Copper header brazing apparatus based on solder guide forming internal fillet

Abstract

The application belongs to the technical field of copper pipe brazing, and particularly relates to a copper header brazing device based on solder guide forming inner fillet. The copper header brazing device based on solder guide forming inner fillet comprises a fixing mechanism, which is suitable for fixing a thin pipe, a guide ring and a surplus solder collecting ring in a hole part of a thick pipe to form and maintain a solder guide flow channel which turns after an inner hole outlet and is communicated with a surplus solder collecting pipe; and a heating assembly which is arranged on the fixing mechanism and is suitable for heating the hole part to make the solder at the outer hole outlet melt, flow along the solder guide flow channel and flow into the surplus solder collecting pipe after the surplus solder forms the inner fillet after turning at the inner hole outlet. The device can change the control of the amount of solder from a point value to a more simple control in an interval, and the part of the solder guide flow channel before the surplus solder collecting pipe is filled with the solder, which can not only ensure that the gap between the outer wall of the thin pipe and the hole wall is filled, but also make the solder form the inner fillet after turning at the inner hole outlet.

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