A DIMM testing device with convenient plugging

Abstract

The application relates to the technical field of DIMM testing, and discloses a DIMM testing device convenient to plug and unplug, which comprises several groups of testing components and several groups of mainboards, a plurality of testing components are connected with a group of mainboards, the testing component comprises: a socket plate, an interface plate, a flow guide pipe and auxiliary parts, and a plurality of groups of auxiliary parts are arranged in the air cavity. The socket plate and the interface plate are modularly combined, the problem of difficult maintenance of a large plate is solved, and the defects of insufficient strength and limited space of a small plate are overcome. The two are quickly plugged and unplug connected through fixing pins and fixing holes, the independent and convenient replacement of the socket plate is realized, and the maintenance efficiency is greatly improved; meanwhile, the socket plate and the interface plate are rigidly connected through a mechanical structure and fixed to an external frame, the overall structural strength of the slender plate card is significantly enhanced, the bending damage caused by frequent plugging and unplugging and circulation is avoided, and the durability and reliability of the device are improved.

Description

Technical Field

[0001] This invention relates to the field of DIMM testing technology, and more specifically to a convenient plug-and-play DIMM testing device. Background Technology

[0002] In the field of computer storage technology, DIMM (Dual In-line Package) finished product testing is a crucial step in ensuring the quality and reliability of memory products. This testing refers to the comprehensive electrical performance and functional verification of the complete module after the memory chips are mounted on the circuit board, soldered, and all components (including chips, decoupling capacitors, and possibly temperature sensors) are installed. To complete the test, the DIMM module needs to be connected to an automated testing machine via a dedicated adapter, similar to the dedicated socket and load board used in testing individual packaged memory chips.

[0003] Currently, there are two main types of adapter designs used in the industry for testing DIMM finished products: one integrates the DIMM socket onto a large circuit board (commonly known as a "large board"); the other uses a separate small board (commonly known as a "small board") to carry one or more sockets. However, both of these existing solutions have significant drawbacks: First, while the large-panel design is structurally stable and facilitates improved operational efficiency through a plug-and-play approach, its large size and compact layout make disassembly and repair cumbersome and maintainable in the event of a malfunction or the need to replace parts.

[0004] Secondly, while the small board design offers greater flexibility in localized maintenance and component replacement, the elongated shape of the DIMM socket results in a slender board that lacks sufficient mechanical strength, making it prone to bending or damage during frequent insertions, removals, and transfers. Furthermore, if testing requires integrating additional circuitry or functional devices (such as signal conditioning or power management) onto the adapter, the limited area of ​​the small board often prevents its inclusion, thus restricting the test coverage or accuracy.

[0005] Third, in actual testing systems, multiple small boards are often combined and installed on the same frame or base. While this integration method saves space, it makes it difficult to quickly locate the specific faulty unit during maintenance due to the similar appearance and dense layout of the boards, increasing the complexity and time cost of maintenance.

[0006] Fourth, in reliability verification stages such as high and low temperature testing, although the temperature environment is controlled by the sorting machine (Handler), condensation is easily generated on the surface of the board at low temperatures, which may cause short circuits, device corrosion or signal distortion, affecting the accuracy of testing and the life of the equipment. Existing designs generally lack effective protection against this problem.

[0007] In summary, existing DIMM-based test adapters have shortcomings in maintainability, structural reliability, circuit expansion capability, module identification, and environmental adaptability. A new design solution is urgently needed to overcome these deficiencies and improve testing efficiency, reliability, and ease of maintenance. Summary of the Invention

[0008] The purpose of this invention is to address the shortcomings of existing technologies by providing a convenient DIMM testing device that allows for easy insertion and removal, thereby ensuring reliable testing while also providing convenient maintenance and good environmental adaptability.

[0009] The objective of this invention can be achieved through the following technical solutions: A convenient plug-and-play DIMM testing device includes several sets of test components and several sets of motherboards, with multiple test components connected to one set of motherboards. The test components include: A socket board, comprising a base, a circuit board, a socket, and a connector. The circuit board and the socket are arranged sequentially from the inside to the outside on one side of the base. Several slots are provided on the other side of the base, and the connector is installed in the slots. Several fixing pins are provided on the base. An interface board includes an outer frame, terminals, and connectors. Several terminals are installed on one side of the outer frame, and several connectors are installed on the other side. The connectors are connected to connectors. Several wire harnesses are led out from the terminals and are connected to the motherboard to transmit signals. Several fixing holes are provided on the outer frame, and fixing pins on the base are inserted into the fixing holes to fix the socket board and the interface board. The socket plate has an upper groove and the interface plate has a lower groove. The upper groove and the lower groove overlap to form an air cavity. The connection between connector one and connector two is located in the air cavity. The air cavity is equipped with a guide tube. Auxiliary components: Several sets of auxiliary components are installed inside the air chamber.

[0010] As a further aspect of the present invention: an air inlet and an exhaust outlet are respectively provided at both ends of the lower groove, an air inlet pipe is connected to the air inlet, and an exhaust outlet pipe is connected to the exhaust outlet.

[0011] As a further embodiment of the present invention: the guide tube includes a connecting cylinder and a main pipe. The connecting cylinder has a connecting hole that coincides with the air inlet. One end of the connecting cylinder is connected to the main pipe. The connecting cylinder is perpendicular to the main pipe. Two sets of guide plates are symmetrically arranged on the main pipe. An air injection hole is formed between the two sets of guide plates. The air injection hole faces the air chamber.

[0012] As a further aspect of the present invention: both ends of the main pipe are connected to branch pipes, both sets of guide plates are in an inclined state, the guide plates guide part of the gas into the branch pipes, the branch pipes are provided with a number of side air holes, and the inner sides of both sets of branch pipes are provided with a number of auxiliary components, the auxiliary components being located between two adjacent sets of side air holes.

[0013] As a further embodiment of the present invention: the auxiliary components include a drying box, a mesh plate, an air outlet, and a fan. The top and bottom of the drying box abut against the surfaces of the upper and lower grooves, respectively. One end of the drying box abuts against the branch pipe, and the other end abuts against the connection point of connector one and connector two. A desiccant is placed inside the drying box. A mesh plate is provided on the side of the drying box facing the main pipe, and several air outlets are provided on the other side. An electromagnetic shaft frame is provided inside the air outlet, and a fan is rotatably installed inside the electromagnetic shaft frame.

[0014] As a further aspect of the present invention: the end of the fan is provided with a rotating shaft, the rotating shaft extends into the drying box, and a stirring element is provided around the rotating shaft.

[0015] As a further aspect of the present invention: the drying box is equipped with several humidity-sensitive resistors, transistors and power supplies respectively. The power supply is connected to an external control unit, the humidity-sensitive resistor is connected between the gate of the transistor and the positive terminal of the power supply, the electromagnetic shaft is connected between the positive terminal of the power supply and the drain of the transistor, and the source of the transistor is grounded.

[0016] As a further aspect of the present invention, a gasket is provided between the board and the socket.

[0017] The beneficial effects of this invention are: (1) In this invention, a modular combination design of socket board and interface board is adopted, which not only solves the problem of difficult maintenance of large board, but also overcomes the defects of insufficient strength and limited space of small board. The two are quickly plugged and unplugged through fixing pins and fixing holes, realizing independent and convenient replacement of socket board, which greatly improves maintenance efficiency; at the same time, socket board and interface board are rigidly connected and fixed to the external frame through mechanical structure, which significantly enhances the overall structural strength of slender board, avoids bending damage caused by frequent plugging and unplugging and circulation, and improves the durability and reliability of the device; (2) In this invention, the interface board provides ample space for device layout, allowing most test circuits (such as relays and termination circuits) to be placed within it, thus relieving the space pressure on the socket board. This design not only meets the requirements of a complete test link but also reserves space for subsequent functional expansion, improving the scalability and flexibility of the circuit; (3) In this invention, an ID encoding circuit based on a DIP switch is set on the interface board, which can assign a unique identifier to each test component. This design solves the problem of difficulty in distinguishing and locating faults when multiple identical components are integrated, greatly facilitating system maintenance and fault diagnosis; (4) In this invention, an active dehumidification system is constructed by setting a guide pipe and auxiliary components in the air cavity formed by the upper and lower grooves. The dry gas can be injected into the air cavity from multiple points and blown evenly to the connector area after being dynamically dehumidified by the desiccant, effectively preventing the accumulation of low-temperature condensate and significantly improving the adaptability and testing accuracy of the device in harsh environments such as high and low temperature tests; (5) In this invention, the auxiliary component integrates humidity sensing and feedback adjustment functions. The humidity-sensitive resistor monitors the humidity of the air cavity in real time and automatically adjusts the fan speed through the control circuit, thereby intelligently controlling the agitation intensity of the desiccant and the air flow rate, realizing dynamic optimization of dehumidification efficiency, and ensuring the anti-condensation effect while taking into account energy consumption and component life. Attached Figure Description

[0018] The invention will now be further described with reference to the accompanying drawings.

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the overall cross-sectional structure of the present invention; Figure 3 This is a schematic diagram of the socket board structure in this invention; Figure 4 This is a schematic diagram of the interface board structure in this invention; Figure 5 This is a schematic diagram of the cross-sectional structure of the interface board in this invention; Figure 6 This is a schematic diagram of the flow guide tube structure in this invention; Figure 7 This is a schematic diagram of the auxiliary component structure in this invention; Figure 8 This is a simplified diagram of the socket board in this invention; Figure 9 This is a simplified diagram of the interface board in this invention; Figure 10 This is a simplified diagram of part of the test circuit of this invention.

[0020] In the picture: 1. Socket board; 11. Base; 12. Board; 13. Socket; 14. Gasket; 15. Slot; 16. Connector 1; 17. Upper groove; 18. Fixing pin; 2. Interface board; 21. Outer frame; 22. Terminal; 221. Wire harness; 23. Connector 2; 24. Lower groove; 25. Air inlet; 26. Exhaust outlet; 27. Air inlet pipe; 28. Exhaust pipe; 3. Guide pipe; 31. Connecting cylinder; 311. Connecting hole; 32. Main pipe; 321. Air injection hole; 322. Guide plate; 33. Branch pipe; 331. Side air hole; 4. Auxiliary parts; 41. Drying box; 42. Mesh plate; 43. Air outlet; 44. Electromagnetic shaft bracket; 45. Fan; 451. Rotating shaft; 452. Stirring component; 46. Humidity-sensitive resistor; 47. Transistor; 48. Power supply. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] like Figures 1-7 As shown, a convenient plug-and-play DIMM testing device includes several sets of test components and several sets of motherboards. Multiple test components are connected to one set of motherboards. The test components include: The socket board 1 includes a base 11, a board 12, a socket 13 and a connector 16. The board 12 and the socket 13 are arranged sequentially from the inside to the outside on one side of the base 11. Several slots 15 are opened on the other side of the base 11. The connector 16 is installed in the slots 15. Several fixing pins 18 are provided on the base 11. Interface board 2 includes an outer frame 21, terminals 22 and connectors 23. Several terminals 22 are installed on one side of the outer frame 21 and several connectors 23 are installed on the other side. Several connectors 23 are connected to several connectors 16. Several wire harnesses 221 are led out from the terminals 22 and are connected to the main board to transmit signals. Several fixing holes are opened on the outer frame 21. Fixing pins 18 on the base 11 are inserted into the fixing holes to fix the socket board 1 and the interface board 2. The guide tube 3, the socket plate 1 has an upper groove 17, the interface plate 2 has a lower groove 24, the upper groove 17 and the lower groove 24 overlap to form an air cavity, the connection of connector one 16 and connector two 23 is located in the air cavity, and the guide tube 3 is installed in the air cavity. Auxiliary component 4: Several sets of auxiliary components 4 are installed inside the air cavity.

[0023] A gasket 14 is provided between the board 12 and the socket 13 to prevent direct contact between the exposed copper in the board 12 and the metal parts of the socket 13.

[0024] In practical applications, the mainboard in this embodiment is mainly used to organize signals from different signal generators into the same block and connect them to the interface board 2. For the same test equipment and using the same signal generator configuration, the corresponding signal generator configuration is selected according to the chip under test. The mainboard does not need to be redesigned and can be reused. Interface board 2 can accommodate components that cannot fit in socket board 1, saving space in socket board 1. These include some terminal signals. Otherwise, it is only used as a connector to connect the motherboard and socket board 1. In addition, the need to use the signals in the interface board can be considered through relay switching. As long as the signal distribution of the connector portion in the motherboard and socket board 1 remains unchanged, interface board 2 does not need to be redesigned and can be reused. The socket 13 on socket board 1 directly contacts and tests the chip under test (DUT). Different DUTs can be tested on the same testing equipment, eliminating the need to redesign the DIB or HIB as in traditional test structures. In this test assembly, only a redesigned socket board 1 is required. Since the signal distribution is identical across all blocks on the motherboard, socket board 1 is not a single large board; instead, only a small board needs to be designed, and many boards can be manufactured and inserted into their respective positions. This reduces complexity and significantly increases substitutability.

[0025] like Figure 8 As shown, taking the DIMM in this design as an example, each test module can test two DIMMs. The digital and power signals from the four connectors A, B, C, and D are connected to the test pins of the DIMMs. A total of 32 such test modules are set up to form the test interface in the test head. The maximum number of DIMMs that can be tested simultaneously in this design is 64. The positions for testing other DIMMs are the same. When testing SO-DIMMs (small outline dual in-line memory modules), due to their smaller size, less than half the size of a DIMM, two SO-DIMMs can be placed in the area of ​​a DIMM. Therefore, four SO-DIMMs can be installed in a single test module, and the total number of DIMMs that can be tested simultaneously in the entire device can reach 128. While the large board offers sufficient space for hardware circuitry and facilitates board insertion and removal, repairs require complete removal of the entire board, necessitating equipment downtime. To balance the space constraints of the large board with the ease of repair of the smaller board, an interface board 2 was added below the socket board 1. This additional board features: 1) Direct signal transmission from the connectors, without branching into the socket board 1, ensuring signal stability. 2) Components can be placed on both sides of the interface board 2, allowing most test circuitry to be housed there, maintaining the integrity of the test chain even with limited space on the socket board 1. 3) As an interface board 2, it has minimal signal connections, and multiple functions can be switched via a switch, allowing reuse across different socket boards 1, saving design time and manufacturing costs. 4) Since 32 identical test components are required to form a complete test interface, we added a DIP switch to interface board 2 to determine the sequence of the test components in the entire test interface, which facilitates later problem localization and board repair.

[0026] like Figure 9 As shown, the signal transmission path is from right to left, consisting of the test head and test components that provide the signal. The test components include an interface board 2, which acts as a signal relay, and a socket board 1, which directly contacts the chip under test. There are four main signals from the test head: 1) Output power (DPS) signals: Force, Sense, DGS, and Option. Each power channel has one Force and one Sense signal. A group of eight power channels shares one DGS signal. The Option DPS signal is an optional power signal, and like ordinary power signals, it also has Force, Sense, and DGS, but it is only used as a pull-up level for termination signals. 2) Digital signals IO and DR. IO can be used for signal input and output, while DR is only used as a drive signal. 3) ID signals that number different test components. 4) GPIO signals connecting to the temperature and humidity sensor module, which determine the temperature and humidity status of the component and feed it back to the system control module of the machine. The system control module then determines whether dry air needs to be provided to the test component.

[0027] like Figure 10As shown, interface board 2 houses most of the devices used as relay signals (all other devices in the test circuits are placed on the DSA interface board; only a partial circuit diagram is shown for reference). These include relays for switching different DPS signals; switches for terminating control signals (not all IO or DR signals need to be terminated; the termination signal is introduced into the IO signal in the diagram as an example); and DIP switches connected to the ID signal. These DIP switches use six bits of binary to switch the sequence from 0 to 31 bits to ensure that the 32 identical test components do not confuse during assembly. In addition to the devices used in the test circuits of interface board 2 shown in the example diagram, customized test circuits can also be added to meet customer needs. For customized requirements, most devices can be placed in interface board 2 where there is sufficient space. Socket board 1 mainly houses socket 13 on the front and decoupling capacitors connected to the DIMM power signal pins on the back.

[0028] The design utilizes a long, narrow board to avoid the maintenance difficulties associated with larger board designs. Both interface board 2 and socket board 1 are mechanically secured, reducing the risk of damage from impacts. All connections are rigidly linked using external mechanical components, ensuring a more stable board installation. The combined design of interface board 2 and socket board 1, rather than a separate board design, provides more space for components in the test circuit. Sufficient space in interface board 2 facilitates future expansion to include more circuit functions. Interface board 2 and socket board 1 can be combined into a single unit using fixing pins 18 and fixing holes. They are then mounted in an external mechanical frame via a through-hole in the middle of interface board 2 and socket board 1, allowing for easy individual and overall disassembly for subsequent maintenance and replacement. A DIP switch added to interface board 2 uses six-bit binary to switch between bits 0 and 31 to ensure that the 32 identical test components do not become confused during assembly.

[0029] Furthermore, an air inlet 25 and an exhaust 26 are respectively provided at both ends of the lower groove 24. An air inlet pipe 27 is connected to the air inlet 25, and an exhaust pipe 28 is connected to the exhaust 26.

[0030] In practical applications, the intake pipe 27 is connected to an external device that supplies dry gas. At the same time, a temperature and humidity sensor on the test component detects the humidity inside the test component. Dry gas is then introduced into the air chamber through the intake pipe 27. The dry gas enters the air chamber through the intake port 25. The dry gas can quickly evaporate and carry away the condensate. Finally, it is discharged from the exhaust port 26 and the exhaust pipe 28, thereby avoiding short circuits, component corrosion, or signal distortion, and preventing any impact on test accuracy and equipment lifespan.

[0031] Furthermore, the guide tube 3 includes a connecting cylinder 31 and a main pipe 32. The connecting cylinder 31 has a connecting hole 311, which coincides with the air inlet 25. One end of the connecting cylinder 31 is connected to the main pipe 32. The connecting cylinder 31 is perpendicular to the main pipe 32. Two sets of guide plates 322 are symmetrically arranged on the main pipe 32. An air injection hole 321 is formed between the two sets of guide plates 322, and the air injection hole 321 faces the air chamber.

[0032] Both ends of the main pipe 32 are connected to branch pipes 33. Both sets of guide plates 322 are in an inclined state. The guide plates 322 guide part of the gas into the branch pipes 33. Several side air holes 331 are opened on the branch pipes 33. Several auxiliary parts 4 are provided on the inner side of both sets of branch pipes 33. The auxiliary parts 4 are located between two adjacent sets of side air holes 331.

[0033] It should be noted that if the dry gas enters through the air inlet 25 and exits through the exhaust port 26, the dry gas will be in continuous contact with the condensate during the flow process. The dehumidification capacity of the dry gas will gradually weaken. That is, the dehumidification capacity of the short-flowing dry gas will be weaker as it moves to the back, which will lead to a decrease in the efficiency of removing condensate.

[0034] In practical application, the dry gas enters the inlet pipe 27, passes through the inlet hole 25 and the connecting hole 311, and enters the connecting cylinder 31. A portion of the dry gas directly enters the air chamber through the injection hole 321, while another portion of the dry gas enters the branch pipes 33 on both sides under the guidance of the guide plate 322. Finally, it enters the air chamber through the side air holes 331 of the branch pipes 33. This achieves the goal of using mainly dry gas entering through the injection hole 321, supplemented by dry gas entering through several side air holes 331. This allows for the injection of dry gas at multiple locations in the air chamber, preventing a single dry gas from continuously contacting the condensate, thereby improving the efficiency of condensate removal.

[0035] Furthermore, the auxiliary component 4 includes a drying box 41, a mesh plate 42, an air outlet 43, and a fan 45. The top and bottom of the drying box 41 abut against the surfaces of the upper groove 17 and the lower groove 24, respectively. One end of the drying box 41 abuts against the branch pipe 33, and the other end abuts against the connection point of connector 16 and connector 23. A desiccant is placed inside the drying box 41. A mesh plate 42 is provided on the side of the drying box 41 facing the main pipe 32, and several air outlets 43 are provided on the other side. An electromagnetic shaft frame 44 is provided inside the air outlet 43, and a fan 45 is rotatably installed inside the electromagnetic shaft frame 44.

[0036] In practical application, when the drying gas flows to the auxiliary component 4, it enters the drying box 41 through the mesh plate 42. The drying gas then comes into contact with the desiccant. If the drying gas contains evaporated condensate, the desiccant will absorb the moisture in the drying gas, thus ensuring the dehumidification capacity of the continuing flowing drying gas and further improving the efficiency of condensate removal. When the drying gas is discharged from the outlet pipe 43, it drives the fan 45 to rotate. This promotes the entry of the drying gas into the drying box 41 and also divides a stream of drying gas into multiple streams, increasing the speed of the drying gas flow and further improving the efficiency of condensate removal.

[0037] Furthermore, the end of the fan 45 is provided with a rotating shaft 451, which extends into the drying box 41, and a stirring element 452 is provided around the rotating shaft 451.

[0038] In practical application, when the fan 45 rotates, it drives the stirring element 452 to rotate through the rotating shaft 451. This causes the desiccant in the drying box 41 to be stirred, so that the desiccant particles are constantly turned over and their surfaces are renewed, effectively increasing the contact area with the drying gas, thereby enhancing the dehumidification effect on the drying gas. As the drying gas continues to flow, it can continuously carry away condensate, further improving the efficiency of condensate removal.

[0039] Furthermore, several humidity-sensitive resistors 46, transistors 47, and power supplies 48 are respectively installed on the drying box 41. The power supply 48 is connected to an external control unit. The humidity-sensitive resistors 46 are connected between the gate of the transistor 47 and the positive terminal of the power supply 48. The electromagnetic shaft bracket 44 is connected between the positive terminal of the power supply 48 and the drain of the transistor 47. The source of the transistor 47 is grounded.

[0040] In one embodiment, transistor 47 may be an N-channel MOSFET transistor; humidity-sensitive resistor 46 may be an electrolyte material, a semiconductor ceramic material, or an organic polymer material.

[0041] In practical application, when the humidity in the air chamber is high, the resistance of the humidity-sensitive resistor 46 decreases, which increases the gate voltage of the transistor 47, thereby increasing the conduction degree of the transistor 47 (equivalent to a decrease in the resistance between the drain and source). This increases the current flowing through the electromagnetic shaft 44, strengthening the electromagnetic force. Since the fan 45 has a magnet on its shaft 451, the fan speed is increased. This accelerates the passage of the drying gas and strengthens the tumbling frequency of the desiccant particles, thereby forcing the drying gas to fully and evenly contact all the desiccant particles, improving the dehumidification effect of the drying gas, and thus improving the overall efficiency of removing condensate after the drying gas passes through the air chamber. When the humidity in the air chamber is low, the fan 45 rotates at a lower speed. This low-speed stirring is sufficient to ensure that the remaining moisture comes into full contact with the desiccant, ensuring that the dry gas discharged from the air outlet 43 meets the low humidity requirements, while avoiding the heat and dust that may be generated due to excessive stirring. The above solution can specifically adjust the efficiency of condensate removal under different humidity environments, while ensuring dehumidification stability and extending the service life of the equipment.

[0042] It should be noted that when conducting high-temperature testing during the high and low temperature testing phase, the circuit board will be in a high-temperature state. In this case, the condensate absorbed by the desiccant will evaporate and return to the gas chamber. At this time, dry gas can continue to be introduced for dehumidification, thereby extending the service life of the desiccant.

Claims

1. A convenient DIMM testing device, characterized in that, It includes several sets of test components and several sets of motherboards, with multiple test components connected to a set of motherboards. The test components include: The socket board (1) includes a base (11), a board (12), a socket (13) and a connector (16). The board (12) and the socket (13) are arranged sequentially from the inside to the outside on one side of the base (11). Several slots (15) are opened on the other side of the base (11). The connector (16) is installed in the slots (15). Several fixing pins (18) are provided on the base (11). Interface board (2), the interface board (2) includes an outer frame (21), terminals (22) and connectors (23). Several terminals (22) are installed on one side of the outer frame (21), and several connectors (23) are installed on the other side. Several connectors (23) are connected to several connectors (16). Several wire harnesses (221) are led out from the terminals (22). The wire harnesses (221) are connected to the motherboard to transmit signals. Several fixing holes are opened on the outer frame (21). The fixing pins (18) on the base (11) are inserted into the fixing holes to fix the socket board (1) and the interface board (2). The guide tube (3) has an upper groove (17) on the socket plate (1) and a lower groove (24) on the interface plate (2). The upper groove (17) and the lower groove (24) overlap to form an air cavity. The connection of connector one (16) and connector two (23) is located in the air cavity. The guide tube (3) is installed in the air cavity. Auxiliary component (4): Several sets of auxiliary components (4) are installed in the air cavity; The lower groove (24) has an air inlet (25) and an exhaust outlet (26) respectively through its two ends. An air inlet pipe (27) is connected to the air inlet (25), and an exhaust pipe (28) is connected to the exhaust outlet (26). The guide tube (3) includes a connecting tube (31) and a main tube (32). The connecting tube (31) has a connecting hole (311) which coincides with the air inlet (25). One end of the connecting tube (31) is connected to the main tube (32). The connecting tube (31) is perpendicular to the main tube (32). Two sets of guide plates (322) are symmetrically arranged on the main tube (32). An air injection hole (321) is formed between the two sets of guide plates (322). The air injection hole (321) faces the air chamber. Both ends of the main pipe (32) are connected to branch pipes (33). Both sets of guide plates (322) are in an inclined state. The guide plates (322) guide part of the gas into the branch pipe (33). Several side air holes (331) are opened on the branch pipe (33). Several auxiliary parts (4) are provided on the inner side of both sets of branch pipes (33). The auxiliary parts (4) are located between two adjacent sets of side air holes (331). The auxiliary component (4) includes a drying box (41), a mesh plate (42), an air outlet (43), and a fan (45). The top and bottom of the drying box (41) abut against the surfaces of the upper groove (17) and the lower groove (24), respectively. One end of the drying box (41) abuts against the branch pipe (33), and the other end abuts against the connection of connector one (16) and connector two (23). A desiccant is placed inside the drying box (41). A mesh plate (42) is provided on the side of the drying box (41) facing the main pipe (32), and several air outlets (43) are provided on the other side. An electromagnetic shaft frame (44) is provided inside the air outlet (43), and a fan (45) is rotatably installed inside the electromagnetic shaft frame (44). The fan (45) has a rotating shaft (451) at its end, which extends into the drying box (41), and a stirring element (452) is provided around the rotating shaft (451). The drying box (41) is equipped with several humidity-sensitive resistors (46), transistors (47) and power supplies (48). The power supply (48) is connected to an external control unit. The humidity-sensitive resistors (46) are connected between the gate of the transistor (47) and the positive terminal of the power supply (48). The electromagnetic shaft frame (44) is connected between the positive terminal of the power supply (48) and the drain of the transistor (47). The source of the transistor (47) is grounded.

2. The convenient plug-in / plug-out DIMM testing device according to claim 1, characterized in that, A gasket (14) is provided between the board (12) and the socket (13).

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