Repair device, defect processing system, defect processing device, and repair method

Abstract

This repairing device is a device for repairing a defective part (94) of a pattern (93) formed on the upper surface (91) of a substrate (9). The substrate holding portion holds a substrate (9) having a pattern (93) formed on an upper surface (91). The application unit (32) applies a droplet-like conductive paste to the defect portion (94) of the pattern (93). The curing unit (33) cures the conductive paste by heating and drying the conductive paste. The compression unit (34) presses the conductive paste against the substrate (9) while heating the cured conductive paste. As a result, the density of the metal in the repair section provided so as to fill the defect section (94) can be increased.

Description

[0001] [Refer to related applications]

[0002] This application claims the benefit of priority based on Japanese Patent Application JP2024-186748, filed on October 23, 2024, and invokes the entire disclosure of that application. Technical Field

[0003] This invention relates to a technique for repairing defects in patterns formed on the surface of a substrate. Background Technology

[0004] In the past, during the production process of printed circuit boards, the wiring patterns formed on the surface of the substrate were inspected, and substrates deemed defective were repaired. For example, in the case of a broken wire due to a missing portion of the wiring, the broken wire was repaired by applying conductive paste to the missing portion of the wiring and then sintering it.

[0005] On the other hand, Japanese Patent Application Publication No. 2009-251119 (Document 1) discloses a method for repairing defects in wiring in a substrate used in a liquid crystal display. In this repair method, a transfer member having a metal film of a low-melting-point metal disposed on the lower surface of a substrate such as polyimide is brought into close contact with the defect in the wiring. Furthermore, the metal film is melted by irradiating the contact area with a laser through the substrate, thereby forming an alloy layer of the metal film and the wiring to repair the defect.

[0006] However, in the repair method using the aforementioned conductive paste (e.g., copper paste), the density of the repaired area decreases after the solvent in the conductive paste evaporates due to sintering, and the resistance of the repaired area may be higher than that of the wiring near the repaired area. Furthermore, while the repair method in Reference 1 is applicable to cases with very thin wiring, such as liquid crystal displays, it is difficult to apply to cases with thicker wiring, such as printed circuit boards. Summary of the Invention

[0007] This invention relates to a repair device, the purpose of which is to increase the density of metal in the repaired part.

[0008] One aspect of the present invention is a repair device for repairing defects in a pattern formed on the surface of a substrate. The repair device includes: a substrate holding section for holding the substrate on which the pattern is formed; an application section for applying droplet-shaped conductive paste to the defect in the pattern; a curing section for drying the conductive paste by heating it, thereby curing the conductive paste; and a compression section for pressing the cured conductive paste onto the substrate while heating the cured conductive paste.

[0009] According to the present invention, the density of metal in the repaired part can be increased.

[0010] The second embodiment of the present invention is the repair device described in the first embodiment, wherein the repair device further comprises: a removal unit that removes the portion of the conductive paste that has overflowed around the defect by irradiating it with a laser after it has been pressed by the compression unit.

[0011] The third embodiment of the present invention is the repair device described in embodiment one (or embodiment one or embodiment two), wherein the curing part has a gas ejection part that sprays heated gas onto the conductive paste.

[0012] The fourth embodiment of the present invention is the repair device described in embodiment three, wherein the gas is an inactive gas.

[0013] The fifth embodiment of the present invention is the repair device described in embodiment three (or embodiment three or four), wherein the compression section has a rod-shaped compression member, the compression member having its heated tip directly in contact with the conductive paste, and pressing the conductive paste against the substrate. The gas ejection section has gas ejection ports disposed around the compression member. The tip of the compression member is heated by the gas ejected from the gas ejection ports along the compression member.

[0014] The sixth embodiment of the present invention is the repair device described in embodiment one (or embodiment one or embodiment two), wherein the compression section has a rod-shaped compression member, the compression member having its heated tip directly in contact with the conductive paste, and pressing the conductive paste onto the substrate. The curing section shares the compression member with the compression section. With the heated tip of the compression member removed from the conductive paste, the conductive paste is cured using radiant heat from the tip.

[0015] The seventh embodiment of the present invention is the repair device described in embodiment one (or any one of embodiments one to six), wherein the compression section has a rod-shaped compression member, the compression member having its heated tip directly contacting the conductive paste and pressing the conductive paste against the substrate. The conductive particles contained in the compression member and the conductive paste are formed of the same type of metal.

[0016] The eighth embodiment of the present invention is the repair device described in embodiment one (or any one of embodiments one to seven), wherein the application of the conductive paste by the applying part, the curing of the conductive paste by the curing part, and the pressing of the conductive paste by the compression part are all performed in an inactive gas environment.

[0017] The ninth embodiment of the present invention is the repair device described in embodiment one (or any one of embodiments one to eight), wherein, before the conductive paste is applied to the application portion, a laser is irradiated near the defect portion of the pattern for pretreatment.

[0018] Embodiment 10 of the present invention is a defect processing system that detects and repairs defects in a pattern formed on the surface of a substrate. The defect processing system includes: an inspection device for inspecting a substrate with a pattern on its surface; and a repair device as described in any one of embodiments 1 to 9. The inspection device includes: an image acquisition unit for capturing an image of the substrate and acquiring an image to be inspected; a defect detection unit for detecting defects in the pattern based on the image to be inspected; and an output unit for outputting position information of the defects detected by the defect detection unit to the repair device. The repair device repairs the defects based on the position information of the defects output from the output unit.

[0019] The eleventh embodiment of the present invention is a defect processing apparatus that detects and repairs defects in a pattern formed on the surface of a substrate. The defect processing apparatus comprises: a repair device as described in any one of embodiments one to nine; an image acquisition unit that captures an image of the substrate held by the substrate holding unit of the repair device; and a defect detection unit that detects defects in the pattern based on the image of the defect. The defect is repaired based on the position information of the defect detected by the defect detection unit.

[0020] The twelfth aspect of the present invention is a repair method for repairing defects in a pattern formed on the surface of a substrate, wherein the repair method includes: step a) applying a droplet-shaped conductive paste to the defect in the pattern formed on the surface of the substrate; step b) curing the conductive paste; and step c) pressing the conductive paste onto the substrate while heating the cured conductive paste.

[0021] The above-mentioned objects, as well as other objects, features, methods, and advantages, will become more apparent from the following detailed description of the invention with reference to the accompanying drawings. Attached Figure Description

[0022] Figure 1 This is a side view showing the structure of the repair device according to the first embodiment.

[0023] Figure 2 This is a diagram showing the internal structure of the repair head.

[0024] Figure 3 This is a diagram illustrating an example of the repair process for a damaged area.

[0025] Figure 4 This is a magnified side view showing a portion of the repair head.

[0026] Figure 5 This is a magnified side view showing a portion of the repair head.

[0027] Figure 6 This is a top view showing a portion of the substrate.

[0028] Figure 7 This is a magnified side view showing a portion of the repair head.

[0029] Figure 8 This is a magnified side view showing a portion of the repair head.

[0030] Figure 9 This is a top view showing a portion of the substrate.

[0031] Figure 10 This is a magnified side view showing a portion of the repair head.

[0032] Figure 11 This is a magnified side view showing a portion of the repair head.

[0033] Figure 12 This is a side view showing the structure of the defect handling system.

[0034] Figure 13 This is a diagram showing the structure of the control unit.

[0035] Figure 14 It is a block diagram representing the functions of the control unit.

[0036] Figure 15 This is a side view showing the structure of the defect handling apparatus according to the second embodiment.

[0037] Explanation of reference numerals in the attached figures

[0038] 1 Repair device

[0039] 6 Inspection Device

[0040] 9 substrates

[0041] 10 Defect Handling System

[0042] 21 Substrate Holding Section

[0043] 32. Granted to the Department

[0044] 33Cure Department

[0045] 34 Compression Section

[0046] 35 Removal Section

[0047] 91 (top surface of the substrate)

[0048] 93 pattern

[0049] 94 Defective Parts

[0050] 96 Conductive Paste

[0051] 100 Defect Handling Device

[0052] 331, 331a Gas Ejection Section

[0053] 333a gas outlet

[0054] 341 Compressor

[0055] 632 Image Acquisition Unit

[0056] 802 Defect Detection Department

[0057] 803 Output Section

[0058] Steps S11 to S16 Detailed Implementation

[0059] Figure 1 This is a side view showing the structure of the repair device 1 according to the first embodiment of the present invention. The repair device 1 is a device for repairing defects in a pattern formed on the surface of a substrate 9. Figure 1 In the diagram, three mutually orthogonal directions are represented by arrows as the X, Y, and Z directions. Figure 1 In the example shown, the X and Y directions are horizontal directions that are perpendicular to each other, and the Z direction is a vertical direction (i.e., up and down). The same applies to other figures.

[0060] The substrate 9 is, for example, a generally rectangular flat printed circuit board. In the substrate 9, for example, a circuit pattern formed of a metal such as copper is provided on the surface of a generally rectangular flat substrate made of a composite material containing glass and resin. Furthermore, the type and shape of the substrate 9 can be varied in various ways.

[0061] The repair device 1 includes a substrate holding section 21, a moving mechanism 22, a repair head 3, and a control section 8. The control section 8 has the structure of a typical computer system, including a CPU (Central Processing Unit), a GPU (Graphics Processing Unit), ROM (Read-Only Memory), RAM (Random Access Memory), a mounting disk, a display, an input section, a reading device, a communication section, and a bus. The control section 8 controls the moving mechanism 22, the repair head 3, and other components.

[0062] The substrate holding part 21, the moving mechanism 22, and the repair head 3 are disposed on a generally cuboid base 11. Specifically, the first moving mechanism 23 (described later) of the moving mechanism 22 is fixed to the upper surface of the base 11 (i.e., the main surface on the (+Z) side), and the substrate holding part 21 is supported from the lower side (i.e., the (-Z) side) by the first moving mechanism 23. On the upper surface of the base 11, a gate-shaped support part 12 (so-called gantry) spanning the substrate holding part 21 and the first moving mechanism 23 is erected. The repair head 3 is movably mounted on the beam part 13 extending in the X direction of the support part 12. In other words, the support part 12 supports the repair head 3 so that it can move in the X direction.

[0063] The substrate holding portion 21 is, for example, a generally rectangular flat plate stage located away from the repair head 3 towards the (-Z) side (i.e., the lower side). The substrate holding portion 21 contacts the main surface (i.e., the lower surface) of the substrate 9 on the (-Z) side and holds the substrate 9 by supporting it from below. The substrate holding portion 21 may have, for example, a vacuum chuck (not shown) that adsorbs and holds the lower surface of the substrate 9. Alternatively, the substrate holding portion 21 may have a holding structure other than a vacuum chuck (e.g., a mechanical chuck). The main surface (hereinafter also referred to as "upper surface 91") of the substrate 9 held by the substrate holding portion 21 on the (+Z) side is generally perpendicular to the Z direction and generally parallel to the X and Y directions. A circuit pattern (not shown) formed of a metal such as copper is pre-set on the upper surface 91 (i.e., the surface of the substrate) of the substrate 9.

[0064] The moving mechanism 22 is a mechanism that moves the substrate holding portion 21 relative to the repair head 3 in a horizontal direction (i.e., a direction substantially parallel to the upper surface 91 of the substrate 9). The moving mechanism 22 has a first moving mechanism 23 and a second moving mechanism 24. The first moving mechanism 23 is disposed on the upper surface of the base 11 and moves the substrate holding portion 21 linearly along a guide rail in the Y direction. The second moving mechanism 24 is disposed on the beam portion 13 of the support portion 12 and moves the repair head 3 linearly in the X direction. The drive source for the first moving mechanism 23 and the second moving mechanism 24 is, for example, a linear servo motor, or a drive source with an electric motor mounted on a ball screw. Various modifications can be made to the structure of the first moving mechanism 23 and the second moving mechanism 24.

[0065] Figure 2 This is a diagram showing the internal structure of the repair head 3. Figure 2 In the diagram, the repair head cover 31 of the repair head 3 is depicted in cross-section, and the internal structure of the repair head cover 31 is represented by solid lines. The repair head 3 has an application section 32, a curing section 33, a compression section 34, and a removal section 35. The application section 32, the curing section 33, the compression section 34, and the removal section 35 are housed inside the repair head cover 31. The repair head cover 31 is, for example, a generally cuboid shape with an opening on its lower surface.

[0066] The applicator 32 applies a droplet-shaped conductive paste to the defect 94 of the pattern 93 provided on the upper surface 91 of the substrate 9. Figure 2 In the example shown, an open circuit defect, i.e., a missing portion 94, exists in one of the pattern elements 931 constituting pattern 93. An open circuit defect (i.e., a broken line) refers to a defect where a portion of the pattern element 931 is missing, exposing the substrate 95 at the location where the pattern element 931 should be, thus creating an interruption in the pattern element 931 at that location. The thickness of the pattern element 931 in the Z direction (i.e., the vertical direction) is, for example, 10 μm to 20 μm. The pattern element 931 is, for example, copper (Cu) wiring. The thickness or material of the pattern element 931 can be varied.

[0067] exist Figure 2 In the example shown, the application unit 32 has a dispenser 321 that drips a small amount of conductive paste onto the substrate 9. The conductive paste is formed by dispersing highly conductive metal particles in a solvent with high viscosity (so-called metallic ink). The average particle size of these particles is, for example, 0.5 μm to 5 μm. In this embodiment, tiny droplets of copper paste formed by dispersing copper particles in a solvent are dripped from the dispenser 321 onto the substrate 9. That is, in this embodiment, the metal particles contained in the conductive paste are the same type of metal as those forming the pattern element 931. As the dispenser 321, for example, a pneumatic or mechanical dispenser can be used. Furthermore, in the application unit 32, conductive paste can also be applied to the substrate 9 using a structure other than the dispenser 321.

[0068] The curing section 33 dries the droplets of conductive paste applied to the substrate 9 by heating them, thereby curing the paste. The curing section 33 includes a gas ejection section 331 that ejects heated, high-temperature gas from the droplets of conductive paste onto the substrate 9. The gas ejection section 331 is, for example, a generally cylindrical nozzle that ejects gas from an outlet located at the top (i.e., the lower end) onto the substrate 9. The gas ejection section 331 is connected to a gas supply source (not shown), and gas supplied from the gas supply source is heated and then supplied to the gas ejection section 331. The gas ejected from the gas ejection section 331 is, for example, an inactive gas such as nitrogen (N2). The temperature of the gas ejected from the gas ejection section 331 is, for example, 100°C to 200°C. This gas temperature can be appropriately varied depending on the type of conductive paste or the amount applied to the substrate 9.

[0069] The compression section 34 compresses the conductive paste by pressing it against the substrate 9 while heating the conductive paste cured by the curing section 33. The compression section 34 includes a compression member 341 and a pressing mechanism 342. The compression member 341 is a rod-shaped (e.g., generally cylindrical) member extending substantially parallel to the Z-direction. The pressing mechanism 342 is a mechanism that moves the compression member 341 along the Z-direction. The pressing mechanism 342 is, for example, a cylinder that uses the pressure of air supplied to its interior to move the compression member 341 in the (-Z) direction and press it against the substrate 9. Alternatively, the pressing mechanism 342 may be a mechanism other than a cylinder. The compression member 341 is formed of, for example, a metal of the same type as the conductive particles (i.e., metal particles) contained in the conductive paste. In this embodiment, the compression member 341 is formed of copper.

[0070] The compression member 341 is heated, for example, by an electric heater disposed inside the compression member 341 or the pressing mechanism 342. Alternatively, the compression member 341 can be heated by supplying heated gas to the compression member 341 from the gas ejection section 331 of the curing section 33. Heating of the compression member 341 can also be performed by various other methods. In the compression member 341, the tip (i.e., the lower end) of the conductive paste that is in direct contact with and pressed is heated to, for example, 160°C to 180°C and maintained within this temperature range. The temperature of the tip of the compression member 341 can be appropriately varied depending on the type of conductive paste or the amount of conductive paste applied to the substrate 9.

[0071] The removal section 35 irradiates the portion of the conductive paste that has overflowed around the defective portion 94 after being pressed by the compression section 34 with a laser, thereby removing the exposed portion from the substrate 9.

[0072] On substrate 9, the remaining conductive paste overflowing from the defect 94 is removed by laser ablation using laser irradiation. Specifically, conductive paste overflowing to the side of the defect 94 when viewed from above is removed by laser irradiation of removal section 35. Additionally, excess conductive paste adhering to existing pattern elements 931 near the defect 94 is also removed by laser irradiation of removal section 35. Laser light source 351 is, for example, an LD (Laser Diode). Alternatively, laser light source 351 can be a light source other than an LD.

[0073] The imaging device 352 is positioned on the (+Z) side of the optical element 353, and captures an image of the upper surface 91 of the substrate 9 via the optical element 353. Specifically, illumination light from an illumination source (not shown) shines onto the upper surface 91 of the substrate 9, and the illumination light reflected from the upper surface 91 of the substrate 9 (i.e., reflected light) is received by the imaging device 352 via the optical element 353. The image captured by the imaging device 352 is sent to the control unit 8 (see reference 8). Figure 1The image is compared with design data such as CAD (Computer Aided Design) data of wiring patterns pre-stored in the control unit 8. In the control unit 8, based on the comparison result between the captured image and the design data, the area on the substrate 9 that is laser-irradiated by the removal unit 35 is controlled to prevent other pattern elements 931 adjacent to the pattern element 931 with the defect 94 from being erroneously removed by the removal unit 35.

[0074] In the repair device 1, before the conductive paste is applied to the application section 32, a laser emitted from the laser source 351 is irradiated onto a portion near the defect 94 in the pattern element 931 having the defect 94, thereby enabling a pretreatment to remove the metal oxide film (e.g., a thin film of copper oxide) present on the surface of that portion.

[0075] Next, refer to Figures 3 to 9 This explains the repair process of the repair device 1 in repairing the damaged part 94. Figure 3 This is a diagram illustrating an example of the repair process for defective part 94. Figure 4 , Figure 5 , Figure 7 and Figure 8 This is a side view, enlarged, showing a portion of the repair head 3 in the repair device 1 during the repair process of the damaged part 94. Figure 2 Similarly, in Figure 4 , Figure 5 , Figure 7 and Figure 8 In the diagram, the repair head cover 31 of the repair head 3 is depicted in cross section, and the internal structure of the repair head cover 31 is represented by solid lines. Figure 6 and Figure 9 This is a top view showing a portion of the substrate 9 during the repair process of the defective part 94.

[0076] When repairing the defect 94 using the repair device 1, firstly, the substrate 9 is inspected using an inspection device (not shown) to obtain the position of the defect 94 (i.e., the coordinates of the defect 94) on the substrate 9. The position information of the defect 94 obtained by the inspection device is sent from the inspection device to the repair device 1 and stored in the control unit 8 (see reference 1). Figure 1 The number of defective units 94 storing location information in the control unit 8 can be one or multiple.

[0077] The defect 94, where the position information is stored in the control unit 8, is not limited to the open-circuit defect described above; it can also be a notch defect or a cutting defect, etc. A notch defect refers to a defect in a localized area of ​​the pattern element 931 where only the upper part of that area is missing, resulting in the pattern element 931 being thinner than its surroundings. A cutting defect refers to a defect in a localized area of ​​the pattern element 931 where a portion of that area in the width direction is missing, resulting in the pattern element 931 being narrower than its surroundings when viewed from above. Furthermore, in the following description, the defect 94 will be described as an open-circuit defect.

[0078] Next, the substrate 9, after being inspected by the aforementioned inspection device, is moved into... Figure 1 The repair device 1 shown is held by the substrate holding part 21 (step S11). When the substrate 9 is held, the moving mechanism 22 is controlled by the control part 8 based on the position information of the damaged part 94 (see reference). Figure 1 The repair head 3 is located above the defect 94. Specifically, as... Figure 4 As shown, the substrate 9 moves relative to the repair head 3 so that the optical axis J1 of the removal part 35 (i.e., the optical axis J1 of the laser emitted from the laser source 351) overlaps with the defect part 94.

[0079] Then, a pretreatment (step S12) is performed by irradiating the area near the defect 94 in the pattern element 931 having the defect 94 with a laser emitted from the laser source 351, thereby removing the metal oxide film (e.g., a thin film of copper oxide) present on the surface of that area. In step S12, the laser is irradiated in particular on the end face of the pattern element 931 constituting the defect 94 to remove the metal oxide film on that end face.

[0080] When the above pretreatment is completed, the substrate 9 is moved relative to the repair head 3 using the moving mechanism 22, so that the dispenser 321 of the dispensing part 32 is positioned vertically above the defective part 94. Then, as Figure 5 As shown, droplets of conductive paste are dispensed from dispenser 321 onto the defect 94, filling the defect 94 with conductive paste 96 (step S13). Figure 6 As shown, since the droplets of conductive paste 96 are larger than the defect 94 of pattern element 931, the conductive paste 96 expands around the defect 94 and adheres to the substrate 95. The shape of the conductive paste 96 in the state of being dropped onto the substrate 9 is, for example, a roughly circular shape with a diameter of about 50 μm when viewed from above. Furthermore, as... Figure 5 As shown, the conductive paste 96 protrudes further towards the (+Z) side than the defect 94 (i.e., further up than the upper surface of the pattern element 931 near the defect 94).

[0081] When the application of conductive paste 96 is completed, heated gas is ejected from the gas ejection section 331 of the curing section 33 onto the conductive paste 96 on the substrate 9, thereby heating the conductive paste 96. As a result, the conductive paste 96 is dried and cured (step S14). The gas applied to the conductive paste 96 in step S14 is, for example, an inactive gas such as nitrogen. This prevents the formation of a metal oxide film on the surface of the cured conductive paste 96 (hereinafter also referred to as "cured paste") and the pattern elements 931 near the cured paste. Furthermore, depending on the positional relationship between the gas ejection section 331 and the conductive paste 96 on the substrate 9, the moving mechanism 22 (see reference 22) can be used between steps S13 and S14. Figure 1 The substrate 9 is moved relative to the repair head 3 so that the heated gas is properly applied to the conductive paste.

[0082] When the curing of the conductive paste 96 (i.e., the formation of the curing paste) is completed, the substrate 9 is moved relative to the repair head 3 by means of the moving mechanism 22, so that the compression member 341 of the compression section 34 is positioned vertically above the defect 94 filled with the curing paste. Then, as Figure 7 As shown, the preheated compression member 341 is moved in the (-Z) direction by the pressing mechanism 342, approaching and contacting the curing paste filling the defect 94 from the (+Z) side. By moving the compression member 341 further in the (-Z) direction, the curing paste is pressed onto the substrate 9 while being heated (step S15).

[0083] As a result, the curing paste is compressed and further filled into the defect 94, increasing the density of the metal particles (e.g., copper particles) in the curing paste within the defect 94. Then, the metal particles within the curing paste fuse with each other, and with the end faces of the pattern elements 931 that are the joined members. Consequently, a repair portion 97 is formed, filling the defect 94 and joining the pattern elements 931 where the defect 94 is located. The repair portion 97 is made of a high-density metal (e.g., copper). The compressed member 341, after pressing, moves upward from the repair portion 97.

[0084] When the repair section 97 is formed, the moving mechanism 22 moves the substrate 9 relative to the repair head 3, thereby... Figure 8 As shown, the optical axis J1 of the removal section 35 is located at a position overlapping with or near the repair section 97. Furthermore, using the imaging device 352, images are taken of the repair section 97 and the area near the repair section 97 on the substrate 9, and the captured images are sent to the control unit 8 (see reference 8). Figure 1 In the control unit 8, by comparing the captured image with the aforementioned design data (e.g., CAD data), it is possible to identify areas where curing paste has overflowed from the defective part 94 (i.e., curing paste that should be removed).

[0085] Subsequently, by controlling the laser light source 351 and the moving mechanism 22 with the control unit 8, the laser is used to irradiate the cured paste overflowing from the defect 94 of the pattern element 931 (i.e., the portion of the cured paste that does not constitute the repair part 97, hereinafter also referred to as "residual cured paste"), as shown. Figure 9 As shown, residual curing paste can be removed from substrate 9 (step S16). Figure 6 As shown, the remaining curing paste includes curing paste that overflows from the defect 94 to the surrounding area when viewed from above. The remaining curing paste also includes curing paste that is attached to the top surface of the pattern element 931 around the defect 94 (i.e., on the (+X) side and the (-X) side), and portions of the curing paste that overlap with the defect 94 when viewed from above that protrude upwards from the upper surface of the pattern element 931.

[0086] Thus, in the repair device 1, the defect 94 of the pattern 93 is filled by the repair part 97, and the repair of the defect 94 is completed by removing the remaining curing paste on the substrate 9.

[0087] Furthermore, the repair device 1 can also repair defects in the pattern 93 other than the missing portion 94. For example, if a short-circuit defect or a protrusion defect is detected in the pattern using the aforementioned inspection device, the location information of these defects is sent to the repair device 1. A short-circuit defect refers to a defect in which wiring material is incorrectly applied to the gap between two adjacent pattern elements 931, causing the two pattern elements 931 to be electrically connected contrary to their intended purpose. A protrusion defect refers to a defect in which a portion of a pattern element 931 erroneously protrudes in the width direction, causing the width of the pattern element 931 to appear larger than its surroundings when viewed from above. In the repair device 1, the removal portion 35 of the repair head 3 is arranged above the short-circuit defect or protrusion defect, and a laser is irradiated onto the area where wiring material has been incorrectly applied. As a result, the incorrectly applied wiring material can be removed from the substrate 9 and the defect can be repaired.

[0088] As explained above, the repair device 1 is an apparatus for repairing defects 94 in the pattern 93 formed on the surface (i.e., the upper surface 91) of the substrate 9. The substrate holding part 21 holds the substrate 9 on which the pattern 93 is formed on the upper surface 91. The applying part 32 applies droplet-shaped conductive paste 96 to the defect 94 of the pattern 93. The curing part 33 dries the conductive paste 96 by heating it, thereby curing it. The compression part 34 presses the cured conductive paste 96 (i.e., the cured paste) onto the substrate 9 while heating it.

[0089] This increases the density of metal in the repair portion 97, which is provided to fill the defect 94. As a result, the resistance of the repair portion 97 can be suppressed in the pattern element 931 where the defect 94 has been repaired. In addition, the bonding strength between the repair portion 97 and the pattern element 931 or the substrate 9 can be increased.

[0090] As described above, preferably, the repair device 1 further includes a removal section 35, which removes the portion of the conductive paste 96 (i.e., the pressed cured paste) that has overflowed around the defect 94 by irradiating it with a laser. In this way, by removing the unwanted portion (i.e., the remaining cured paste) of the conductive paste 96 from the substrate 9 using the removal section 35, the desired shape of the pattern 93 can be achieved.

[0091] As described above, preferably, the curing section 33 has a gas ejection section 331 that ejects heated gas into the conductive paste 96. This allows the conductive paste 96 to cure easily and quickly. Furthermore, preferably, the gas is an inactive gas, thereby preventing the formation of an oxide metal film on the surface of the repair section 97 and the pattern elements 931 near the repair section 97.

[0092] As described above, preferably, the compression section 34 has a rod-shaped compression member 341, which directly contacts the conductive paste 96 (i.e., the curing paste) with its heated tip and presses the conductive paste 96 onto the substrate 9. Furthermore, preferably, the conductive particles contained in the compression member 341 and the conductive paste 96 are formed of the same type of metal. This suppresses contamination of the pattern 93 (e.g., the introduction of impurities) caused by contact with the compression member 341.

[0093] As described above, preferably, in the repair apparatus 1, before applying the conductive paste 96 to the application part 32, a laser is irradiated near the defect 94 of the pattern 93 for pretreatment. This removes or reduces metal oxides present on the surface of the pattern element 931 near the defect 94. As a result, the increase in resistance at the junction of the repair part 97 and the pattern element 931 can be suppressed.

[0094] The repair method described above includes: a step of applying a droplet-shaped conductive paste 96 to the defective portion 94 of the pattern 93 formed on the surface (i.e., the upper surface 91) of the substrate 9 (step S13); a step of curing the conductive paste 96 (step S14); and a step of pressing the cured conductive paste 96 (i.e., the cured paste) onto the substrate 9 while heating it (step S15). Thus, substantially similarly to the above, the density of the metal in the repair portion 97 can be increased.

[0095] In the above example, the curing of the conductive paste 96 (step S14) is performed in an inactive gas environment by using an inactive gas ejected from the gas ejection section 331, while the pretreatment (step S12), applying the conductive paste 96 (step S13), pressing the cured paste (step S15), and removing the remaining cured paste (step S16) are performed in an atmospheric environment, but this is not the only option. For example, the application of the conductive paste 96 by the application section 32, the curing of the conductive paste 96 by the curing section 33, and the pressing of the conductive paste 96 by the compression section 34 (i.e., pressing of the cured paste) can also be performed in an inactive gas environment. This further suppresses the formation of an oxide metal film on the surface of the repair section 97 and the pattern elements 931 near the repair section 97. In addition, the pretreatment performed by the removal section 35 and / or the removal of the remaining cured paste by the removal section 35 can also be performed in an inactive gas environment.

[0096] In the repair device 1, the structure of the repair head 3 is not limited to... Figure 2 The example shown can be modified in various ways. For example, in Figure 2 In the example shown, the compressor 341 and the gas ejector 331 are separately disposed on the (+X) side and (-X) side of the distributor 321, but it is not limited to this; it can also be as follows: Figure 10 It is set up as a single unit as shown. In Figure 10 In the repair head 3a shown, a roughly cylindrical gas ejection section 331a is provided around the compression member 341 instead of a compression member 341. Figure 2 The gas ejection section 331 is shown. The gas ejection section 331a surrounds the generally cylindrical compressor 341 approximately around its entire circumference. Furthermore, Figure 10 The shape, material and configuration of the compression component 341 in the middle are similar to those of the compression component 341 in the Figure 2 The compression component 341 is roughly the same.

[0097] A generally cylindrical gas flow path 332a is provided inside the gas ejection section 331a. This gas flow path 332a directly contacts the outer surface of the compressor 341 approximately around its circumference and extends approximately parallel to the length direction of the compressor 341. A generally annular gas outlet 333a is provided at the lower end of the gas flow path 332a. The gas outlet 333a surrounds the compressor 341 approximately around its circumference and directly contacts the outer surface of the compressor 341. The gas outlet 333a is located higher than the top end (i.e., the lower end) of the compressor 341.

[0098] High-temperature gas ejected from gas outlet 333a flows downward along the outer side of compressor 341 (i.e., the (-Z) side), heating the top of compressor 341 while being applied to conductive paste 96 on substrate 9. The conductive paste 96 is then dried by heating, thereby solidifying it. Additionally, compressor 341 can also be heated by contacting heated gas flowing through gas path 332a inside gas outlet 331a.

[0099] As described above, in the repair head 3a, the compression section 34 has a rod-shaped compression member 341, which directly contacts the conductive paste 96 with its heated tip and presses the conductive paste 96 onto the substrate 9. Furthermore, the gas ejection section 331a has gas ejection ports 333a disposed around the compression member 341. The tip of the compression member 341 can be heated using gas ejected from the gas ejection ports 333a along the compression member 341.

[0100] In the repair head 3a, by making the curing portion 33 of the cured conductive paste 96 also function as the top end of the heating and compression member 341, the structure of the repair head 3a can be simplified. Furthermore, by integrally providing the compression member 341 and the gas ejection portion 331a, the repair head 3a can also be miniaturized. Therefore, the structure of the repair device 1 equipped with the repair head 3a can be simplified, and the repair device 1 can also be miniaturized.

[0101] In the repair apparatus 1, the curing section 33 does not necessarily have a gas ejection section 331, 331a that ejects high-temperature gas; the conductive paste 96 can also be cured by heating it and drying it using other methods. For example, in step S14 above, the pressing mechanism 342 can be used to lower the compression member 341 to approach the conductive paste 96 applied to the substrate 9. The top end of the preheated compression member 341 can be used as follows: Figure 11 As shown, the paste is positioned close to the conductive paste 96 while moving upwards from it. Furthermore, the conductive paste 96 is heated and dried by radiant heat from the top of the compressor 341, thus curing it. In this case, Figure 11 In the repair head 3b shown, the following can be omitted. Figure 2 The gas ejection section 331 is shown in the figure.

[0102] As described above, in the repair head 3b, the compression section 34 has a rod-shaped compression member 341, which directly contacts the conductive paste 96 with its heated tip and presses the conductive paste 96 onto the substrate 9. Furthermore, the curing section 33 shares the compression member 341 with the compression section 34. And, when the heated tip of the compression member 341 leaves the conductive paste 96, the conductive paste 96 cures due to radiant heat from that tip.

[0103] In the repair head 3b, by having the compression member 341 also function as a curing agent for the conductive paste 96, the structure of the repair head 3b can be simplified. Furthermore, compared to the case where the curing section 33 is provided separately from the compression member 341, the repair head 3b can also be miniaturized. Therefore, the structure of the repair device 1 equipped with the repair head 3b can be simplified, and the repair device 1 can also be miniaturized.

[0104] like Figure 12 As shown, the repair device 1 can also be combined with the inspection device 6 to serve as a defect handling system 10. The defect handling system 10 is a system that detects and repairs defects in patterns formed on the surface of the substrate 9.

[0105] Figure 12 The repair device 1 shown has the same as Figure 2 The repair device 1 shown has the same structure. Figure 12 The inspection apparatus 6 shown is an apparatus for inspecting a substrate 9 having a pattern on its surface. The inspection apparatus 6 includes a substrate holding section 621, a moving mechanism 622, a camera 63, and a control section 8a. The moving mechanism 622 includes a first moving mechanism 623 and a second moving mechanism 624. The structure and shape of the substrate holding section 621, the moving mechanism 622, the first moving mechanism 623, and the second moving mechanism 624 are substantially the same as those of the substrate holding section 21, the moving mechanism 22, the first moving mechanism 23, and the second moving mechanism 24 of the repair apparatus 1, respectively. The substrate holding section 621 holds the substrate 9 by supporting it from below. The moving mechanism 622 moves the substrate holding section 621 relative to the camera 63 in a horizontal direction (i.e., a direction substantially parallel to the upper surface 91 of the substrate 9).

[0106] A substrate holding portion 621, a moving mechanism 622, and a camera 63 are disposed on a generally cuboid base 611. Specifically, a first moving mechanism 623 is fixed to the upper surface of the base 611 (i.e., the main surface on the (+Z) side), and the substrate holding portion 621 is supported from below by the first moving mechanism 623. On the upper surface of the base 611, a portal-shaped support portion 612 (so-called a gantry) spanning the substrate holding portion 621 and the first moving mechanism 623 is erected. The camera 63 is mounted on a beam portion 613 extending in the X direction of the support portion 612 in a manner that allows it to move in the X direction. A second moving mechanism 624 is provided on the beam portion 613 of the support portion 612, causing the camera 63 to move linearly in the X direction.

[0107] The camera 63 has a camera cover 631 and an image acquisition unit 632. The image acquisition unit 632 is disposed inside the camera cover 631. The image acquisition unit 632 emits illumination light toward the substrate 9, and by using an imaging sensor or the like to receive the reflected light from the substrate 9, it captures an image of the substrate 9 and obtains an image to be inspected.

[0108] Figure 13 This diagram illustrates the structure of the control unit 8a. The control unit 8a has the structure of a typical computer system, including a CPU 81, GPU 82, ROM 83, RAM 84, a fixed disk 85, a display 86, an input unit 87, a reading device 88, a communication unit 89, and a bus 80. The CPU 81 performs various arithmetic operations. The GPU 82 performs various arithmetic operations related to image processing. The ROM 83 stores the basic program. The RAM 84 stores various information. The fixed disk 85 stores information. The display 86 is a display unit that displays images and other information.

[0109] The input unit 87 includes a keyboard 87a and a mouse 87b for receiving input from the operator. The reading device 88 reads information from a computer-readable recording medium 881, such as an optical disc, magnetic disk, magneto-optical disk, or memory card. The display 86, keyboard 87a, mouse 87b, and reading device 88 are connected to the bus 80 via an interface I / F. The communication unit 89 transmits and receives signals between the control unit 8a and external devices. The bus 80 is a signal circuit connecting the CPU 81, GPU 82, ROM 83, RAM 84, fixed disk 85, display 86, input unit 87, reading device 88, and communication unit 89.

[0110] In the control unit 8a, the program 882 is read from the recording medium 881 via the reading device 88 and stored in the fixed disk 85. The program 882 can be stored in the fixed disk 85 via a network. The CPU 81 and GPU 82 perform arithmetic processing according to the program 882 while utilizing the RAM 84 or the fixed disk 85. The CPU 81 and GPU 82 function as a computing unit in the control unit 8a. In addition to the CPU 81 and GPU 82, other structures that function as computing units can also be used.

[0111] Figure 14 This is a diagram illustrating the functional structure implemented by the control unit 8a performing calculations and other operations according to program 882. Figure 14The structure other than the control unit 8a is also shown. The control unit 8a has a storage unit 801, a defect detection unit 802, and an output unit 803. All or part of these functions can be implemented by dedicated circuitry. Alternatively, these functions can be implemented using multiple computers. The storage unit 801 is mainly implemented by RAM 33 and a fixed disk 85. The defect detection unit 802 and the output unit 803 are implemented by CPU 81, GPU 82, ROM 83, RAM 84, fixed disk 85, and their peripheral structures.

[0112] exist Figure 12 In the defect handling system 10 shown, firstly, the substrate 9 is moved into the inspection device 6 and held by the substrate holding unit 621. Next, the substrate 9 is moved relative to the camera 63 using the moving mechanism 622, and an image of the substrate being inspected is acquired using the image acquisition unit 632. The image of the substrate being inspected acquired by the image acquisition unit 632 is sent to the control unit 8a and stored in [the system / system]. Figure 14 The storage unit 801 shown.

[0113] Then, the defect detection unit 802 detects the defect 94 of the pattern 93 on the substrate 9 based on the inspected image (see reference). Figure 2 The defect detection unit 802 can detect the defect 94 using various known methods. For example, the defect 94 can be detected by rule-based inspection or by inspection using a learned model. Alternatively, the defect 94 can be detected by sequentially performing rule-based inspection and inspection using a learned model. Furthermore, the learned model can be pre-generated and stored in the storage unit 801 using machine learning.

[0114] In the control unit 8a, the location information of the defect 94 detected by the defect detection unit 802 is output to the control unit 8 of the repair device 1 through the output unit 803. In the repair device 1, based on the location information of the defect 94, the control unit 8 controls the moving mechanism 22 and the repair head 3, etc., to perform the above steps S11 to S16 to repair the defect 94.

[0115] As described above, the defect handling system 10 includes an inspection device 6 and a repair device 1. The inspection device 6 inspects a substrate 9 having a pattern 93 on its surface (i.e., the upper surface 91). The inspection device 6 includes an image acquisition unit 632, a defect detection unit 802, and an output unit 803. The image acquisition unit 632 captures an image of the substrate 9 and acquires the image to be inspected. The defect detection unit 802 detects defects 94 in the pattern 93 based on the image to be inspected. The output unit 803 outputs the location information of the defects 94 detected by the defect detection unit 802 to the repair device 1. The repair device 1 repairs the defects 94 based on the location information of the defects 94 output from the output unit 803. Thus, the defects 94 can be appropriately detected and repaired.

[0116] Next, the defect processing apparatus 100 of the second embodiment of the present invention will be described. Figure 15 This is a side view showing the structure of the defect processing apparatus 100. The defect processing apparatus 100 is a device for detecting and repairing defects in patterns formed on the surface of the substrate 9.

[0117] Figure 15 The defect handling device 100 shown excludes Figure 2 In addition to the various structures shown in the repair device 1, it also has Figure 12 The inspection device 6 shown has a camera 63. Additionally, the defect handling device 100 has a control unit 8b instead of... Figure 2 The control unit 8 is shown. Other structures of the defect handling device 100 are similar to... Figure 2 The repair device 1 shown is substantially the same. In the following description, the structures corresponding to each structure of the repair device 1 are labeled with the same reference numerals.

[0118] The camera 63, together with the repair head 3, is supported by the support 12. The camera 63 moves in the X direction via the second moving mechanism 24. The camera 63 can move independently of the movement of the repair head 3. Figure 13 Similarly, as shown in the control unit 8a, the control unit 8b has the structure of a general computer system including a CPU, GPU, ROM, RAM, fixed disk, display, input unit, reading device, communication unit, and bus. The control unit 8b implements the functions implemented by the control unit 8 and the functions implemented by the control unit 8a (see reference). Figure 14 The control unit 8b controls the moving mechanism 22, the repair head 3, and the camera 63, among other structures.

[0119] In the defect processing apparatus 100, firstly, a substrate 9 is brought in and held by a substrate holding part 21. Next, a camera 63 is moved along the X direction using the second moving mechanism 24 of the moving mechanism 22, positioning it above the substrate 9. At this time, the repair head 3 is positioned in a retracted position on the (-X) side of the support part 12 so as not to overlap with the substrate 9 when viewed from above. Then, the substrate 9 is moved relative to the camera 63 using the first moving mechanism 23 and the second moving mechanism 24, and an image to be inspected is acquired using the image acquisition unit 632. The image to be inspected acquired by the image acquisition unit 632 is sent to the control unit 8b and stored in the storage unit 801 (see reference 801). Figure 14 ).

[0120] Next, through the defect detection unit 802 (refer to...) Figure 14 Similarly, based on the inspected image, defects 94 in the pattern 93 on the substrate 9 are detected (see reference). Figure 2 As described above, the defect detection unit 802 can detect the defect 94 using various known methods. In the control unit 8b, the location information of the defect 94 detected by the defect detection unit 802 is stored in the storage unit 801.

[0121] When the detection of the defect 94 is completed, the camera 63 is moved in the (+X) direction by the second moving mechanism 24 of the moving mechanism 22, so that it is in a retracted position on the (+X) side of the support 12. Additionally, the repair head 3 is moved in the (+X) direction by the second moving mechanism 24, so that it is positioned above the substrate 9. Then, based on the position information of the defect 94 stored in the storage unit 801, steps S11 to S16 are performed to repair the defect 94.

[0122] As explained above, the defect processing apparatus 100 includes a repair apparatus 1, an image acquisition unit 632, and a defect detection unit 802. The image acquisition unit 632 captures an image of the substrate 9 held by the substrate holding unit 21 of the repair apparatus 1. The defect detection unit 802 detects defects 94 in the pattern 93 based on the image. Furthermore, based on the location information of the defects 94 detected by the defect detection unit 802, the defects 94 are repaired. Thus, the defects 94 can be appropriately detected and repaired.

[0123] Various modifications can be made to the aforementioned repair device 1, defect handling system 10, defect handling device 100, and repair method.

[0124] For example, in the defect handling device 100, the camera 63 can be supported by a different support portion than the support portion 12 of the support repair head 3, and can be moved by a different moving mechanism than the second moving mechanism 24 of the moving repair head 3.

[0125] In the preprocessing of step S12 above, it is not necessary for the removal unit 35 to perform laser irradiation, and a structure different from the removal unit 35 can also be used to irradiate the laser.

[0126] In steps S11 to S16 above, the pretreatment in step S12 can be omitted. Furthermore, if the curing paste (i.e., the cured conductive paste 96) hardly overflows from the defect 94, the removal of the remaining curing paste in step S16 can also be omitted.

[0127] The compression element 341 can be formed from a metal or a material other than a metal (e.g., ceramic) that is different from the type of conductive particles contained in the conductive paste.

[0128] The gas ejected from the gas ejection section 331 may also be a gas other than an inactive gas (e.g., air).

[0129] The curing of conductive paste is not limited to applying heated gas to the conductive paste or applying radiant heat from the top of the compressor 341, but can also be carried out by various other means.

[0130] The substrate 9 is not necessarily limited to a printed circuit board. In the repair apparatus 1, for example, it can also repair defects in patterns of semiconductor substrates, semiconductor packaging substrates, glass substrates for flat panel displays such as liquid crystal displays or plasma displays, glass substrates for photomasks, substrates for solar cell panels, etc.

[0131] The structures of the above-described embodiments and their variations can be appropriately combined as long as they do not contradict each other.

[0132] Although the invention has been described and illustrated in detail, the above description is exemplary and not restrictive. Therefore, it can be said that various modifications and methods are possible without departing from the scope of the invention.

Claims

1. A repair apparatus for repairing defects in a pattern formed on the surface of a substrate, wherein, The repair device has: The substrate holding section holds a substrate with a pattern formed on its surface; Applying part: Applying droplet-shaped conductive paste to the defective part of the pattern; The curing section dries the conductive paste by heating it, thereby curing the conductive paste. as well as The compression section presses the conductive paste onto the substrate while heating and curing it.

2. The repair device according to claim 1, wherein, The repair device further includes a removal section that uses laser light to remove the portion of the conductive paste that has overflowed around the defect after being pressed by the compression section.

3. The repair device according to claim 1, wherein, The curing section has a gas ejection section that sprays heated gas onto the conductive paste.

4. The repair device according to claim 3, wherein, The gas is an inert gas.

5. The repair device according to claim 3, wherein, The compression section has a rod-shaped compression member, the heated tip of which directly contacts the conductive paste and presses the conductive paste onto the substrate. The gas ejection section has gas outlets disposed around the compressor. The top end of the compressor is heated by the gas ejected from the gas outlet along the compressor.

6. The repair device according to claim 1, wherein, The compression section has a rod-shaped compression member, the heated tip of which directly contacts the conductive paste and presses the conductive paste onto the substrate. The curing section and the compression section share the compression component. With the heated tip of the compressed component separated from the conductive paste, the conductive paste is cured by radiant heat from the tip.

7. The repair device according to claim 1, wherein, The compression section has a rod-shaped compression member, the heated tip of which directly contacts the conductive paste and presses the conductive paste onto the substrate. The compressed component and the conductive particles contained in the conductive paste are formed of the same type of metal.

8. The repair device according to claim 1, wherein, The application of the conductive paste by the imparting part, the curing of the conductive paste by the curing part, and the pressing of the conductive paste by the compression part are all performed in an inactive gas environment.

9. The repair device according to claim 1, wherein, Before applying the conductive paste to the application section, a laser is irradiated near the defective portion of the pattern for pretreatment.

10. A defect handling system for detecting and repairing defects in a pattern formed on the surface of a substrate, wherein, The defect handling system has the following features: An inspection device for inspecting substrates with patterns on their surfaces; as well as The repair device according to any one of claims 1 to 9; The inspection device has: The image acquisition unit captures images of the substrate and acquires images to be inspected. The defect detection unit detects defects in the pattern based on the image being inspected. as well as The output unit outputs the location information of the defect detected by the defect detection unit to the repair device. The repair device repairs the defective part based on the location information of the defective part output from the output unit.

11. A defect processing apparatus for detecting and repairing defects in a pattern formed on the surface of a substrate, wherein, The defect handling device has: The repair device according to any one of claims 1 to 9; The image acquisition unit takes a picture of the substrate held by the substrate holding unit of the repair device and acquires an image of the substrate to be inspected. as well as The defect detection unit detects defects in the pattern based on the image being inspected. The defect is repaired based on the location information of the defect detected by the defect detection unit.

12. A repair method for repairing defects in a pattern formed on the surface of a substrate, wherein, The repair method includes: Step a) Apply droplet-shaped conductive paste to the defective parts of the pattern formed on the surface of the substrate; Step b), to cure the conductive paste; and Step c), while heating and curing the conductive paste, press the conductive paste onto the substrate.

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