铁电器件及其制备方法

By controlling the reaction conditions through MOCVD process, high-quality MgZnO thin films were prepared, solving the problems of phase separation and high defect density, realizing the industrial application of MgZnO thin films, and improving the performance and reliability of ferroelectric devices.

CN121968621BActive Publication Date: 2026-07-17SUZHOU LABORATORY
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Patents(China)
Current Assignee / Owner
SUZHOU LABORATORY
Filing Date
2026-03-27
Publication Date
2026-07-17

AI Technical Summary

Technical Problem

Existing technologies make it difficult to prepare high-quality, low-cost MgZnO thin films that are compatible with CMOS processes in semiconductor manufacturing. Furthermore, phase separation and high defect density issues limit their application in ferroelectric devices.

Method used

Metal-organic chemical vapor deposition (MOCVD) was employed to control the reaction temperature and pressure, adjust the VI/II ratio and the flow ratio of magnesium source to zinc source, ensure the growth of a single wurtzite structure in the MgZnO film, avoid phase separation, and improve the crystallization quality through annealing.

Benefits of technology

The industrial production of high-quality MgZnO thin films has been realized, reducing costs, improving growth rate and large-area uniformity, reducing defect density, and ensuring the stability of ferroelectric properties.

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Abstract

本申请涉及一种铁电器件及其制备方法。该铁电器件的制备方法,铁电器件包括铁电层,该方法,包括:采用金属有机化学气相沉积工艺沉积铁电层,铁电层的材料包括氧化镁锌,氧化镁锌的化学式为MgxZn1‑xO,x的取值范围为0.1‑0.6,铁电层具有单一的晶格结构,铁电层的晶格结构为纤锌矿结构。本申请的技术方案,可以避免铁电器件中铁电层发生相分离,还可以提高铁电层的生长速率,改善大面积均匀性,有利于产业化,以及可以提高结晶质量和降低缺陷密度。
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