探针过驱量的确定方法及半导体设备
By acquiring chip layout and test location information, and using preset overdrive rules and compensation calculations, the overdrive amount of the probe assembly is adjusted, which solves the problem of uneven overdrive amount in semiconductor wafer-level testing, improves test accuracy, and reduces the risk of chip damage.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SHANGHAI V-TEST SEMICON TECH CO LTD
- Filing Date
- 2026-04-07
- Publication Date
- 2026-07-17
AI Technical Summary
In semiconductor wafer-level testing, uneven overdrive settings of probe components can lead to decreased testing accuracy and increased risk of chip damage, especially inaccurate overdrive settings in wafer edge regions.
By acquiring chip layout information and test location information, using preset overdrive determination rules, calculating compensation amount, and adjusting the target overdrive amount of the probe assembly, the uniformity of overdrive amount distribution of the probe assembly in different areas is ensured. The actual overdrive amount is adjusted in combination with contact displacement and pressure feedback to avoid excessive penetration.
This achieves a uniform overdrive distribution of the probe assembly on the wafer surface, improving testing accuracy and reducing the risk of chip damage, while ensuring reliable contact between the probe and the wafer.
Smart Images
Figure CN121978499B_ABST