一种半球谐振子外表面的加工方法及装置
By adjusting the rotation angle θ of the hemispherical resonator around its center and compensating for the machining path, the problems of precision and integrity in the machining of the outer surface of the hemispherical resonator were solved, and efficient machining of the outer surface within the design tolerance range was achieved.
CN121973028BActive Publication Date: 2026-07-17HUNAN 208 ADVANCED TECH CO LTD
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUNAN 208 ADVANCED TECH CO LTD
- Filing Date
- 2026-04-08
- Publication Date
- 2026-07-17
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Figure CN121973028B_ABST
Abstract
本发明公开了一种半球谐振子外表面的加工方法及装置，方法包括：根据磨轮的实际尺寸和半球谐振子的设计尺寸进行计算，得到加工时半球谐振子绕其球心旋转的角度θ和加工路径；将半球谐振子试验品绕其球心旋转θ，再按所述加工路径对半球谐振子试验品的外表面进行加工；基于加工后的半球谐振子试验品的外球半径的实测值与外球半径的设计尺寸，计算外球半球的偏差，基于所述外球半径的偏差求得加工路径的补偿量，得到补偿后的加工路径；基于所述磨轮，以及所述半球谐振子绕其球心旋转的角度θ和补偿后的加工路径对半球谐振子外表面进行加工。本发明能够实现半球谐振子的外球尺寸加工到位，且避免了外支撑柱与过渡R角的尺寸被破坏的现象。
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