Equivalent activation energy determination method and device of electronic equipment, computer device and storage medium

Abstract

The application relates to a method and device for determining equivalent activation energy of an electronic device, a computer device and a storage medium. The method comprises the following steps: obtaining standard activation energy of each component in the electronic device, environment temperature of the electronic device under normal operation of the electronic device, and failure rate of each component under the environment temperature; determining a logarithmic acceleration ratio of the electronic device according to the failure rate, the standard activation energy, the environment temperature and a preset temperature corresponding to a temperature acceleration test; and determining the equivalent activation energy of the electronic device based on the logarithmic acceleration ratio, the environment temperature and the preset temperature. Therefore, the equivalent activation energy of the electronic device can be calculated based on the known failure rate and activation energy of the component, the accuracy of the activation energy of the electronic device is improved, a large amount of time and resources can be saved compared with the existing fitting estimation method, and a data basis is provided for reliability evaluation of the electronic device.

Description

Technical Field

[0001] This application relates to the field of reliability assessment technology, and in particular to a method, apparatus, computer device, and storage medium for determining the equivalent activation energy of an electronic device. Background Technology

[0002] In the reliability assessment of electronic devices, temperature-accelerated models are needed to predict the lifespan and verify the reliability of the electronic devices. Among them, the Arrhenius model is the most common temperature-accelerated model. When using a temperature-accelerated model, it is necessary to determine the parameters of the temperature-accelerated model, which can be the activation energy of the electronic device or the activation energy of the components in the electronic device.

[0003] However, in related technologies, the activation energy of electronic devices can only be fitted based on experimental data or estimated based on empirical values ​​from engineering experience. Therefore, the activation energy of electronic devices obtained based on existing technologies suffers from low accuracy. Summary of the Invention

[0004] Therefore, it is necessary to provide a method, apparatus, computer device, and storage medium for determining the equivalent activation energy of an electronic device in response to the above-mentioned technical problems.

[0005] Firstly, this application provides a method for determining the equivalent activation energy of an electronic device. The method includes:

[0006] Obtain the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at that ambient temperature;

[0007] The logarithmic speedup ratio of the electronic device is determined based on the failure rate, the standard activation energy, the ambient temperature, and the preset temperature corresponding to the temperature acceleration test.

[0008] Based on the logarithmic speedup ratio, the ambient temperature, and the preset temperature, the equivalent activation energy of the electronic device is determined.

[0009] In one embodiment, determining the logarithmic speedup ratio of the electronic device based on each failure rate, each standard activation energy, the ambient temperature, and a preset temperature corresponding to the temperature acceleration test includes:

[0010] For each component, the acceleration parameters corresponding to the component are determined based on the component's failure rate, standard activation energy, ambient temperature, and preset temperature.

[0011] Determine the first summation result of the acceleration parameters corresponding to the multiple components, and the second summation result of the failure rate of the multiple components;

[0012] The logarithmic speedup ratio is determined based on the logarithm of the first ratio of the first summation result to the second summation result.

[0013] In one embodiment, the acceleration parameters corresponding to the component are determined based on the component's failure rate, the component's standard activation energy, the ambient temperature, and the preset temperature, including:

[0014] Determine the second ratio of the standard activation energy to the Boltzmann constant, and determine the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature;

[0015] The function value of the exponential function with the natural constant as the base is determined by using the product of the second ratio and the first difference as the exponent;

[0016] The product of the function value and the failure rate is determined as the acceleration parameter corresponding to the component.

[0017] In one embodiment, determining the equivalent activation energy of the electronic device based on the logarithmic speedup, the ambient temperature, and a preset temperature includes:

[0018] Determine the temperature conversion coefficient based on the ambient temperature and the preset temperature;

[0019] Based on the logarithmic speedup ratio and the temperature conversion coefficient, the equivalent activation energy of the electronic device is determined.

[0020] In one embodiment, determining the temperature conversion coefficient based on the ambient temperature and the preset temperature includes:

[0021] The result of the second product between the difference and the Boltzmann constant is determined as the temperature conversion coefficient; the difference is the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature.

[0022] In one embodiment, the method further includes:

[0023] The temperature acceleration factor of the electronic device is determined based on its equivalent activation energy.

[0024] In one embodiment, determining the temperature acceleration factor of the electronic device based on its equivalent activation energy includes:

[0025] The acceleration factor of the temperature step is determined based on the equivalent activation energy of the electronic device.

[0026] The duration of high temperature in a single acceleration cycle corresponding to the acceleration test is determined based on the temperature step acceleration factor, and the cycle duration of the single acceleration cycle is determined based on the duration of high temperature, the preset duration of low temperature, and the preset duration of temperature change.

[0027] The number of cycles for the temperature acceleration test is determined based on the temperature cycling acceleration factor, and the test duration is determined based on the number of cycles and the cycle duration of a single acceleration cycle.

[0028] The temperature acceleration factor of the electronic device is determined based on the ratio of the preset standard test duration to the test duration.

[0029] Secondly, this application also provides an apparatus for determining the equivalent activation energy of an electronic device. The apparatus includes:

[0030] The acquisition module is used to acquire the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at that ambient temperature.

[0031] The first determining module is used to determine the logarithmic speedup ratio of the electronic device based on the failure rate, the standard activation energy, the ambient temperature, and the preset temperature corresponding to the temperature acceleration test.

[0032] The second determining module is used to determine the equivalent activation energy of the electronic device based on the logarithmic speedup ratio, the ambient temperature, and the preset temperature.

[0033] Thirdly, this application also provides a computer device. The computer device includes a memory and a processor, the memory storing a computer program, and the processor executing the computer program to perform the following steps:

[0034] Obtain the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at that ambient temperature;

[0035] The logarithmic speedup ratio of the electronic device is determined based on the failure rate, the standard activation energy, the ambient temperature, and the preset temperature corresponding to the temperature acceleration test.

[0036] Based on the logarithmic speedup ratio, the ambient temperature, and the preset temperature, the equivalent activation energy of the electronic device is determined.

[0037] Fourthly, this application also provides a computer-readable storage medium. This computer-readable storage medium stores a computer program thereon, which, when executed by a processor, performs the following steps:

[0038] Obtain the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at that ambient temperature;

[0039] The logarithmic speedup ratio of the electronic device is determined based on the failure rate, the standard activation energy, the ambient temperature, and the preset temperature corresponding to the temperature acceleration test.

[0040] Based on the logarithmic speedup ratio, the ambient temperature, and the preset temperature, the equivalent activation energy of the electronic device is determined.

[0041] Fifthly, this application also provides a computer program product. This computer program product includes a computer program that, when executed by a processor, performs the following steps:

[0042] Obtain the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at that ambient temperature;

[0043] The logarithmic speedup ratio of the electronic device is determined based on the failure rate, the standard activation energy, the ambient temperature, and the preset temperature corresponding to the temperature acceleration test.

[0044] Based on the logarithmic speedup ratio, the ambient temperature, and the preset temperature, the equivalent activation energy of the electronic device is determined.

[0045] The aforementioned method, apparatus, computer equipment, and storage medium for determining the equivalent activation energy of electronic devices acquire the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at the ambient temperature. Based on each failure rate, each standard activation energy, the ambient temperature, and the preset temperature corresponding to the temperature acceleration test, the logarithmic speedup ratio of the electronic device is determined. Based on the logarithmic speedup ratio, the ambient temperature, and the preset temperature, the equivalent activation energy of the electronic device is determined. This allows for the calculation of the equivalent activation energy at the electronic device level based on the known failure rates and activation energies of the components, improving the accuracy of the activation energy at the electronic device level. Furthermore, compared to existing fitting estimation methods, it saves a significant amount of time and resources, providing a data foundation for the reliability assessment of electronic devices. Attached Figure Description

[0046] Figure 1 This is an internal structural diagram of a computer device provided in an embodiment of this application;

[0047] Figure 2 This is a flowchart illustrating a method for determining the equivalent activation energy of an electronic device according to an embodiment of this application.

[0048] Figure 3 This is a schematic flowchart of a method for determining logarithmic speedup provided in an embodiment of this application;

[0049] Figure 4 This is a flowchart illustrating a method for determining acceleration parameters provided in an embodiment of this application;

[0050] Figure 5This is a flowchart illustrating another method for calculating the equivalent activation energy of an electronic device provided in an embodiment of this application.

[0051] Figure 6 This is a flowchart illustrating a method for determining a temperature acceleration factor provided in an embodiment of this application;

[0052] Figure 7 This is a schematic diagram of the calculation process of a device-level temperature acceleration factor based on equivalent activation energy, provided in an embodiment of this application.

[0053] Figure 8 This is a structural block diagram of an equivalent activation energy determination device for an electronic device provided in an embodiment of this application. Detailed Implementation

[0054] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application.

[0055] In the reliability assessment of electronic devices, temperature-accelerated models are needed to predict the lifespan and verify the reliability of the electronic devices. Among them, the Arrhenius model is the most common temperature-accelerated model. When using a temperature-accelerated model, it is necessary to determine the parameters of the temperature-accelerated model, which can be the activation energy of the electronic device or the activation energy of the components in the electronic device.

[0056] In related technologies, two methods are commonly used to obtain the activation energy of electronic devices. One method is to obtain the activation energy at the electronic device level by means of estimation, fitting, etc. This method requires a large number of experiments and the accumulation of corresponding experimental data, which consumes a lot of time and resources. The other method is to use engineering experience, that is, to use engineering experience values ​​as the activation energy at the electronic device level based on applicable standards, which makes it difficult to guarantee the accuracy of the activation energy at the electronic device level.

[0057] Furthermore, in the existing technology, only the activation energy at the component level can be determined, and there is no accurate method for obtaining the activation energy at the electronic device level.

[0058] The method for determining the equivalent activation energy of an electronic device provided in this application embodiment can be applied to, for example... Figure 1 The application environment shown. Figure 1 This is an internal structure diagram of a computer device provided in an embodiment of this application. The computer device may be a server, and its internal structure diagram may be as follows: Figure 1As shown, the computer device includes a processor, memory, and a network interface connected via a system bus. The processor provides computing and control capabilities. The memory includes a non-volatile storage medium and internal memory. The non-volatile storage medium stores an operating system, computer programs, and a database. The internal memory provides an environment for the operation of the operating system and computer programs stored in the non-volatile storage medium. The network interface is used to communicate with external terminals via a network connection. When executed by the processor, the computer program implements a method for determining the equivalent activation energy of an electronic device.

[0059] Those skilled in the art will understand that Figure 1 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the computer device to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0060] In one embodiment, such as Figure 2 As shown, Figure 2 This is a flowchart illustrating a method for determining the equivalent activation energy of an electronic device according to an embodiment of this application. This method can be applied to... Figure 1 The method, using a computer device, includes the following steps:

[0061] S201, obtain the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at the ambient temperature.

[0062] For example, the failure rate of each component in an electronic device under normal temperature stress conditions, that is, under the temperature stress conditions corresponding to the normal operation of the electronic device, can be obtained from manuals such as GJB299 and MIL-HDBK-217.

[0063] Optionally, the standard activation energy of each component in the electronic device can be obtained according to standards such as MIL-HDBK-338, IEC61709, JEP122H, IEC60747-10, JEDEDJESD471.01, IEC62380, IPC279, and GJB299C. Alternatively, the standard activation energy of each component can be determined based on experimental values. Alternatively, the standard activation energy of each component can be found in relevant literature.

[0064] S202, determine the logarithmic speedup ratio of the electronic device based on each failure rate, each standard activation energy, ambient temperature, and the preset temperature corresponding to the temperature acceleration test.

[0065] In this embodiment, the sum of failure rates of each component at the acceleration temperature (i.e., the preset temperature) can be determined based on each failure rate, each standard activation energy, ambient temperature, and the preset temperature corresponding to the temperature acceleration test. The sum of each failure rate can also be calculated. Based on the sum of the failure rates of each component at the acceleration temperature (i.e., the preset temperature) and the sum of each failure rate, the logarithmic speedup ratio of the electronic device can be determined.

[0066] The logarithmic speedup ratio of an electronic device is used to characterize the change in the total failure rate of the electronic device as it moves from ambient temperature to a preset temperature, reflecting the overall sensitivity of the electronic device to temperature stress.

[0067] For example, the ratio between the sum of the failure rates of each component at a preset temperature and the sum of the individual failure rates can be determined as the logarithmic speedup of the electronic device.

[0068] S203 determines the equivalent activation energy of an electronic device based on the logarithmic speedup, ambient temperature, and preset temperature.

[0069] Optionally, the temperature difference between normal temperature stress conditions and accelerated temperature stress conditions can be determined based on the difference between ambient temperature and preset temperature. Then, using the temperature difference as a temperature conversion coefficient, the logarithmic speedup ratio of the electronic device can be converted into the equivalent activation energy of the electronic device.

[0070] In this embodiment, the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at the ambient temperature are obtained. Based on each failure rate, each standard activation energy, the ambient temperature, and the preset temperature corresponding to the temperature acceleration test, the logarithmic speedup ratio of the electronic device is determined. Based on the logarithmic speedup ratio, the ambient temperature, and the preset temperature, the equivalent activation energy of the electronic device is determined. Thus, based on the known failure rate and activation energy of the components, the equivalent activation energy at the electronic device level can be calculated, improving the accuracy of the activation energy at the electronic device level. Compared with existing fitting estimation methods, it can save a lot of time and resources, providing a data foundation for the reliability assessment of electronic devices.

[0071] It should be noted that in the embodiments of this application, each step is performed under preset assumptions. Optionally, the preset assumptions include the electronic device failure rate assumption, the assumption of identical distribution of failure time, the assumption of cumulative failure model, and the assumption of consistency of failure mechanism.

[0072] Among them, the assumptions about the failure rate of electronic equipment include: the failure of electronic equipment follows an exponential distribution, and the failure rate of electronic equipment is equal to the sum of the failure rates of each component;

[0073] The assumption of identical failure time distribution includes: the failure times of various failure modes of electronic equipment follow the same distribution under different stress environments, and the parameters of the distribution are related to the environmental stress.

[0074] The cumulative failure model assumes that in temperature-accelerated testing, the remaining lifespan of electronic devices is only related to the current environmental stress and the cumulative failure, and is independent of the failure mode. In other words, the cumulative damage caused by an electronic device operating for t1 time under a certain stress environment S1 can be equivalent to the damage caused by the same electronic device operating for t2 time under another stress environment S2.

[0075] The assumption of consistency of failure mechanisms includes that, under different stress environments, the failure mechanisms of each failure mode of electronic equipment will not change due to changes in stress level.

[0076] Reference Figure 3 , Figure 3 This is a flowchart illustrating a method for determining logarithmic speedup according to an embodiment of this application. This embodiment relates to a possible implementation of determining the logarithmic speedup of an electronic device based on various failure rates, standard activation energies, ambient temperature, and a preset temperature corresponding to a temperature acceleration test. Based on the above embodiment, S202 includes the following steps:

[0077] S301 determines the corresponding acceleration parameters for each component based on its failure rate, standard activation energy, ambient temperature, and preset temperature.

[0078] Optionally, for each component, the accelerated weighted failure rate of the component at the preset temperature can be determined based on the component's failure rate, standard activation energy, ambient temperature, and preset temperature, and this accelerated weighted failure rate can be used as the corresponding acceleration parameter for the component.

[0079] For example, the acceleration factor of the component can be calculated based on the Arrennis model, and the failure rate of the component can be weighted based on the acceleration factor to obtain the accelerated weighted failure rate of the component at a preset temperature.

[0080] S302, determine the first summation result of the acceleration parameters corresponding to multiple components, and the second summation result of the failure rate of multiple components.

[0081] S303, determine the logarithmic speedup ratio based on the logarithm of the first ratio of the first summation result to the second summation result.

[0082] In this embodiment, a first summation of the accelerated weighted failure rates of multiple components at a preset temperature and a second summation of the failure rates of multiple components at ambient temperature can be determined. Then, a first ratio between the first and second summations is determined to reflect the change in the total failure rate of the electronic device as it moves from ambient temperature to the preset temperature. Finally, the logarithm of the first ratio is taken to obtain the logarithmic speedup ratio.

[0083] In this embodiment, for each component, acceleration parameters corresponding to the component are determined based on the component's failure rate, standard activation energy, ambient temperature, and preset temperature. A first summation result of the acceleration parameters corresponding to multiple components and a second summation result of the failure rates of multiple components are determined. Based on the logarithm of the first ratio of the first summation result to the second summation result, the logarithmic speedup ratio is determined. This enables the determination of the logarithmic speedup ratio of the electronic device, which reflects the overall sensitivity of the electronic device to temperature stress. Furthermore, the equivalent activation energy at the electronic device level can be accurately obtained based on the logarithmic speedup ratio, providing a data foundation for the reliability assessment of the electronic device.

[0084] Reference Figure 4 , Figure 4 This is a flowchart illustrating a method for determining acceleration parameters provided in an embodiment of this application. This embodiment relates to a possible implementation of determining the acceleration parameters corresponding to a component based on the component's failure rate, standard activation energy, ambient temperature, and preset temperature. Based on the above embodiment, step S301 includes the following steps:

[0085] S401, determine the second ratio of the standard activation energy to the Boltzmann constant, and determine the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature.

[0086] S402, using the first product of the second ratio and the difference as the exponent, determines the function value of the exponential function with the natural constant as the base.

[0087] S403 determines the acceleration parameters corresponding to the component by multiplying the function value by the failure rate.

[0088] For example, the acceleration parameters corresponding to the components can be expressed as: .

[0089] in, For the first Failure rate of individual components For the first Standard activation energy of each component Boltzmann's constant, For ambient temperature, This is the preset temperature. Therefore, That is, the second ratio. This is the result of the first product. The value of is the function value.

[0090] In this embodiment, the logarithmic speedup can be expressed as: .

[0091] In this embodiment, a second ratio of the standard activation energy to the Boltzmann constant is determined, and the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature is determined. The first product of the second ratio and the difference is used as the exponent to determine the function value of an exponential function with the natural constant as the base. The product of the function value and the failure rate is determined as the acceleration parameter corresponding to the component. Thus, the acceleration parameter corresponding to the component can be reflected by the acceleration weighted failure rate of the component at the preset temperature, thereby obtaining an accurate electronic device-level equivalent activation energy, providing a data basis for the reliability assessment of electronic devices.

[0092] Reference Figure 5 , Figure 5 This is a flowchart illustrating another method for calculating the equivalent activation energy of an electronic device according to an embodiment of this application. This embodiment relates to a possible implementation of determining the equivalent activation energy of an electronic device based on logarithmic speedup, ambient temperature, and a preset temperature. Based on the above embodiment, S203 includes the following steps:

[0093] S501 determines the temperature conversion coefficient based on the ambient temperature and the preset temperature.

[0094] In this embodiment, the temperature conversion coefficient can be determined based on the difference between the ambient temperature and the preset temperature.

[0095] Alternatively, the product of the difference between the ambient temperature and the preset temperature and the Boltzmann constant can be used to determine the temperature conversion coefficient.

[0096] S502, based on logarithmic speedup and temperature conversion coefficient, determines the equivalent activation energy of electronic devices.

[0097] In this embodiment, the dimensionless logarithmic speedup ratio can be converted into the equivalent activation energy of the electronic device based on the temperature conversion coefficient, and then the equivalent activation energy can be determined as the equivalent activation energy at the electronic device level.

[0098] In this application, the temperature conversion coefficient is determined based on the ambient temperature and the preset temperature; the equivalent activation energy of the electronic device is determined based on the logarithmic speedup and the temperature conversion coefficient, so that the logarithmic speedup can be converted into an energy parameter based on the temperature conversion coefficient, thereby achieving the normalization of the measurement and obtaining the equivalent activation energy that can reflect the activation energy of the electronic device.

[0099] Based on the above embodiments, S501 can be implemented in the following ways:

[0100] The result of the second product between the difference and the Boltzmann constant is determined as the temperature conversion coefficient; the difference is the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature.

[0101] In this embodiment, the temperature conversion coefficient can be expressed as: .

[0102] Based on this, the equivalent activation energy of electronic devices It can be determined by the following formula (1):

[0103] (1)

[0104] To provide a clearer explanation of the embodiments of this application, the derivation process of formula (1) will be explained here.

[0105] In this embodiment, it is assumed that the electronic device as a whole has a parameter similar to the activation energy of a component, namely the equivalent activation energy. Based on the basic form of the Arrhenius model, the process of determining the device-level temperature acceleration factor according to the equivalent activation energy can be expressed as the following formula (2):

[0106] (2)

[0107] in, For electronic devices, temperature acceleration factor The failure rate of electronic devices at a preset acceleration temperature. This represents the failure rate of electronic devices under normal ambient temperature.

[0108] Under the assumption that the reliability of electronic equipment follows an exponential distribution, equation (2) can be rewritten as:

[0109] (3)

[0110] in, and These are the ambient temperatures of the i-th component. Under the conditions and preset temperature The failure rate under given conditions, where n is the number of components in the electronic product. Based on the formula for calculating the acceleration factor of the components:

[0111] (4)

[0112] We can obtain:

[0113] (5)

[0114] Substituting formula (5) into formula (3) and combining it with formula (2), we can derive:

[0115] (6)

[0116] Taking the logarithm of both sides of formula (6) yields the above formula (1).

[0117] Based on the above embodiments, the method further includes the following steps:

[0118] The temperature acceleration factor of an electronic device is determined based on its equivalent activation energy.

[0119] Optionally, the temperature acceleration factor of the electronic device can be directly calculated based on the equivalent activation energy of the electronic device according to the above formula (2).

[0120] Alternatively, the comprehensive temperature acceleration factor of the electronic device under different failure modes can be calculated based on the different failure modes of the electronic device in the temperature environment and the equivalent activation energy of the electronic device.

[0121] In this embodiment, the temperature acceleration factor at the electronic device level can be determined based on the equivalent activation energy at the electronic device level, providing a theoretical basis and data foundation for studying the reliability of electronic devices.

[0122] Reference Figure 6 , Figure 6 This is a flowchart illustrating a method for determining a temperature acceleration factor according to an embodiment of this application. This embodiment relates to a possible implementation of determining the temperature acceleration factor of an electronic device based on its equivalent activation energy. Based on the above embodiment, the method for determining the temperature acceleration factor of an electronic device based on its equivalent activation energy includes the following steps:

[0123] S601, determine the temperature step acceleration factor based on the equivalent activation energy of the electronic device.

[0124] In one embodiment, electronic devices exhibit two typical failure modes in temperature environments: the first type of failure mode is functional failure of components in electronic devices caused by long-term temperature loads (component-related failure modes); the second type of failure mode is fatigue fracture failure of solder joints caused by repeated temperature cycle loads.

[0125] In accelerated cycling tests, a complete temperature cycle can cause two types of damage. First, when the device is held at a high temperature step, the high temperature causes material aging, which leads to cumulative chemical damage and functional failure of components in electronic devices (component-related failure modes). Second, during temperature changes (heating and cooling), the sudden temperature changes cause fatigue of the material due to differences in the coefficient of thermal expansion, which in turn leads to fatigue fracture failure of solder joints due to cumulative mechanical fatigue damage.

[0126] Reference Figure 7 , Figure 7 This is a schematic diagram illustrating the calculation process of a device-level temperature acceleration factor based on equivalent activation energy, provided in an embodiment of this application. In the calculation of the temperature acceleration factor at the electronic device level, the number of cycles in the temperature acceleration test can be accelerated based on the Coffin-Manson model, and the cycle duration of a single acceleration cycle in the temperature acceleration test can be accelerated based on the Arrhenius model. By combining the two forms of temperature stress, the comprehensive acceleration factor under temperature stress is finally calculated according to the principle of equivalent cumulative damage.

[0127] In this embodiment, during the high-temperature stage of the accelerated cycling test, the temperature step acceleration factor can be calculated based on the above formula (2).

[0128] S602, determine the duration of high temperature in a single acceleration cycle corresponding to the temperature acceleration test based on the temperature step acceleration factor, and determine the cycle duration of a single acceleration cycle based on the duration of high temperature, the preset duration of low temperature, and the preset temperature change duration.

[0129] In one embodiment, a conventional reliability test profile is assumed to consist of m temperature steps, each with a duration of m / s. The acceleration factor for each temperature segment, equivalent to the temperature step in the high-temperature segment of the accelerated test, is: The high-temperature duration for each conventional reliability test cycle, converted to a single acceleration cycle, is:

[0130] (7)

[0131] Let N0 be the total number of cycles in the conventional reliability test profile, then the total duration of high temperature in the accelerated test profile is:

[0132] (8)

[0133] With N1 cycles in the accelerated temperature test, the duration of high temperature in a single accelerated cycle is:

[0134] (9)

[0135] The number of cycles N1 in the temperature acceleration test can be calculated based on the following formula:

[0136] (10)

[0137] In formula (10), This represents the i-th temperature cycling acceleration factor in a conventional reliability test profile. In actual testing, temperature cycling tests are generally performed by increasing the amount of temperature change. Compared with actual temperature change The ratio, or by increasing the experimental temperature change rate. With actual temperature change rate The acceleration is achieved through the ratio of [ratio]. Therefore, the temperature cycle acceleration factor can be simplified as:

[0138] (11)

[0139] In this embodiment, the cycle duration of a single acceleration loop is:

[0140] (12)

[0141] in, To preset the duration of low temperature, The preset temperature change duration.

[0142] S603, determine the number of cycles for the temperature acceleration test based on the temperature cycling acceleration factor, and determine the test duration of the acceleration test based on the number of cycles and the cycle duration of a single acceleration cycle.

[0143] In this embodiment, the test duration of the accelerated test is:

[0144] (13)

[0145] S604 determines the temperature acceleration factor of electronic equipment based on the ratio of the preset standard test duration to the test duration.

[0146] In this embodiment, the temperature acceleration factor of the electronic device can be expressed as:

[0147] (14)

[0148] in, This refers to the total test time required for a routine stress test, which is also the aforementioned preset standard test duration.

[0149] In this embodiment, a temperature step acceleration factor is determined based on the equivalent activation energy of the electronic device; the duration of high temperature in a single acceleration cycle corresponding to the temperature acceleration test is determined based on the temperature step acceleration factor; and the cycle duration of a single acceleration cycle is determined based on the duration of high temperature, the preset duration of low temperature, and the preset temperature change duration; the number of cycles of the temperature acceleration test is determined based on the temperature cycle acceleration factor; and the test duration of the acceleration test is determined based on the number of cycles and the cycle duration of a single acceleration cycle; the temperature acceleration factor of the electronic device is determined based on the ratio of the preset standard test duration to the test duration. Thus, based on the Coffin-Manson model and the Arrhenius model, the number of cycles of the temperature acceleration test and the cycle duration of a single acceleration cycle corresponding to the temperature acceleration test are accelerated respectively. By combining the two forms of temperature stress and based on the principle of equivalent cumulative damage, a comprehensive temperature acceleration factor under temperature stress is obtained, which improves the reliability and accuracy of the temperature acceleration factor at the electronic device level, providing a data foundation and theoretical basis for subsequent reliability research.

[0150] It should be understood that although the steps in the flowcharts of the embodiments described above are shown sequentially according to the arrows, these steps are not necessarily executed in the order indicated by the arrows. Unless explicitly stated herein, there is no strict order restriction on the execution of these steps, and they can be executed in other orders. Moreover, at least some steps in the flowcharts of the embodiments described above may include multiple steps or multiple stages. These steps or stages are not necessarily completed at the same time, but can be executed at different times. The execution order of these steps or stages is not necessarily sequential, but can be performed alternately or in turn with other steps or at least some of the steps or stages of other steps.

[0151] Based on the same inventive concept, this application also provides an equivalent activation energy determination apparatus for an electronic device to implement the equivalent activation energy determination method for the electronic device described above. The solution provided by this apparatus is similar to the implementation described in the above method. Therefore, the specific limitations of one or more embodiments of the equivalent activation energy determination apparatus for an electronic device provided below can be found in the limitations of the equivalent activation energy determination method for an electronic device described above, and will not be repeated here.

[0152] In one embodiment, such as Figure 8 As shown, Figure 8 This is a structural block diagram of an equivalent activation energy determination device for an electronic device provided in an embodiment of this application. The device 800 includes:

[0153] The acquisition module 801 is used to acquire the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at the ambient temperature.

[0154] The first determining module 802 is used to determine the logarithmic speedup ratio of the electronic device based on each failure rate, each standard activation energy, ambient temperature, and the preset temperature corresponding to the temperature acceleration test.

[0155] The second determining module 803 is used to determine the equivalent activation energy of the electronic device based on the logarithmic speedup ratio, ambient temperature, and preset temperature.

[0156] In one embodiment, the first determining module includes:

[0157] The first determining unit is used to determine the acceleration parameters corresponding to each component based on the component's failure rate, standard activation energy, ambient temperature, and preset temperature.

[0158] The second determining unit is used to determine the first summation result of the acceleration parameters corresponding to multiple components, and the second summation result of the failure rate of multiple components;

[0159] The third determining unit is used to determine the logarithmic speedup ratio based on the logarithm of the first ratio of the first summation result to the second summation result.

[0160] In one embodiment, the first determining unit is specifically used to determine a second ratio of the standard activation energy to the Boltzmann constant, and to determine the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature; using the first product of the second ratio and the difference as the exponent, to determine the function value of an exponential function with the natural constant as the base; and to determine the product of the function value and the failure rate as the acceleration parameter corresponding to the component.

[0161] In one embodiment, the second determining module includes:

[0162] The fourth determining unit is used to determine the temperature conversion coefficient based on the ambient temperature and the preset temperature;

[0163] The fifth determining unit is used to determine the equivalent activation energy of the electronic device based on the logarithmic speedup and temperature conversion coefficient.

[0164] In one embodiment, the fourth determining unit is specifically used to determine the result of the second product between the difference and the Boltzmann constant as the temperature conversion coefficient; the difference is the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature.

[0165] In one embodiment, the device 800 further includes:

[0166] The third determining module is used to determine the temperature acceleration factor of the electronic device based on the equivalent activation energy of the electronic device.

[0167] In one embodiment, the third determining module includes:

[0168] The sixth determining unit is used to determine the temperature step acceleration factor based on the equivalent activation energy of the electronic device.

[0169] The seventh determining unit is used to determine the duration of high temperature in a single acceleration cycle corresponding to the acceleration test based on the temperature step acceleration factor, and to determine the cycle duration of a single acceleration cycle based on the duration of high temperature, the preset duration of low temperature, and the preset duration of temperature change.

[0170] The eighth determining unit is used to determine the number of cycles for the temperature acceleration test based on the temperature cycling acceleration factor, and to determine the test duration of the acceleration test based on the number of cycles and the cycle duration of a single acceleration cycle.

[0171] The ninth determining unit is used to determine the temperature acceleration factor of the electronic device based on the ratio of the preset standard test duration to the test duration.

[0172] The modules in the equivalent activation energy determination device of the aforementioned electronic device can be implemented entirely or partially through software, hardware, or a combination thereof. These modules can be embedded in or independent of the processor in a computer device in hardware form, or stored in the memory of a computer device in software form, so that the processor can call and execute the operations corresponding to each module.

[0173] In one embodiment, a computer device is provided, including a memory and a processor, wherein the memory stores a computer program, and the processor executes the computer program to perform the following steps:

[0174] To obtain the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at the ambient temperature;

[0175] The logarithmic speedup ratio of the electronic device is determined based on the failure rate, standard activation energy, ambient temperature, and preset temperature corresponding to the temperature acceleration test.

[0176] The equivalent activation energy of the electronic device is determined based on the logarithmic speedup ratio, ambient temperature, and preset temperature.

[0177] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0178] For each component, the corresponding acceleration parameters are determined based on the component's failure rate, standard activation energy, ambient temperature, and preset temperature.

[0179] Determine the first summation result of the acceleration parameters corresponding to multiple components, and the second summation result of the failure rate of multiple components;

[0180] The logarithmic speedup ratio is determined by the logarithm of the first ratio of the first summation result to the second summation result.

[0181] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0182] Determine the second ratio of the standard activation energy to the Boltzmann constant, and determine the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature;

[0183] The function value of the exponential function with the natural constant as the base is determined by using the product of the second ratio and the first difference as the exponent;

[0184] The product of the function value and the failure rate is used to determine the acceleration parameter corresponding to the component.

[0185] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0186] Determine the temperature conversion coefficient based on the ambient temperature and the preset temperature;

[0187] The equivalent activation energy of the electronic device is determined based on the logarithmic speedup and temperature conversion coefficient.

[0188] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0189] The result of the second product between the difference and the Boltzmann constant is determined as the temperature conversion coefficient; the difference is the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature.

[0190] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0191] The temperature acceleration factor of an electronic device is determined based on its equivalent activation energy.

[0192] In one embodiment, the processor, when executing a computer program, also performs the following steps:

[0193] The temperature step acceleration factor is determined based on the equivalent activation energy of the electronic device.

[0194] The duration of high temperature in a single acceleration cycle is determined based on the temperature step acceleration factor, and the cycle duration of a single acceleration cycle is determined based on the duration of high temperature, the preset duration of low temperature, and the preset duration of temperature change.

[0195] The number of cycles for the temperature acceleration test is determined based on the temperature cycling acceleration factor, and the test duration is determined based on the number of cycles and the cycle duration of a single acceleration cycle.

[0196] The temperature acceleration factor of the electronic device is determined based on the ratio of the preset standard test duration to the test duration.

[0197] In one embodiment, a computer-readable storage medium is provided having a computer program stored thereon, the computer program performing the following steps when executed by a processor:

[0198] To obtain the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at the ambient temperature;

[0199] The logarithmic speedup ratio of the electronic device is determined based on the failure rate, standard activation energy, ambient temperature, and preset temperature corresponding to the temperature acceleration test.

[0200] The equivalent activation energy of the electronic device is determined based on the logarithmic speedup ratio, ambient temperature, and preset temperature.

[0201] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0202] For each component, the corresponding acceleration parameters are determined based on the component's failure rate, standard activation energy, ambient temperature, and preset temperature.

[0203] Determine the first summation result of the acceleration parameters corresponding to multiple components, and the second summation result of the failure rate of multiple components;

[0204] The logarithmic speedup ratio is determined by the logarithm of the first ratio of the first summation result to the second summation result.

[0205] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0206] Determine the second ratio of the standard activation energy to the Boltzmann constant, and determine the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature;

[0207] The function value of the exponential function with the natural constant as the base is determined by using the product of the second ratio and the first difference as the exponent;

[0208] The product of the function value and the failure rate is used to determine the acceleration parameter corresponding to the component.

[0209] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0210] Determine the temperature conversion coefficient based on the ambient temperature and the preset temperature;

[0211] The equivalent activation energy of the electronic device is determined based on the logarithmic speedup and temperature conversion coefficient.

[0212] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0213] The result of the second product between the difference and the Boltzmann constant is determined as the temperature conversion coefficient; the difference is the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature.

[0214] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0215] The temperature acceleration factor of an electronic device is determined based on its equivalent activation energy.

[0216] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0217] The temperature step acceleration factor is determined based on the equivalent activation energy of the electronic device.

[0218] The duration of high temperature in a single acceleration cycle is determined based on the temperature step acceleration factor, and the cycle duration of a single acceleration cycle is determined based on the duration of high temperature, the preset duration of low temperature, and the preset duration of temperature change.

[0219] The number of cycles for the temperature acceleration test is determined based on the temperature cycling acceleration factor, and the test duration is determined based on the number of cycles and the cycle duration of a single acceleration cycle.

[0220] The temperature acceleration factor of the electronic device is determined based on the ratio of the preset standard test duration to the test duration.

[0221] In one embodiment, a computer program product is provided, including a computer program that, when executed by a processor, performs the following steps:

[0222] To obtain the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at the ambient temperature;

[0223] The logarithmic speedup ratio of the electronic device is determined based on the failure rate, standard activation energy, ambient temperature, and preset temperature corresponding to the temperature acceleration test.

[0224] The equivalent activation energy of the electronic device is determined based on the logarithmic speedup ratio, ambient temperature, and preset temperature.

[0225] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0226] For each component, the corresponding acceleration parameters are determined based on the component's failure rate, standard activation energy, ambient temperature, and preset temperature.

[0227] Determine the first summation result of the acceleration parameters corresponding to multiple components, and the second summation result of the failure rate of multiple components;

[0228] The logarithmic speedup ratio is determined by the logarithm of the first ratio of the first summation result to the second summation result.

[0229] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0230] Determine the second ratio of the standard activation energy to the Boltzmann constant, and determine the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature;

[0231] The function value of the exponential function with the natural constant as the base is determined by using the product of the second ratio and the first difference as the exponent;

[0232] The product of the function value and the failure rate is used to determine the acceleration parameter corresponding to the component.

[0233] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0234] Determine the temperature conversion coefficient based on the ambient temperature and the preset temperature;

[0235] The equivalent activation energy of the electronic device is determined based on the logarithmic speedup and temperature conversion coefficient.

[0236] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0237] The result of the second product between the difference and the Boltzmann constant is determined as the temperature conversion coefficient; the difference is the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature.

[0238] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0239] The temperature acceleration factor of an electronic device is determined based on its equivalent activation energy.

[0240] In one embodiment, when the computer program is executed by a processor, it also performs the following steps:

[0241] The temperature step acceleration factor is determined based on the equivalent activation energy of the electronic device.

[0242] The duration of high temperature in a single acceleration cycle is determined based on the temperature step acceleration factor, and the cycle duration of a single acceleration cycle is determined based on the duration of high temperature, the preset duration of low temperature, and the preset duration of temperature change.

[0243] The number of cycles for the temperature acceleration test is determined based on the temperature cycling acceleration factor, and the test duration is determined based on the number of cycles and the cycle duration of a single acceleration cycle.

[0244] The temperature acceleration factor of the electronic device is determined based on the ratio of the preset standard test duration to the test duration.

[0245] Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The computer program can be stored in a non-volatile computer-readable storage medium. When executed, the computer program can include the processes of the embodiments described above. Any references to memory, databases, or other media used in the embodiments provided in this application can include at least one of non-volatile and volatile memory. Non-volatile memory can include read-only memory (ROM), magnetic tape, floppy disk, flash memory, optical memory, high-density embedded non-volatile memory, resistive random access memory (ReRAM), magnetic random access memory (MRAM), ferroelectric random access memory (FRAM), phase change memory (PCM), graphene memory, etc. Volatile memory can include random access memory (RAM) or external cache memory, etc. By way of illustration and not limitation, RAM can take many forms, such as Static Random Access Memory (SRAM) or Dynamic Random Access Memory (DRAM). The databases involved in the embodiments provided in this application may include at least one type of relational database and non-relational database. Non-relational databases may include, but are not limited to, blockchain-based distributed databases. The processors involved in the embodiments provided in this application may be general-purpose processors, central processing units, graphics processing units, digital signal processors, programmable logic devices, quantum computing-based data processing logic devices, etc., and are not limited to these.

[0246] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0247] The embodiments described above are merely illustrative of several implementation methods of this application, and while the descriptions are specific and detailed, they should not be construed as limiting the scope of this patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these all fall within the protection scope of this application. Therefore, the protection scope of this application should be determined by the appended claims.

Claims

1. A method for determining the equivalent activation energy of an electronic device, characterized in that, The method includes: The standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at the ambient temperature are obtained. For each of the aforementioned components, a second ratio of the standard activation energy of the component to the Boltzmann constant is determined, and the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature corresponding to the temperature acceleration test is determined; the first product of the second ratio and the difference is used as the exponent to determine the function value of an exponential function with the natural constant as the base; the product of the function value and the failure rate is determined as the acceleration parameter corresponding to the component. The first summation result of the acceleration parameters corresponding to each of the components is determined, and the second summation result of the failure rate of each of the components is determined; The logarithmic speedup of the electronic device is determined based on the logarithm of the first ratio of the first summation result to the second summation result; The second product between the reciprocal of the difference and the Boltzmann constant is determined as the temperature conversion coefficient; The equivalent activation energy of the electronic device is determined based on the logarithmic speedup ratio and the temperature conversion coefficient.

2. The method according to claim 1, characterized in that, The method further includes: The temperature acceleration factor of the electronic device is determined based on the equivalent activation energy of the electronic device.

3. The method according to claim 2, characterized in that, Determining the temperature acceleration factor of the electronic device based on its equivalent activation energy includes: The temperature step acceleration factor is determined based on the equivalent activation energy of the electronic device. The duration of high temperature in a single acceleration cycle corresponding to the temperature acceleration test is determined based on the temperature step acceleration factor, and the cycle duration of the single acceleration cycle is determined based on the duration of high temperature, the preset duration of low temperature, and the preset temperature change duration. The number of cycles for the temperature acceleration test is determined based on the temperature cycling acceleration factor, and the test duration is determined based on the number of cycles and the cycle duration of a single acceleration cycle. The temperature acceleration factor of the electronic device is determined based on the ratio of the preset standard test duration to the test duration.

4. A device for determining the equivalent activation energy of an electronic device, characterized in that, The device includes: The acquisition module is used to acquire the standard activation energy of each component in the electronic device, the ambient temperature of the electronic device under normal operation, and the failure rate of each component at the ambient temperature. The first determining module is configured to, for each of the aforementioned components, determine a second ratio between the standard activation energy of the component and the Boltzmann constant, and determine the difference between the reciprocal of the ambient temperature and the reciprocal of the preset temperature corresponding to the temperature acceleration test; using the first product of the second ratio and the difference as the exponent, determine the function value of an exponential function with the natural constant as the base; multiply the function value by the failure rate to determine the acceleration parameter corresponding to the component; determine a first summation result of the acceleration parameters corresponding to each of the aforementioned components, and a second summation result of the failure rate of each of the aforementioned components; and determine the logarithmic speedup ratio of the electronic device based on the logarithm of the first summation result and the first ratio of the second summation result. The second determining module is used to determine the temperature conversion coefficient as the result of the second product between the reciprocal of the difference and the Boltzmann constant; and to determine the equivalent activation energy of the electronic device based on the logarithmic speedup ratio and the temperature conversion coefficient.

5. A computer device comprising a memory and a processor, wherein the memory stores a computer program, characterized in that, When the processor executes the computer program, it implements the steps of the method according to any one of claims 1 to 3.

6. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by a processor, it implements the steps of the method according to any one of claims 1 to 3.

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