Anti-interference flexible circuit board, method and device of audio device with camera function

Abstract

The application discloses an anti-interference flexible circuit board of an audio device with a camera function, a method and a device. The flexible circuit board is a multi-layer circuit structure in an integrated strip shape. An outer conductive layer is provided with a differential signal line group for transmitting digital video and a main clock line, and is covered by an electromagnetic shielding film to form a shielding cavity. In addition, the flexible circuit board is integrated with an analog audio driving line group and an independent microphone grounding line. The grounding line is physically isolated from a main ground network and is electrically connected only at a terminal part or a pad position, and is provided with an encapsulation body to provide outer protection. Through the layered wiring and shielding isolation design, the application effectively reduces the common ground interference of mixed transmission of high-speed digital signals and analog signals in a narrow and limited space, and greatly improves the signal quality.

Description

Technical Field

[0001] This invention relates to the field of application-specific integrated circuit (ASIC) technology, and more particularly to an anti-interference flexible circuit board, method, and apparatus for an audio device with camera functionality. The anti-interference flexible circuit board and its stacked structure involved in this invention are suitable for integration into application-specific integrated circuits (ASICs) and their peripheral interconnect structures in wearable audio devices with camera functionality. Its structural design is specifically optimized for the mixed transmission requirements of high-speed digital video signals, analog audio signals, and control signals. In particular, it relates to a flexible circuit board structure that provides stable signal transmission, electromagnetic shielding, and reliable interconnection for application-specific integrated circuits within confined spaces. Background Technology

[0002] Bone conduction headphones, due to their "open-ear" characteristic, can transmit audio information to users while retaining the ability to perceive surrounding sounds, and have been widely used in sports, outdoor, and safety-sensitive scenarios. Typical existing technologies, such as those disclosed in Chinese patent CN205336486U (a bone conduction wireless headphone), typically include a back hook assembly, an ear hook assembly, and an ear cup assembly positioned at the ear.

[0003] In existing bone conduction headphones, the electrical connections between the battery, Bluetooth circuit board, and audio transducer are typically achieved through multiple independent circular wires. For example, in current designs, the rear cable, left cable, and right cable are often threaded through the narrow gap between a metal support strip and a silicone sleeve to complete power supply and audio signal transmission. This type of wiring harness structure can meet the basic requirements of low-speed audio signals and DC power, but its design does not consider application scenarios involving high-speed data transmission and the coexistence of multiple signal types.

[0004] With the development of wearable technology, the market demand for combining first-person perspective (FPV) shooting with high-quality audio experience is constantly increasing. However, further integrating camera functionality into the existing shape and wearing structure of bone conduction headphones will face several technical challenges, mainly in the following aspects.

[0005] Firstly, regarding space constraints and wiring, the ear hook assembly of bone conduction headphones is typically designed as a slender structure, with a diameter often less than 5 millimeters, to balance wearing comfort and aesthetic requirements. Existing solutions using round enameled wire, stranded wire, or parallel wire harnesses are only suitable for low-speed signal and power transmission. When a camera module is introduced, multiple additional lines are needed to transmit high-speed digital video signals, such as differential signal lines for the MIPI interface. If traditional wire harnesses are still used, the overall size of the wire harness will increase significantly, making it difficult to run within the existing ear hook cavity, thus structurally challenging.

[0006] Secondly, and more critically, are electromagnetic interference and ground noise. Camera modules transmit high-speed, high-frequency digital pulse signals during operation, and the rapid transitions at the signal edges generate significant high-frequency electromagnetic radiation. In contrast, audio transducers require high-current analog drive signals, while microphones output analog audio signals with extremely low amplitude. In a confined linear space, if these signal lines of different characteristics are arranged in parallel, the electromagnetic noise generated by the high-speed digital signals can easily couple to the analog audio lines through crosstalk, resulting in noticeable background noise or unwanted audible interference.

[0007] Furthermore, existing designs generally employ a common grounding loop. When the audio transducer is operating, its large current flowing through the ground wire causes ground potential fluctuations, and the high-frequency ground noise generated by the camera's digital circuitry is also superimposed on the same grounding network. This common grounding interference caused by ground impedance not only degrades the microphone's sound pickup quality but may also adversely affect the stability of the video signal.

[0008] Secondly, regarding mechanical reliability and protective performance, in existing technologies, the cables are mostly loosely arranged inside the silicone sleeve, lacking clear hierarchical fixation and structural protection. When a sliding and adjustable camera structure is introduced, the connecting lines need to withstand repeated push-pull and bending stresses, and traditional cables are prone to fatigue fracture at the connection points. At the same time, it is difficult to achieve a reliable seal in the transition area between the cable and the rigid shell, making it difficult for the entire device to meet high-level protection requirements in terms of waterproofing and sweatproofing.

[0009] In summary, the existing technology lacks an integrated interconnection solution that can simultaneously achieve high-speed video signal transmission and high-current audio drive under extremely limited space conditions (e.g., a connection area with a width of no more than 12 mm), effectively isolate electromagnetic interference and ground noise, adapt to dynamic sliding structures, and possess good mechanical and protective performance. Summary of the Invention

[0010] Existing bone conduction headphones typically use multiple circular wire bundles to connect the battery, motherboard, and speaker. However, as wearable devices become more multifunctional, integrating camera functionality into bone conduction headphones presents significant challenges with existing wiring methods. Firstly, the internal space of the ear hook assembly is extremely narrow (typically less than 5 mm wide), making it difficult to accommodate the complex wiring required for transmitting high-speed digital video signals. Secondly, the high-frequency radiation of high-speed digital video signals (such as MIPI signals) easily causes severe electromagnetic interference to the high-current analog drive signal of bone conduction and the weak analog signal of the microphone, leading to increased audio noise floor and reduced signal-to-noise ratio. Furthermore, if the camera module is given a sliding adjustment function, traditional wire connections are prone to fatigue fracture under repeated pushing and pulling, and achieving a high level of waterproof sealing at the connection points of each component is difficult. Therefore, the purpose of this invention is to provide an anti-interference flexible circuit board for an audio device with camera functionality, its manufacturing method, and the resulting headphones. This aims to solve the problem of ground interference in the mixed transmission of high-speed digital and analog signals within a confined space, while ensuring signal integrity and meeting the structural requirements for dynamic bending and waterproof sealing.

[0011] To achieve the above objectives, the present invention proposes the following technical solution: I. A flexible circuit board with anti-interference capability for an audio device with camera function is provided. The flexible circuit board includes: a flexible conductive laminate structure configured as an integrated flexible strip structure, and divided into a mounting portion and a connecting portion along its length, the width of the connecting portion being between 2 and 12 mm; the flexible conductive laminate structure includes: a first conductive layer and a second conductive layer as outer signal layers, and a core layer located between the first conductive layer and the second conductive layer, the first conductive layer, the core layer, and the second conductive layer being separated by an insulating medium; the first conductive layer and / or the second conductive layer form differential signal line groups and a master clock line, the differential signal line groups being used to transmit digital video signals, the master clock line being used to synchronize the clock frequencies of the master device and the slave device, and the core layer... A reference potential layer is formed in at least a portion of the area; an electromagnetic shielding film is respectively covered on the outer surfaces of the first conductive layer and the second conductive layer, thereby encapsulating the core layer, differential signal line group and master clock line together in the shielding cavity formed by the electromagnetic shielding film in at least a portion of the connection portion; and an encapsulation body is disposed in the connection portion to cover the flexible conductive stacked structure and form an outer protective layer; wherein, the flexible conductive stacked structure also forms an analog audio drive line group and an electrically independent microphone ground line, the analog audio drive line group is used to transmit drive current to the audio transducer, the microphone ground line is physically isolated from the main ground network of the flexible conductive stacked structure, and the microphone ground line is electrically connected to the main ground network only at the terminal portion and / or the pad position.

[0012] II. A method for manufacturing the aforementioned anti-interference flexible circuit board is provided, comprising the following steps: providing a core layer, wherein a reference potential layer is formed in at least a portion of the core layer; forming a first conductive layer and a second conductive layer on the upper and lower surfaces of the core layer respectively, wherein the first conductive layer and the second conductive layer are physically isolated from the core layer by an insulating medium, thereby forming a flexible conductive stacked structure; patterning the first conductive layer and / or the second conductive layer to form differential signal lines and a master clock line; and attaching an electromagnetic shielding film to the outer surfaces of the first conductive layer and the second conductive layer respectively, thereby constructing a structure that encloses the core layer and the differential signal lines. The system includes an electromagnetic shielding cavity for the master clock circuit; a flexible conductive laminate structure covered with an electromagnetic shielding film is cut into an integrated flexible strip structure, and divided into a mounting part and a connecting part along the length direction, with the width of the connecting part between 2 and 12 mm; and an encapsulation is formed in the connecting part to cover the flexible conductive laminate structure and form an outer layer of protection; wherein, the flexible conductive laminate structure also forms an analog audio drive line group and an electrically independent microphone ground line, the analog audio drive line group is used to transmit drive current to the audio transducer, and the microphone ground line is physically isolated from the main ground line network of the flexible conductive laminate structure.

[0013] III. An audio device with camera function is provided, comprising: a back-hook assembly for wrapping around the back of a user's head; ear hook assemblies connected to both ends of the back-hook assembly, each ear hook assembly having a proximal end connected to the back-hook assembly and a distal end extending above the user's auricle and pointing towards the user's face area; at least one earbud assembly physically connected to the distal end of the ear hook assembly, the earbud assembly having a rigid shell, the rigid shell housing an audio transducer; a camera module slidably connected to the outside of the earbud assembly for acquiring video signals from a first-person perspective and allowing the user to adjust the shooting field of view; and a main control circuit board disposed on the ear hook. Inside the component's internal cavity, an anti-interference flexible circuit board serves as a flexible bridge connecting the ear hook assembly and the ear cup assembly. The connecting portion of the anti-interference flexible circuit board passes through the ear hook assembly and is inserted into the main control circuit board. The mounting portion of the anti-interference flexible circuit board extends into the rigid shell of the ear cup assembly and is electrically connected to the camera module. The encapsulation of the anti-interference flexible circuit board covers and seals the connection between the distal end of the ear hook assembly and the rigid shell of the ear cup assembly, forming an outer protective layer. The anti-interference flexible circuit board serves as the main mixed signal transmission channel, simultaneously transmitting the video signal from the camera module and the audio signal from the audio transducer.

[0014] The technical solution provided by this invention has the following beneficial effects: I. Excellent Anti-interference Performance: Through a unique layered design, high-speed digital video signals (differential lines / clock lines) that are prone to radiation are placed on the outer layer and adjacent to the electromagnetic shielding film, while sensitive analog audio signals are placed on the inner core layer. The Faraday cage formed by the shielding film effectively locks in high-frequency radiation, while the core layer, as a reference ground plane, further isolates signal crosstalk.

[0015] 2. Solving common ground interference: In response to the scenario of high current drive and weak microphone signal coexisting in bone conduction headphones, this invention designs a physically isolated independent microphone ground wire that only converges at the endpoints (e.g., terminal part or solder pad area), effectively cutting off ground loop noise and ensuring the purity of recording and calls.

[0016] III. Integration in an extremely narrow space: This invention integrates multiple complex signals into an integrated flexible strip structure with a width of no more than 3.5 mm, successfully solving the space problem of transmitting audio and video signals simultaneously in a thin ear hook, and replacing the traditional bulky wire harness.

[0017] IV. Reliable Structural Connection and Protection: The anti-interference flexible circuit board not only transmits signals, but also serves as a flexible bridging component to connect rigid ear hooks and ear covers. Furthermore, the encapsulation can cover and seal the connection between rigid shells, achieving structural integration and excellent waterproof performance.

[0018] V. Adaptable to sliding adjustment: At the device level, the flexible extension and redundant bending section design of the camera module cleverly solves the problem of circuit expansion and contraction during camera sliding adjustment, avoiding the main circuit board from breaking due to repeated stretching, and improving the mechanical life of the product and user experience.

[0019] Furthermore, the interference-resistant flexible circuit board of the present invention is configured as a flexible interconnect structure specifically for carrying and connecting at least one application-specific integrated circuit (ASIC). The ASIC includes a control chip for image signal processing, audio signal processing, or wireless communication, which simultaneously generates high-speed digital signals, analog signals, and control signals during operation.

[0020] To address the issues of electromagnetic coupling, ground noise, and signal integrity degradation that commonly arise when ASICs operate in confined spaces, this invention addresses these problems by: incorporating a reference potential layer within a flexible conductive stacked structure; placing high-speed differential signal lines on the outer layer adjacent to the electromagnetic shielding film; physically isolating the analog audio drive lines from the independent microphone grounding wire; and combining this with the shielding and protection structure formed by the overall package. This provides a stable, low-interference signal interconnection environment for the ASIC, enabling it to operate reliably within the limited space of wearable devices. Attached Figure Description

[0021] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0022] in: Figure 1 This is a cross-sectional view of the anti-interference flexible circuit board of the audio device with camera function provided in this embodiment of the technical solution; Figure 2 This is a top view of the anti-interference flexible circuit board of the audio device with camera function provided in this embodiment of the technical solution; Figure 3 This is a flowchart of the anti-interference flexible circuit board manufacturing method provided in this technical solution embodiment; Figure 4 This is a cross-sectional view of the core layer provided in this embodiment of the technical solution; Figure 5 Is Figure 4 A cross-sectional view showing that the first conductive layer and the second conductive layer are formed on the upper and lower surfaces of the core layer, respectively; Figure 6 Is Figure 5 A cross-sectional view of the insulating medium formed on the first conductive layer and the second conductive layer; Figure 7 Is Figure 5 A cross-sectional view of the electromagnetic shielding film formed on the first conductive layer and the second conductive layer; Figure 8 Yes Figure 7 A schematic diagram showing the transformation of a flexible conductive laminated structure covered with an electromagnetic shielding film into an integrated flexible strip structure. Figure 9 This is a three-dimensional schematic diagram of the audio device with camera function provided in this embodiment of the technical solution; Figure 10 This is an exploded structural diagram of the audio device with camera function provided in this embodiment of the technical solution; Figure 11 This is a schematic diagram of a camera module with a camera function that can be slidably connected. Figure 12 This is a schematic diagram of an anti-interference flexible circuit board as a flexible bridging component connecting the ear hook assembly and the ear cup assembly. Figure 13 This is a schematic diagram of a structure in which elastic elements are filled in the gap between the anti-interference flexible circuit board and the ear hook assembly and ear cup assembly.

[0023] Explanation of main component symbols Detailed Implementation The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0024] Please see Figure 1 This embodiment of the technical solution provides an anti-interference flexible circuit board 100 for an audio device with camera function. The anti-interference flexible circuit board 100 mainly includes a flexible conductive laminate structure 110, an electromagnetic shielding film 160, and an encapsulation body 170. Among them, as shown... Figure 2As shown, the flexible conductive laminate structure 110 is configured as an integrated flexible strip structure, and is divided into a mounting portion 111 and a connecting portion 112 along its length. The width W of the connecting portion 112 is between 2 and 12 mm. Specifically, the width W of the connecting portion 112 can be adjusted according to the structural form, wearing method, and internal wiring requirements of the wearable audio device. When the wearable audio device is an ear-hook structure, the connecting portion 112 usually needs to be inserted into a narrow, curved space extending along the outer side of the user's ear. The lateral dimension of this space is limited by the ear contour and wearing comfort. Therefore, in a preferred embodiment, when used in an ear-hook structure, the width W of the connecting portion 112 is preferably controlled within 3.5 mm to accommodate the narrow channel inside the ear-hook assembly and avoid pressure or foreign body sensation on the user's ear. In another embodiment, when the wearable audio device is a headband structure, the connecting portion 112 can be arranged along the outer side of the head or the headband structure, and its available lateral space is increased compared to the ear-hook structure. Therefore, the width W of the connecting portion 112 can be moderately increased to accommodate more conductive layers, shielding structures, or reinforced encapsulation, but it is usually still controlled within 12 mm to maintain the overall slim appearance and take into account wearing comfort. It should be noted that, regardless of the width W of the connecting portion 112 being any value within the above range, its design goal is to minimize the lateral size as much as possible while meeting the requirements of signal transmission, electromagnetic shielding, and structural strength, so as to reduce the burden on the user during long-term wear of the wearable device. Therefore, in specific applications, the width W of the connecting portion 112 often tends to be selected as a smaller value within the above range to achieve a balance between structural compactness and wearing comfort. In this embodiment, the flexible strip structure is generally elongated to fit and pass through the narrow internal space of the wearable audio device. The mounting portion 111 is mainly used to carry or electrically connect functional modules, such as camera modules, audio transducer interfaces, or other electronic components. The connecting portion 112 serves as a flexible bridging section extending outward from the mounting portion 111, used to achieve electrical connection and signal transmission between different structural components. Specifically, the connecting portion 112 extends along its length, and its lateral dimension is limited to no more than 12 mm by the wearing structure of the wearable device, thus enabling it to be installed in various narrow internal channels while avoiding adverse effects on wearing comfort and appearance. Compared with the traditional wire harness structure formed by multiple circular wires, this integrated flexible strip structure, by integrating multiple signal lines into the same flexible conductive stack, significantly reduces the wiring volume and improves the consistency and reliability of the overall structure.Furthermore, since the mounting part 111 and the connecting part 112 are integrally formed in the same flexible conductive laminate structure 110, the stress concentration problem caused by welding, bending or stretching at the connection node of traditional wires is avoided. This allows the flexible conductive laminate structure 110 to better adapt to the repeated bending and displacement of wearable devices during daily use, thereby improving the mechanical durability and service life of the whole device.

[0025] Specifically, the flexible conductive stacked structure 110 includes: a first conductive layer 120 and a second conductive layer 130 serving as outer signal layers, and a core layer 140 located between the first conductive layer 120 and the second conductive layer 130. The first conductive layer 120, the core layer 140, and the second conductive layer 130 are separated by an insulating medium 150. The core layer is at least one conductive or composite conductive layer located in the middle of the flexible conductive stacked structure 110, and its main function is to provide a reference potential, a signal return path, and mechanical support. In this embodiment, the first conductive layer 120 and the second conductive layer 130 are respectively disposed on opposite sides of the flexible conductive stacked structure 110 to form the outermost conductive layer structure of the stack, while the core layer 140 is disposed between the first conductive layer 120 and the second conductive layer 130 to provide structural support within the stack. Through the above-mentioned multi-layer structure, the flexible conductive stacked structure 110 can still form a distinct stacked structure even when the overall thickness is strictly controlled. This is beneficial for integrating multiple conductive layers within a limited lateral dimension and meeting the deployment requirements in narrow spaces.

[0026] Furthermore, the core layer 140 can be composed of a single conductive layer or a composite structure composed of multiple internal conductive layers separated by an insulating medium 150. For example, in this embodiment, the core layer 140 can be a double-sided copper-clad flexible substrate, i.e., a double-layer conductive layer structure separated by an insulating medium; in a variation, the core layer 140 can also be a multilayer conductive structure formed by stacking at least two single-sided copper-clad flexible substrates, depending on specific structural strength requirements or stacking layer requirements. The insulating medium 150 is disposed between adjacent conductive layers to electrically isolate each conductive layer, while also providing support and buffering in the mechanical structure. By rationally selecting the thickness and material properties of the insulating medium 150, the reliability of interlayer insulation and overall flexibility can be balanced without significantly increasing the total stacking thickness.

[0027] In this embodiment, the first conductive layer 120, the second conductive layer 130, and the core layer 140 can all be made of adhesive-free rolled copper material. By omitting the traditional adhesive layer structure, the overall thickness of the flexible conductive stack structure 110 can be effectively reduced, thereby reserving more space for component stacking in the mounting portion 111. Simultaneously, rolled copper has better grain orientation consistency and ductility than electrolytic copper, enabling the flexible conductive stack structure 110 to exhibit superior flexibility and fatigue resistance during repeated bending or flexing. Therefore, the adhesive-free rolled copper stack structure is particularly suitable for laying along curved paths in the width-limited connection portion 112 area to meet the dynamic bending requirements that the connection portion 112 needs to withstand during use.

[0028] The first conductive layer 120 and / or the second conductive layer 130 form a differential signal line group 121 and a master clock line 131. The differential signal line group 121 is used to transmit digital video signals, and the master clock line 131 is used to synchronize the clock frequencies of the master device and the slave device. In this embodiment, the differential signal line group 121 is disposed within the first conductive layer 120, while the master clock line 131 is disposed within the second conductive layer 130. By arranging the differential signal line group 121 and the master clock line 131 on the outermost layer of the flexible conductive stacked structure 110, it is beneficial to achieve centralized arrangement of high-speed signal lines within a limited lateral space and to provide a clear spatial positional relationship for the subsequent electromagnetic shielding structure.

[0029] In this embodiment, the core layer 140 forms a reference potential layer in at least a portion of its area to provide a stable reference potential for the signal lines on the first conductive layer 120 and / or the second conductive layer 130. The differential signal line group 121 is separated from the core layer 140 by an insulating medium 150, and the insulating medium 150 has a preset interlayer thickness range, resulting in a relatively stable geometric spacing between the differential signal line group 121 and the core layer 140. For example, the thickness of the insulating medium 150 can be selected between 15 micrometers and 60 micrometers; in one variation, the thickness of the insulating medium 150 is approximately 25 micrometers; in another variation, the thickness of the insulating medium 150 is approximately 50 micrometers. The thickness of the insulating medium can be adjusted in conjunction with the dielectric constant of the material and the line width and spacing, and can be verified through impedance testing. By designing the material type and interlayer thickness of the insulating medium 150, the differential signal line group 121 can obtain the expected distributed capacitance and distributed inductance parameters during transmission, thereby achieving control over the characteristic impedance of high-speed signals, which is beneficial to maintaining the signal integrity of digital video signals and reducing the risk of reflection and distortion.

[0030] Furthermore, the flexible conductive laminate structure 110 also forms an analog audio drive line group 122 for transmitting drive current to the audio transducer. Compared with high-speed digital video signals, the analog audio drive line group 122 carries a larger current during operation, so a relatively large line width is used in the wiring design. In this embodiment, the line width of the analog audio drive line group 122 is not less than 0.2 mm, and grounding shield lines 123 with a line width of not less than 0.3 mm are arranged parallel to both sides of the analog audio drive line group 122, thereby forming lateral electromagnetic isolation for the analog audio drive line group 122 within the same conductive layer to reduce the crosstalk effect from adjacent lines. Generally speaking, so-called fine lines refer to less than 1 mil (about 0.25 mm). When transmitting large dynamic range audio signals, the DC resistance (DCR) of the line will increase significantly, so a wider line needs to be designed to reduce resistance, thereby reducing audio distortion and avoiding excessive temperature rise of the line due to current thermal effect, which would affect the reliability in narrow and confined spaces. According to the principle of electromagnetic compatibility, the wider the grounding wire, the lower its inductance and impedance, and the more effectively it can guide coupled interference noise into the main ground network. Therefore, by setting the grounding shield 123 with a wider line width in the same layer, the edge radiation field from the adjacent analog audio drive line group 122 can be absorbed by the lateral coupling capacitor, thereby forming effective lateral electromagnetic isolation of the analog audio drive line group 122 within the same conductive layer. The above-mentioned line width range can be matched with the overall thickness, number of layers and space constraints of the flexible conductive stacked structure 110 while meeting the requirements of current carrying capacity and anti-interference, thereby achieving a better balance between anti-interference performance and structural size, and has good engineering feasibility. In a variation, when the core layer 140 is composed of multiple internal conductive layers, for example, the core layer 140 contains three or more internal conductive layers, the analog audio drive line group 122 can be distributed in different internal conductive layers to share the audio drive current and improve the overall current carrying capacity. By distributing the analog audio drive line group 122 in different internal conductive layers, it is not only beneficial to reduce the current density on a single conductive layer, but also to improve the reliability of the audio drive path without increasing the lateral dimension of the flexible conductive stack structure 110.

[0031] In this embodiment, a main ground network is provided in the flexible conductive stacked structure 110 to provide a common reference potential and return path for various circuits within the flexible conductive stacked structure 110. The ground shield 123 is connected to the main ground network to enhance the lateral electromagnetic isolation effect on the analog audio driver line group 122. The main ground network can be formed by at least one internal conductive layer in the core layer 140, or it can be formed by ground lines disposed on the first conductive layer 120 and / or the second conductive layer 130 and the reference potential layer in the core layer 140, thereby forming a continuous and low-impedance ground network within the stacked structure. Specifically, the main ground network extends along the length of the flexible strip structure and is connected to the external circuit system ground through terminal portions or pad areas to achieve consistency with the main device ground reference. The main ground network is used to carry the return current of high-speed digital signals, the return current of audio drive signals, and the common return current generated by other functional modules. Therefore, its structural design preferably has a large equivalent cross-sectional area to reduce the impedance of the grounding path and reduce ground potential fluctuations. In one embodiment, the core layer 140 forms a continuous reference potential layer in part or all of its area and serves as a major component of the main ground network, enabling signal lines located on adjacent conductive layers to obtain a stable reference plane, thereby facilitating control of the signal return path and reducing loop area. In another embodiment, the main ground network can be electrically connected to grounding lines located on different conductive layers through conductive connection structures (e.g., vias, conductive adhesive connection points, or local conductive voltage connection structures); preferably, the conductive connection structure can be located in areas with less bending requirements to reduce the fatigue risk caused by repeated bending.

[0032] It should be noted that, to reduce the impact of common-ground noise on audio signal quality, the flexible conductive laminate structure 110 also includes an electrically independent microphone grounding wire 141. The microphone grounding wire 141 is continuously laid along an independent conductive path throughout the entire length of the connecting portion 112 of the flexible strip structure. It does not form an electrical connection with the analog audio drive line group 122 or high-speed signal lines along its path, nor does it electrically converge with the main ground network, thus maintaining physical isolation from the main ground network. That is, the microphone grounding wire 141 maintains a preset distance from the main ground network along its path, and no conductive structures or conductive adhesive contact points are provided in non-pad areas. Therefore, the microphone grounding wire 141 is only equipotentially connected to the main ground network at the terminal portion and / or pad location to form a single-point grounding structure, thereby avoiding the superposition of audio drive current or high-speed digital signal return current in the microphone's grounding path, and thus reducing the impact of common-ground interference on the microphone's pickup quality. In a preferred embodiment, a nano-waterproof coating may be provided on the outer surface of the flexible conductive stacked structure 110. This nano-waterproof coating is a thin film layer with hydrophobic properties, further enhancing the protective capability of the flexible conductive stacked structure 110 in humid, sweaty, or watery environments. Specifically, the nano-waterproof coating may cover at least one exposed surface of the flexible conductive stacked structure 110, including but not limited to covering the first conductive layer 120, the second conductive layer 130, or the outer surface of electronic components mounted on the first conductive layer 120 and the second conductive layer 130, thereby forming a continuous hydrophobic protective interface on the outer side of the flexible conductive stacked structure 110. By providing the nano-waterproof coating on the aforementioned surfaces, the adhesion of moisture or sweat to the surface of the flexible conductive stacked structure 110 can be reduced, making it easier for liquids to form droplets and roll off, reducing the possibility of moisture remaining on the surface or penetrating into the interior. In this embodiment, the nano-waterproof coating may be a functional coating with nanoscale thickness, and its material may be selected from fluoropolymers, siloxane materials, nano-modified resins, or other coating materials with hydrophobic or superhydrophobic properties. The nano-waterproof coating can be formed by spraying, dipping, chemical vapor deposition, plasma treatment, or other film-forming processes suitable for the surface of flexible circuit boards, and maintains good adhesion to the outer surface of the flexible conductive multilayer structure 110. Because the nano-waterproof coating is relatively thin, it provides hydrophobic protection without significantly affecting the overall thickness, bending performance, or electrical characteristics of the flexible conductive multilayer structure 110. Furthermore, by providing the nano-waterproof coating, the impact of humidity changes on the characteristic impedance and electromagnetic shielding continuity of the differential signal line group 121 can be reduced.

[0033] The electromagnetic shielding film 160 covers the outer surfaces of the first conductive layer 120 and the second conductive layer 130, respectively, thereby encapsulating the core layer 140, the differential signal line group 121, and the master clock line 131 within the shielding cavity formed by the electromagnetic shielding film 160 in at least a portion of the connection portion 112. By providing the electromagnetic shielding film 160 on the outside of the flexible conductive laminated structure 110, the connection portion 112 structurally forms a relatively closed electromagnetic shielding space, thereby providing external shielding for the high-speed signal lines inside the flexible conductive laminated structure 110. In this embodiment, the electromagnetic shielding film 160 can be a conductive metal film or a composite conductive film, and the electromagnetic shielding film 160 is continuously laid along the length of the flexible strip structure and covers the outer surfaces of the first conductive layer 120 and the second conductive layer 130. Through the above configuration, the flexible conductive laminated structure 110 forms a shielded cavity structure defined by the upper and lower electromagnetic shielding films 160 in the connection portion 112 region, thereby achieving constraint of the internal electromagnetic field under limited thickness conditions. In this embodiment, the differential signal line group 121 specifically includes MCN, MCP, MDN0, and MDP0 lines for transmitting MIPI interface signals. The differential signal line group 121 is directly adjacent to the electromagnetic shielding film 160 in the laminated direction. Here, "adjacent" means that there is only one insulating medium between the differential signal line group 121 and the corresponding electromagnetic shielding film 160, and there are no other conductive layers or signal lines between the differential signal line group 121 and the electromagnetic shielding film 160. By arranging the differential signal line group 121 close to the electromagnetic shielding film 160 through the aforementioned "close proximity" structural configuration, the electromagnetic coupling distance is minimized. This allows the high-frequency electromagnetic field generated by the differential signal line group 121 during high-speed digital signal transmission to be absorbed or reflected by the electromagnetic shielding film 160 in the near-field region. This reduces the coupling of high-frequency energy to other conductive lines within the flexible conductive laminate structure 110, thereby reducing crosstalk and electromagnetic interference. Furthermore, since the differential signal line group 121 itself employs a paired differential structure, its signal currents are in opposite directions in the two complementary lines, achieving self-cancellation radiation to a certain extent. However, under high-speed operating conditions, residual common-mode components or high-frequency edge radiation may still exist. By placing the differential signal line group 121 and the electromagnetic shielding film 160 closely adjacent in the laminate direction, these residual radiation components can be further suppressed, thereby enhancing the electromagnetic compatibility of high-speed digital signals at the structural level.In this embodiment, the electromagnetic shielding film 160 can be grounded by being electrically connected to the main ground network, serving as a reference potential layer for electromagnetic shielding during operation. In a variation, the electromagnetic shielding film 160 can also be connected to the main ground network in a partial area to achieve both shielding effectiveness and flexibility of the flexible conductive laminate structure 110. Through this method, the electromagnetic shielding film 160 provides an effective electromagnetic isolation environment for the high-speed differential signal line group 121 without significantly increasing the structural thickness. Therefore, through the coordinated configuration of the electromagnetic shielding film 160 and the differential signal line group 121, this embodiment can achieve stable transmission of high-speed digital video signals in a width-limited flexible strip structure, and effectively reduce electromagnetic interference from high-speed digital video signals to the analog audio drive line group 122, the microphone ground wire 141, and other low-level signal lines during transmission. Therefore, this invention, through layered wiring and shielding isolation design, effectively reduces grounding interference in the mixed transmission of high-speed digital and analog signals in narrow and limited spaces, significantly improving signal quality.

[0034] The encapsulation body 170 is mainly disposed on the connecting portion 112 to cover the flexible conductive laminate structure 110 and form an outer protective layer. The encapsulation body 170 is continuously disposed along the length direction of the connecting portion 112, allowing the flexible conductive laminate structure 110 to be completely covered, thereby preventing the connecting portion 112 from being directly exposed to the external environment. In this embodiment, the encapsulation body 170 is preferably made of a waterproof elastic material, such as silicone. By selecting silicone, which has good elasticity and a soft touch, as the material of the encapsulation body 170, the connecting portion 112 can conform to the contours of the user's ear or head during wear, thereby improving wearing comfort and reducing pressure on the skin. Simultaneously, silicone material has good resilience; when the connecting portion 112 is bent or displaced, it can deform with the flexible conductive laminate structure 110 without easily cracking or permanent deformation. Furthermore, silicone material itself has good water resistance and sweat resistance. By completely encapsulating the flexible conductive laminate structure 110 with the encapsulation body 170 in a sealed manner, a continuous protective layer can be formed in the area of ​​the connection portion 112, thereby preventing moisture, sweat, or dust from seeping into the interior of the flexible conductive laminate structure 110 along the connection portion 112, improving the reliability of the device in daily wear and sports scenarios. In one embodiment, the encapsulation body 170 can be formed by injection molding, overmolding, or compression molding, so that the encapsulation body 170 and the flexible conductive laminate structure 110 are tightly fitted. Specifically, the encapsulation body 170 not only serves a waterproof and protective function, but also provides a flexible cushioning function to disperse the mechanical stress generated by bending, stretching, or external forces on the connection portion 112, thereby reducing the risk of stress concentration at the terminal portion or solder pad position of the flexible conductive laminate structure 110, and further improving the mechanical durability of the overall structure.

[0035] In a variation, the encapsulation body 170 can also be made of other materials with elasticity and protective properties, such as thermoplastic elastomer (TPE) or thermoplastic polyurethane (TPU), to balance softness, abrasion resistance, or molding efficiency in different application scenarios. The selection of these different materials can achieve the sealing and outer protection of the flexible conductive laminate structure 110 without changing the basic function of the encapsulation body 170. Through the configuration of the encapsulation body 170, the flexible conductive laminate structure 110 simultaneously possesses multiple functions such as waterproofing, protection, cushioning, and comfortable fit in the connection portion 112 area.

[0036] Please see Figure 3The flowchart illustrates a method for manufacturing an anti-interference flexible circuit board for an audio device with camera functionality, as provided in this embodiment of the technical solution. The method mainly includes the following steps: Step S1: Please refer to Figure 4 A core layer 140 is provided, wherein a reference potential layer is formed in at least a portion of the core layer 140. In one embodiment, the core layer 140 may include at least one conductive layer, which is continuously disposed in at least a portion of the core layer 140 to form the reference potential layer. The reference potential layer is used to provide a stable reference potential and return path for high-speed signal lines and other signal lines in subsequent stack-up structures. In this embodiment, the core layer 140 adopts a double-sided copper-clad structure, that is, conductive layers are formed on the upper and lower surfaces of the first insulating medium 151, wherein the conductive layer on at least one side can be used as the reference potential layer. In detail, the core layer 140 serves as an intermediate layer of the overall structure, providing mechanical support and electrical reference for the subsequently formed conductive layers. The first insulating medium 151 is preferably a flexible substrate, such as polyimide (PI) or other insulating substrates suitable for flexible circuit boards, to balance heat resistance, mechanical strength, and bending performance. In one variation, the core layer 140 may also be composed of multiple internal conductive layers. For example, multiple conductive layers separated by an insulating medium can be disposed in a multilayer flexible substrate, such that at least one of the internal conductive layers forms a reference potential layer in a predetermined region. In this manner, the area, position, and continuity of the reference potential layer can be flexibly adjusted according to actual design needs, while ensuring overall thickness control. In a preferred embodiment, the reference potential layer can be continuously formed in a portion of the core layer 140 to provide a stable reference plane for high-speed signal lines; while in other regions, adjustments can be made according to component layout or structural requirements, such as partial windowing or partitioning, without affecting its basic function as a reference potential layer.

[0037] Through the above step S1, the core layer 140 is provided, which enables the core layer 140 to have flexible support in structure and provides stable reference potential conditions for the conductive layer and signal lines to be formed in electrical terms, thereby laying the foundation for the formation of conductive structure and electromagnetic shielding structure in subsequent steps.

[0038] Step S2: Please refer to Figure 5A first conductive layer 120 and a second conductive layer 130 are formed on the upper and lower surfaces of the core layer 140, respectively. The first conductive layer 120 and the second conductive layer 130 are physically isolated from the core layer 140 by a second insulating medium 152, thereby forming a flexible conductive stacked structure 110. The first conductive layer 120 and / or the second conductive layer 130 are patterned to form a differential signal line group 121 and a master clock line 131. In this embodiment, the first conductive layer 120 and the second conductive layer 130 are respectively disposed on opposite sides of the core layer 140. By providing the second insulating medium 152 between the core layer 140 and the corresponding first conductive layer 120 and second conductive layer 130, the first conductive layer 120, the second conductive layer 130 and the substrate layer are electrically isolated from each other and structurally stably stacked, thereby forming an integrally continuous flexible conductive stacked structure 110. In detail, the second insulating medium 152 may be formed using a flexible substrate that is the same as or compatible with the first insulating medium 151, to ensure that the flexible conductive stack structure 110 has consistent mechanical properties during subsequent bending or flexing. In this embodiment, the patterning process for the first conductive layer 120 and / or the second conductive layer 130 may include photolithography, etching, or other circuit forming processes suitable for flexible circuit boards, so that the first conductive layer 120 and / or the second conductive layer 130 can form signal lines with a predetermined direction. Through the above patterning process, the differential signal line group 121 for transmitting digital video signals and the master clock line 131 for providing timing synchronization are formed on the first conductive layer 120 and / or the second conductive layer 130. The above patterning process can be performed after the stacking is completed, or it can be completed before the first conductive layer 120 and the second conductive layer 130 are bonded to the core layer 140. The specific process sequence can be adjusted according to the manufacturing conditions.

[0039] In this embodiment, the flexible conductive stacked structure 110 also forms an analog audio drive line group 122 for transmitting drive current to the audio transducer. The analog audio drive line group 122 can be selected according to current carrying requirements and the overall stacked layout, and is patterned and formed within the first conductive layer 120, the second conductive layer 130, or the core layer 140. Furthermore, the flexible conductive stacked structure 110 also forms an electrically independent microphone ground line 141. Preferably, the electrically independent microphone ground line 141 is formed within the core layer 140 and is continuously laid along the length of the flexible conductive stacked structure 110, maintaining independent routing throughout the entire length of the connecting portion 112 of the flexible strip structure. During its formation, the microphone ground line 141 does not form an electrical connection with the signal lines in the first conductive layer 120 or the second conductive layer 130, thereby maintaining physical isolation from the main ground network of the flexible conductive stacked structure 110. Therefore, the microphone grounding wire 141 is only equipotentially connected to the main ground network at a predetermined pad location to form a single-point grounding structure. In this way, the microphone's grounding path is independently planned during the manufacturing stage, avoiding superposition with high-speed signal return current or audio drive current during subsequent use, thereby reducing the impact of common-ground noise on microphone signal quality.

[0040] By completing step S2 above, a flexible conductive laminated structure 110 with complete circuit definition in both structure and electrical aspects is obtained, providing a foundation for subsequent steps such as bonding of electromagnetic shielding film, cutting of strip structure and formation of encapsulation.

[0041] Furthermore, such as Figure 6As shown, after the patterning process of the first conductive layer 120 and the second conductive layer 130 is completed, a third insulating medium 153 can be respectively covered on the outer surfaces of the first conductive layer 120 and the second conductive layer 130 to protect the signal lines located within the first conductive layer 120 and the second conductive layer 130. In this embodiment, the third insulating medium 153 is disposed on the outermost side of the flexible conductive stack structure 110 to form a temporary or permanent insulating cover for the exposed signal lines before subsequent process steps. By setting the third insulating medium 153, the risk of accidental scratches, contamination or short circuits of the first conductive layer 120 and the second conductive layer 130 during subsequent processing, handling or stacking can be avoided, thereby improving the stability and yield of the manufacturing process. In one embodiment, the third insulating medium 153 can be a cover film, a protective film or a solder resist layer, and its material can be selected as polyimide film, heat-resistant insulating coating or other insulating materials suitable for flexible circuit boards. The third insulating medium 153 can be formed by bonding, coating, or laminating, and maintains good adhesion to the first conductive layer 120 and the second conductive layer 130 to achieve effective protection without significantly increasing the overall thickness. In this embodiment, the third insulating medium 153 can continuously cover the first conductive layer 120 and the second conductive layer 130 to accommodate subsequent bending, cutting, or bonding of the electromagnetic shielding film 160; alternatively, the third insulating medium 153 can be partially opened according to component soldering or connection requirements to expose predetermined solder pads or connection areas in subsequent processes.

[0042] By providing the third insulating medium 153 on the outside of the first conductive layer 120 and the second conductive layer 130, reliable electrical and mechanical protection can be provided for the outer signal lines during the manufacturing stage, and relatively flat and stable surface conditions can be provided for the subsequent bonding of the electromagnetic shielding film, which is conducive to forming a complete flexible conductive stacked structure 110.

[0043] Step 3, S3, please refer to Figure 7Electromagnetic shielding films 160 are respectively bonded to the outer surfaces of the first conductive layer 120 and the second conductive layer 130, thereby constructing an electromagnetic shielding cavity that encloses the core layer 140, the differential signal line group 121, and the master clock line 131. The electromagnetic shielding film 160 is preferably a conductive silver foil, employing a multi-layer composite structure, specifically including a conductive adhesive layer 163, a metal layer 162, and an outermost protective layer 161. The conductive adhesive layer 163 is disposed near the flexible conductive stacked structure 110, used to establish a stable electrical connection with the first conductive layer 120 or the second conductive layer 130 during bonding; the metal layer 162 provides the main electromagnetic shielding function; and the protective layer 161 provides mechanical and environmental protection for the metal layer 162 to prevent oxidation, wear, or external damage. In a preferred embodiment, the conductive adhesive layer 163 can fill the opening area of ​​the third insulating medium 153 during the bonding process, so that the first conductive layer 120 and the second conductive layer 130 can form a reliable electrical connection path with the metal layer 162 through the conductive adhesive layer 163. In a variation, the electromagnetic shielding film 160 can also be selected from other shielding materials with good conductivity and flexibility according to different product requirements, such as conductive copper foil, nickel-plated metal foil, or composite conductive film. The main purpose is still to establish a reliable electrical connection with the flexible conductive laminate structure 110 and form a continuous shielding path. The third insulating medium 153 forms an opening at a predetermined grounding position to expose the grounding area of ​​the first conductive layer 120 and / or the second conductive layer 130; the conductive adhesive layer 163 fills the opening and contacts the grounding area during bonding, so that the electromagnetic shielding film 160 can form a continuous conductive connection with the main grounding network.

[0044] Through the above design, the electromagnetic shielding film 160 can form a continuous conductive covering structure with the flexible conductive stacked structure 110, thereby constituting a closed or semi-closed electromagnetic shielding cavity. Therefore, the core layer 140, the differential signal line group 121, and the master clock line 131 can be entirely enclosed within the shielding cavity formed by the electromagnetic shielding film 160, significantly reducing the leakage of electromagnetic radiation generated during high-speed digital signal transmission. Furthermore, since the differential signal line group 121 is positioned adjacent to the electromagnetic shielding film 160 in the stacking direction, the electromagnetic field generated by the high-frequency digital video signal during operation can be absorbed by the electromagnetic shielding film 160 nearby and reflected or attenuated by the metal layer 162, thereby reducing electromagnetic interference to the analog audio lines and other sensitive signal lines inside the stack. Simultaneously, the core layer 140, as a reference potential layer, together with the electromagnetic shielding film 160, forms a stable electromagnetic environment, which is beneficial for further improving the signal integrity of high-speed signal transmission.

[0045] Through the above step S3, without significantly increasing the overall thickness of the flexible conductive stacked structure 110, a structurally complete and electrically continuous electromagnetic shielding cavity can be formed in a specific area, providing a foundation for the subsequent stable mixed transmission of high-speed digital video signals and analog audio signals in a narrow space.

[0046] Step 4, S4, please refer to Figure 8 The flexible conductive laminated structure 110, which covers the electromagnetic shielding film 160, is cut into an integrated flexible strip structure, and is divided into a mounting portion 111 and a connecting portion 112 along the length direction. The width W of the connecting portion 112 is between 2 and 12 mm. In a preferred embodiment, the width W of the connecting portion 112 can be controlled to be no more than 3.5 mm. Specifically, the cutting step is performed after the electromagnetic shielding film 160 is attached, so that the cut flexible strip structure retains the complete flexible conductive laminated structure 110 and the electromagnetic shielding film 160 in both the mounting portion 111 and the connecting portion 112 areas, thereby avoiding damage to the continuity of electromagnetic shielding or the integrity of the interlayer structure due to improper cutting during subsequent use. Before cutting, the flexible conductive laminated structure 110 may be in the form of a matrix-arranged plate. Through precision cutting processes, such as laser cutting, punching, or CNC die cutting, the flexible conductive laminated structure 110 is cut into an integrated flexible strip structure extending along the length direction. The outline of the flexible strip structure can be pre-designed according to the overall structure of the product, so that the cut flexible strip structure forms a continuous extension in the longitudinal direction. In this embodiment, at least two functionally distinct parts, namely a mounting portion 111 and a connecting portion 112, are defined along the length of the flexible strip structure. The mounting portion 111 has a larger local width than the connecting portion 112, and is used to accommodate or mount electronic components, pad areas, or structures that are electrically connected to components such as the camera module 240 and circuit boards. The connecting portion 112 serves as a channel for the external extension and electrical connection of the mounting portion 111, mainly used to achieve flexible bridging and signal transmission in narrow spaces. In a preferred embodiment, the connecting portion 112 is cut into a narrow structure with a width W not exceeding 3.5 mm to adapt to the internal space of ear hook components, turning cavities, or other narrow channels in audio devices. By controlling the width of the connecting part 112 within the above-mentioned range, the flexible strip structure can be laid and bent under small curvature radius conditions without sacrificing the multi-layer stacked structure and shielding structure, thereby taking into account both wiring density and wearing comfort.

[0047] Furthermore, the mounting portion 111 and the connecting portion 112 are integrally formed structures, with no independent splicing or welding interface between them, thereby avoiding mechanical stress concentration or electrical discontinuity problems caused by interface transition. Through integral cutting and forming, the flexible strip structure forms a smooth transition between the mounting portion 111 and the connecting portion 112, which is beneficial for maintaining structural reliability during subsequent assembly or dynamic bending. In a variation, the specific length ratio, outline, or local width of the connecting portion 112 and the mounting portion 111 can be adjusted according to different product structural requirements, as long as the connecting portion 112 maintains a width of no more than 3.5 mm and can achieve flexible connection and signal transmission functions.

[0048] Through the above-mentioned fourth step S4, the flexible conductive stacked structure 110 is formally transformed from a semi-finished product in the form of a connected plate into an integrated flexible strip structure with clear functional partitions, laying the foundation for the subsequent formation of the package and assembly with the internal structure of the audio device.

[0049] Please refer to step S5 again. Figure 1 An encapsulation 170 is formed at the connecting portion 112 to cover the flexible conductive laminate structure 110 and form an outer protective layer. In this embodiment, the encapsulation 170 is mainly formed in the connecting portion 112 area of ​​the flexible strip structure, while the mounting portion 111 is at least partially exposed or only partially protected to facilitate subsequent electrical connection and assembly with the main control circuit board, camera module, or other electronic components. By confining the encapsulation 170 to the connecting portion 112, sufficient protection can be obtained in the bending area while avoiding unnecessary restrictions on the welding, assembly, and dimensional layout of the mounting portion 111. In a preferred embodiment, the encapsulation 170 is made of a waterproof elastic material, preferably silicone, and is formed by injection molding. Specifically, after completing the fourth step S4, the pre-cut flexible strip structure can be placed in a preset mold cavity, so that the connecting portion 112 is located within the injection molding area of ​​the mold cavity, while the mounting portion 111 extends out of the mold cavity through a positioning structure. Subsequently, liquid or semi-fluid silicone material is injected into the mold cavity via injection molding, causing the liquid or semi-fluid silicone material to coat the outer surface of the connecting portion 112, and forming a continuous and dense encapsulation 170 after curing. In this embodiment, the silicone material has good elastic recovery properties and a soft touch after curing, allowing the encapsulation 170 to provide effective mechanical buffering and stress dispersion for the flexible conductive laminate structure 110 without significantly increasing the overall rigidity of the connecting portion 112. When the connecting portion 112 is repeatedly bent, torn, or stretched during use, the encapsulation 170 can absorb and disperse external forces, reducing the risk of fatigue damage to the internal conductive layer and insulating medium.

[0050] Furthermore, during the molding process, the package 170 continuously adheres to the outer surfaces of the electromagnetic shielding film 160, the third insulating medium 153, and the flexible conductive laminate structure 110, thereby forming a continuous sealing structure in the connection portion 112 region. Specifically, the package 170 is continuously molded along the length direction of the connection portion 112, and an integrated encapsulation transition section is formed in the transition area between the connection portion 112 and the mounting portion 111 to avoid the formation of leakage channels at the boundary. In one embodiment, the package 170 forms a sealing edge structure at at least one end of the connection portion 112. The sealing edge structure extends around the outer periphery of the flexible conductive laminate structure 110 to cover and encapsulate the edges of the electromagnetic shielding film 160 and the third insulating medium 153, thereby reducing the risk of liquid capillary penetration along the interlayer interface. In another embodiment, the encapsulation body 170 may form a continuous sealing lip or sealing ring at the assembly joint with the outer shell or ear hook assembly 220, so that the encapsulation body 170 forms a surface contact or line contact sealing fit with the inner wall of the shell after assembly, thereby blocking the path of sweat and moisture to enter the interior of the connection portion 112 along the assembly gap. Thus, the encapsulation body 170 can achieve a reliable waterproof sealing effect in wearing and sports scenarios. Under reasonable encapsulation continuity and assembly sealing conditions, the sealing design of the encapsulation body 170 helps to improve waterproof capability and can be used to achieve waterproof requirements such as IPX7 or IPX8. In a variation, in addition to silicone material, the encapsulation body 170 may also be made of other elastic, waterproof, and biocompatible polymer materials, such as thermoplastic elastomers (TPE), liquid silicone rubber (LSR), or polyurethane elastomers, as long as they can stably cover the connection portion 112 through the molding process and provide corresponding protection and cushioning effects.

[0051] Through the above step S5, without changing the internal stacking relationship and electrical structure of the flexible conductive stacked structure 110, an integrated package 170 with waterproof, buffering and fixing functions can be formed in the connection part 112. This allows the anti-interference flexible circuit board 100 to not only serve as a signal transmission carrier, but also as a flexible bridging component between different rigid structures inside the audio device, thereby significantly improving the reliability and service life of the overall device in complex usage environments.

[0052] Please see Figure 9 and Figure 10 This provides a perspective view and an exploded view of an audio device 200 with camera function, as provided in this embodiment of the technical solution. The audio device 200 with camera function mainly includes: a rear-hook assembly 210, an ear hook assembly 220, at least one ear cup assembly 230, a camera module 240, and a main control circuit board 250.

[0053] The backrest assembly 210 is used to wrap around the back of the user's head, spanning the user's occipital region when worn, thereby providing overall support and stable positioning for the audio device 200 with camera function. In this embodiment, the backrest assembly 210 may adopt a structure with a certain elastic recovery capability, allowing it to open appropriately when worn and rebound after release to fit different user head sizes. In one embodiment, the backrest assembly 210 may include an internal support member and an outer adhesive layer, wherein the internal support member may be made of elastic metal, engineering plastic, or composite material to provide basic structural strength; the outer adhesive layer may be formed of silicone or other elastic materials to improve wearing comfort and avoid the hard pressure sensation of direct contact with the skin. In a variation, the backrest assembly 210 may also adopt a one-piece molded elastic structure without a separate internal support member.

[0054] The ear hook assemblies 220 are respectively connected to both ends of the rear hook assembly 210. That is, in this embodiment, at least two ear hook assemblies 220 are included. Each ear hook assembly 220 has a proximal end 220a connected to the rear hook assembly 210 and a distal end 220b extending along the upper part of the user's auricle and pointing towards the user's face area. When worn, the ear hook assemblies 220 are arranged along the outer side of the user's auricle to provide structural support and positioning reference for the audio device 200 with camera function, and to stably position the front-end functional components near the user's ear. It should be noted that in this embodiment, the ear hook assembly 220 itself is not used to directly realize the audio output function. The main function of the ear hook assembly 220 is to serve as a structural support and internal wiring channel. The audio output and camera functions are jointly realized by the ear cup assembly 230 connected to the ear hook assembly 220 and the anti-interference flexible circuit board 100. Specifically, as... Figure 10As shown, the ear hook assembly 220 can form an elongated internal cavity 221, which is arranged along the extending direction of the ear hook assembly 220 and is used to accommodate at least a portion of the structure of the main control circuit board 250 and the anti-interference flexible circuit board 100. By forming the internal cavity 221 inside the ear hook assembly 220, the connecting portion 112 of the anti-interference flexible circuit board 100 can pass through the inside of the ear hook assembly 220, thereby avoiding the appearance of exposed wires and reducing the possibility of friction between the wires and the skin or external objects during wearing. In this embodiment, the main control circuit board 250 is disposed in the internal cavity 221 of one of the ear hook assemblies 220 and is arranged on the side closer to the rear hook assembly 210, so as to be close to the rear support area in structure, which is beneficial to the overall center of gravity distribution and wearing stability. The main control circuit board 250 is mainly used to control the overall function of the audio device 200 with camera function, and can integrate circuit modules for video signal processing, audio signal processing, wireless communication and power management. Furthermore, the main control circuit board 250 is provided with a connector 251, which is used to plug into the connection portion 112 of the anti-interference flexible circuit board 100. The connector 251 enables the anti-interference flexible circuit board 100 to establish an electrical connection with the main control circuit board 250 during the assembly stage via a plug-in connection, thereby reducing the thermal stress impact of the soldering process on the flexible circuit board and improving assembly efficiency and reliability. In one embodiment, the internal cavity 221 of the ear hook assembly 220 may also form a guiding structure or limiting structure in a local area to position the connection portion 112 of the anti-interference flexible circuit board 100, ensuring that the connection portion 112 of the anti-interference flexible circuit board 100 maintains a predetermined orientation within the ear hook assembly 220, preventing compression, torsion, or stress concentration due to relative displacement during wearing or use. With the above structural configuration, one of the ear hook components 220 can serve as an integrated carrier for the anti-interference flexible circuit board 100 and the main control circuit board 250, while the ear hook component 220 on the other side can also be used to accommodate power-related components (e.g., battery or its protection circuit) to facilitate left and right weight distribution. Its specific configuration can be adjusted according to product requirements, thereby realizing functional division between the left and right ear hook components 220 and improving the flexibility of the overall structural layout and wearing stability.

[0055] In a preferred embodiment, a heat dissipation element 270 may also be provided on the main control circuit board 250 to effectively dissipate the heat generated by the main control circuit board 250 during video processing, audio processing, or wireless communication operation. Specifically, the heat dissipation element 270 can be tightly attached to the main control circuit board 250 through a thermally conductive medium, wherein the thermally conductive medium can be a thermal adhesive, a thermally conductive pad, or other elastic material with thermal conductivity, thereby forming a stable heat conduction path between the main control circuit board 250 and the heat dissipation element 270. In this embodiment, the heat dissipation element 270 can extend along the thickness direction of the ear hook assembly 220 and penetrate the panel cover 222 of the ear hook assembly 220, so that at least a portion of the heat dissipation element 270 is directly exposed to the external environment. With the above structural configuration, the heat generated by the main control circuit board 250 during operation can be conducted to the heat dissipation element 270 through the thermally conductive medium, and further dissipated into the outside air by the heat dissipation element 270, thereby reducing the operating temperature of the main control circuit board 250. In one variation, the heat dissipation element 270 may be a metal heat sink, a metal heat sink block, or a structural component with heat dissipation function, and may form an integral structure with the panel cover 222. In another variation, the heat dissipation element 270 may only partially penetrate the panel cover 222, or may be disposed in an area close to the outer surface of the ear hook assembly 220, so as to satisfy the heat dissipation effect while taking into account the appearance integrity and wearing comfort. By introducing the heat dissipation element 270 into the ear hook assembly 220, the heat dissipation capacity of the main control circuit board 250 can be effectively improved without significantly increasing the size or weight of the device, thereby helping to ensure the performance stability and reliability of the audio device 200 with camera function under long-term operation or high load conditions. In addition, the heat dissipation element 270 may further integrate a temperature sensor, which is electrically connected to the main control circuit board 250 for real-time monitoring of the temperature change of the main control circuit board 250 under operating conditions. Specifically, the temperature sensor can be disposed on the side of the heat dissipation element 270 near the main control circuit board 250, or disposed on the heat conduction path between the heat dissipation element 270 and the main control circuit board 250, so that the temperature sensor can accurately sense the heat change generated by the main control circuit board 250 and conducted to the heat dissipation element 270, thereby reflecting the actual operating temperature of the main control circuit board 250. In this embodiment, the temperature sensor can be a thermistor, a digital temperature sensor, or other temperature detection element suitable for electronic devices, and is electrically connected to the main control circuit board 250 through wires or pads, so that the main control circuit board 250 can acquire the corresponding temperature signal.In one embodiment, the main control circuit board 250 can adjust the operating parameters related to video processing, audio processing, or wireless communication based on the temperature information output by the temperature sensor, or perform control measures such as frequency reduction, power limiting, or protective shutdown when the temperature exceeds a preset threshold. By integrating the temperature sensor into the heat dissipation element 270 and forming a closed-loop monitoring and control relationship with the main control circuit board 250, heat management can be achieved collaboratively at both the structural and circuit control levels, thereby preventing the main control circuit board 250 from experiencing performance degradation, signal quality deterioration, or reduced reliability due to overheating. Thus, the audio device 200 with camera function can maintain stable signal transmission and overall functional performance even under prolonged operation, high load, or high ambient temperature conditions.

[0056] At least one earbud assembly 230 is physically connected to the distal end 220b of the ear hook assembly 220 via the anti-interference flexible circuit board 100. It is positioned close to the user's ear and serves as the functional integration terminal of the audio device 200 with camera functionality. The earbud assembly 230 has a rigid housing 231, which may be made of plastic, metal, or composite material, providing structural support and positioning protection for internal functional components. The rigid housing 231 contains an accommodating space for housing an audio transducer 232, a microphone, and at least one electronic component related to the camera function. In this embodiment, the earbud assembly 230 is electrically connected to and physically bridged with the ear hook assembly 220 via the anti-interference flexible circuit board 100. Specifically, the mounting portion 111 of the anti-interference flexible circuit board 100 extends into the interior of the rigid housing 231 along the assembly direction of the earbud assembly 230, and is electrically connected to the audio transducer 232, microphone, and / or other electronic components; while the connecting portion 112 of the anti-interference flexible circuit board 100 passes through the interior of the ear hook assembly 220, and is used to establish a flexible electrical connection channel between the earbud assembly 230 and the main control circuit board 250. Through the above structural configuration, the anti-interference flexible circuit board 100 not only serves as a transmission carrier for electrical signals, but also as a flexible bridging component connecting the ear hook assembly 220 and the earbud assembly 230, allowing the earbud assembly 230 to undergo slight displacement or angular changes relative to the ear hook assembly 220 during wearing or use without causing excessive mechanical stress to the internal conductive circuitry, thereby improving the overall structural reliability. In this embodiment, at least one microphone 234 is provided inside the earbud assembly 230, and the microphone 234 is used to collect user voice or ambient sound. The microphone 234 forms a grounding network directly with the connector 251 through the independent microphone grounding wire 141 in the anti-interference flexible circuit board 100, so as to form a single-point grounding relationship with the main grounding network in the flexible conductive stacked structure 110 electrically, thereby isolating common ground interference caused by audio drive current or high-speed digital signal return flow, and improving the signal-to-noise ratio and stability of microphone pickup. In this embodiment, the audio transducer 232 can be a bone conduction transducer, which is used to transmit audio signals to the user's skull or ear bone structure through the earpiece assembly 230 by mechanical vibration, thereby achieving audio output effect in the binaural open state. In a variation, the audio transducer 232 can also be an air conduction speaker, which is used to radiate sound to the user's ear canal by air vibration, so as to meet the needs of different users for sound quality, wearing method or usage scenario.It should be noted that regardless of whether the audio transducer 232 adopts bone conduction or air conduction, it is electrically connected to the main control circuit board 250 through the anti-interference flexible circuit board 100, and can share the anti-interference structure, independent grounding design and encapsulation protection structure provided by the anti-interference flexible circuit board 100, thus having universality and expandability in structural design.

[0057] Furthermore, the main control circuit board 250 is equipped with at least one dedicated integrated circuit (ASIC) for performing video signal processing, audio signal processing, and system control functions. The ASIC is electrically connected to the camera module 240, the audio transducer 232, and the microphone 234 via the anti-interference flexible circuit board 100. Since the ASIC involves both high-speed digital and analog signals during operation, it has high requirements for the impedance continuity, electromagnetic shielding effect, and grounding stability of its external interconnect structure. Therefore, this invention designs the anti-interference flexible circuit board 100 as a multi-layered flexible printed circuit and forms a reference potential layer on its core layer 140, enabling the ASIC to obtain a stable signal reference plane in different operating modes, thereby effectively reducing signal reflection, crosstalk, or noise amplification problems caused by improper interconnect structure.

[0058] The camera module 240 is slidably connected to the outside of the earpiece assembly 230 for acquiring video signals from a first-person perspective. In this embodiment, the camera module 240 is positioned on the side of the earpiece assembly 230 closer to the user's face, enabling the camera module 240 to obtain a shooting angle substantially consistent with the user's line of sight when worn, thereby achieving a first-person view (FPV) video acquisition effect. In this embodiment, the camera module 240 includes a main body 241 and a flexible extension 242 integrally extending from the main body 241. The main body 241 integrates an image sensor and corresponding optical components for image acquisition; the flexible extension 242 establishes an electrical connection between the camera module 240 and the anti-interference flexible circuit board 100, and provides a flexible transition in structure. Specifically, the flexible extension 242 includes a redundant bending section 243. This redundant bending section 243 naturally exhibits an S-shaped, U-shaped, or wavy structure, or it can be designed as a serpentine structure with repeated bending. The flexible extension 242 and the redundant bending section 243 are integrally formed using the same flexible circuit board material system, rather than being spliced ​​from different materials. Both the flexible extension 242 and the redundant bending section 243 include a flexible insulating layer based on polyimide (PI) and a rolled copper foil conductive layer disposed on the surface of the substrate. The redundant bending section 243 extends along the length of the flexible extension 242, and its total length is preferably between 10 and 30 mm, for example, 12 mm or 15 mm, to provide sufficient flexibility within a limited structural space. Each bending segment in the redundant bending segment 243 may have a preset minimum bending radius, preferably not less than 0.3 mm, more preferably not less than 0.5 mm, to ensure that the flexible extension 242 does not experience fatigue fracture of the conductive lines or damage to the insulation layer during repeated bending or sliding. In one embodiment, the serpentine structure may be composed of multiple continuous bending units, with the pitch between adjacent bending units preferably between 0.8 mm and 2.5 mm, to achieve a balance between deformation capacity and structural stability. Through the above-mentioned dimensional and structural design, when the camera module 240 slides in the front-back direction, the redundant bending segment 243 can absorb the relative displacement generated by the camera module 240 through changes in the bending angle or the expansion and compression of the bending amplitude, thereby avoiding the direct transmission of mechanical stress to the welding position or connection terminal between the flexible extension 242 and the anti-interference flexible circuit board 100.Therefore, the redundant bending segment 243 not only provides the necessary expansion and contraction buffer function in terms of structure, but also significantly improves the connection reliability and service life of the camera module 240 during repeated adjustments or long-term use. In fact, since the overall width of the anti-interference flexible circuit board 100 needs to be controlled to be no more than 12 mm, especially in narrow applications with a width of no more than 3.5 mm, it is not suitable for more complex bending designs to adapt to narrow and restricted spaces; while the layout space of the camera module 240 is relatively open, making it suitable for providing a redundant bending design. By setting the redundant bending segment 243, the flexible extension 242 has deformable margin in the length direction. When the camera module 240 slides relative to the earpiece assembly 230 in the front-to-back direction, the flexible extension 242 can absorb the displacement change through the expansion or compression of the redundant bending segment 243, thereby avoiding the direct transmission of tensile or compressive stress generated by sliding to the anti-interference flexible circuit board 100 or the welding / connection parts.

[0059] In one embodiment, the redundant bending segment 243 can be verified for reliability through bending fatigue testing. For example, using the redundant bending segment 243 as the bending center, a reciprocating tensile bending test is performed under conditions of a bending radius of 1.0 mm and a bending angle of ±90°. It can withstand no less than 10,000 tensile bending cycles without any conduction failure or significant resistance abnormality, thereby meeting the reliability requirements of wearable devices in daily wear and repeated adjustment scenarios. It should be noted that the above-mentioned tensile bending cycles and test conditions are an exemplary implementation method. In practice, the bending radius, bending angle, or number of tests can be adjusted according to product design requirements, material specifications, and usage scenarios. Through the above structural design, while realizing the sliding adjustment function, the electrical connection path of the camera module 240 remains flexible, thereby significantly reducing the risk of fatigue breakage of conductive lines due to repeated sliding or adjustment, and improving the reliability of the camera function during long-term use.

[0060] Furthermore, the camera module 240 may integrate an image stabilization module, which is disposed within or on the main body 241, and is used to maintain the stability of image acquisition when the camera module 240 moves with the user's head. That is, it can be used to compensate for shake during image acquisition when the camera module 240 moves, walks, or rotates with the user's head. In a preferred embodiment, the image stabilization module may be a gyroscope, which is used to detect changes in angular velocity or angular displacement of the camera module 240 in at least one direction in real time, and outputs the corresponding motion data to the image processing unit of the camera module 240 or the main control circuit board 250 to perform image stabilization compensation calculations. Specifically, the gyroscope may be disposed within the main body 241 of the camera module 240, or mounted on the circuit board of the main body 241, and located in approximately the same horizontal plane as the lens assembly of the camera module 240. By aligning the gyroscope with the lens assembly in space, the angular motion information detected by the gyroscope can more accurately reflect the actual attitude changes of the lens, thereby improving the accuracy and response consistency of the image stabilization compensation algorithm. In one embodiment, the gyroscope can work in conjunction with the image sensor to perform electronic image stabilization (EIS) processing on the acquired image signal based on the detected head motion data. For example, by cropping, shifting, or resampling image frames, it can counteract image shake caused by slight head movements or walking. In another embodiment, the motion data output by the gyroscope can also be transmitted to the main control circuit board 250, where the main control circuit board 250 performs image stabilization calculations or integrates them with the video encoding process. By integrating the image stabilization module into the camera module 240, the audio device 200 with video recording function can continuously obtain relatively stable first-person perspective video footage during user wear, exercise, or daily activities, making it particularly suitable for outdoor recording, sports recording, or long-term wear applications. Since the image stabilization module is integrated with the camera module 240, it can improve image acquisition quality and user experience without relying on additional mechanical image stabilization structures, without significantly increasing the size or weight of the camera module 240.

[0061] In this embodiment, as Figure 10As shown, a connecting terminal 244 is welded to the end of the flexible extension 242. The connecting terminal 244 can be fixed to the mounting portion 111 of the anti-interference flexible circuit board 100 by surface mounting process, or the connecting terminal 244 can be inserted into the corresponding interface of the mounting portion 111 of the anti-interference flexible circuit board 100, thereby simultaneously achieving electrical conduction and mechanical fixation between the camera module 240 and the anti-interference flexible circuit board 100. By using surface mounting for connection, the height of the welding area can be reduced while ensuring connection reliability, further facilitating the miniaturization and compact design of the overall structure. Preferably, a guide rail 233 or a groove extending in the front-rear direction is formed on the outer side of the earpiece assembly 230, and the camera module 240 is slidably connected by cooperating with the guide rail 233 or the groove. Specifically, as Figure 11 As shown, the camera module 240 also includes a housing assembly 245. Besides housing the main body 241 and the flexible extension 242, the housing assembly 245 also has a limiting structure matching the guide rail 233, used to limit the sliding path of the camera module 240, ensuring that the camera module 240 can only move in a predetermined direction, thereby guaranteeing the stability and controllability of the shooting angle adjustment. Users can adjust the position of the camera module 240 in the front-back direction according to their wearing position or usage needs to change the horizontal viewing angle range of the captured image. By setting the camera module 240 as a sliding structure, and combining the coordinated design of the flexible extension 242 and the redundant bending section 243, the audio device 200 with camera function achieves adjustable shooting angle and high reliability of the electrical connection structure without increasing the overall size or compromising wearing stability. It is particularly suitable for applications requiring high first-person perspective stability, such as sports and outdoor recording.

[0062] Specifically, such as Figure 12As shown, the anti-interference flexible circuit board 100 serves as a flexible bridge connecting the ear hook assembly 220 and the ear cup assembly 230, extending continuously along the structural connection path of the device. The connecting portion 112 of the anti-interference flexible circuit board 100 passes through the internal cavity 221 of the ear hook assembly 220 and establishes an electrical connection with the main control circuit board 250 disposed within the ear hook assembly 220 via a plug-in method. The mounting portion 111 of the anti-interference flexible circuit board 100 extends forward into the rigid housing 231 of the ear cup assembly 230 and forms an electrical connection with the camera module 240 and / or the audio transducer 232. Through this structural configuration, the anti-interference flexible circuit board 100 simultaneously undertakes the dual functions of electrical interconnection and structural transition in the overall structure, eliminating the need for additional independent wiring harnesses or multiple connecting segments between the ear hook assembly 220 and the ear cup assembly 230, thereby forming a continuous, integrated connection path in the structure. In this embodiment, the encapsulation body 170 of the anti-interference flexible circuit board 100 is disposed in the connection portion 112 region and extends to cover the connection area between the distal end 220b of the ear hook assembly 220 and the rigid shell 231 of the ear cup assembly 230, thereby forming a continuous outer protective structure in this region. Through the covering and sealing of the encapsulation body 170, the anti-interference flexible circuit board 100 is not directly exposed to the external environment at the transition position from the ear hook assembly 220 to the ear cup assembly 230, which helps prevent moisture, sweat, or dust from intruding into the device along the connection path. The anti-interference flexible circuit board 100 serves as the main mixed signal transmission channel inside the device, simultaneously transmitting the video signal from the camera module 240 and the audio signal from the audio transducer 232. By integrating high-speed digital video signals and analog audio signals into the same flexible conductive stacked structure 110, and in conjunction with the aforementioned differential wiring, electromagnetic shielding, and independent grounding design, stable transmission of multiple signals can be achieved under width-limited structural conditions, while avoiding the volume expansion and interference problems caused by traditional multi-wire harness solutions.

[0063] In this embodiment, the audio device 200 with camera function further includes a rigid support strip 260 passing through the encapsulation body 170. The rigid support strip 260 and the anti-interference flexible circuit board 100 are arranged side by side along the length direction and are physically connected to the ear hook assembly 220 and the ear cup assembly 230. The rigid support strip 260 is used to structurally withstand the tensile or bending loads from the ear hook assembly 220 and the ear cup assembly 230, so that when the device is worn, moved, or subjected to external forces, the main mechanical stress is borne by the rigid support strip 260, avoiding the anti-interference flexible circuit board 100 from directly bearing tensile or bending stresses. In this embodiment, the rigid support strip 260 can be made of metal wire to provide sufficient tensile strength and bending rigidity without significantly increasing the thickness of the encapsulation body 170, and can extend along the length direction together with the anti-interference flexible circuit board 100 to withstand the mechanical tensile or bending loads between the ear hook assembly and the ear cup assembly. In one variation, the rigid support bar 260 can also be made of stainless steel wire (e.g., SUS304, SUS316) or spring steel wire to improve resistance to sweat corrosion and long-term elastic recovery; alternatively, titanium alloy wire can be used to maintain high specific strength while reducing weight, further improving wearing comfort and fatigue durability over long-term use. By arranging the rigid support bar 260 and the anti-interference flexible circuit board 100 side by side, the anti-interference flexible circuit board 100 maintains the necessary flexibility while possessing sufficient structural stability, thereby improving the overall reliability of the connection structure between the ear hook assembly 220 and the ear cup assembly 230 without significantly increasing the thickness of the connection area.

[0064] In a preferred embodiment, such as Figure 13As shown, before performing the encapsulation and sealing step of the package 170, an elastic element 280 can be pre-filled between the anti-interference flexible circuit board 100 and the ear hook assembly 220 and the ear cup assembly 230, so that a tight bond without obvious gaps is formed between the anti-interference flexible circuit board 100 and the ear hook assembly 220 and the ear cup assembly 230. The elastic element 280 can be made of waterproof rubber, waterproof silicone, or other materials with elasticity and waterproof properties, and can be set on the anti-interference flexible circuit board 100 by coating, dispensing, or bonding. By introducing the elastic element 280 filling step before the package 170 is formed, structural gaps in the connection area can be eliminated in advance, so that the subsequently formed package 170 can form a continuous transition sealing interface with the ear hook assembly 220, the ear cup assembly 230, and the anti-interference flexible circuit board 100 during the encapsulation process, thereby reducing the risk of water leakage caused by structural gaps. Meanwhile, the elastic element 280 can also form a flexible buffer layer between the package 170 and the anti-interference flexible circuit board 100 to absorb minor assembly deviations or displacement changes caused by thermal expansion and contraction, thereby further improving the reliability and assembly fault tolerance of the overall sealing structure.

[0065] Through the above structural design, the anti-interference flexible circuit board 100, the rigid support bar 260, the elastic element 280 and the package 170 work together in the connection area, so that the ear hook assembly 220 and the ear cup assembly 230 not only achieve a stable electrical connection, but also form an integrated connection structure with waterproof, protective and mechanical reinforcement functions, thereby significantly improving the reliability and durability of the audio device 200 with camera function in complex use environments.

[0066] In one variation, the audio device 200 with camera functionality can be a head-mounted or ear-hook wearable device. Specifically, the head-mounted wearable device can be fixed to the user's head via a headband, back hook, or frame structure, with the ear-cover assembly 230, the camera module 240, and the anti-interference flexible circuit board 100 arranged along the head contour; the ear-hook wearable device uses an ear-hook assembly 220 located on the outside of the user's ear to support and position the main functional modules of the audio device 200 with camera functionality near the user's ear. Regardless of whether a head-mounted or ear-hook structure is used, the anti-interference flexible circuit board 100 serves as a flexible bridge connecting different structural components, enabling mixed transmission of camera and audio signals within a space-constrained structure. Combined with the electromagnetic shielding structure, independent grounding structure, and encapsulation 170, it achieves stable signal transmission and reliable structural connection. Therefore, this technical solution is not limited to a specific wearing form, and its technical effects are equally applicable to other wearable audio devices or multifunctional wearable devices employing similar space-constrained wiring structures.

[0067] In summary, the anti-interference flexible circuit board 100 constitutes the core signal channel between the various functional modules in the audio device 200 with camera function. Specifically, the digital video signal from the camera module 240 is transmitted to the main control circuit board 250 for processing via the differential signal line group 121 in the anti-interference flexible circuit board 100; simultaneously, the audio drive signal output by the main control circuit board 250 is transmitted to the audio transducer 232 via the analog audio drive line group 122 in the anti-interference flexible circuit board 100 to achieve sound output; the audio signal collected by the microphone 234 is transmitted to the main control circuit board 250 via the electrically independent microphone grounding wire 141 and the corresponding signal line provided in the anti-interference flexible circuit board 100. During the aforementioned signal transmission process, high-speed digital video signals, analog audio drive signals, and weak audio acquisition signals are uniformly integrated into the same flexible conductive laminated structure 110. Through the coordinated design of interlayer distribution, reference potential layer, electromagnetic shielding film 160, and independent grounding structure, effective isolation and stable transmission of different types of signals are achieved within the width-limited flexible strip structure. Therefore, the anti-interference flexible circuit board 100 not only undertakes the function of multi-channel signal mixed transmission but also serves as a flexible bridge connecting the ear hook assembly 220 and the ear cup assembly 230. Structurally, it works in conjunction with the package 170 and support structure to meet the comprehensive requirements of dynamic bending, waterproof sealing, and mechanical reliability.

[0068] Therefore, this technical solution, through the integrated design of signal path, electromagnetic environment and structural connection, achieves stable coexistence and collaborative operation of high-speed video signal and high-quality audio signal in audio device 200 with camera function without increasing the size of the device or the burden of wearing it. It has good engineering practicality and promotion value.

[0069] The above-described embodiments are only used to illustrate the technical solutions of the present invention, and are not intended to limit it. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some of the technical features. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the spirit and scope of the technical solutions of the embodiments of the present invention, and should all be included within the protection scope of the present invention.

Claims

1. An anti-interference flexible circuit board for an audio device with camera function, characterized in that, include: The flexible conductive laminate structure is configured as an integrated flexible strip structure and is divided into a mounting part and a connecting part along the length direction, wherein the width of the connecting part is between 2 and 12 mm. The flexible conductive stacked structure includes: a first conductive layer and a second conductive layer as outer signal layers, and a core layer located between the first conductive layer and the second conductive layer, wherein the first conductive layer, the core layer and the second conductive layer are separated by an insulating medium; The first conductive layer and / or the second conductive layer are formed with differential signal line groups and a master clock line. The differential signal line groups are used to transmit digital video signals, and the master clock line is used to synchronize the clock frequencies of the master device and the slave device. The core layer forms a reference potential layer in at least a portion of the area. An electromagnetic shielding film covers the outer surfaces of the first conductive layer and the second conductive layer, respectively, thereby encapsulating the core layer, the differential signal line group, and the master clock line within a shielding cavity formed by the electromagnetic shielding film in at least a portion of the connection area; and An encapsulation body is disposed at the connection portion to cover the flexible conductive multilayer structure and form an outer protective layer; The flexible conductive laminate structure also includes an analog audio drive line group and an electrically independent microphone ground line. The analog audio drive line group is used to transmit drive current to the audio transducer. The microphone ground line is physically isolated from the main ground network of the flexible conductive laminate structure, and the microphone ground line is electrically connected to the main ground network only at the terminal and / or pad positions.

2. The anti-interference flexible circuit board of the audio device with camera function according to claim 1, characterized in that, The core layer is a composite structure consisting of a single conductive layer or multiple internal conductive layers separated by an insulating medium.

3. The anti-interference flexible circuit board of the audio device with camera function according to claim 2, characterized in that, When the core layer consists of multiple internal conductive layers, the analog audio drive line group is distributed in different internal conductive layers to increase current carrying capacity.

4. The anti-interference flexible circuit board of the audio device with camera function according to claim 1, characterized in that, The first conductive layer, the second conductive layer, and the core layer are all made of adhesive-free rolled copper to meet the dynamic bending requirements of the connection.

5. The anti-interference flexible circuit board of the audio device with camera function according to claim 1, characterized in that, The differential signal line group includes MCN, MCP, MDN0 and MDP0 lines for transmitting MIPI signals. The differential signal line group is directly adjacent to the electromagnetic shielding film in the stacking direction, so that the electromagnetic shielding film absorbs high-frequency radiation nearby.

6. The anti-interference flexible circuit board of the audio device with camera function according to claim 1, characterized in that, The line width of the analog audio driver line group is not less than 0.2 mm, and grounding shield lines with a line width of not less than 0.3 mm are arranged parallel to both sides of the analog audio driver line group to isolate interference on the same layer.

7. The anti-interference flexible circuit board of the audio device with camera function according to claim 1, characterized in that, The microphone grounding wire maintains an independent routing along the entire length of the connection portion of the flexible strip structure, and is only equipotentially connected to the main ground network at the pad location.

8. The anti-interference flexible circuit board of the audio device with camera function according to claim 1, characterized in that, The core layer serves as a reference ground plane for the first conductive layer and the second conductive layer, and a specific dielectric thickness is configured between the differential signal line group and the core layer to control the characteristic impedance.

9. The anti-interference flexible circuit board of the audio device with camera function according to claim 1, characterized in that, The encapsulation body is made of a waterproof elastic material and seals over the flexible conductive laminate structure.

10. The anti-interference flexible circuit board of the audio device with camera function according to claim 1, characterized in that, The flexible strip structure has an overall U-shaped design, and the length of the connecting part is adapted to the semi-circular size of the outside of the human ear.

11. The anti-interference flexible circuit board of the audio device with camera function according to any one of claims 1 to 10, characterized in that, A nano-waterproof coating is provided on the outer surface of the flexible conductive laminate structure. The nano-waterproof coating is a thin film layer with hydrophobic properties.

12. A method for manufacturing an anti-interference flexible circuit board for an audio device with camera function as described in any one of claims 1 to 11, characterized in that, include: A core layer is provided, wherein a reference potential layer is formed in at least a portion of the core layer; A first conductive layer and a second conductive layer are formed on the upper and lower surfaces of the core layer, respectively. The first conductive layer and the second conductive layer are physically isolated from the core layer by an insulating medium, thereby forming a flexible conductive stacked structure. The first conductive layer and / or the second conductive layer are patterned to form differential signal line groups and master clock lines. Electromagnetic shielding films are respectively attached to the outer surfaces of the first conductive layer and the second conductive layer to construct an electromagnetic shielding cavity that encloses the core layer, the differential signal line group and the master clock line; The flexible conductive laminate structure, already covered by the electromagnetic shielding film, is cut into an integrated flexible strip structure, and divided along its length into a mounting portion and a connecting portion, the width of which is between 2 and 12 millimeters; and An encapsulation is formed at the connection portion to cover the flexible conductive multilayer structure and form an outer protective layer; The flexible conductive stacked structure also includes an analog audio drive line group and an electrically independent microphone ground line. The analog audio drive line group is used to transmit drive current to the audio transducer, and the microphone ground line is physically isolated from the main ground network of the flexible conductive stacked structure.

13. The method for manufacturing an anti-interference flexible circuit board for an audio device with camera function according to claim 12, characterized in that, The electrically independent microphone grounding wire is formed within the core layer, so that the microphone grounding wire maintains independent routing along the entire length of the connection portion of the flexible strip structure, and is only equipotentially connected to the main ground network at the pad location.

14. The method for manufacturing an anti-interference flexible circuit board for an audio device with camera function according to claim 12, characterized in that, The encapsulation body is made of waterproof elastic material and is formed by injection molding.

15. An audio device with a camera function, characterized in that, include: Rear-mounted component, designed to wrap around the back of the user's head; Ear hook assemblies are respectively connected to both ends of the rear hook assembly. Each ear hook assembly has a proximal end connected to the rear hook assembly and a distal end extending along the upper part of the user's auricle and pointing towards the user's facial area. The anti-interference flexible circuit board as described in any one of claims 1 to 11, wherein the anti-interference flexible circuit board is connected to the remote end; At least one earbud assembly is physically connected to the distal end of the ear hook assembly via the anti-interference flexible circuit board. The earbud assembly has a rigid housing, and an audio transducer is housed inside the rigid housing. A camera module is slidably connected to the outside of the earpiece assembly for acquiring video signals from a first-person perspective. as well as The main control circuit board is located inside the internal cavity of the ear hook assembly; The anti-interference flexible circuit board serves as a flexible bridge connecting the ear hook assembly and the ear cup assembly. The connecting portion of the anti-interference flexible circuit board passes through the ear hook assembly and is inserted into the main control circuit board. The mounting portion of the anti-interference flexible circuit board extends into the rigid housing of the ear cup assembly and is electrically connected to the camera module. The encapsulation of the anti-interference flexible circuit board covers and seals the connection between the distal end of the ear hook assembly and the rigid housing of the ear cup assembly, forming an outer protective layer. The anti-interference flexible circuit board serves as the main mixed signal transmission channel, simultaneously transmitting the video signal from the camera module and the audio signal from the audio transducer.

16. The audio device with camera function according to claim 15, characterized in that, The camera module includes a main body and a flexible extension extending integrally from the main body. The flexible extension has a reserved redundant bending section, which is S-shaped, U-shaped or wavy. When the camera body slides relative to the earpiece assembly, the deformation of the flexible extension provides a stretching allowance.

17. The audio device with camera function according to claim 16, characterized in that, The flexible extension is welded to a connection terminal. The camera module is fixed to the mounting part of the anti-interference flexible circuit board by welding the connection terminal to the mounting part of the anti-interference flexible circuit board through a surface mount process, thereby realizing the electrical conduction and mechanical connection between the camera module and the anti-interference flexible circuit board.

18. The audio device with camera function according to claim 16, characterized in that, The camera module integrates an image stabilization module, which is located inside or on the main body and is used to maintain the stability of image acquisition when the camera module moves with the user's head.

19. The audio device with camera function according to claim 15, characterized in that, The outer side of the ear cup assembly is provided with a guide rail or slide groove extending in the front-to-back direction. The camera module is slidably connected through the guide rail or slide groove, allowing the user to adjust the horizontal position of the shooting field of view.

20. The audio device with camera function according to claim 15, characterized in that, It also includes a rigid support strip that passes through the inside of the package body. The rigid support strip is arranged side by side with the anti-interference flexible circuit board to reinforce the bending shape of the flexible bridging component and to physically connect the ear hook assembly and the ear cup assembly to withstand mechanical tension.

21. The audio device with camera function according to claim 15, characterized in that, The main control circuit board is equipped with a connector, and the connection part of the anti-interference flexible circuit board is inserted into the connector.

22. The audio device with camera function according to claim 21, characterized in that, The earpiece assembly also includes a microphone, which is connected to the connector via an independent microphone grounding wire on the anti-interference flexible circuit board to isolate common ground interference.

23. The audio device with camera function according to any one of claims 15 to 22, characterized in that, The audio transducer is a bone conduction transducer, used to transmit sound to the user's skull through vibration.

24. The audio device with camera function according to any one of claims 15 to 22, characterized in that, The audio transducer is an air-conducting loudspeaker used to radiate sound into the user's ear canal.

25. The audio device with camera function according to any one of claims 15 to 22, characterized in that, The audio device with camera function is a head-mounted or ear-hook wearable device.

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