一种用于半导体切割用金刚石划片刀的涂层涂敷设备及方法

By using coating equipment and methods, combined with the irregular movement of the protection and transmission mechanisms, the problems of uneven coating thickness and blade tip damage were solved, achieving uniform coating and high-precision cutting of diamond dicing blades.

CN121931501BActive Publication Date: 2026-07-17BOZHOU QIANGRUI SUPERHARD MATERIALS CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
BOZHOU QIANGRUI SUPERHARD MATERIALS CO LTD
Filing Date
2026-02-06
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing technologies for coating diamond dicing blades suffer from problems such as uneven coating thickness, incomplete coverage, blade tip damage, and reduced cutting accuracy, especially when dealing with complex three-dimensional morphologies.

Method used

A coating application device and method are adopted, which combines a protective mechanism and a transmission mechanism. Through irregular compound motion and air curtain constraint, a uniform distribution of precursor molecules and plasma ion flux is achieved, and the coating is deposited using PE-ALD technology.

Benefits of technology

This achieves uniform coating thickness across the entire tool surface, improving the tool's wear resistance and cutting accuracy while preventing damage to the tool tip.

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Abstract

本发明涉及划片刀表面处理技术领域，特别是涉及一种用于半导体切割用金刚石划片刀的涂层涂敷设备及方法，用于解决传统涂敷技术效果不佳的问题；该设备包括防护机构和传动机构，放置杆的底端固定连接有安装杆，齿轮的中部开设有与安装杆间隙配合的插孔，底座上安装有竖直移动设置的控制环，控制环上设置有多个无规律排列的凸起，控制环上移时能够推动放置杆上移于齿轮，从而放置杆能够变为倾斜且停止自转或降低自转速度或竖直且停止自转或降低自转速度的任一状态；该装置能够使得划片刀能够无序的运动，确保刀具表面的每一个微小面元接收到的前驱体分子通量和等离子体离子通量的期望值是完全一致的，实现最小化涂层厚度在整个刀具表面的方差。
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Citation Information

Patent Citations

  • Method for inhibiting graphitization during diamond cutting and cutting device

    CN116276136A

  • Nano coating spraying device for cutting tool machining

    CN116637747A