一种低温增韧的羟基支化聚合物改性环氧树脂复合材料及其制备方法与应用
By introducing hydroxyl-branched polymers and curing agents into epoxy resins, a uniformly dispersed microphase structure is constructed, which solves the problem of brittle fracture of epoxy resins at low temperatures and improves the mechanical properties of the material in low-temperature environments.
CN121949754BActive Publication Date: 2026-07-17INNER MONGOLIA UNIV OF TECH
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INNER MONGOLIA UNIV OF TECH
- Filing Date
- 2026-01-30
- Publication Date
- 2026-07-17
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Figure CN121949754B_ABST
Abstract
本发明公开了一种低温增韧的羟基支化聚合物改性环氧树脂复合材料及其制备方法与应用，属于复合材料技术领域，本发明以1,4‑丁二醇与三羟甲基丙烷三缩水甘油醚为原料在催化剂作用下，经加热反应得到羟基支化聚合物；该聚合物与环氧树脂、固化剂共混制得混合溶液，混合溶液经消泡处理得到环氧树脂共混物，环氧树脂共混物浇铸于预处理的模具中固化，得到羟基支化聚合物改性环氧树脂复合材料。本发明通过羟基支化聚合物对环氧树脂进行改性，使得改性后环氧树脂复合材料在低温下的拉伸强度、弯曲强度和冲击韧性相比于纯环氧树脂均有显著提升，克服了传统环氧树脂固化后脆性高的问题。
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