Microchannel chip heat dissipation device

Abstract

This invention discloses a microchannel chip heat dissipation device, relating to the field of electronic device heat dissipation technology. The device includes a cover plate, a receiving plate, and a cooling cavity between them. The cooling cavity contains multiple spaced jet structures, with adjacent jet structures forming impact channels. The jet structures and the receiving plate together form a main flow channel, which is connected to the main flow channel. A hot-cold partition between the jet structures and the cover plate divides the cooling cavity into independent cold channel and hot channel sections. Coolant impacts the receiving plate vertically at high speed through the impact channels in the cold channel section, effectively disrupting the thermal boundary layer and significantly improving the heat transfer coefficient. After absorbing heat, the coolant flows into the main flow channel and then out through the hot channel section. This structure achieves separation of hot and cold fluids, ensuring that the low-temperature coolant directly impacts the heat source, balancing efficient heat dissipation with low flow resistance.

Description

Technical Field

[0001] This invention relates to the field of heat dissipation technology for electronic devices, and in particular to a heat dissipation device for microchannel chips. Background Technology

[0002] With the rapid development of fields such as artificial intelligence, high-performance computing, and data centers, the computing power demand for chips has exploded, and their power consumption has also risen sharply, currently reaching kilowatts or even higher. The resulting enormous heat has become a core bottleneck restricting the continuous improvement of equipment performance and stable operation. If the heat cannot be dissipated in a timely and effective manner, it will lead to excessively high chip junction temperatures, causing performance degradation, decreased reliability, and even permanent damage.

[0003] Currently, heat dissipation in electronic devices mainly relies on two technical approaches: air cooling and liquid cooling. Traditional microchannel cold plates often employ processes such as toothing and etching to fabricate dense, flat, fine microchannels within a metal substrate. As the coolant flows through these channels, heat is dissipated through convection with the channel walls. While this approach is easy to manufacture and relatively cost-effective, it has inherent drawbacks in heat dissipation performance: First, the fluid flow within the flat, straight channels is typically fully developed laminar or turbulent, forming a thick thermal boundary layer on the walls, severely hindering heat transfer. Second, the simple channel structure lacks an active disturbance mechanism for the boundary layer, limiting overall heat transfer efficiency. Third, to achieve sufficient heat dissipation capacity, it is often necessary to increase the channel length or reduce the hydraulic diameter, which leads to a significant flow pressure drop, increased pumping power consumption, and a reduced system energy efficiency ratio. Therefore, traditional flat microchannel solutions are no longer sufficient to meet the heat dissipation requirements of high-power-density chips. Summary of the Invention

[0004] The main objective of this invention is to provide a microchannel chip heat dissipation device that aims to improve heat dissipation efficiency.

[0005] To achieve the above objectives, the present invention provides a microchannel chip heat dissipation device comprising: A cover plate, a shock-absorbing plate, and a cooling cavity disposed between the cover plate and the shock-absorbing plate; Multiple spaced jet structures are disposed within the cooling chamber; An impact flow channel is formed between two adjacent jet structures; The jet structure and the impact plate together form a main channel, and the end of the impact channel away from the cover plate is connected to the main channel. A hot and cold partition is disposed between the jet structure and the cover plate, dividing the cooling cavity and the jet structure into a cold channel portion and a hot channel portion; The coolant impacts the impact plate vertically through the impact channel of the cold channel section, absorbs heat, flows into the main channel, and flows out from the impact channel of the hot channel section.

[0006] In one embodiment, the microchannel chip heat dissipation device further includes separators, with multiple separators spaced apart between the two jet structures; The plurality of the dividing strips are configured to divide the impact channel into a plurality of pressurized channels, wherein the extension direction of the pressurized channels is perpendicular to the impact plate, so as to adjust the jet velocity and pressure drop.

[0007] In one embodiment, a plurality of fins are provided between the impact plate and the jet structure, and a jet channel is formed between two adjacent fins; Wherein, the extension direction of the jet channel and the extension direction of the main channel are perpendicular to each other; The impact channel and the main channel are connected through the jet channel.

[0008] In one embodiment, the bottom of the jet structure is provided with a plurality of flow grooves, and the flow grooves and the impact plate together form a flow channel, and the impact channel and the main flow channel are connected through the flow channel.

[0009] In one embodiment, the jet structure has a U-shaped cross-section and is inverted on the impact plate to form the main flow channel together with the impact plate.

[0010] In one embodiment, the microchannel chip heat dissipation device further includes a housing located between the cover plate and the impact plate; The cover plate, the housing, and the impact plate together form the cooling cavity.

[0011] In one embodiment, both ends of the jet structure along the extension direction are in contact with the inner wall of the housing.

[0012] In one embodiment, the cover plate is provided with an inlet and an outlet. Coolant flows into the cooling chamber from the inlet in a direction perpendicular to the impact plate and flows out from the outlet in a direction perpendicular to the impact plate.

[0013] In one embodiment, a heat-conducting structure is attached to the side of the impact plate opposite to the jet structure to conduct the heat of the chip to the impact plate.

[0014] In one embodiment, the thermally conductive structure includes thermal grease, phase change material, or liquid metal.

[0015] The technical solution of this invention divides the flow channel into independent cold channel and hot channel sections using the hot and cold baffle. This ensures that the coolant remains unheated before absorbing heat as it passes through the impact channel of the cold channel section. After absorbing heat by vertically impacting the impact plate from the impact channel of the cold channel section, the coolant flows into the main flow channel and then out through the impact channel of the hot channel section, carrying away heat. The impact channel allows the coolant to impact the impact plate vertically and at high speed, directly and effectively breaking the thermal boundary layer on the wall. Compared with the co-current heat transfer in traditional parallel flow channels, this jet impact method can greatly improve the local and overall convective heat transfer coefficient. Attached Figure Description

[0016] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0017] Figure 1 A schematic diagram of an embodiment of the microchannel chip heat dissipation device provided by the present invention; Figure 2 Schematic diagram of the exploded structure of a microchannel chip heat dissipation device; Figure 3 This is a cross-sectional view of a microchannel chip heat dissipation device; Figure 4 This is a schematic diagram of the jet structure; Figure 5 for Figure 4 A magnified view of a portion of point A in the middle.

[0018] Explanation of icon numbers: 1. Cover plate; 11. Liquid inlet; 12. Liquid outlet; 13. First connector; 14. Second connector; 2. Impact plate; 3. Cooling chamber; 4. Jet structure; 41. Main channel; 5. Hot and cold baffle; 6. Separator; 61. Pressurized channel; 7. Fin; 71. Jet channel; 8. Shell; 91. Heat-conducting structure; 92. Chip; 93. Printed circuit board.

[0019] The realization of the objective, functional features and advantages of the present invention will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0020] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0021] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0022] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0023] With the rapid development of fields such as artificial intelligence, high-performance computing, and data centers, the computing power demand for chips has exploded, and their power consumption has also risen sharply, currently reaching kilowatts or even higher. The resulting enormous heat has become a core bottleneck restricting the continuous improvement of equipment performance and stable operation. If the heat cannot be dissipated in a timely and effective manner, it will lead to excessively high chip junction temperatures, causing performance degradation, decreased reliability, and even permanent damage.

[0024] Currently, heat dissipation in electronic devices mainly relies on two technical approaches: air cooling and liquid cooling. Traditional microchannel cold plates often employ processes such as toothing and etching to fabricate dense, flat, fine microchannels within a metal substrate. As the coolant flows through these channels, heat is dissipated through convection with the channel walls. While this approach is easy to manufacture and relatively cost-effective, it has inherent drawbacks in heat dissipation performance: First, the fluid flow within the flat, straight channels is typically fully developed laminar or turbulent, forming a thick thermal boundary layer on the walls, severely hindering heat transfer. Second, the simple channel structure lacks an active disturbance mechanism for the boundary layer, limiting overall heat transfer efficiency. Third, to achieve sufficient heat dissipation capacity, it is often necessary to increase the channel length or reduce the hydraulic diameter, which leads to a significant flow pressure drop, increased pumping power consumption, and a reduced system energy efficiency ratio. Therefore, traditional flat microchannel solutions are no longer sufficient to meet the heat dissipation requirements of high-power-density chips.

[0025] This invention proposes a heat dissipation device for microchannel chips.

[0026] Please see Figures 1 to 5 In one embodiment of the present invention, the heat dissipation device for the microchannel chip 92 includes: Cover plate 1, impact plate 2, and cooling cavity 3 disposed between the cover plate 1 and the impact plate 2; Multiple spaced jet structures 4 are disposed within the cooling chamber 3; An impact flow channel is formed between two adjacent jet structures 4; The jet structure 4 and the impact plate 2 together form a main channel 41, and the end of the impact channel away from the cover plate 1 is connected to the main channel 41. A hot and cold partition 5 is provided between the jet structure 4 and the cover plate 1, which divides the cooling cavity 3 and the jet structure 4 into a cold channel part and a hot channel part. The coolant impacts the impact plate 2 vertically through the impact channel of the cold channel section, absorbs heat, flows into the main channel 41, and flows out from the impact channel of the hot channel section. The technical solution of the present invention divides the flow channel into an independent cold channel portion and a hot channel portion by means of the cold and hot baffle 5. This ensures that the coolant always passes through the impact channel of the cold channel portion in an unheated state before absorbing heat. After the coolant absorbs heat by vertically impacting the impact plate 2 from the impact channel of the cold channel portion, it flows into the main flow channel 41 and then flows out through the impact channel of the hot channel portion, carrying away the heat. The impact channel enables the coolant to impact the impact plate 2 vertically and at high speed, directly and effectively destroying the thermal boundary layer of the wall. Compared with the co-current heat transfer in the traditional parallel flow channel, this jet impact method can greatly improve the local and overall convective heat transfer coefficient.

[0027] It should be noted that the hot and cold baffle 5 divides the cooling chamber 3 and the jet structure 4 into a cold channel section and a hot channel section, ensuring that the coolant can flow out only after passing through the jet structure 4.

[0028] Furthermore, the hot and cold baffle 5 can adjust the pressure of the coolant impacting the impact plate 2 according to its setting position. By adjusting the position or layout of the hot and cold baffle 5 as needed, the distribution of the flow field and the distribution of the pressurization area inside the cooling cavity 3 can be flexibly reconfigured. This allows the heat dissipation device to dynamically adapt to the power distribution diagram of different chips 92 or the same chip 92 under different operating conditions. For local high heat flux density areas, the hot and cold baffle 5 can be optimized to guide more coolant flow or increase the local jet impact velocity, thereby achieving enhanced heat dissipation in hot spots.

[0029] Understandably, the adjustable hot and cold baffle 5 improves adaptability and scalability. The impact plate 2 with the same basic structure can be quickly adapted to multiple chips 92 with different sizes and power distribution characteristics by changing the configuration of the hot and cold baffle 5, reducing the cost and cycle of customized development.

[0030] Understandably, chip 92 is typically integrated onto printed circuit board 93.

[0031] It should be noted that the impact plate 2 and the chip 92 are attached to each other to absorb the heat emitted by the chip 92.

[0032] Optionally, such as Figure 2 As shown, a heat-conducting structure 91 is attached to the side of the impact plate 2 opposite to the jet structure 4 to conduct the heat of the chip 92 to the impact plate 2.

[0033] Understandably, the heat-conducting structure 91 ensures that the heat generated by the chip 92 can be conducted to the impact plate 2 more efficiently and evenly, facilitating jet impact cooling and improving the heat transfer efficiency of the entire thermal path from the chip 92 to the coolant.

[0034] Furthermore, the thermally conductive structure 91 includes thermally conductive silicone grease, phase change material, or liquid metal.

[0035] It is understandable that thermally conductive materials such as thermal grease, phase change materials, or liquid metals can enable heat transfer between the chip 92 and the impact plate 2 to improve heat dissipation efficiency.

[0036] Optionally, such as Figure 5 As shown, the heat dissipation device for the microchannel chip 92 also includes partition bars 6, with multiple partition bars 6 spaced apart between the two jet structures 4; The plurality of the dividing strips 6 are configured to divide the impact channel into a plurality of pressurized channels 61, and the extending direction of the pressurized channels 61 is perpendicular to the impact plate 2, so as to adjust the jet velocity and pressure drop.

[0037] It should be noted that dividing the large-section impact channel into multiple small-section pressurized channels 61 can adjust the flow area of ​​the coolant and increase the flow velocity of the coolant, thereby directly enhancing the impact heat transfer coefficient. At the same time, the guiding effect of the partition strip 6 reduces the turbulence of the flow and ineffective dead zones, making the flow more orderly.

[0038] Furthermore, by increasing or decreasing the number of pressurized flow channels 61, the total effective flow area of ​​the coolant before impact is directly altered. With a constant total flow rate, a decrease in the flow area will lead to an increase in the flow velocity through that region, and significantly enhance local dynamic pressure and impact pressure.

[0039] It is understood that the number of pressurized flow channels 61 can be adjusted by adjusting the number and size of the partition bars 6 to adjust the jet velocity and the pressure drop of the cold plate system.

[0040] It is understood that the number of the separators 6 and the position of the hot and cold baffles 5 can be adjusted as needed according to the power distribution of the chip 92 to achieve regulation and control of the jet velocity and pressure drop.

[0041] It should be noted that heat dissipation can be achieved even without the separator 6, and this embodiment does not impose any specific limitations on this.

[0042] In one embodiment, such as Figure 5 As shown, a plurality of fins 7 are provided between the impact plate 2 and the jet structure 4, and a jet channel 71 is formed between two adjacent fins 7; The extension direction of the jet channel 71 and the extension direction of the main channel 41 are perpendicular to each other; The impact channel and the main channel 41 are connected through the jet channel 71.

[0043] It is understood that by providing an array of fins 7 with a direction perpendicular to the extension of the jet channel 71 between the impact plate 2 and the jet structure 4, an outlet path is provided for the coolant that impacts the surface of the impact plate 2 vertically. After completing the impact heat exchange, the coolant can quickly change direction through the jet channel 71 formed by adjacent fins 7 and flow into the main flow channel 41, ensuring that the coolant can flow into the main flow channel 41.

[0044] In another embodiment, the bottom of the jet structure 4 is provided with a plurality of flow grooves (not shown in the figure), and the flow grooves and the impact plate 2 together form a flow channel (not shown in the figure), and the impact channel and the main flow channel 41 are connected through the flow channel.

[0045] It is understandable that even without using the fins 7, the flow grooves can still facilitate the flow between the impact channel and the main flow channel 41.

[0046] It is understandable that both of the above schemes can achieve the connection between the impact channel and the main channel 41.

[0047] Optionally, such as Figure 4 and Figure 5 As shown, the cross-section of the jet structure 4 is U-shaped, and the jet structure 4 is inverted on the impact plate 2 to form the main channel 41 together with the impact plate 2.

[0048] It is understood that the main channel 41 is used to collect the coolant in the cold channel section and transport it to the hot channel section for discharge.

[0049] Furthermore, during installation, the jet structure 4 can be simply placed upside down on the impact plate 2, making installation convenient.

[0050] Optionally, such as Figure 3 As shown, the heat dissipation device for the microchannel chip 92 also includes a housing 8, which is located between the cover plate 1 and the impact plate 2; The cover plate 1, the housing 8, and the impact plate 2 together form the cooling cavity 3.

[0051] It is understood that the housing 8 provides a limit for the installation of the jet structure 4.

[0052] In some embodiments, both ends of the hot and cold partition 5 are integrally connected to a limiting frame. The shape of the limiting frame is adapted to the cross-sectional shape of the housing 8 and fits against the inner wall of the housing 8. The limiting frame fixes the position of the hot and cold partition 5 in the cooling cavity 3 relative to the housing 8.

[0053] It is understandable that when the position of the hot and cold partition 5 needs to be changed, since the limiting frame and the hot and cold partition 5 are integrally connected, different limiting frames and hot and cold partitions 5 need to be replaced.

[0054] In some embodiments, the housing 8 is provided with an outwardly protruding mounting platform on the side near the cover plate 1 to facilitate the installation and fixation of the cover plate 1 and the housing 8.

[0055] Optionally, both ends of the jet structure 4 along the extension direction are attached to the inner wall of the housing 8.

[0056] Understandably, the jet structure 4 is tightly fitted to the inner wall of the housing 8 at both ends, directly sealing the two end openings of the main flow channel 41 in the flow direction. This prevents the coolant from accidentally leaking or bypassing from the ends of the main flow channel 41, ensuring that all coolant entering the main flow channel 41 must flow through the complete impact channel and vertically impact the impact plate 2.

[0057] Furthermore, both ends of the jet structure 4 along the extension direction are fitted to the inner wall of the housing 8, which facilitates the installation and fixation of the jet structure 4.

[0058] It should be noted that the coolant flow path in the hot channel section is opposite to that in the cold channel section, and the coolant in the hot channel section flows out from the main channel 41 through the impact channel.

[0059] Figure 5 In the diagram, the direction indicated by the dashed arrow is the flow direction of the coolant in the cold aisle section.

[0060] Optionally, the cover plate 1 is provided with an inlet 11 and an outlet 12. Coolant flows into the cooling chamber 3 from the inlet 11 in a direction perpendicular to the impact plate 2, and flows out from the outlet 12 in a direction perpendicular to the impact plate 2.

[0061] It is understandable that the flow direction of the coolant from the inlet 11 is parallel to the extension direction of the pressurized flow channel 61, which avoids the coolant from changing direction in the cooling chamber 3, prevents local hydraulic loss caused by drastic changes in flow direction, and increases the impact velocity of the coolant on the impact plate 2.

[0062] In some embodiments, the inlet 11 and the outlet 12 are respectively connected to a first connector 13 and a second connector 14, the first connector 13 being used to provide coolant and the second connector 14 being used to discharge the coolant after heat absorption.

[0063] In other embodiments, the inlet 11 is used for liquid discharge, and the outlet 12 is used for liquid inlet.

[0064] It is understandable that the coolant flows through the same jet structure 4 regardless of whether it is inlet or outlet, only the flow direction is different. Therefore, in actual use, the operator does not need to specifically distinguish the direction of coolant flow. The inlet 11 can also be used for outlet, and the outlet 12 can also be used for inlet, without restriction.

[0065] It is understandable that when the inlet 11 is used for liquid discharge and the outlet 12 is used for liquid inlet, the coolant flow direction and the cold channel section and the hot channel section change accordingly.

[0066] The above description is merely an exemplary embodiment of the present invention and does not limit the scope of protection of the present invention. Any equivalent structural transformations made based on the technical concept of the present invention and the contents of the specification and drawings of the present invention, or direct / indirect applications in other related technical fields, are included within the scope of protection of the present invention.

Claims

1. A microchannel chip heat spreader, comprising: include: A cover plate, a shock-absorbing plate, and a cooling cavity disposed between the cover plate and the shock-absorbing plate; Multiple spaced jet structures are disposed within the cooling chamber; An impact flow channel is formed between two adjacent jet structures; The jet structure and the impact plate together form a main channel, and the end of the impact channel away from the cover plate is connected to the main channel. A hot and cold partition is disposed between the jet structure and the cover plate, dividing the cooling cavity and the jet structure into a cold channel portion and a hot channel portion; The coolant impacts the impact plate vertically through the impact channel of the cold channel section, absorbs heat, flows into the main channel, and flows out from the impact channel of the hot channel section. The microchannel chip heat dissipation device also includes partition bars, with multiple partition bars spaced apart between the two jet structures; The plurality of the dividing strips are configured to divide the impact channel into a plurality of pressurized channels, wherein the extending direction of the pressurized channels is perpendicular to the impact plate, so as to adjust the jet velocity and pressure drop; The jet structure has a U-shaped cross-section and is inverted on the impact plate to form the main channel together with the impact plate.

2. The microchannel chip heat spreader of claim 1, wherein, Multiple fins are provided between the impact plate and the jet structure, and a jet channel is formed between two adjacent fins; Wherein, the extension direction of the jet channel and the extension direction of the main channel are perpendicular to each other; The impact channel and the main channel are connected through the jet channel.

3. The microchannel chip heat spreader of claim 1, wherein, The bottom of the jet structure has multiple flow grooves, and the flow grooves and the impact plate together form a flow channel. The impact channel and the main flow channel are connected through the flow channel.

4. The microchannel chip heat spreader of claim 1, wherein, The microchannel chip heat dissipation device also includes a housing, which is located between the cover plate and the impact plate; The cover plate, the housing, and the impact plate together form the cooling cavity.

5. The microchannel chip heat spreader of claim 4, wherein, Both ends of the jet structure along the extension direction are in contact with the inner wall of the shell.

6. The microchannel chip heat spreader of claim 1, wherein, The cover plate is provided with an inlet and an outlet. Coolant flows into the cooling chamber from the inlet in a direction perpendicular to the impact plate and flows out from the outlet in a direction perpendicular to the impact plate.

7. The microchannel chip heat spreader of claim 1, wherein, A heat-conducting structure is attached to the side of the impact plate opposite to the jet structure to conduct the heat of the chip to the impact plate.

8. The microchannel chip heat spreader of claim 7, wherein, The thermally conductive structure includes thermal grease, phase change material, or liquid metal.

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