Wafer processing apparatus, liquid supply assembly, and wafer processing method

Abstract

The application provides a wafer processing device, a liquid supply assembly and a wafer processing method, and belongs to the technical field of wafer processing. The device comprises a bearing disc, a swing arm and a liquid supply assembly. The bearing disc is used to drive the wafer to rotate. The swing arm is swingly arranged above the bearing disc. The liquid supply assembly is arranged at the swing end of the swing arm. The liquid supply assembly comprises a liquid supply nozzle used to release fluid onto the wafer. The liquid supply nozzle has a first channel and a second channel. The first channel comprises at least two branch channels which are in parallel communication with each other. The second channel has a suction structure which is in communication with the outlet end of each branch channel. After the wafer processing is completed, the fluid is stopped from being delivered to the first channel, and the airflow is input into the second channel, so that the negative pressure is formed at the suction structure, the fluid remaining at the outlet end of the first channel is sucked back into the second channel, the suction and discharge of the fluid remaining in the liquid supply nozzle are realized, and the fluid dripping is avoided to affect the processing quality of the wafer.

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