A nonlinear harmonic testing device

Abstract

The application provides a nonlinear harmonic testing device, and relates to the technical field of radio frequency nonlinear testing. The device comprises a first circuit board, a second circuit board, a flexible circuit board and a pressure joint. The first circuit board and the second circuit board are oppositely arranged, and at least part of the second circuit board is located on the same layer as the first circuit board. The two ends of the flexible circuit board are respectively connected to the first circuit board and the second circuit board. The pressure joint is arranged on one side of the first circuit board and the second circuit board and is electrically connected to the first circuit board and the second circuit board. The flexible circuit board is arranged opposite to the pressure joint, and the pressure joint is used for pressure connection with a to-be-tested member. In the application, the signal current can vertically pass through the to-be-tested member, the current direction of the to-be-tested member in the equipment is simulated, the test error caused by the current direction difference is reduced, the authenticity of the nonlinear harmonic test is ensured, and the flexible circuit board is additionally arranged to expand the range of harmonic detection.

Description

Technical Field

[0001] This application relates to the field of radio frequency nonlinear testing technology, and in particular to a nonlinear harmonic testing device. Background Technology

[0002] When high-frequency signals pass through electronic devices, they generate harmonic signals several times the original signal frequency. In wireless electronic products, non-ideal harmonic signals generated in the signal transmission link can cause radiated spurious interference, interfering with the received signals of other communication systems. Among these, the device under test (DUT) in the radio frequency front-end equipment is the main grounding current-carrying structure and is prone to generating nonlinear harmonics.

[0003] In related technologies, harmonic testing devices include a test circuit board, on which the device under test (DUT) is attached or soldered to achieve signal transmission. Alternatively, the harmonic testing device includes a pressure-adjusting structure based on a metal cavity, in which the DUT is pressed into the pressure plate. The fundamental signal is input from one end of the cavity and transmitted to the DUT, and the excited nonlinear harmonic components are reflected back to the input port to achieve signal transmission.

[0004] However, the test circuit board cannot simulate the actual assembly of the device under test. The pressure structure is a single-port device, which does not match the signal transmission path of the actual device under test. It also cannot simulate the real assembly and has a narrow detection range for harmonics. Summary of the Invention

[0005] This application provides a nonlinear harmonic testing device, which facilitates the simulation of real assembly conditions of the test piece and expands the testing range.

[0006] To achieve the above objectives, the technical solution of this application is as follows:

[0007] This application provides a nonlinear harmonic testing device, comprising: a first circuit board; a second circuit board, wherein the first circuit board and the second circuit board are disposed opposite to each other, and at least a portion of the second circuit board and the first circuit board are located on the same layer; a flexible circuit board, wherein the two ends of the flexible circuit board are respectively connected to the first circuit board and the second circuit board; and a pressing member, wherein the pressing member is disposed across one side of the first circuit board and the second circuit board and is electrically connected to both the first circuit board and the second circuit board, wherein the flexible circuit board and the pressing member are disposed opposite to each other, and the pressing member is used to press against the test piece.

[0008] In one possible implementation, the nonlinear harmonic testing device provided in this application embodiment has a crimping member that is detachably connected to at least one of the second circuit board and the first circuit board.

[0009] In one possible implementation, the nonlinear harmonic testing device provided in this application includes a first pressure bar and a second pressure bar as the crimping component. The first pressure bar is disposed on a first circuit board and indirectly coupled to a first transmission line thereon. The second pressure bar is disposed on a second circuit board and indirectly coupled to a second transmission line thereon. A portion of the second pressure bar is suspended above the first pressure bar, and the test piece is crimped between the first pressure bar and the second pressure bar.

[0010] In one possible implementation, the nonlinear harmonic testing device provided in this application embodiment includes a second pressure bar comprising a first segment, a second segment, and a third segment connected in sequence. The first segment is disposed opposite to the first pressure bar in a first direction, the second segment is disposed at an angle, and the third segment is disposed opposite to the first pressure bar in a second direction. The third segment is suspended on the second transmission line in the first direction, wherein the first direction is perpendicular to the second direction.

[0011] In one possible implementation, the nonlinear harmonic testing device provided in this application embodiment further includes a first base and a second base disposed opposite to each other, a first circuit board disposed on the first base, a second circuit board disposed on the second base, and a portion of the second base extends into the clearance portion of the first base so that at least a portion of the second circuit board is located on the same layer as the first circuit board.

[0012] In one possible implementation, the nonlinear harmonic testing device provided in this application embodiment has a slot on the second base, and at least part of the second pressure strip is disposed in the slot, which is located on the side of the second base facing the first base.

[0013] In one possible implementation, the nonlinear harmonic testing device provided in this application embodiment has a second circuit board that moves relative to the first circuit board along the height direction of the first circuit board.

[0014] In one possible implementation, the nonlinear harmonic testing device provided in this application embodiment has two ends of the flexible circuit board that are electrically connected to the reference ground plane of the first circuit board and the reference ground plane of the second circuit board, respectively.

[0015] In one possible implementation, the nonlinear harmonic testing device provided in this application embodiment further includes a test bench and a moving arm. A first base is mounted on the test bench, and a second base is mounted on the moving end of the moving arm. The moving arm is configured to drive the second base to move in a direction close to or away from the first base in order to apply pressure to the test piece.

[0016] In one possible implementation, the nonlinear harmonic testing device provided in this application embodiment further includes a nonlinear testing module. Both the first circuit board and the second circuit board are electrically connected to the nonlinear testing module. The nonlinear testing module is used to input the fundamental signal to the first circuit board and receive the nonlinear signal through the second circuit board.

[0017] This application provides a nonlinear harmonic testing device. The device uses a first and second circuit board, which are relatively parallel and partially on the same layer, and a cross-connecting pressure piece to form a transmission path from the first circuit board, the pressure piece, and the second circuit board. This allows the signal current to pass perpendicularly through the device under test (DUT), simulating the current flow of the DUT within the equipment. This reduces testing errors introduced by differences in current direction and ensures the authenticity of the nonlinear harmonic test. The pressure piece facilitates adjustment of the pressure on the DUT, simulating the preload and contact state of the DUT in actual assembly. The flexible circuit board allows for easy adjustment of the relative positions of the first and second circuit boards and optimizes the grounding loop, reducing signal loss. In harmonic testing, higher-order harmonics (such as the fifth and seventh harmonics) have weak amplitudes and are more sensitive to signal loss. By reducing signal transmission loss, effective transmission of weak higher-order harmonic signals can be ensured, thereby expanding the harmonic detection range. Attached Figure Description

[0018] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0019] Figure 1 This is a schematic diagram of the nonlinear harmonic testing device provided in the embodiments of this application;

[0020] Figure 2 A schematic diagram of the structure in the nonlinear harmonic testing device provided in this application, in which the first circuit board and the second circuit board are respectively assembled on the first base and the second base;

[0021] Figure 3 for Figure 2 Explosion-proof schematic diagram of a nonlinear harmonic testing device;

[0022] Figure 4 for Figure 2 A schematic diagram of the nonlinear harmonic testing device from another perspective;

[0023] Figure 5 for Figure 4 Cross-sectional view of a nonlinear harmonic testing device;

[0024] Figure 6 This is a schematic diagram of the structure of the second base provided in an embodiment of this application;

[0025] Figure 7 A circuit block diagram of the nonlinear testing module provided in an embodiment of this application;

[0026] Figure 8 Simulation diagram of the nonlinear harmonic testing device provided in the embodiments of this application in the 0.9GHz test frequency band.

[0027] Explanation of reference numerals in the attached figures:

[0028] 10 - Component to be tested;

[0029] 100 - First circuit board; 110 - First transmission line; 101 - Reference ground layer; 120 - Spacer; 121 - Groove;

[0030] 200 - Second circuit board; 210 - Second transmission line;

[0031] 300 - Flexible circuit board;

[0032] 400 - Crimping component; 410 - First crimping strip; 420 - Second crimping strip; 421 - First section; 422 - Second section; 423 - Third section;

[0033] 500 - First base; 501 - Clearance section;

[0034] 600 - Second base; 601 - Card slot; 602 - Connection hole.

[0035] The accompanying drawings illustrate specific embodiments of this application, which will be described in more detail below. These drawings and descriptions are not intended to limit the scope of the concept in any way, but rather to illustrate the concept of this application to those skilled in the art through reference to particular embodiments. Detailed Implementation

[0036] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numerals in different drawings denote the same or similar elements. The embodiments described in the following exemplary embodiments do not represent embodiments consistent with this application. Rather, they are merely examples of apparatuses and methods consistent with some aspects of this application as detailed in the appended application.

[0037] It should be noted that in the description of the embodiments of this application, the terms "upper", "lower", "inner", "outer" and other terms indicating the orientation or positional relationship are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description, and are not intended to indicate or imply that the device or component must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation on the embodiments of this application.

[0038] Furthermore, it should be noted that the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, "multiple" means two or more, unless otherwise explicitly specified.

[0039] In this application, unless otherwise expressly specified and limited, the terms "installation," "connection," "fixation," etc., should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral part; they can refer to a mechanical connection, an electrical connection, or a connection that allows communication between them; they can refer to a direct connection or an indirect connection through an intermediate medium; they can refer to the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0040] It is understood that electrical connections include direct electrical connections and indirect electrical connections. A direct electrical connection can be understood as components physically contacting and conducting electricity; it can also be understood as different components in a circuit structure being connected through physical lines that can transmit electrical signals, such as copper foil or wires on a circuit board. An indirect electrical connection, such as indirect coupling, can be understood as two conductors conducting electricity through a gap / non-contact method. In one embodiment, indirect coupling can also be called capacitive coupling, for example, using the coupling between the gaps between two conductive parts to form an equivalent capacitance to achieve signal transmission.

[0041] With the rapid development of the mobile communication industry, modern smart devices are becoming increasingly integrated and complex, leading to more serious electromagnetic interference problems. Among these, radiated spurious emissions affect the communication reliability and security of devices. The cause of radiated spurious emissions is the nonlinear harmonic distortion generated in the device under test (such as conductive foam, springs, etc.) under the influence of high-frequency signals. For example, when a high-frequency signal passes through an electronic device, it can generate harmonic signals several times the original signal frequency.

[0042] In wireless electronic products, non-ideal harmonic signals generated in the signal transmission link can cause radiated spurious interference, interfering with the received signals of other communication systems. Among these, the device under test (DUT) in the radio frequency front-end equipment is the main ground current-carrying structure and is prone to generating nonlinear harmonics.

[0043] In related technologies, harmonic testing devices include test circuit boards. The device under test (DUT) is attached to the test circuit board by pasting or soldering, and the DUT is bridged between two transmission lines on the test circuit board. A certain pressure is then applied from above using a matching fixture to simulate the actual working state of the DUT.

[0044] However, in actual assembly, the current passes vertically through the device under test (DUT), while during circuit board testing, the current passes horizontally through the DUT. The nonlinear data measured under these conditions differs from the nonlinear data obtained in actual assembly.

[0045] Alternatively, harmonic testing devices may include a pressure-adjusting structure based on a metal cavity, where the component under test (DUT) is pressed into the pressure plate. The fundamental signal is input from one end of the cavity and transmitted to the DUT, and the excited nonlinear harmonic components are reflected back to the input port to achieve signal transmission. This pressure-adjusting structure is a single-port device, which does not match the actual signal transmission path of the DUT and cannot simulate a real assembly. Taking the GSM900 band as an example, existing testing devices can only test third harmonics; higher-order harmonics are difficult to detect, thus limiting the harmonic detection range.

[0046] The following is in conjunction with the appendix Figure 1 To be continued Figure 8 The present application will be described in detail with reference to the illustrations and specific embodiments.

[0047] This application provides a nonlinear harmonic testing device, combined with... Figure 1 , Figure 2 , Figure 3 , Figure 4 As shown, it includes: a first circuit board 100; a second circuit board 200, the first circuit board 100 and the second circuit board 200 are disposed opposite to each other, and at least part of the second circuit board 200 and the first circuit board 100 are located on the same layer; a flexible circuit board 300, the two ends of the flexible circuit board 300 are respectively connected to the first circuit board 100 and the second circuit board 200; a crimping member 400, the crimping member 400 is disposed across one side of the first circuit board 100 and the second circuit board 200 and is electrically connected to both the first circuit board 100 and the second circuit board 200, the flexible circuit board 300 and the crimping member 400 are disposed opposite to each other, and the crimping member 400 is used to crimp to the test piece 10.

[0048] The first circuit board 100 is used to receive signals and to carry signal input ports. For example, the first circuit board 100 is used to transmit fundamental signals, and the first circuit board 100 may be a rectangular plate structure with SMA internal hole connectors welded to its surface.

[0049] The second circuit board 200 can move relative to the first circuit board 100 to form a pressure-contact structure on the same layer as the first circuit board 100. The surface of the second circuit board 200 is also soldered with an SMA connector to facilitate docking with external test equipment, such as a nonlinear test module.

[0050] At least a portion of the second circuit board 200 and the first circuit board 100 are located on the same layer and partially overlap in space. For example, the second circuit board 200 and the first circuit board 100 are spaced apart along the x-direction, and the first circuit board 100 and the pressure fitting 400 are spaced apart along the z-direction. The second circuit board 200 can move relative to the first circuit board 100 in the z-direction, such as in the +z-direction or the -z-direction, thereby enabling the testing of the test piece 10 under different compression heights.

[0051] It should be noted that being on the same layer means that when the test piece 10 is in the test crimping state, the projections of the second circuit board 200 and the first circuit board 100 in the height direction at least partially overlap to ensure the continuity of the signal path; while during the adjustment process, the process of the second circuit board 200 moving along the z direction will change the assembly height of the test piece 10.

[0052] The device under test 10 is located between the first circuit board 100 and the crimping member 400. The crimping member 400 transmits signals to the first circuit board 100 through indirect coupling, and the crimping member 400 transmits signals to the second circuit board 200 through indirect coupling as well.

[0053] The crimping member 400 is located between the first circuit board 100 and the second circuit board 200, and the test piece 10 is crimped into the crimping member 400.

[0054] The signal source inputs the fundamental wave signal to the first circuit board 100 through the port. The fundamental wave signal excites the nonlinear component through the contact interface between the crimping member 400 and the device under test 10. The nonlinear component is output through the signal port of the second circuit board 200 and separated and analyzed by an external test system (such as a duplexer or filter).

[0055] The pressing of the crimping parts 400 (such as two metal pressure strips) is used to make the contact interface state of the test piece 10 consistent with the actual assembly, and the current flows vertically through the test piece 10 to simulate the current path in the actual working environment.

[0056] In one possible implementation, combining Figure 1 , Figure 2 , Figure 3 As shown, the crimping member 400 is detachably connected to at least one of the second circuit board 200 and the first circuit board 100.

[0057] In this embodiment, the crimping member 400 is detachably connected, facilitating replacement or substitution of the crimping member 400, and allowing for the replacement of crimping members 400 made of different materials to meet harmonic testing under different contact conditions. Furthermore, depending on testing needs, this application can also replace the material under test within the device, such as different types of conductive foam, spring sheets, and other test components 10.

[0058] The crimping component 400 has an upper metal surface and a lower metal surface, and the upper and lower sides of the test component 10 are respectively connected to the upper metal surface and the lower metal surface.

[0059] In this embodiment of the application, external force is applied to the crimping member 400. For example, an external high-precision pressure test bench presses the device and controls the required pressure. The contact state between the test member 10 and the upper and lower metal surfaces changes accordingly. The nonlinear parameter of the test member 10 as a function of the pressure can be measured to detect the reliability of the test member 10.

[0060] In this circuit, the traces of the first circuit board 100 and the second circuit board 200 are electrically connected to the crimping member 400. The two ends of the flexible circuit board 300 are respectively electrically connected to the reference ground layer 101 of the first circuit board 100 and the reference ground layer 101 of the second circuit board 200. For example, the flexible circuit board 300 has grounding pads at both ends, which are fixed to the reference ground layers 101 on the first circuit board 100 and the second circuit board 200 by reflow soldering to ensure a low-impedance electrical connection; alternatively, conductive adhesive or elastic crimping can be used for easy disassembly.

[0061] The flexible circuit board 300 provides a low-impedance electrical connection to the reference ground of the first circuit board 100 and the second circuit board 200, forming a complete ground loop, reducing loop inductance, suppressing common-mode interference, ensuring the integrity of signal transmission, and facilitating the movement of the second circuit board 200 relative to the first circuit board 100 in the z direction.

[0062] In some embodiments, the reference ground layer 101 of the first circuit board 100 and the second circuit board 200 may be a metal layer of its inner layer or surface layer, and a ground layer is provided on the flexible circuit board 300, which is fixedly connected to the reference ground layer 101 of the two circuit boards by soldering or conductive adhesive.

[0063] The addition of the flexible circuit board 300 allows the second circuit board 200 to move relative to the first circuit board 100, for example, as shown in... Figure 1 , Figure 2 , Figure 3 , Figure 4 , Figure 5 As shown, the second circuit board 200 moves relative to the first circuit board 100 along the height direction of the first circuit board 100.

[0064] In order to perform harmonic testing on the device under test 10 under different compression states, the second circuit board 200 is configured to be movable relative to the height direction of the first circuit board 100.

[0065] Specifically, the first circuit board 100 is fixedly mounted on the first base 500 or the workbench of an external pressure testing device. The second circuit board 200 is mounted on the second base 600, with the first base 500 and the second base 600 positioned opposite each other, and a portion of the second base 600 extending into the first base 500. This facilitates the placement of the crimping member 400 on the same side of the second circuit board 200 and the first circuit board 100, while also placing the second circuit board 200 and the first circuit board 100 on the same layer.

[0066] The second circuit board 200 can reciprocate smoothly relative to the first circuit board 100 in a direction perpendicular to the board surface (i.e., the Z direction or the height direction). By adjusting the height position of the second circuit board 200, the compression amount of the test piece 10 installed between the crimping member 400 and the first circuit board 100 can be changed, thereby simulating the contact state of the test piece 10 due to different pressing heights during the actual assembly of electronic devices.

[0067] In one possible implementation, combining Figures 1 to 6 The crimping member 400 includes a first crimping strip 410 and a second crimping strip 420. The first crimping strip 410 is disposed on the first circuit board 100 and indirectly coupled to the first transmission line 110 thereon. The second crimping strip 420 is disposed on the second circuit board 200 and indirectly coupled to the second transmission line 210 thereon. A portion of the second crimping strip 420 is suspended above the first crimping strip 410. The test piece 10 is crimped between the first crimping strip 410 and the second crimping strip 420.

[0068] The first circuit board 100 has a first transmission line 110, the second circuit board 200 has a second transmission line 210, the crimping member 400 is indirectly coupled to the first transmission line 110, and the crimping member 400 is indirectly coupled to the second transmission line 210.

[0069] Both the first transmission line 110 and the second transmission line 210 are high-frequency signal transmission lines with specific characteristic impedances to match the interface impedance of external test instruments (such as signal sources, spectrum analyzers, receivers, etc.) and reduce signal reflection.

[0070] Indirect coupling refers to non-contact electromagnetic coupling. Capacitive coupling can be formed between the crimp member 400 and the signal conductor of the transmission line. For example, the crimp member 400 is located near the end of the signal conductor of the transmission line, with a gap between them, using air as a dielectric to form a parallel-plate capacitor structure. High-frequency signals are coupled from one conductor to another through capacitive effects, avoiding the additional nonlinear effects that might be introduced by physical welding or crimping.

[0071] The test piece 10 is positioned between the first pressure strip 410 and the second pressure strip 420. For example, as shown... Figure 3As shown, a pad 120 is provided on the surface of the first circuit board 100, and a groove 121 is provided on the pad 120. For example, the groove 121 is located in the middle of the pad 120, and a portion of the first pressure strip 410 is disposed in the groove so that the portion of the first pressure strip 410 is suspended on the first transmission line 110 of the first circuit board 100 in a first direction. That is, the first pressure strip 410 and the first transmission line 110 are not in direct contact, and there is a gap between them, which facilitates indirect coupling between the first pressure strip 410 and the first transmission line 110. A portion of the second pressure strip 420 is spaced apart from the second transmission line 210. For example, the third segment 423 of the second pressure strip 420 is suspended above the second transmission line 210.

[0072] In some embodiments, this application does not limit the material of the pad 120; the exemplary pad 120 may be a plastic part.

[0073] The first pressure strip 410 is attached to the surface of the first circuit board 100, and its length extends along the signal transmission direction. One end or a specific area of ​​the first pressure strip 410 forms an indirect coupling with the first transmission line 110, so that the fundamental wave signal on the first circuit board 100 can be fed into the first pressure strip 410.

[0074] A portion of the second pressure strip 420 is mounted on the second circuit board 200, and another portion extends outward from the edge of the second circuit board 200 and bends upward or extends horizontally, such that the extended portion is located directly above the first pressure strip 410, thereby being opposite to the first pressure strip 410 in the height direction to form an electrode with upper and lower pressure.

[0075] During testing, the test piece 10 is placed on the upper surface of the first pressure bar 410. When the second circuit board 200 is moved or pressed towards the first circuit board 100 by an external force, the suspended portion of the second pressure bar 420 descends accordingly, clamping and compressing the test piece 10 together with the first pressure bar 410. At this time, the lower surface of the test piece 10 contacts the first pressure bar 410, and the upper surface contacts the suspended portion of the second pressure bar 420, forming a complete electrical path.

[0076] This application does not limit the test piece 10. For example, the test piece 10 is an electrical connector, which can be conductive foam, conductive rubber, metal spring, etc.

[0077] The fundamental frequency signal is input from the port of the first circuit board 100, transmitted to the first pressure bar 410 via the first transmission line 110, and then enters the test device 10 through the contact interface between the first pressure bar 410 and the test device 10. The test device 10, acting as a nonlinear source, generates a nonlinear signal containing harmonic components under fundamental frequency excitation. This nonlinear signal enters the second pressure bar 420 through the contact interface between the test device 10 and the second pressure bar 420, and is then transmitted to the output port of the second circuit board 200 via the second transmission line 210, ultimately being sent to an external testing system for analysis.

[0078] This application does not impose any restrictions on the external testing system, such as a non-linear testing module.

[0079] In some embodiments, in order to facilitate the replacement and testing of different materials, the first pressure strip 410 and the second pressure strip 420 are both detachably connected to the first circuit board 100 or the second circuit board 200.

[0080] In some embodiments, such as Figure 3 As shown, the second pressure strip 420 includes a first segment 421, a second segment 422 and a third segment 423 connected in sequence. The first segment 421 is disposed opposite to the first pressure strip 410 in a first direction. The second segment 422 is disposed at an angle. The third segment 423 is disposed opposite to the first pressure strip 410 in a second direction, and the third segment 423 is suspended on the second transmission line 210 in the first direction. The first direction is perpendicular to the second direction.

[0081] This application achieves this by bending the second pressure strip 420 so that a portion of the second pressure strip 420 is located on the same side of the second circuit board 200 and the first circuit board 100, and a portion of the second pressure strip 420 is disposed on the second circuit board 200, thereby being located on the same layer as the first circuit board 100.

[0082] The first segment 421 and the first pressure strip 410 are disposed opposite each other in a first direction, and are used to contact and apply pressure to the upper side of the test piece 10 to form the main pressing area. The second segment 422 extends obliquely from the end of the first segment 421, serving as a spatial transition and connection. For example, the first direction is the height direction perpendicular to the surface of the first circuit board 100 (i.e., the Z direction), and the second direction is the horizontal direction parallel to the surface of the first circuit board 100 (i.e., the X direction).

[0083] The first segment 421 is horizontally positioned directly above the first pressure bar 410, with the two facing each other in the Z direction, and the test piece 10 is clamped between them. The second segment 422 extends from the end of the first segment 421 along an inclined direction (e.g., at a certain angle to the horizontal plane) to one side. The third segment 423 extends horizontally, is positioned on the same side of the first circuit board 100 and the second circuit board 200, and is facing the first pressure bar 410 in the X direction.

[0084] Furthermore, since the third segment 423 is opposite to the first pressure strip 410 in the horizontal direction, at least part of the second pressure strip 420 (i.e. the third segment 423) is located on the same horizontal layer or adjacent area as the first circuit board 100. This layout is beneficial for shortening the signal path and reducing unnecessary electromagnetic radiation and path loss.

[0085] In this embodiment, the tilt angle of the second segment 422 can be set according to the relative position and height difference between the first circuit board 100 and the second circuit board 200, and this application does not impose any restrictions on this.

[0086] In some embodiments, the bends of the second pressure strip 420, i.e., between the first segment 421 and the second segment 422, and between the second segment 422 and the third segment 423, can be rounded to avoid signal reflection and field concentration effects caused by sharp edges.

[0087] In one possible implementation, such as Figures 1 to 6 As shown, the testing device in this embodiment of the application further includes a first base 500 and a second base 600 disposed opposite to each other. A first circuit board 100 is disposed on the first base 500, and a second circuit board 200 is disposed on the second base 600. A portion of the second base 600 extends into the clearance portion 501 of the first base 500, so that at least a portion of the second circuit board 200 and the first circuit board 100 are located on the same layer.

[0088] The first base 500 has a clearance portion 501 that accommodates a portion of the second base 600, such that at least a portion of the second circuit board 200 and the first circuit board 100 are located on the same layer in the second direction. Figure 1 The x-direction in the middle.

[0089] Among them, such as Figure 6 As shown, the second base 600 is also provided with a slot 601, and at least part of the second pressure strip 420 is provided in the slot 601. The slot 601 is located on the side of the second base 600 facing the first base 500.

[0090] For example, the shape of the slot 601 is adapted to the shape of the second pressure strip 420.

[0091] In one possible implementation, such as Figures 1 to 6 As shown, it also includes a test bench and a moving arm. A first base 500 is mounted on the test bench, and a second base 600 is mounted on the moving end of the moving arm. The moving arm is configured to drive the second base 600 to move in a direction close to or away from the first base 500 to apply pressure to the test piece 10.

[0092] A first base 500 is fixedly mounted on the upper surface of the test bench to support the first circuit board 100; a second base 600 is fixedly mounted on the moving end of the moving arm to support the second circuit board 200. The fixed end of the moving arm is fixed relative to the test bench. A connection hole 602 is provided on the second base 600, through which the second base 600 is connected to the moving arm.

[0093] The mobile arm can be any drive mechanism capable of linear displacement; for example, it is a stepper robot arm with a pressure sensor. The stepper robot arm integrates or externally connects a pressure sensor and a controller. The pressure sensor is positioned between the moving end and the second base 600 to detect the pressure applied to the test piece 10 in real time. The controller is electrically connected to the drive motor of the stepper robot arm and the pressure sensor. When a pressure test is required, the controller, according to a preset test program, controls the stepper robot arm to drive the second base 600 in a direction closer to or further away from the first base 500 (e.g., ...). Figure 1 The movement is in the +z or -z direction. The preset test program can be a test program from existing technologies, for example, setting a target pressure value or a target displacement value; the controller reads the pressure and displacement values ​​from the pressure sensor in real time and compares them with the target pressure or displacement value, adjusting the stepper motor's drive pulses through a PID control algorithm until the actual value reaches the target value and remains stable. This control program can be implemented using existing closed-loop control algorithms.

[0094] This device can simulate the actual working conditions of electrical connectors under different assembly heights and working pressures, providing a reliable mechanical basis for the accurate measurement of nonlinear harmonic characteristics and effectively improving the accuracy of the test.

[0095] It is understood that the assembly height in this embodiment refers to the vertical distance between the contact surfaces at both ends of the test component 10, such as an electrical connector, under test conditions. By changing the relative position of the second base 600 and the first base 500, the compression state of the electrical connector under different installation tolerances or working stresses can be simulated, i.e., different assembly heights can be achieved. By adjusting the assembly height, the degree of compression of the test component 10 can be changed, thereby simulating various possible working conditions during the actual product assembly process.

[0096] In one possible implementation, such as Figures 1 to 7 As shown, it also includes a nonlinear testing module. The first circuit board 100 and the second circuit board 200 are both electrically connected to the nonlinear testing module. The nonlinear testing module is used to input the fundamental signal to the first circuit board 100 and receive the nonlinear signal through the second circuit board 200.

[0097] In specific implementation, such as Figure 7As shown, the nonlinear test module includes a signal source, a duplexer, a spectrum analyzer, and a load. The duplexer has a transmit port (TX), an antenna port (ANT), and a receive port (RX) for isolation and signal splitting.

[0098] The output of the signal source is connected to the transmit port (TX) of the duplexer, and the antenna port (ANT) of the duplexer is connected to the input of the first circuit board 100 to form a fundamental excitation signal path. The output of the second circuit board 200 is divided into two paths: one path is connected to the load to absorb the fundamental wave and most of the harmonic energy; the other path is led out to the antenna port of the duplexer through a directional coupler. The receive port (RX) of the duplexer is connected to a spectrum analyzer to acquire nonlinear harmonic signals. Both the first circuit board 100 and the second circuit board 200 are electrically connected to the nonlinear test module via SMA connectors.

[0099] After the test is started, the signal source in the nonlinear test module generates a radio frequency fundamental excitation signal. This fundamental signal is first transmitted to the transmit port (TX) of the duplexer. After the radio frequency isolation and transmission path are connected inside the duplexer, it is output from the antenna port (ANT) of the duplexer and then transmitted to the first circuit board 100 of the harmonic measurement device.

[0100] After the fundamental wave signal is transmitted to the first circuit board 100, it is conducted along the first transmission line 110 to couple the fundamental wave signal to the first pressure bar 410, and then transmitted to the electrical connector under test via the first pressure bar 410. After the electrical connector under test receives the fundamental wave excitation signal, it will generate nonlinear distortion due to its own material properties and structural parameters. Nonlinear signals such as second harmonic, third harmonic and higher harmonics are derived from the fundamental wave signal. The fundamental wave signal and the nonlinear harmonics are jointly conducted through the second pressure bar 420 to the second transmission line 210 of the second circuit board 200 to realize the acquisition of the output signal of the device under test. The nonlinear signal transmitted from the second circuit board 200 is fed into the duplexer antenna port (ANT) and then exported to the spectrum analyzer through the duplexer receiver port (RX). The signal transmitted from the second circuit board 200 can also absorb redundant signals through the matched load to reduce radio frequency reflection interference test results.

[0101] In some embodiments, the flexible circuit board 300 employs a layered processing technology.

[0102] In some embodiments, the first pressure strip 410 and the second pressure strip 420 can both be metal pressure strips. During assembly, the test piece 10 is placed between the first circuit board 100 and the second circuit board 200, and pressed together by the two metal pressure strips. The displacement of the second circuit board 200 is adjusted by a moving arm, so that the metal pressure strips apply a preset pressure to the test piece 10. The fundamental frequency signal is input from the first circuit board 100 and output from the second circuit board 200 to the load. When the fundamental frequency signal passes through the test piece 10, it simultaneously excites harmonic signals in two directions, namely, transmission harmonics and reflected harmonics. During testing, the transmission harmonics can be received at the second circuit board 200 end, or the reflected harmonics can be received at the first circuit board 100 end; these are two different testing methods. Figure 7 In this case, the latter method is used, which involves testing reflected harmonics using a duplexer. The nonlinear test module (including the duplexer) is connected before the first circuit board 100, not after the second circuit board 200, which is directly connected to the load.

[0103] Among them, such as Figure 8 The figure shows the simulation parameter results of the nonlinear harmonic testing device in the 0.9 GHz test frequency band. The horizontal axis represents frequency, indicating the oscillation frequency of the electromagnetic wave, in gigahertz (GHz). Figure 8 The scattering parameters in the diagram are used to describe the reflection and transmission characteristics of signals in radio frequency / microwave networks; and the amplitude value of the scattering parameters is measured in decibels (dB).

[0104] S21 represents the forward transmission coefficient, reflecting transmission efficiency. The closer the value is to 0dB, the lower the transmission loss and the better the signal conductivity. S11 represents the input return loss, reflecting the degree of signal reflection. The more negative the value (the larger the absolute value), the lower the reflection and the higher the port matching degree. The simulation parameter results for the 0.9GHz test band are shown in the figure. In the 0.9GHz band, the forward transmission coefficient S21 is close to 0dB, indicating that the device has low transmission loss for the fundamental signal and can efficiently feed the fundamental signal into the device under test 10, providing stable excitation for nonlinear harmonic excitation. The input return loss S11 indicates that the fundamental signal reflection is minimal, avoiding energy waste and signal interference. In the 1GHz~6GHz high-frequency band, S21 maintains stable transmission characteristics, and S11 maintains a low reflection level, indicating that the device can effectively transmit the second, third, and higher harmonic signals generated by the device under test 10, expanding the detection range of nonlinear harmonics and improving the sensitivity of higher harmonic testing. Here, dB represents decibels.

[0105] Other embodiments of this application will readily occur to those skilled in the art upon consideration of the specification and practice of the invention disclosed herein. This application is intended to cover any variations, uses, or adaptations of this application that follow the general principles of this application and include common knowledge or customary techniques in the art not disclosed herein. The specification and examples are to be considered exemplary only.

[0106] It should be understood that this application is not limited to the precise structure described above and shown in the accompanying drawings, and various modifications and changes can be made without departing from its scope.

Claims

1. A nonlinear harmonic testing device, characterized in that, include: First circuit board (100); The second circuit board (200) is disposed opposite to the first circuit board (100), and at least a portion of the second circuit board (200) and the first circuit board (100) are located on the same layer; A flexible circuit board (300) has its two ends respectively connected to the first circuit board (100) and the second circuit board (200); a crimping member (400) is disposed across one side of the first circuit board (100) and the second circuit board (200) and is electrically connected to both the first circuit board (100) and the second circuit board (200), the flexible circuit board (300) is disposed opposite to the crimping member (400), and the crimping member (400) is used to crimp to the test piece (10); The second circuit board (200) moves relative to the first circuit board (100) along the height direction of the first circuit board (100) to change the amount of compression of the test piece (10) installed between the crimping member (400) and the first circuit board (100); The two ends of the flexible circuit board (300) are respectively electrically connected to the reference ground layer (101) of the first circuit board (100) and the reference ground layer (101) of the second circuit board (200). The flexible circuit board (300) provides a low impedance electrical connection to the reference ground of the first circuit board (100) and the second circuit board (200). The crimping member (400) includes a first crimping strip (410) and a second crimping strip (420). The first crimping strip (410) is disposed on the first circuit board (100) and indirectly coupled to the first transmission line (110) thereon. The second crimping strip (420) is disposed on the second circuit board (200) and indirectly coupled to the second transmission line (210) thereon. A portion of the second crimping strip (420) is suspended above the first crimping strip (410). The test piece (10) is crimped between the first crimping strip (410) and the second crimping strip (420).

2. The nonlinear harmonic testing device according to claim 1, characterized in that, The crimping member (400) is detachably connected to at least one of the second circuit board (200) and the first circuit board (100).

3. The nonlinear harmonic testing device according to claim 1, characterized in that, The second pressure strip (420) includes a first segment (421), a second segment (422) and a third segment (423) connected in sequence. The first segment (421) is disposed opposite to the first pressure strip (410) in a first direction. The second segment (422) is disposed at an angle. The third segment (423) is disposed opposite to the first pressure strip (410) in a second direction. The third segment (423) is suspended on the second transmission line (210) in the first direction. The first direction is perpendicular to the second direction.

4. The nonlinear harmonic testing device according to claim 3, characterized in that, It also includes a first base (500) and a second base (600) disposed opposite to each other, the first circuit board (100) being disposed on the first base (500), the second circuit board (200) being disposed on the second base (600), and a portion of the second base (600) extending to a clearance portion (501) of the first base (500) such that at least a portion of the second circuit board (200) is located on the same layer as the first circuit board (100).

5. The nonlinear harmonic testing device according to claim 4, characterized in that, The second base (600) is also provided with a slot (601), at least part of the second pressure strip (420) is disposed in the slot (601), and the slot (601) is located on the side of the second base (600) facing the first base (500).

6. The nonlinear harmonic testing device according to claim 4, characterized in that, It also includes a test bench and a moving arm, wherein the first base (500) is mounted on the test bench and the second base (600) is mounted on the moving end of the moving arm, the moving arm being configured to drive the second base (600) to move in a direction toward or away from the first base (500) to apply pressure to the test piece (10).

7. The nonlinear harmonic testing device according to claim 6, characterized in that, It also includes a nonlinear testing module, with the first circuit board (100) and the second circuit board (200) both electrically connected to the nonlinear testing module. The nonlinear testing module is used to input the fundamental signal to the first circuit board (100) and receive the nonlinear signal through the second circuit board (200).

Images