Imaging device and electronic apparatus

Abstract

An imaging device according to one embodiment of the present disclosure includes: a plurality of pixel groups, each pixel group including a predetermined number of pixels; and a plurality of lenses provided one-to-one for each pixel group. The plurality of pixel groups and the plurality of lenses are arranged in a cellular array in plan view. Each of the plurality of pixel groups is formed in a hexagonal shape in a plan view.

Description

Imaging devices and electronic equipment Technical Field

[0001] This disclosure relates to an imaging device and an electronic device. Background Technology

[0002] For example, imaging devices that achieve autofocus by acquiring the phase difference of an image plane are known. For example, Patent Document 1 discloses an imaging device in which a lens is disposed on a pixel pair containing two pixels. Note that this imaging device is also referred to as, for example, a solid-state imaging device or a solid-state imaging element.

[0003] For example, in a planar view, multiple pixel pairs and multiple lenses are arranged in a honeycomb array. In the planar view, each lens is formed in a circular or elliptical shape to substantially cover the entire surface of the pixel pair. Note that reducing the spacing between lenses (gap region) is effective in improving quantum efficiency (QE). Therefore, the lenses are arranged in a honeycomb array. (List of cited patent documents)

[0004] Patent Document 1: WO 2012 / 026292 Technical problems of the invention

[0005] However, in the above configuration, a portion of the lens on a pixel pair can enter another pixel pair adjacent to that pixel pair, resulting in crosstalk and degrading aspects such as color reproducibility, phase difference detection accuracy, and sensitivity uniformity. Therefore, in addition to improving quantum efficiency, it is also necessary to suppress crosstalk.

[0006] In view of this, this disclosure provides an imaging device and electronic device that can improve quantum efficiency and suppress crosstalk. Solution to the problem

[0007] An imaging apparatus according to one aspect of the present disclosure includes: a plurality of pixel groups, each pixel group including a predetermined number of pixels; and a plurality of lenses, each lens being disposed for a corresponding pixel group, wherein, in a plan view, the plurality of pixel groups and the plurality of lenses are configured as a cellular array, and in a plan view, each pixel group in the plurality of pixel groups is formed into a hexagonal shape.

[0008] An electronic device according to one aspect of the present disclosure includes an imaging apparatus, wherein the imaging apparatus includes: a plurality of pixel groups, each pixel group including a predetermined number of pixels; and a plurality of lenses, each lens being disposed for a corresponding pixel group, wherein in a plan view, the plurality of pixel groups and the plurality of lenses are configured as a cellular array, and in a plan view, each pixel group in the plurality of pixel groups is formed into a hexagonal shape. Attached Figure Description

[0009] Figure 1 is a diagram showing a construction example of an imaging apparatus according to the first embodiment. Figure 2 is a plan view showing a construction example of a pixel array unit according to the first embodiment. Figure 3 is a plan view showing a construction example of a pixel array unit according to a comparative example of the first embodiment. Figure 4 is a cross-sectional view showing a construction example of a pixel array unit according to the first embodiment. Figure 5 is a cross-sectional view showing a pixel construction example 1 according to the first embodiment. Figure 6 is a plan view showing a pixel construction example 1 according to the first embodiment. Figure 7 is a cross-sectional view showing a pixel construction example 2 according to the first embodiment. Figure 8 is a plan view showing a pixel construction example 2 according to the first embodiment. Figure 9 is a plan view showing a construction example of a pixel array unit according to the second embodiment. Figure 10 is a plan view showing a pixel array unit construction example 1 according to the third embodiment. Figure 11 is a plan view showing a pixel array unit construction example 2 according to the third embodiment. Figure 12 is a plan view showing a construction example of a pixel array unit according to the fourth embodiment. Figure 13 is a diagram illustrating an example of zoom operation of an imaging apparatus according to the fourth embodiment. Figure 14 is a diagram illustrating an application example of using the imaging device according to any of the above embodiments. Figure 15 is a diagram illustrating a construction example of the imaging device according to the application example. Figure 16 is a diagram illustrating a construction example of the ranging device according to the application example. Detailed Implementation

[0010] The embodiments of this disclosure will now be described in detail with reference to the accompanying drawings. These embodiments include examples, variations, etc. It should be noted that the apparatuses, devices, methods, etc., related to this disclosure are not limited to these embodiments. Furthermore, in the following embodiments, repetitive descriptions are substantially omitted by assigning the same reference numerals to substantially the same components.

[0011] One or more of the following embodiments can be implemented independently. Alternatively, at least a portion of each of the following multiple embodiments can be suitably combined with at least a portion of another embodiment. These multiple embodiments may include novel features that differ from each other. Therefore, the various embodiments can be used for different purposes or to solve different problems, and can achieve different effects. Note that the effects in the embodiments are merely illustrative and not limiting; other effects may also be provided.

[0012] This disclosure will be described in the following order: 1. First Embodiment 1-1. Construction Example of Imaging Device 1-2. Construction Example of Pixel Array Unit 1-3. Construction Example of Pixel 1-3-1. Construction Example 11-3-2. Construction Example 22. Second Embodiment 2-1. Construction Example of Pixel Array Unit 3. Third Embodiment 3-1. Construction Example of Pixel Array Unit 3-1-1. Construction Example 13-1-2. Construction Example 24. Fourth Embodiment 4-1. Construction Example of Pixel Array Unit 4-2. Example of Zoom Operation of Imaging Device 5. Function and Effect of Each Embodiment 6. Other Embodiments 7. Application Examples 7-1. Imaging Device 7-2. Rangefinder 8. Appendix

[0013] <1. First Embodiment><1-1. Construction Example of Imaging Apparatus> A construction example of the imaging apparatus 10 according to this embodiment will now be described with reference to FIG1. ​​FIG1 is a diagram showing a construction example of the imaging apparatus 10 according to this embodiment.

[0014] As shown in Figure 1, the imaging device 10 includes a pixel array unit 11, a vertical drive unit 12, a column signal processing unit 13, and a control unit 14. For example, the imaging device 10 is a solid-state imaging device for generating image data of a subject.

[0015] The pixel array unit 11 is composed of a plurality of pixels 100. In the example of FIG1, the individual pixels 100 are arranged in a two-dimensional matrix. Each pixel 100 includes a photoelectric conversion unit that performs photoelectric conversion on incident light and generates an image signal of the subject based on the incident illumination light. For example, a photodiode can be used as the photoelectric conversion unit.

[0016] Signal lines 15 and 16 are respectively connected to each pixel 100. Pixels 100 are controlled by control signals transmitted through signal lines 15 to generate image signals, and the generated image signals are output to column signal processing unit 13 via signal lines 16. Signal lines 15 are arranged for each row of the two-dimensional matrix and are connected to multiple pixels 100 arranged in a row. Signal lines 16 are arranged for each column of the two-dimensional matrix and are connected to multiple pixels 100 arranged in a column.

[0017] The vertical drive unit 12 generates control signals for the pixel 100. The vertical drive unit 12 generates control signals for each row of the two-dimensional matrix of the pixel array unit 11, and outputs the generated control signals to each pixel 100 via the signal line 15.

[0018] The column signal processing unit 13 processes the image signals generated by the pixels 100. The column signal processing unit 13 simultaneously processes the image signals from each pixel 100 arranged in a row of the pixel array unit 11, and the image signals are transmitted via signal line 16. This processing may include, for example, analog-to-digital conversion to convert the analog image signals generated by the pixels 100 into digital image signals, or correlation double sampling (CDS) to remove offset errors in the image signals. The processed image signals are then output to external circuitry of the imaging device 10, etc.

[0019] Control unit 14 controls vertical drive unit 12 and column signal processing unit 13. Based on clock input from external circuitry or data indicating operating modes, control unit 14 generates control signals for controlling vertical drive unit 12 and column signal processing unit 13. Control unit 14 outputs control signals to vertical drive unit 12 via signal line 17 and to column signal processing unit 13 via signal line 18, thereby controlling vertical drive unit 12 and column signal processing unit 13.

[0020] The imaging device 10 described above, having this structure, essentially receives light incident from the subject, performs photoelectric conversion, and outputs an electrical signal corresponding to the amount of light. The imaging device 10 can be, for example, a wafer-level chip-scale package (WLCSP) formed by forming terminals and wiring before dicing a wafer (silicon wafer), and then dicing the wafer. There are no particular limitations on the type of imaging device 10, and it can be either a front-illuminated or back-illuminated type. The imaging device 10 can be, for example, a complementary metal-oxide-semiconductor (CMOS), a charge-coupled device (CCD), or other systems.

[0021] <1-2. Construction Examples of Pixel Array Units> Construction examples of the pixel array unit 11 according to this embodiment will now be described with reference to FIGS. 2 to 4. FIG. 2 is a plan view showing a construction example of the pixel array unit 11 according to this embodiment. FIG. 3 is a plan view showing a construction example of the pixel array unit 11A according to a comparative example of this embodiment. FIG. 4 is a cross-sectional view showing a construction example of the cross-sectional structure of the pixel array unit 11 according to this embodiment. Note that FIG. 4 shows a cross-section taken along line Y1-Y1 described in FIG. 2.

[0022] As shown in Figure 2, the pixel array unit 11 includes multiple pixel blocks B1 and multiple lenses 101. In the example of Figure 2, a single pixel block B1 is clearly shown, but in reality, for example, multiple pixel blocks B1 are arranged in a two-dimensional matrix.

[0023] For example, pixel block B1 comprises four pixels 100. Each pixel 100 is formed as a trapezoid in the planar view. In the example of Figure 2, each pixel 100 is formed as an isosceles trapezoid in the planar view, and two adjacent pixels 100 in the X-axis direction, i.e., pixel pair 110, are formed as a hexagon in the planar view. In pixel block B1, the two pixel pairs 110 are arranged to be offset from each other by one pixel 100 in the X-axis direction. Therefore, the pixel pairs 110 are configured as a cellular array. The pixel pairs 110 function as a group of pixels comprising two pixels 100.

[0024] Note that, for example, pixel block B1 includes green (Gr) pixel blocks, red (R) pixel blocks, blue (B) pixel blocks, and green (Gb) pixel blocks. For example, four pixel blocks B1 are set as the smallest repeating unit (pixel unit), and each has 100 pixels. Note that pixel block B1 includes optical filters such as color filters.

[0025] Four pixel blocks B1—a green (Gr) pixel block, a red (R) pixel block, a blue (B) pixel block, and a green (Gb) pixel block—are arranged, for example, in a two-row, two-column configuration. As an example, the green (Gr) pixel block is placed in the upper left, the red (R) pixel block in the upper right, the blue (B) pixel block in the lower left, and the green (Gb) pixel block in the lower right. This arrangement is, for example, called 2 × 2 quad Bayer coding (QBC).

[0026] Lens 101 is provided for each pixel pair 110 and shared by the pixel pairs 110. In a planar view, lens 101 is formed, for example, in an elliptical (or circular) shape to substantially cover the entire surface of the pixel pair 110. The lens 101 for the pixel pair 110 is configured as a cellular array. Specifically, the lens rows of lens 101 arranged in the X-axis direction are arranged parallel to each other in the Y-axis direction, and each lens row is alternately offset by one pixel 100 (half the lens diameter = half the pitch) in the X-axis direction.

[0027] In the comparative example, as shown in FIG3, in the pixel array unit 11A of the comparative example, each pixel 100 is formed into a rectangular shape in the planar view. Each lens 101 is formed into an elliptical shape (or a circular shape) in the planar view to substantially cover the entire surface of the pixel pair 110. To improve quantum efficiency (QE), suppressing the spacing (gap region) between the lenses 101 is effective. Therefore, the lenses 101 are arranged in a cellular array.

[0028] However, in the comparative example construction, a portion of the lens 101 on pixel pair 110 enters into another pixel pair 110 adjacent to pixel pair 110. That is, because a portion of the lens 101 on pixel pair 110 intrudes into another pixel pair 110 adjacent to pixel pair 110, crosstalk occurs, and, for example, color reproducibility, phase difference detection accuracy, and sensitivity uniformity are degraded. Therefore, in addition to improving quantum efficiency, it is also necessary to suppress crosstalk.

[0029] Therefore, as in this embodiment, by making the planar shape of pixel 100 trapezoidal in the planar diagram and the planar shape of pixel pair 110 hexagonal, the extension of a portion of the lens 101 on pixel pair 110 over another pixel pair 110 adjacent to pixel pair 110 can be suppressed while minimizing the spacing between lenses 101. In this way, quantum efficiency can be improved and crosstalk can be suppressed.

[0030] Note that, in order to improve quantum efficiency (QE), in addition to arranging the lenses 101 in a cellular array, another approach is to form the planar shape of the lenses 101 into a rectangular shape based on the planar shape of the rectangular pixels 100. However, when the planar shape of the lenses 101 is rectangular, the curvature of the lenses 101 is often low, and the phase difference detection accuracy also decreases. Furthermore, in processes such as reflow forming of the lenses 101, it is difficult to form the planar shape of the lenses 101 into a rectangular shape (resulting in reduced yield), and special exposure machines and masks are required, which increases costs. Therefore, to improve quantum efficiency (QE), it is preferable to arrange the lenses 101 in a cellular array.

[0031] As shown in Figure 4, the pixel array unit 11 includes a semiconductor substrate 111, a light receiving unit 112, a separation unit 113, a separation region 114, a multilayer wiring layer 121, a color filter 131, and a light-shielding layer 132.

[0032] The semiconductor substrate 111 is a support substrate on which the imaging device 10 is formed. The semiconductor substrate 111 is a p-type semiconductor substrate and, for example, includes a pair of opposing surfaces (front side S1 and back side S2). The back side S2 is the light incident surface. As the semiconductor substrate 111, for example, a substrate such as a silicon wafer can be used.

[0033] The light receiving unit 112 is a semiconductor region embedded and formed in the substrate of the semiconductor substrate 111 at a position corresponding to each of the plurality of pixels 100. In the semiconductor region, for example, an n-type impurity is doped to form a photodiode (PD). A photodiode is an example of a photoelectric conversion element.

[0034] Separation units 113 are disposed at the boundaries of a plurality of adjacent pixels 100 in the XY plane of the semiconductor substrate 111. In the example shown in FIG3, separation units 113 are deep trench isolation (DTI) formed using an insulating material such as an oxide film, but other structures may also be used.

[0035] The separation region 114 is a semiconductor region of the separation light receiving unit 112 (e.g., a photodiode). In this semiconductor region, for example, p-type impurities are doped to form the separation region 114.

[0036] A multilayer wiring layer 121 is disposed on the front side S1 of the semiconductor substrate 111, which is the surface of the pixel array unit 11 opposite to the light incident side S. For example, the multilayer wiring layer 121 includes multiple wiring layers 122, 123, and 124 and an interlayer insulating layer 125. Wiring layers 122, 123, and 124 are sequentially disposed on the front side S1 of the semiconductor substrate 111 from the light incident side S. Each of the wiring layers 122, 123, and 124 is provided with multiple wirings such as control lines. The control lines are wirings used to connect multiple transistors disposed on the front side S1 of the semiconductor substrate 111 to the vertical drive unit 12, the column signal processing unit 13, etc.

[0037] A color filter 131 is disposed on the back side (light incident surface) S2 of the semiconductor substrate 111, which is the light incident side S of the pixel array unit 11. The color filter 131 is a red (R), green (Gr, Gb), or blue (B) color filter. The color filter 131 can be disposed for every two adjacent pixels 100 (pixel pair 110) in the X-axis direction, or it can be disposed for each pixel 100. In either case, each pixel 100 will have a color filter 131.

[0038] For example, a light-shielding layer 132 is provided on the back side (light incident surface) S2 of the semiconductor substrate 111 for each pair of pixels 100 adjacent to each other in the X-axis direction, that is, for each pixel pair 110, to surround the pixel pair 110. The light-shielding layer 132 can be used as, for example, a filter wall separating the color filter 131, or it can be used as a layer that only blocks light without separating the color filter 131.

[0039] Each lens 101 is an on-chip lens (convex lens) and is disposed on the color filter 131, for example, on the light incident side S of the pixel array unit 11. The lens 101 is disposed above each pair of pixels 100 adjacent to each other in the X-axis direction (i.e., for each pixel pair 110). For example, each lens 101 is formed by reflow, etching, or the like. For each lens 101, microlenses may be used, for example.

[0040] Using this configuration, the images are offset from each other at two pixels 100 in a pixel pair 110 corresponding to a lens 101. The imaging device 10 generates phase difference data based on the so-called image plane phase difference detected by the multiple pixel pairs 110. For example, a camera equipped with the imaging device 10 determines the amount of defocus based on the phase difference data and moves the position of the imaging lens based on the amount of defocus. In this way, the camera can achieve autofocus.

[0041] <1-3. Construction Examples of Pixels> Construction Examples 1 and 2 of the pixel 100 according to this embodiment will be described with reference to Figures 5 to 8.

[0042] <1-3-1. Construction Example 1> Figure 5 is a cross-sectional view showing a construction example 1 of pixel 100 according to this embodiment. Figure 6 is a plan view showing a construction example 1 of pixel 100 according to this embodiment.

[0043] As shown in Figure 5, the pixel array unit 11 includes a trapezoidal region A1, a shape transition region A2, and a square region A3. That is, the pixel 100 is divided into the trapezoidal region A1, the shape transition region A2, and the square region A3.

[0044] As shown in FIG6, in the trapezoidal region A1 of pixel 100, the separation unit 113 is formed in a trapezoidal shape in the planar view. Therefore, the main part of the semiconductor substrate 111 of pixel 100 has a trapezoidal shape in the planar view, and pixel 100 is formed in a trapezoidal shape in the planar view. Additionally, as shown in FIG6, in the square region A3 of pixel 100, the separation region 114 is formed in a rectangular shape (e.g., a square shape) in the planar view. The shape transition region A2 of pixel 100 is the region where the separation unit 113 and the separation region 114 connect to each other.

[0045] Note that, as shown in Figure 5, for example, a pixel transistor T1 is disposed on the front side S1 of the semiconductor substrate 111. Examples of pixel transistor T1 include a transfer transistor, a reset transistor, an amplification transistor, and a selection transistor. Pixel transistor T1 is substantially disposed in each pixel 100.

[0046] <1-3-2. Construction Example 2> Figure 7 is a cross-sectional view showing a construction example 2 of pixel 100 according to this embodiment. Figure 8 is a plan view showing a construction example 2 of pixel 100 according to this embodiment. Note that in construction example 2, the differences from construction example 1 described above will be explained.

[0047] As shown in Figure 7, the pixel array unit 11 includes a hexagonal region A4 and a square region A5. That is, the pixel 100 is divided into a hexagonal region A4 and a square region A5.

[0048] As shown in Figure 8, in the hexagonal region A4 of pixel 100, the light-blocking layer 132 is formed in a hexagonal shape in the planar view. Therefore, the color filter 131 of pixel pair 110 is formed in a hexagonal shape in the planar view, and pixel pair 110 is also formed in a hexagonal shape in the planar view. Additionally, as shown in Figure 8, in the square region A5 of pixel 100, the separation unit 113 is formed in a rectangular shape (e.g., a square shape) in the planar view. Note that, similar to the separation unit 113, the separation region 114 is also formed in a rectangular shape (e.g., a square shape) in the planar view.

[0049] Note that the imaging device 10 according to this embodiment can be manufactured using methods, apparatus, and conditions commonly used for manufacturing semiconductor devices. That is, the imaging device 10 according to this embodiment can be manufactured using existing semiconductor device manufacturing methods. For example, various methods such as chemical vapor deposition, physical vapor deposition, coating methods such as spin coating, photolithography, and bonding techniques for support substrates, peripheral circuit substrates, etc., are used to manufacture the imaging device 10.

[0050] <2. Second Embodiment> <2-1. Construction Example of Pixel Array Unit> A construction example of the pixel array unit 11 according to this embodiment will be described with reference to FIG9. FIG9 is a plan view showing a construction example of the pixel array unit 11 according to this embodiment. Note that in this embodiment, the differences from the first embodiment will be explained.

[0051] As shown in Figure 9, pixel group 110A according to this embodiment includes four pixels 100. That is, the number of pixels in the shared lens 101 can be four, not just two. Pixel block B1 includes eight pixels 100. Each pixel 100 is formed in a trapezoidal shape in the planar view. In the example of Figure 9, each pixel 100 is formed in a right-angled trapezoidal shape in the planar view.

[0052] According to this embodiment, the same effect as the first embodiment can be obtained. Furthermore, by constructing a pixel group 110A using four pixels 100, phase difference detection in multiple directions can be performed within the pixel group 110A.

[0053] <3. Third Embodiment> <3-1. Construction Examples of Pixel Array Units> Construction Examples 1 and 2 of the pixel array unit 11 according to this embodiment will be described with reference to Figures 10 and 11. Note that in this embodiment, the differences from the first embodiment will be explained.

[0054] <3-1-1. Construction Example 1> Figure 10 is a plan view showing a construction example 1 of the pixel array unit 11 according to this embodiment.

[0055] As shown in Figure 10, in Construction Example 1, the pixel boundary directions (pixel segmentation directions) of pixel pairs 110 are the same, and the pixel boundary directions are inclined relative to the X-axis direction. That is, in the example of Figure 10, the pixel boundary directions of each pixel pair 110 are directions that intersect with the X-axis direction. The pixel boundary direction is the extending direction that divides the boundaries of the two pixels 100 in the pixel pair 110.

[0056] Note that in the example in Figure 2, the pixel boundary direction of each pixel pair 110 is the direction perpendicular to the X-axis direction, that is, the direction parallel to the Y-axis direction.

[0057] <3-1-2. Construction Example 2> Figure 11 is a plan view showing a construction example 2 of the pixel array unit 11 according to this embodiment.

[0058] As shown in Figure 11, in Construction Example 2, the pixel boundary directions of each pixel pair 110 are different from each other. In the example of Figure 11, the pixel boundary directions of every four pixel pairs 110 are different, but in reality, the pixel boundary directions differ according to various predetermined conditions. Pixel boundary directions include, for example, directions that are inclined to the upper right relative to the X-axis, directions that are parallel to the Y-axis, and directions that are inclined to the lower right relative to the X-axis.

[0059] According to this embodiment, the same effect as the first embodiment can be obtained. That is, according to Construction Example 1 or Construction Example 2, quantum efficiency can be improved and crosstalk can be suppressed. Furthermore, according to Construction Example 2, phase difference detection in multiple directions can be performed by mixing multiple pixel boundary directions with different orientations.

[0060] <4. Fourth Embodiment> <4-1. Construction Example of Pixel Array Unit> A construction example of the pixel array unit 11 according to this embodiment will be described with reference to FIG12. FIG12 is a plan view showing a construction example of the pixel array unit 11 according to this embodiment. Note that in this embodiment, the differences from the first embodiment will be described.

[0061] As shown in Figure 12, in the fourth embodiment, a plurality of pixel units U1 are provided in the pixel array unit 11. In the example shown in Figure 12, one pixel unit U1 is clearly shown, but in reality, a plurality of pixel units U1 are provided.

[0062] Pixel unit U1 includes four pixel blocks B1a, B1b, B1c and B1d, namely, green (Gr) pixel block B1a, red (R) pixel block B1b, blue (B) pixel block B1c and green (Gb) pixel block B1d.

[0063] Each of the green (Gr) pixel blocks B1a and B1d comprises ten pixels 100 (five pixel pairs 110). Each of the red (R) pixel blocks B1b and B1c blue (B) pixel blocks comprises eight pixels 100 (four pixel pairs 110).

[0064] The arrangement pattern of pixels 100 in green (Gr) pixel block B1a is the same as the arrangement pattern of pixels 100 in green (Gb) pixel block B1d. The arrangement pattern of pixels 100 is, for example, an H-shaped pattern in which four pixels 100 are arranged in parallel in the X-axis direction, two pixels 100 are arranged in parallel, and four pixels 100 are arranged sequentially in the Y-axis direction.

[0065] The arrangement pattern of pixels 100 in the red (R) pixel block B1b is the same as the arrangement pattern of pixels 100 in the blue (B) pixel block B1c. The arrangement pattern of pixels 100 is, for example, a cross-shaped pattern in which two pixels 100 are arranged in parallel in the X-axis direction, four pixels 100 are arranged in parallel in the X-axis direction, and two pixels 100 are arranged sequentially in the Y-axis direction.

[0066] The aforementioned green (Gr) pixel block B1a, red (R) pixel block B1b, blue (B) pixel block B1c, and green (Gb) pixel block B1d are arranged, for example, in a two-row, two-column configuration. As an example, green (Gr) pixel block B1a is placed in the upper left, red (R) pixel block B1b in the upper right, blue (B) pixel block B1c in the lower left, and green (Gb) pixel block B1d in the lower right. This arrangement is, for example, called deca-octa Bayer coding (DOBC).

[0067] According to this embodiment, the same effect as the first embodiment can be achieved. That is, even when the pixels 100 are arranged in a DOBC configuration, quantum efficiency can be improved and crosstalk can be suppressed.

[0068] <4-2. Example of Zoom Operation of Imaging Device> An example of the zoom operation of the imaging device 10 described above will be explained with reference to FIG13. FIG13 is a diagram illustrating an example of the zoom operation of the imaging device 10 according to this embodiment. In the example of FIG13, (A) shows image G1 and operation at a zoom magnification of 1x, (B) shows image G2 and operation at a zoom magnification of 2x, and (C) shows image G3 and operation at a zoom magnification of 3x. Each of images G1, G2, and G3 includes a subject H1.

[0069] As shown in Figure 13, the imaging device 10 includes three imaging modes: MA, MB, and MC. The control unit 14 selects one of the three imaging modes (MA, MB, or MC) based on information about the zoom ratio contained in the control signal. More specifically, for example, the control unit 14 selects imaging mode MA when the zoom ratio is less than 2, imaging mode MB when the zoom ratio is greater than 2 but less than 3, and imaging mode MC when the zoom ratio is greater than 3.

[0070] In imaging mode MA (refer to (A) in Figure 13), imaging device 10 obtains four pixel values ​​V (e.g., four pixel values ​​VGr, VR, VB, and VGb) in each of a plurality of pixel units U1, and four pixel blocks B1a, B1b, B1c, and B1d are considered as one pixel unit U1. In this way, imaging device 10 generates image data DP for every 36 pixels 100 by generating pixel values ​​V at a ratio of 4. For example, when the number of pixels 100 in pixel array unit 11 is 108 (Mpix), a pixel value V corresponding to 12 (Mpix) is calculated. In this way, the number of effective pixels becomes 12 (Mpix).

[0071] In imaging mode MA, for example, as the zoom ratio increases from 1, the number of effective pixels decreases as the zoom ratio increases. Then, when the zoom ratio becomes 2, the imaging mode changes to imaging mode MB. The number of effective pixels at zoom ratio 2 is the same as the number of effective pixels at zoom ratio 1.

[0072] In imaging mode MB (refer to (B) in Figure 13), imaging device 10 obtains 16 pixel values ​​V in each of the plurality of pixel units U1. In this way, imaging device 10 generates image data DP for every 36 pixels 100 by generating pixel values ​​V at a ratio of 16. For example, when the number of pixels 100 in pixel array unit 11 is 108 (Mpix), a pixel value V corresponding to 48 (Mpix) is calculated. In fact, since the zoom ratio is doubled, the imaging range is reduced to 1 / 4, and the number of effective pixels becomes 12 (Mpix) (= 48 / 4).

[0073] In imaging mode MB, for example, as the zoom ratio increases from 2, the number of effective pixels decreases with increasing zoom ratio. Then, when the zoom ratio becomes 3, the imaging mode changes to imaging mode MC. The number of effective pixels at zoom ratio 3 is the same as the number of effective pixels at zoom ratio 2.

[0074] In imaging mode MC (refer to (C) in Figure 13), imaging device 10 obtains 36 pixel values ​​V in each of the plurality of pixel units U1. In this way, imaging device 10 generates image data DP for each of the 36 pixels 100 by generating pixel values ​​V at a ratio of 36. For example, when the number of pixels 100 in pixel array unit 11 is 108 (Mpix), 108 (Mpix) captured images can be obtained. In fact, since the zoom ratio is three times, the imaging range is reduced to 1 / 9, and the number of effective pixels becomes 12 (Mpix) (= 108 / 9).

[0075] In this way, the imaging device 10 provides three imaging modes: MA, MB, and MC, thus reducing the variation in image quality caused by changes in zoom magnification. For example, if the imaging mode MB is omitted and two imaging modes, MA and MC, are provided so that imaging mode MA is selected when the zoom magnification is less than 2x and imaging mode MC is selected when the zoom magnification is greater than 2x, the number of effective pixels changes significantly. In this example, when the zoom magnification is 2x, imaging mode MC is selected, and the number of effective pixels becomes 27 (Mpix) (= 108 / 4). Therefore, there is a significant difference between the number of effective pixels at 1.9x zoom magnification and the number of effective pixels at 2x zoom magnification, and thus the image quality of the captured image changes significantly when the zoom magnification is approximately 2x. On the other hand, since the imaging device 10 provides three imaging modes, MA, MB, and MC, the variation in the number of effective pixels caused by changes in zoom magnification can be reduced, thereby suppressing the variation in image quality of the captured image.

[0076] <5. Effects and Benefits of Each Embodiment> As described above, the imaging apparatus 10 according to each embodiment includes multiple pixel groups (e.g., pixel pairs 110 or pixel groups 110A), each pixel group including a predetermined number of pixels 100, and multiple lenses 101, multiple pixel groups, and multiple lenses 102 arranged for each pixel group are arranged in a cellular array in a planar view, and each of the multiple pixel groups is formed in a hexagonal shape in a planar view (see Figures 2, 9, etc.). This allows for minimizing the spacing between the lenses 101 while suppressing the extension of a portion of the lens 101 on the pixel pair 110 above another pixel pair 110 adjacent to the pixel pair 110. Therefore, quantum efficiency can be improved and crosstalk can be suppressed.

[0077] Pixel 100 can be formed into a trapezoidal shape in a planar image (see Figures 2, 9, etc.). This makes it easy to form the planar shape of the pixel group into a hexagonal shape, and can reliably achieve improved quantum efficiency and suppression of crosstalk.

[0078] Furthermore, pixel 100 may include separation units 113 disposed at the boundary of pixel 100 and separating pixel 100, and separation units 113 may be formed into a trapezoidal shape in a planar view (see Figures 5 and 6). This makes it easy to form the planar shape of pixel 100 into a trapezoidal shape.

[0079] In addition to the separation unit 113 having a trapezoidal shape in the planar view, the pixel 100 may also include a separation region 114 connected to the separation unit 113 and separating the pixel 100, and the separation region 114 may be formed into a rectangular shape in the planar view (refer to Figures 5 and 6). This eliminates the need to form the planar shape of the separation region 114 into a trapezoidal shape, and the planar shape of the pixel 100 can be easily formed into a trapezoidal shape.

[0080] Additionally, a pixel group (e.g., pixel pair 110 or pixel group 110A) may include a light-shielding layer 132 surrounding the pixel group in a planar view, and the light-shielding layer 132 may be formed in a hexagonal shape in the planar view (see Figures 7 and 8). This makes it easy to form the planar shape of the pixel group into a hexagonal shape.

[0081] In addition to the light-shielding layer 132 having a hexagonal shape in the planar view, the pixel 100 may also include a separation unit 113 disposed at the boundary of the pixel 100 and separating the pixel 100, and the separation unit 113 may be formed into a rectangular shape in the planar view (refer to Figures 7 and 8). This eliminates the need to form the planar shape of the separation unit 113 into a trapezoidal shape, and the planar shape of the pixel group can be easily formed into a hexagonal shape.

[0082] In addition to the light-shielding layer 132 having a hexagonal shape in the planar view, the pixel 100 may also include a separation region 114 connected to the separation unit 113 and separating the pixel 100, and the separation region 114 may be formed into a rectangular shape in the planar view (refer to Figures 7 and 8). This eliminates the need to form the planar shape of the separation region 114 into a trapezoidal shape, and the planar shape of the pixel group can be easily formed into a hexagonal shape.

[0083] Lens 101 is formed in an elliptical or circular shape in the plan view (see Figure 2, etc.). Even in this configuration, it is possible to suppress the extension of a portion of lens 101 on pixel pair 110 above another pixel pair 110 adjacent to pixel pair 110 while minimizing the spacing between lenses 101. Therefore, quantum efficiency can be improved and crosstalk can be suppressed.

[0084] A predetermined number of pixels 100 may include two pixels 100 (pixel pair 110) (see Figure 2). Even with this configuration, quantum efficiency can be improved and crosstalk can be suppressed. In addition, phase difference detection can be performed in the pixel pair 110.

[0085] Furthermore, each pixel 100 of pixel pair 110 can be formed into an isosceles trapezoidal shape (see Figure 2). This ensures that the planar shape of pixel pair 110 is hexagonal.

[0086] A predetermined number of pixels 100 may include four pixels 100 (pixel group 110A) (see Figure 9). Even with this configuration, quantum efficiency can be improved and crosstalk can be suppressed. In addition, phase differences in multiple directions can be detected in pixel group 110A.

[0087] Furthermore, each pixel 100 of pixel group 110A can be formed into a right-angled trapezoidal shape (see Figure 9). This ensures that the planar shape of pixel group 110A is hexagonal.

[0088] Furthermore, the pixel boundary directions of pixel groups (e.g., pixel pair 110 or pixel group 110A) can be the same (see Figures 2 and 10). Even with this construction, quantum efficiency can be improved and crosstalk can be suppressed.

[0089] The pixel boundary orientations of a pixel group (e.g., pixel pair 110 or pixel group 110A) can be different from each other (see Figure 11). Even with this construction, quantum efficiency can be improved and crosstalk can be suppressed. In addition, by mixing multiple pixel boundary orientations with different orientations, phase difference detection in multiple directions can be performed.

[0090] Multiple pixels 100 can be arranged in a DOBC (see Figure 12). Even with this configuration, quantum efficiency can be improved and crosstalk can be suppressed.

[0091] <6. Other Implementation Schemes> The various structures and processes described in the above-described embodiments (including examples and variations) can be implemented in various forms other than those described above. For example, the structures and processes are not limited to the examples described above, but can take various forms. In addition, for example, unless otherwise stated, the structures, processes, specific names, or information including various data and parameters described in the above description and drawings can be modified at will.

[0092] Furthermore, the various structures and processes according to the above-described embodiments (including examples and variations) do not necessarily need to be physically constructed as shown in the figures. That is, the specific form of the distribution or integration of the various structures and processes is not limited to the examples shown, and all or part of them can be functionally or physically distributed or integrated in any unit according to various loads, usage conditions, etc.

[0093] Furthermore, the various structures and processes according to the above embodiments (including examples and variations) can be appropriately combined. For example, at least a portion of one embodiment can be appropriately combined with at least a portion of another embodiment. Additionally, the effects of the embodiments are merely illustrative and not limiting, and other effects may also be obtained.

[0094] <7. Application Examples> Application examples of the imaging apparatus 10 according to any of the above embodiments (including examples and variations) will be described with reference to FIG14. FIG14 is a diagram showing an application example of using the imaging apparatus 10 according to any of the above embodiments.

[0095] The imaging device 10 according to any of the above embodiments can be used for various applications, such as sensing visible light, infrared light, ultraviolet light, X-rays, etc. For example, the imaging device 10 can be applied to various devices (electronic devices), electronic devices mounted on various devices, etc., as described below.

[0096] For example, as shown in Figure 14, the imaging device 10 according to any of the above embodiments is used for: "devices for capturing images for viewing, such as digital cameras or portable devices with camera functions"; "devices for transportation purposes, such as onboard sensors for capturing images of the front, rear, surroundings, or interior of a vehicle for purposes such as safe driving including automatic parking and driver status recognition, surveillance cameras for monitoring moving vehicles or roads, or rangefinders for measuring distances between vehicles"; "devices for household appliances, such as televisions, refrigerators, or air conditioners, for capturing user gestures and performing device operations based on gestures"; "devices for healthcare purposes, such as endoscopes or devices for capturing images of blood vessels by receiving infrared light"; "devices for security purposes, such as surveillance cameras for crime prevention or cameras for personal identification"; "devices for beauty purposes, such as skin measurement devices for capturing images of the skin or microscopes for capturing images of the scalp"; "devices for sports purposes, such as action cameras or wearable cameras for sports applications"; and "devices for agricultural purposes, such as cameras for monitoring field or crop conditions".

[0097] The technology disclosed herein can be applied to a variety of products. For example, the technology disclosed herein can be implemented as an electronic device installed on any type of mobile body such as automobiles, electric vehicles, hybrid electric vehicles, motorcycles, bicycles, personal mobility vehicles, airplanes, drones, ships, robots, construction machinery, or agricultural machinery (tractors). Additionally, for example, the technology disclosed herein can be implemented as an electronic device installed on an endoscopic surgical system or a microsurgical system.

[0098] <7-1. Imaging Device> An imaging device 300 according to an application example will be described with reference to FIG15. FIG15 is a diagram showing a construction example of the imaging device 300 according to the application example. The imaging device 300 is an example of an electronic device that applies the imaging device 10 according to any of the above embodiments. Examples of the imaging device 300 include digital cameras, video cameras, and electronic devices such as smartphones or mobile phones with imaging capabilities.

[0099] As shown in Figure 15, the imaging device 300 includes an optical system 301, a shutter device 302, an imaging element (solid-state imaging device) 303, a control circuit (drive circuit) 304, a signal processing circuit 305, a monitor 306, and a memory 307. The imaging device 300 is capable of capturing still images and moving images.

[0100] The optical system 301 includes one or more lenses. The optical system 301 guides light (incident light) from the subject to the imaging element 303 and forms an image on the light-receiving surface of the imaging element 303.

[0101] The shutter device 302 is arranged between the optical system 301 and the imaging element 303. Under the control of the control circuit 304, the shutter device 302 controls the illumination period and the shading period of the imaging element 303.

[0102] Imaging element 303 accumulates signal charge over a certain period of time based on the light that forms an image on the light-receiving surface through optical system 301 and shutter device 302. The signal charge accumulated in imaging element 303 is transferred according to a drive signal (timing signal) provided from control circuit 304. For example, imaging device 10 according to any of the above embodiments is used as imaging element 303.

[0103] The control circuit 304 outputs a drive signal for controlling the transmission operation of the imaging element 303 and the shutter operation of the shutter device 302, and drives the imaging element 303 and the shutter device 302.

[0104] The signal processing circuit 305 performs various signal processing operations on the signal charge output from the imaging element 303. It supplies the image (image data) obtained through the signal processing by the signal processing circuit 305 to the monitor 306 and the memory 307.

[0105] Based on image data supplied from signal processing circuit 305, monitor 306 displays moving or still images captured by imaging element 303. Monitor 306 may be, for example, a panel display device such as a liquid crystal panel or an organic electroluminescent (EL) panel.

[0106] The memory 307 stores image data supplied from the signal processing circuit 305, that is, image data of moving or still images captured by the imaging element 303.

[0107] Even with the imaging device 300 having this configuration, quantum efficiency can be improved and crosstalk suppressed by applying the imaging device 10 according to any of the above embodiments to the imaging element 303.

[0108] <7-2. Range Measuring Device> A range measuring device 400 according to an application example will be described with reference to FIG16. FIG16 is a diagram showing a construction example of the range measuring device 400 according to the application example. The range measuring device 400 is an example of an electronic device that applies the imaging device 10 according to any of the above embodiments.

[0109] As shown in Figure 16, the ranging device (distance image sensor) 400 includes a light source unit 401, an optical system 402, an imaging element (solid-state imaging device) 403, a control circuit (drive circuit) 404, a signal processing circuit 405, a monitor 406, and a memory 407. The ranging device 400 can acquire a distance image corresponding to the distance to the subject by emitting light from the light source unit 401 towards the subject and receiving light (modulated light or pulsed light) reflected from the surface of the subject.

[0110] The light source unit 401 emits light toward the subject. For example, the light source unit 401 may be a vertical-cavity surface-emitting laser (VCSEL) array that emits laser light as a surface light source, or a laser diode array arranged in a row. Note that the laser diode array is supported by a predetermined driving unit (not shown) and scans in a direction perpendicular to the arrangement direction of the laser diodes.

[0111] The optical system 402 includes one or more lenses. The optical system 402 guides light (incident light) from the subject to the imaging element 403 and forms an image on the light receiving surface (sensor unit) of the imaging element 403.

[0112] Imaging element 403 accumulates signal charge based on light forming an image on the light-receiving surface through optical system 402. A distance signal representing the distance determined based on the light-receiving signal (APD OUT) output from imaging element 403 is supplied to signal processing circuit 405. Imaging element 403 may, for example, be an imaging device 10 according to any of the above embodiments.

[0113] The control circuit 404 outputs a drive signal (control signal) for controlling the operation of the light source unit 401, the imaging element 403, etc., and drives the light source unit 401 and the imaging element 403, etc.

[0114] The signal processing circuit 405 performs various signal processing operations on the distance signal supplied from the imaging element 403. For example, the signal processing circuit 405 performs image processing (such as histogram processing and peak detection processing) to construct a distance image based on the distance signal. The image (image data) obtained by the signal processing performed by the signal processing circuit 405 is supplied to the monitor 406 and the memory 407.

[0115] Based on image data supplied from signal processing circuit 405, monitor 406 displays a distance image captured by imaging element 403. Monitor 406 may be, for example, a panel display device such as a liquid crystal panel or an organic EL panel.

[0116] The memory 407 stores the image data supplied from the signal processing circuit 405, that is, the image data of the distance image captured by the imaging element 403.

[0117] Even with the rangefinder 400 having this configuration, quantum efficiency can be improved and crosstalk suppressed by applying the imaging device 10 according to any of the above embodiments to the imaging element 403.

[0118] As described above, the imaging device 10 according to any of the above embodiments can be installed in various electronic devices. For example, the imaging device 10 according to any of the above embodiments can be installed not only in the imaging device 300 and the ranging device 400, but also in various electronic devices such as hard disk drives (HDDs), notebook personal computers (PCs), mobile devices (such as smartphones and tablets), personal digital assistants (PDAs), wearable devices, game consoles, and music devices.

[0119] 8. Appendix This technology can be constructed as follows. (1) An imaging device, comprising: a plurality of pixel groups, each pixel group comprising a predetermined number of pixels; and a plurality of lenses, each lens being disposed for a corresponding pixel group, wherein the plurality of pixel groups and the plurality of lenses are configured as a cellular array in a plan view, and each pixel group in the plurality of pixel groups is formed in a hexagonal shape in a plan view. (2) The imaging device according to (1), wherein the pixel is formed in a trapezoidal shape in a plan view. (3) The imaging device according to (2), wherein the pixel includes a separation unit disposed at the boundary of the pixel and separating the pixel, and the separation unit is formed in a trapezoidal shape in a plan view. (4) The imaging device according to (3), wherein the pixel further includes a separation region connected to the separation unit and separating the pixel, and the separation region is formed in a rectangular shape in a plan view. (5) The imaging device according to (2), wherein the pixel group includes a light-shielding layer surrounding the pixel group in a plan view, and the light-shielding layer is formed in a hexagonal shape in a plan view. (6) The imaging apparatus according to (5), wherein the pixel further includes a separation unit disposed at the boundary of the pixel and separating the pixel, and the separation unit is formed in a rectangular shape in a plan view. (7) The imaging apparatus according to (6), wherein the pixel further includes a separation region connected to the separation unit and separating the pixel, and the separation region is formed in a rectangular shape in a plan view. (8) The imaging apparatus according to any one of (1) to (7), wherein the lens is formed in an elliptical shape or a circular shape in a plan view. (9) The imaging apparatus according to any one of (1) to (8), wherein the predetermined number of pixels is two pixels. (10) The imaging apparatus according to (9), wherein each of the two pixels is formed in an isosceles trapezoidal shape. (11) The imaging apparatus according to any one of (1) to (8), wherein the predetermined number of pixels is four pixels. (12) The imaging apparatus according to (11), wherein each of the four pixels is formed in a right trapezoidal shape. (13) The imaging apparatus according to any one of (1) to (12), wherein the pixel boundary directions of each group of pixels are the same. (14) The imaging apparatus according to any one of (1) to (12), wherein the pixel boundary directions of each of the pixel groups are different from each other. (15) The imaging apparatus according to any one of (1) to (14), wherein the plurality of pixels are arranged in an eighteen-pixel Bayer code (DOBC).(16) An electronic device including an imaging apparatus, wherein the imaging apparatus comprises: a plurality of pixel groups, each pixel group including a predetermined number of pixels; and a plurality of lenses, each lens being disposed for a corresponding pixel group, the plurality of pixel groups and the plurality of lenses being configured as a cellular array in a planar view, and each pixel group in the plurality of pixel groups being formed in a hexagonal shape in the planar view. (17) An electronic device including the imaging apparatus according to any one of (1) to (15). (18) A method of manufacturing an imaging apparatus for manufacturing the imaging apparatus according to any one of (1) to (15). List of reference numerals.

[0120] 10 Imaging device 11 Pixel array unit 11A Pixel array unit 12 Vertical drive unit 13 Column signal processing unit 14 Control unit 15 Signal line 16 Signal line 17 Signal line 18 Signal line 100 Pixel 101 Lens 110 Pixel pair 110A Pixel group 111 Semiconductor substrate 112 Light receiving unit 113 Separation unit 114 Separation area 121 Multilayer wiring layer 122 Wiring layer 123 Wiring layer 124 Wiring layer 125 Interlayer insulating layer 131 Color filter 132 Light shielding layer 300 Imaging device 400 Ranging device A1 Trapezoidal area A2 Shape transition area A3 Square area A4 Hexagonal area A5 Square area B1 Pixel block B1a Pixel block B1b Pixel block B1c Pixel block B1d Pixel block DP Image data G1 Image G2 Image G3 Image H1 Subject MA Imaging mode MB Imaging mode MC Imaging mode S Light incident side S1 Front S2 Back T1 Pixel transistor U1 Pixel unit

Claims

1. An imaging device, comprising: Multiple pixel groups, each pixel group including a predetermined number of pixels; The system comprises multiple lenses, each lens being configured for a corresponding pixel group, wherein the multiple pixel groups and the multiple lenses are configured as a cellular array in a planar view, and each pixel group in the multiple pixel groups is formed into a hexagonal shape in the planar view.

2. The imaging apparatus according to claim 1, wherein the pixel is formed in a trapezoidal shape in a planar view.

3. The imaging apparatus according to claim 2, wherein the pixel includes a separation unit disposed at the boundary of the pixel and separating the pixel, and the separation unit is formed in a trapezoidal shape in a plan view.

4. The imaging apparatus of claim 3, wherein the pixel further includes a separation region connected to the separation unit and separating the pixel, and the separation region is formed in a rectangular shape in a plan view.

5. The imaging apparatus of claim 2, wherein the pixel group includes a light-shielding layer surrounding the pixel group in a plan view, and the light-shielding layer is formed in a hexagonal shape in the plan view.

6. The imaging apparatus according to claim 5, wherein the pixel further includes a separation unit disposed at the boundary of the pixel and separating the pixel, and the separation unit is formed in a rectangular shape in a plan view.

7. The imaging apparatus of claim 6, wherein the pixel further includes a separation region connected to the separation unit and separating the pixel, and the separation region is formed in a rectangular shape in a plan view.

8. The imaging apparatus according to claim 1, wherein the lens is formed in an elliptical or circular shape in a plan view.

9. The imaging apparatus according to claim 1, wherein the predetermined number of pixels is two pixels.

10. The imaging apparatus according to claim 9, wherein each of the two pixels is formed in an isosceles trapezoidal shape.

11. The imaging apparatus according to claim 1, wherein the predetermined number of pixels is four pixels.

12. The imaging apparatus according to claim 11, wherein each of the four pixels is formed in a right-angled trapezoidal shape.

13. The imaging apparatus according to claim 1, wherein the pixel boundary directions of each of the pixel groups are the same.

14. The imaging apparatus of claim 1, wherein the pixel boundary directions of each of the pixel groups are different from each other.

15. The imaging apparatus of claim 1, wherein the plurality of said pixels are arranged in an eighteen-pixel Bayer code (DOBC).

16. An electronic device including an imaging apparatus, wherein the imaging apparatus comprises: Multiple pixel groups, each pixel group including a predetermined number of pixels; The system comprises multiple lenses, each lens being configured for a corresponding pixel group. The multiple pixel groups and the multiple lenses are configured as a honeycomb array in a planar view, and each pixel group in the multiple pixel groups is formed into a hexagonal shape in the planar view.

Images