention and do not constitute a limitation thereof. In the drawings:

[0020] Figure 1 This is a perspective view of an etching spray device for PCB board processing according to the present invention;

[0021] Figure 2 This is an internal schematic diagram of an etching spray device for PCB board processing according to the present invention;

[0022] Figure 3 This is a schematic diagram of the spray mechanism of a PCB board processing etching spray device according to the present invention;

[0023] Figure 4 This is a schematic diagram of the liquid suction mechanism of a PCB board processing etching spray device according to the present invention;

[0024] Figure 5 This invention relates to an etching spray device for PCB board processing. Figure 4 Enlarged view of point A in the middle;

[0025] Figure 6 This is a schematic diagram of the liquid collection tank of an etching spray device for PCB board processing according to the present invention;

[0026] Figure 7 This invention relates to an etching spray device for PCB board processing. Figure 6 Enlarged view at point B in the middle;

[0027] Figure 8 This is a schematic diagram of the elastic telescopic rod of a PCB board etching spray device according to the present invention;

[0028] In the diagram: 1. Main body of the equipment; 2. Conveying mechanism; 3. Upper spraying mechanism; 4. Lower spraying mechanism; 5. Mounting frame; 6. Spray pipe; 7. Nozzle; 8. Connecting block; 9. Connecting frame; 10. Suction pipe; 11. Side pipe; 12. Suction nozzle; 13. Connecting pipe; 14. Connector; 15. Guide rod; 16. Insertion tube; 17. Closing block; 18. Spring; 19. Limiting rod; 20. Collection tank; 21. Connecting rod; 22. Inlet pipe; 23. Cylinder; 24. Drive rod; 25. Rocker arm; 26. Gear; 27. Rack; 28. Fixing frame; 29. ​​Outlet pipe; 30. Divider block; 31. Elastic telescopic rod. Detailed Implementation

[0029] The preferred embodiments of the present invention will be described below with reference to the accompanying drawings. It should be understood that the preferred embodiments described herein are for illustration and explanation only and are not intended to limit the present invention.

[0030] Example: Figure 1 - Figure 8 As shown, a PCB board processing etching spraying device includes a main body 1. A conveying mechanism 2 is installed in the middle of the main body 1. An upper spraying mechanism 3 and a lower spraying mechanism 4 are installed on the upper and lower sides of the conveying mechanism 2, respectively. A suction pipe 10 is installed on the outer side of the upper spraying mechanism 3. Multiple suction nozzles 12 are installed on the suction pipe 10. Both the upper spraying mechanism 3 and the lower spraying mechanism 4 include a mounting frame 5. Multiple spraying pipes 6 are rotatably installed on the inner side of the mounting frame 5. A nozzle 7 is installed on the side of the spraying pipe 6 facing the conveying mechanism 2. A connecting frame 9 is installed on one side of the mounting frame 5. Multiple connecting blocks 8 are hinged on both sides of the connecting frame 9, and the connecting blocks 8 are fixedly installed on the ends of the spraying pipes 6. A first driving mechanism is installed at the top of the upper spraying mechanism 3, and a second driving mechanism is installed on the right side of the lower spraying mechanism 4. The first driving mechanism and the second driving mechanism drive the corresponding connecting frame 9, respectively. The suction pipe 10 is connected to the pump body, and the spraying pipes 6 are connected to the pump body in the etching solution through pipes.

[0031] The PCB board enters the main body 1 of the equipment under the action of the conveying mechanism 2. When it reaches the area between the upper spraying mechanism 3 and the lower spraying mechanism 4, the upper spraying mechanism 3 and the lower spraying mechanism 4 work, spraying out etching liquid and acting on the surface of the PCB board to etch the copper sheets. During etching, the etching liquid flows slowly on the board surface. The suction pipe 10 sucks up part of the etching liquid on the board surface through the suction nozzle 12, providing a position for the flow of the etching liquid. The first drive mechanism controls the nozzle 7 on the upper spraying mechanism 3 to swing left and right, expanding the landing point of the etching liquid, so that the etching liquid starts to flow at multiple positions on the board surface, further promoting the flow of the etching liquid on the board surface, replenishing new etching liquid in time, and draining the etching liquid after the reaction, improving the etching efficiency and ensuring the etching effect of the PCB board, avoiding severe side etching in some areas and incomplete etching in some areas. The second drive mechanism causes the nozzle 7 of the lower spraying mechanism 4 to swing, expanding the landing point of the etching liquid, so that the copper sheets on the lower surface of the PCB board are etched more evenly.

[0032] Specifically, such as Figure 4 and Figure 5 As shown, the first driving mechanism includes a connecting pipe 13 and a side passage pipe 11. The connecting pipe 13 and the side passage pipe 11 are installed at the ends of the suction pipe 10, and the end of the side passage pipe 11 away from the suction pipe 10 is connected to the connecting pipe 13. An insert pipe 16 is fixedly installed inside the side passage pipe 11, and a closing block 17 is provided inside the insert pipe 16. A limit rod 19 is fixedly connected to the middle of the closing block 17, and the limit rod 19 extends to the right side of the side passage pipe 11. A connector 14 is fixedly connected to the right end of the limit rod 19, and the connector 14 is hinged to the connecting frame 9. A spring 18 is sleeved on the outside of the limit rod 19, and the two ends of the spring 18 are fixedly connected to the outer walls of the connector 14 and the side passage pipe 11, respectively. The inner diameter of the connecting pipe 13 gradually increases from the position where it communicates with the side passage pipe 11. The pump body passes through the connecting pipe 13 and the side passage pipe 11. The suction tube 10 draws in the etching solution through the suction nozzle 12. The pump operates, and the etching solution flows within the suction tube 10 and the connecting tube 13. As the inner diameter of the connecting tube 13 gradually increases, and the change in inner diameter occurs at the junction of the side tube 11 and the connecting tube 13, the pressure difference between the two ends of the side tube 11 under specific power conditions will push the closing block 17 to move along the insertion tube 16, creating a gap between the closing block 17 and the insertion tube 16. The etching solution will then enter the connecting tube 13 along the side tube 11. At this time, the limiting rod 19 will reciprocate left and right under the action of the etching solution and the spring 18, which in turn drives the connecting frame 9 to move left and right through the connector 14, causing the spray tube 6 and the nozzle 7 to swing left and right, expanding the landing point of the etching solution on the PCB board, and making the etching solution evenly applied to the PCB board etching.

[0033] Furthermore, such as Figure 5As shown, a guide rod 15 is fixedly connected inside the side passage pipe 11, and the guide rod 15 is inserted into the inside of the limiting rod 19. The limiting rod 19 moves along the guide rod 15 to ensure the stability of the movement of the limiting rod 19.

[0034] Specifically, such as Figure 6 and Figure 7 As shown, the second driving mechanism includes a connecting rod 21, which is hinged to the right side of the connecting frame 9 and slidably mounted on the bottom end of the lower spray mechanism 4. The connecting rod 21 is a hinged rod. A fixed frame 28 is fixedly mounted on the bottom end of the lower spray mechanism 4. A gear 26 is rotatably mounted on the end of the fixed frame 28. A rack 27 is meshed with the top of the gear 26 and is fixedly mounted on the bottom end of the connecting rod 21. By driving the rotation of the gear 26, the rotating gear 26 drives the rack 27 to move the connecting rod 21 at the bottom of the lower spray mechanism 4, thereby driving the connecting frame 9 on the lower spray mechanism 4 to move, causing the nozzle 7 on the lower spray mechanism 4 to swing left and right, expanding the landing point of the etching solution.

[0035] Furthermore, such as Figure 7 and Figure 8 As shown, a rocker arm 25 is fixedly mounted on the front end of gear 26, and a drive rod 24 is hinged to the end of the rocker arm 25. A liquid collection tank 20 is mounted on the bottom end of the lower spray mechanism 4, and an inlet pipe 22 is mounted on the bottom of the liquid collection tank 20. A cylinder 23 is mounted on the end of the inlet pipe 22. A partition block 30 is slidably mounted inside the cylinder 23, and the top of the partition block 30 is hinged to the drive rod 24. An outlet pipe 29 is mounted on the bottom of the cylinder 23, and an elastic telescopic rod 31 is mounted on the bottom of the partition block 30. A through hole is opened at the top of the cylinder 23, and the drive rod 24 passes through the through hole. The etching solution is sprayed onto the PCB board and then falls into the liquid collection tank 24 under the action of gravity. Within the 0, the etching solution is collected in the collection tank 20, and then enters the cylinder 23 along the inlet pipe 22, concentrating on the top of the separator block 30. As the etching solution accumulates, the total mass on the separator block 30 increases, gradually compressing the elastic telescopic rod 31 until the separator block 30 moves below the outlet pipe 29, the etching solution is discharged from the outlet pipe 29, the mass on the separator block 30 decreases again, and the elastic telescopic rod 31 returns to its original position. During this process, the up and down movement of the separator block 30 causes the drive rod 24 to reciprocate up and down, and the reciprocating up and down movement of the drive rod 24 drives the rocker arm 25 to swing, thereby controlling the reciprocating rotation of the gear 26.

[0036] Furthermore, the nozzle 7 on the lower spray mechanism 4 is flat, and the direction of the flatness is perpendicular to the movement direction of the connecting frame 9. The flat nozzle 7 makes the etching liquid sprayed on the PCB board in a line. By swinging the nozzle 7 left and right, the etching liquid is washed on the PCB surface in the form of a surface.

[0037] Working principle: The PCB board enters the interior of the main body 1 under the action of the conveying mechanism 2. When it reaches the space between the upper spraying mechanism 3 and the lower spraying mechanism 4, the upper spraying mechanism 3 and the lower spraying mechanism 4 work to spray out etching liquid and act on the surface of the PCB board to perform etching operation on the copper sheet.

[0038] During etching, the etching solution flows slowly on the board surface. The suction pipe 10 draws up part of the etching solution on the board surface through the suction nozzle 12, providing a location for the flow of the etching solution and promoting the flow of the etching solution on the board surface.

[0039] During the process of suction nozzle 12 absorbing etching solution, the etching solution flows in suction pipe 10 and connecting pipe 13. As the inner diameter of connecting pipe 13 gradually increases, and the position of the inner diameter change is at the connection between side pipe 11 and connecting pipe 13, when the pump body is under specific power conditions, the pressure difference between the two ends of side pipe 11 will push closing block 17 to move along insertion pipe 16, so that closing block 17 and insertion pipe 16 will have a gap, and etching solution will enter connecting pipe 13 along side pipe 11. At this time, limit rod 19 will reciprocate left and right under the action of etching solution and spring 18, and then drive connecting frame 9 to move left and right through connector 14, so that spray pipe 6 and nozzle 7 swing left and right, expand the landing point of etching solution on PCB board, so that etching solution is evenly applied to PCB board etching, so that etching solution starts to flow at multiple positions on the board surface, further promoting the flow of etching solution on the board surface, timely replenishing new etching solution, draining the etching solution after reaction, and improving etching efficiency.

[0040] The etching solution is sprayed onto the PCB board and then falls into the collection tank 20 under gravity. The etching solution is collected in the collection tank 20 and then enters the cylinder 23 along the inlet pipe 22, concentrating on the top of the separator block 30. As the etching solution accumulates, the total mass on the separator block 30 increases, gradually compressing the elastic telescopic rod 31 until the separator block 30 moves below the outlet pipe 29, the etching solution is discharged from the outlet pipe 29, the mass on the separator block 30 decreases again, and the elastic telescopic rod 31 returns to its original position. During this process, the up and down movement of the separator block 30 causes the drive rod 24 to reciprocate up and down. The reciprocating up and down movement of the drive rod 24 drives the rocker arm 25 to swing, which in turn controls the reciprocating rotation of the gear 26. The rotating gear 26 drives the rack 27 to move the connecting rod 21 at the bottom of the lower spray mechanism 4, which in turn drives the connecting frame 9 on the lower spray mechanism 4 to move, causing the nozzle 7 on the lower spray mechanism 4 to swing left and right, expanding the landing point of the etching solution.

[0041] Finally, it should be noted that the above descriptions are merely preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A PCB board etching spraying device, comprising a main body (1), characterized in that, A conveying mechanism (2) is installed in the middle of the main body (1) of the equipment. An upper spraying mechanism (3) and a lower spraying mechanism (4) are installed on the upper and lower sides of the conveying mechanism (2), respectively. A suction pipe (10) is installed on the outer side of the upper spraying mechanism (3). Multiple suction nozzles (12) are installed on the suction pipe (10). Both the upper spraying mechanism (3) and the lower spraying mechanism (4) include a mounting frame (5). Multiple spraying pipes (6) are rotatably installed on the inner side of the mounting frame (5). A nozzle (7) is installed on the side of the spraying pipe (6) facing the conveying mechanism (2). A connecting frame (9) is installed on one side of the mounting frame (5). Multiple connecting blocks (8) are hinged on both sides of the connecting frame (9). The connecting blocks (8) are fixedly installed at the end of the spraying pipe (6). A first driving mechanism is installed at the top of the upper spraying mechanism (3). A second driving mechanism is installed on the right side of the lower spraying mechanism (4). The first driving mechanism and the second driving mechanism drive the corresponding connecting frame (9) respectively. The first driving mechanism includes a connecting pipe (13) and a side-through pipe (11). The connecting pipe (13) and the side-through pipe (11) are installed at the ends of the suction pipe (10), and the end of the side-through pipe (11) away from the suction pipe (10) is connected to the connecting pipe (13). An insertion tube (16) is fixedly installed inside the side-through pipe (11), and a closing block (17) is provided inside the insertion tube (16). A limit rod (19) is fixedly connected to the middle of the closing block (17), and the limit rod (19) 19) Penetrating to the right side of the side tube (11), the right end of the limiting rod (19) is fixedly connected to a connector (14), and the connector (14) is hinged to the connecting frame (9); a spring (18) is sleeved on the outside of the limiting rod (19), and the two ends of the spring (18) are fixedly connected to the connector (14) and the outer wall of the side tube (11) respectively; a guide rod (15) is fixedly connected inside the side tube (11), and the guide rod (15) is inserted into the inside of the limiting rod (19); The second drive mechanism includes a connecting rod (21), which is hinged to the right side of the connecting frame (9) and slidably mounted on the bottom end of the lower spray mechanism (4). A fixing frame (28) is fixedly mounted on the bottom end of the lower spray mechanism (4), and a gear (26) is rotatably mounted on the end of the fixing frame (28). A rack (27) is meshed with the top end of the gear (26), and the rack (27) is fixedly mounted on the bottom end of the connecting rod (21). A rocker arm (25) is fixedly mounted on the front end of the gear (26). The rocker arm (25) is hinged to a drive rod (24); the bottom end of the lower spraying mechanism (4) is equipped with a liquid collection tank (20), the bottom of the liquid collection tank (20) is equipped with an inlet pipe (22), the end of the inlet pipe (22) is equipped with a cylinder (23), a partition block (30) is slidably installed inside the cylinder (23), and the top of the partition block (30) is hinged to the drive rod (24). The bottom of the cylinder (23) is equipped with an outlet pipe (29), and the bottom of the partition block (30) is equipped with an elastic telescopic rod (31).

2. The PCB board etching spray device according to claim 1, characterized in that, The inner diameter of the connecting pipe (13) gradually increases from the position where it connects with the side pipe (11).

3. The PCB board etching spray device according to claim 1, characterized in that, The top end of the cylinder (23) has a through hole, and the drive rod (24) passes through the through hole.

4. The PCB board etching spray device according to claim 1, characterized in that, The nozzle (7) on the lower spray mechanism (4) is flat, and the direction of the flatness is perpendicular to the movement direction of the connecting frame (9).

Images