A circuit board etching device with self-cleaning function
The self-cleaning circuit board etching equipment solves the problems of uneven etching solution distribution and nozzle clogging, achieving uniformity in circuit board etching and efficient equipment operation.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUNAN CHAOSHENG ELECTRONICS TECH CO LTD
- Filing Date
- 2026-03-31
- Publication Date
- 2026-08-04
AI Technical Summary
Existing etching equipment sprays etching solution over a wide area during the etching process, resulting in uneven distribution of etching solution on the circuit board and excessively long residual time of the etching solution, which can easily cause over-etching and uneven etching, affecting the quality of the circuit board.
A circuit board etching device with self-cleaning function was designed. The device uses a nozzle to spray etching liquid at an angle and uses a drain shell to absorb the residual liquid. It combines wiping with absorbent cotton and guiding water with a guide plate to control the reaction time of the etching liquid. The etching liquid on the absorbent cotton is squeezed out by rollers. When the nozzle is blocked, airflow backflushing and pulse airflow are used to clean the impurities.
It enables rapid cleaning of circuit boards, controls the reaction time of the etching solution, reduces over-etching and uneven etching, ensures etching quality, and maintains continuous operation of the equipment by automatically cleaning the blockage inside the nozzle.
Smart Images
Figure CN121985485B_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of integrated circuit manufacturing technology, and in particular to a circuit board etching device with a self-cleaning function. Background Technology
[0002] In the production process of circuit boards, dry film or photoresist is first applied to the copper foil surface of the copper-clad laminate to form an anti-etching protective layer for the target circuit. Then, an etching solution is used to react with the unprotected copper foil in an oxidation-reduction reaction to dissolve and remove excess copper foil, leaving the copper under the anti-etching protective layer to form the circuit. After etching, the circuit board needs to be cleaned in time. This step is mainly to remove the etching solution to prevent over-etching of the circuit board and affect its quality.
[0003] Existing etching equipment requires placing the circuit board on a conveyor assembly before etching it. The assembly then transports the circuit board into the equipment, where etching solution is sprayed onto the surface of the circuit board. However, due to the wide spray area, the etching solution in the middle of the circuit board cannot be drained off in time, resulting in different concentrations of etching solution remaining in different parts of the circuit board. This leads to uneven etching or excessive etching time, causing over-etching and severely affecting the production quality of the circuit board. Summary of the Invention
[0004] To overcome the shortcomings mentioned in the background art, the present invention provides a circuit board etching device with a self-cleaning function.
[0005] The technical solution of the present invention is as follows: a circuit board etching device with self-cleaning function, comprising a body, a conveying component on the body, a first support fixedly connected to the body, a fixed disk fixedly connected to the first support at equal intervals, a rotating disk rotatably connected to the fixed disk, a nozzle circumferentially evenly distributed and penetrating the rotating disk fixedly connected to the rotating disk, the nozzle having an inner flow channel and an outer flow channel, a connecting groove on the fixed disk having a connecting groove communicating with the outer flow channel, a first pipe fixedly connected to the fixed disk, the first pipe communicating with the adjacent inner flow channel, a second pipe fixedly connected to all the fixed disks, all the connecting grooves communicating with the second pipe, a second support fixedly connected to the body, a drain shell fixedly connected to the second support, a third pipe communicating with the drain shell, the first pipe and the second pipe communicating with a liquid supply device and a gas supply device respectively, the third pipe communicating with an etching solution collection tank, and the etching solution collection tank communicating with a negative pressure device.
[0006] As an improvement to the above solution, two third supports are fixedly connected inside the machine body. The two third supports are rotatably connected to a rotating frame. The rotating frame is fixed with absorbent cotton that is evenly distributed around the circumference. The absorbent cotton is used to wipe the etching solution remaining on the circuit board. A first motor is fixedly connected to one of the third supports. The output shaft of the first motor is fixedly connected to the rotating frame.
[0007] As an improvement to the above solution, the two third supports are rotatably connected to a threaded rod and fixed to a straight rod. The straight rod is slidably connected to a movable frame that is threadedly connected to the threaded rod. A second motor is fixedly connected to one of the third supports. The output shaft of the second motor is fixedly connected to the threaded rod. The movable frame is slidably connected to two sliding blocks. The sliding blocks are rotatably connected to rollers. The rollers are used to squeeze out the etching solution in the absorbent cotton. A first spring is provided between the sliding blocks and the movable frame.
[0008] As an improvement to the above solution, a fourth bracket is fixedly connected to the body of the machine, a water guide is fixedly connected to the fourth bracket, and a water guide plate is hinged to the water guide for guiding the etching solution squeezed out from the absorbent cotton.
[0009] As an improvement to the above solution, a third motor is fixedly connected to the fixed disk, and the third motor is driven by a gear ring to the adjacent rotating disk. A sensor is provided at the connection between the first pipe and the adjacent inner flow channel.
[0010] As an improvement to the above solution, the fixed plate is fixedly connected to a connecting shell, the connecting shell is connected to a connecting head, the connecting head is used to connect to the corresponding nozzle, the connecting shells distributed at equal intervals are connected to a fourth pipe, the fourth pipe is connected to an air supply device, the fourth pipe is equipped with solenoid valves distributed at equal intervals, and the solenoid valves of the fourth pipe correspond one-to-one with the connecting shells.
[0011] As an improvement to the above solution, the fixed plate is provided with a connecting hole, which is connected to the corresponding inner flow channel, and the connecting holes on the fixed plate that are evenly distributed are connected to a fifth pipe, which is connected to the miscellaneous box.
[0012] As an improvement to the above solution, the connecting shell is rotatably connected to a rotating plate, which is used to pulse the airflow passing through the connecting shell.
[0013] As an improvement to the above solution, the fourth pipe is slidably connected with equally spaced sliding members, which are used to limit the adjacent rotating plates, and a second spring is provided between the sliding members and the fourth pipe.
[0014] As an improvement to the above solution, the projections of the water guide plate and the water guide component on the horizontal plane partially overlap, and the water guide plate is located on the upper side of the water guide component.
[0015] The beneficial effects of adopting the above technical solution are as follows: The present invention sprays the etching solution onto the moving circuit board at an angle through the nozzle, and then uses the drain shell to absorb the residual etching solution on the circuit board, thereby quickly cleaning the etching solution on the circuit board, accurately controlling the reaction time of the etching solution on the circuit board, thereby reducing the over-etching during the etching process of the circuit board, which leads to uneven etching of the circuit board, and ensuring the quality of the etching of the circuit board.
[0016] The residual etching solution on the circuit board is wiped with absorbent cotton to further reduce the residue and ensure uniform etching. After the absorbent cotton is saturated with etching solution, two rollers squeeze out the etching solution, ensuring that the absorbent cotton continues to wipe the circuit board. The squeezed-out etching solution is then guided by water guides and water guide plates to prevent it from falling back onto the circuit board.
[0017] After impurities clog the inner flow channel of the nozzle, the nozzle is replaced, and then airflow is used to backflush the nozzle, thereby blowing off the blockage in the inner flow channel and restoring its smooth flow. The rotating plate changes the continuous airflow into a pulsed airflow, increasing the probability that the airflow will clear away the impurities. Attached Figure Description
[0018] Figure 1 This is a three-dimensional structural diagram of the present invention; Figure 2 This is a three-dimensional structural diagram of the rotating frame and absorbent cotton of the present invention; Figure 3 This is a three-dimensional structural diagram of the inner and outer flow channels of the present invention; Figure 4 This is a three-dimensional structural diagram of the threaded rod and straight rod of the present invention; Figure 5 This is a three-dimensional structural diagram of the sliding block and roller of the present invention; Figure 6 This is a three-dimensional structural diagram of the rotating plate and sliding component of the present invention.
[0019] The following are the labels in the diagram: 1. Body, 2. Conveying assembly, 3. First support, 4. Fixed plate, 401. Connecting groove, 5. Rotating plate, 6. Nozzle, 601. Inner flow channel, 602. Outer flow channel, 7. First pipe, 8. Second pipe, 9. Second support, 10. Drain shell, 11. Third pipe, 12. Third support, 13. Rotating frame, 14. Absorbent cotton, 15. First motor, 16. Threaded rod, 17. Straight rod, 18. Moving frame, 19. Second motor, 20. Sliding block, 21. Roller, 22. First spring, 23. Fourth support, 24. Water guide, 25. Water guide plate, 26. Third motor, 27. Connecting shell, 28. Connecting head, 29. Fourth pipe, 30. Fifth pipe, 31. Rotating plate, 32. Sliding component, 33. Second spring. Detailed Implementation
[0020] The above-described solution will be further illustrated below with reference to specific embodiments. It should be understood that these embodiments are for illustrative purposes only and are not intended to limit the scope of this application. The implementation conditions used in the embodiments may be further adjusted according to the conditions of specific manufacturers, and the implementation conditions not specified are generally those in routine experiments.
[0021] Example 1: In the process of etching circuit boards, existing etching equipment sprays a wide area of etching solution, and the etching solution in the middle of the circuit board cannot be drained from the circuit board in time, which seriously affects the production quality of the circuit board.
[0022] A circuit board etching device with self-cleaning function, such as Figures 1-3As shown, the device includes an organic body 1, on which a conveying assembly 2 is mounted. The conveying assembly 2 is an existing device used to convey circuit boards, allowing the circuit boards to move within the organic body 1. A first support 3 is fixedly connected inside the organic body 1. The first support 3 is fixedly connected to three equally spaced fixed disks 4. Each fixed disk 4 is rotatably connected to a rotating disk 5. The rotating disk 5 is fixedly connected to two equally spaced circumferentially distributed nozzles 6 that pass through it. Each nozzle 6 is provided with an inner flow channel 601 and an outer flow channel 602. The inner flow channel 601 is used for etching solution to pass through, and the outer flow channel 602 is used for airflow to pass through. The fixed disks 4 are provided with a connecting groove 401, which communicates with the outer flow channel 602. A first pipe 7 is fixedly connected to the fixed disks 4. The first pipe 7 is connected to the adjacent inner flow channel 601. The first pipe 7 passes through the fixed plate 4 and isolates the inner flow channel 601 and outer flow channel 602 of the corresponding nozzle 6. The three fixed plates 4 are all fixedly connected to the second pipe 8. The three connecting slots 401 are all connected to the second pipe 8. Two second brackets 9 are fixedly connected inside the body 1. The two second brackets 9 are all fixedly connected to the drain shell 10. The lower side of the drain shell 10 does not contact the circuit board to avoid scratching the circuit board. The residual etching liquid on the upper side of the circuit board is sucked away by negative pressure. The drain shell 10 is connected to the third pipe 11. The first pipe 7 and the second pipe 8 are respectively connected to the liquid supply device and the air supply device. The device is connected to the external flow channel 602. Both the liquid supply device and the air supply device are existing devices. The liquid supply device is used to pump the etching solution into the internal flow channel 601, and the air supply device is used to provide high-pressure airflow to the external flow channel 602 to atomize and spray the etching solution. The third pipe 11 is connected to the etching solution collection tank, which is used to collect the used etching solution. The etching solution collection tank is connected to the negative pressure device, which is an existing device, and is used to generate negative pressure in the etching solution collection tank. The etching solution collection tank is a sealed box, which is not shown in the figure. Its upper side is connected to the third pipe 11 and the negative pressure device, so that the negative pressure device can draw the used etching solution into the box.
[0023] like Figure 2 and Figure 4 As shown, two third brackets 12 are fixedly connected inside the body 1. The two third brackets 12 are rotatably connected to a rotating frame 13. The rotating frame 13 consists of a rotating shaft and two Y-shaped frames. Three absorbent cottons 14 are fixedly connected to the rotating frame 13 at equal intervals around the circumference. The absorbent cottons 14 are used to wipe the residual etching solution on the circuit board. The absorbent cottons 14 are made of corrosion-resistant materials, such as PVA. A first motor 15 is fixedly connected to the third bracket 12 on the front side. The output shaft of the first motor 15 is fixedly connected to the rotating frame 13. When the absorbent cotton 14 on the lower side needs to be replaced, the first motor 15 is started. The output shaft of the first motor 15 drives the rotating frame 13 to rotate 120° clockwise, thereby replacing the absorbent cotton 14 in use.
[0024] like Figure 2 , Figure 4 and Figure 5As shown, two third supports 12 are rotatably connected to threaded rods 16 and fixed to straight rods 17. The axes of threaded rods 16 and straight rods 17 are parallel. A movable frame 18, which is threadedly connected to threaded rods 16, is slidably connected to straight rods 17. A second motor 19 is fixedly connected to the rear third support 12. The output shaft of the second motor 19 is fixedly connected to threaded rods 16. When the output shaft of the second motor 19 drives threaded rods 16 to rotate, threaded rods 16 push movable frame 18 to move along straight rods 17 through threaded compression. Movable frame 18 is slidably connected to two sliding blocks 20. Rollers 21 are rotatably connected to sliding blocks 20. Rollers 21 are used to squeeze out the etching solution in absorbent cotton 14. A first spring 22 is provided between sliding blocks 20 and movable frame 18. The first spring 22 is always in a compressed state, thereby providing sufficient pressure to rollers 21 to squeeze out the etching solution in absorbent cotton 14.
[0025] like Figure 2 and Figure 4 As shown, two fourth supports 23 are fixed inside the body 1. The first support 3, the second support 9, the third support 12, and the fourth support 23 are arranged from right to left. The two fourth supports 23 are jointly fixed with a water guide 24. The cross-section of the water guide 24 is L-shaped. The water guide 24 is hinged to a water guide plate 25. The water guide plate 25 is used to guide the etching solution squeezed out from the absorbent cotton 14. The projections of the water guide plate 25 and the water guide 24 on the horizontal plane partially overlap, and the water guide plate 25 is located on the upper side of the water guide 24, thereby preventing the etching solution from leaking out from the gap between them. The width of the water guide 24 and the width of the water guide plate 25 are both greater than the width of the circuit board, so as to prevent the etching solution squeezed out from the absorbent cotton 14 from falling onto the circuit board.
[0026] When using this device to etch circuit boards, the circuit board is placed on the conveying assembly 2 from the right side of the machine body 1. The conveying assembly 2 then transports the circuit board from right to left. Simultaneously, the air supply device, liquid supply device, and negative pressure device are activated. The air supply device blows air from the second pipe 8 into the three connecting slots 401, and then blows it out from the nozzle 6 through the outer flow channel 602. The liquid supply device pumps the etching solution from the first pipe 7 into the inner flow channel 601, and then it flows out from the inner flow channel 601. The etching solution is dispersed into a spray by the airflow in the outer flow channel 602. The negative pressure device uses negative pressure to make the air... Gas enters from the drain housing 10 and then enters the etching solution collection tank through the third pipe 11. Afterwards, the circuit board is transported to the area below the nozzle 6 by the conveying assembly 2. The etching solution is sprayed onto the circuit board for etching. After the circuit board moves to the area below the drain housing 10, the residual etching solution on the circuit board is absorbed from the drain housing 10. Then, the circuit board moves to contact with the absorbent cotton 14, thereby wiping the residual etching solution on the circuit board dry by the absorbent cotton 14. This controls the etching time of the etching solution on the circuit board, reduces the probability of over-etching and uneven etching, and ensures the quality of the etching of the circuit board.
[0027] Before the absorbent cotton 14 on the lower side loses its ability to absorb etching solution due to excessive etching solution, the first motor 15 starts. The output shaft of the first motor 15 drives the rotating frame 13 to rotate clockwise, which in turn drives the absorbent cotton 14 to rotate, thus replacing the absorbent cotton 14 in use. During this process, the absorbent cotton 14 pushes the water guide plate 25, causing the water guide plate 25 to rotate. Then, the absorbent cotton 14 and the water guide plate 25 separate, and the water guide plate 25 falls back to its original position under its own weight. After the rotating frame 13 rotates 120°, the first motor 15 stops working. Then, the second motor 19 starts. The output shaft of the second motor 19 drives the threaded rod 16 to rotate, and the threaded rod 16 pushes the moving frame through the thread. 18 moves forward. The moving frame 18 drives the roller 21 to move through the sliding block 20, thereby squeezing the absorbent cotton 14 through the two sliding blocks 20, squeezing out the etching solution inside the absorbent cotton 14. After the etching solution is squeezed out, it falls onto the water guide plate 25, then flows to the water guide component 24, and then flows from the water guide component 24 into the machine body 1. When the roller 21 moves to the front, the second motor 19 stops working. When the next absorbent cotton 14 needs to be squeezed, the second motor 19 starts and changes the rotation direction of its output shaft, thereby driving the roller 21 to move backward. After the etching of the circuit board is completed, the air supply device, liquid supply device and negative pressure device are turned off, and then the remaining etching solution in the device is cleaned.
[0028] Example 2: If the existing etching machine is not cleaned properly after use, etching liquid will remain in the nozzle. After the etching liquid dries, it will harden and form a crust, causing the nozzle to become clogged.
[0029] Based on Example 1, such as Figure 2 and Figure 3 As shown, a third motor 26 is fixedly connected to the fixed disk 4. The third motor 26 is driven by a gear ring to the adjacent rotating disk 5. A sensor is installed at the connection between the first pipe 7 and the adjacent inner flow channel 601. This sensor can be a flow sensor or a pressure sensor. When the inner flow channel 601 is blocked, both the flow rate and pressure will change. At this time, the blockage of the inner flow channel 601 can be determined based on this change. After blockage, the third motor 26 starts, and the output shaft of the third motor 26 drives the rotating disk 5 to rotate 180°, thereby replacing the nozzle 6 to ensure the continued etching process.
[0030] like Figure 3 and Figure 6As shown, a fixed plate 4 is fixedly connected to a connecting shell 27, which is connected to a connecting head 28. The connecting head 28 is used to connect to the corresponding nozzle 6. The equally spaced connecting shells 27 are connected to a fourth pipe 29, which is connected to the air supply device. The connecting shell 27 is a three-way ball shell. The connecting head 28 and the fourth pipe 29 are connected to two channels of the connecting shell 27, respectively. The other channel of the connecting shell 27 is connected to the outside. The fourth pipe 29 is equipped with three equally spaced solenoid valves, which correspond one-to-one with the connecting shell 27. When the nozzle 6 is blocked and switches to connect with the connecting head 28, the corresponding solenoid valve will open, so that the airflow of the air supply device impacts the impurities in the inner flow channel 601.
[0031] like Figure 2 and Figure 3 As shown, the fixed plate 4 is provided with a connecting hole, which is connected to the corresponding inner flow channel 601. The fixed plate 4 blocks the outer flow channel 602, so that all the gas is cleared through the inner flow channel 601. The connecting holes on the three fixed plates 4 are connected to the fifth pipe 30. The fifth pipe 30 is connected to the debris box, which is a box used to collect impurities. It is not shown in the figure. The cleaned impurities will enter the debris box with the airflow through the fifth pipe 30.
[0032] like Figure 6 As shown, a rotating plate 31 is rotatably connected to the connecting shell 27. The rotating plate 31 is used to make the airflow passing through the connecting shell 27 form a pulse. When the plane of the rotating plate 31 is perpendicular to the line connecting the connecting head 28 and the connection point of the fourth pipe 29 with the connecting shell 27, the channel of the airflow blown from the fourth pipe 29 to the connecting head 28 is blocked. When the plane of the rotating plate 31 is parallel to the line connecting the connecting head 28 and the connection point of the fourth pipe 29 with the connecting shell 27, the airflow blown from the fourth pipe 29 enters the connecting head 28 through the connecting shell 27, thereby converting the continuous airflow into a pulsed airflow to enhance the effect of cleaning impurities.
[0033] like Figure 6 As shown, the fourth pipe 29 is slidably connected to three equally spaced sliding members 32. The sliding members 32 are L-shaped and are used to limit the adjacent rotating plates 31. When airflow passes through the fourth pipe 29, the airflow pressure pushes the sliding members 32 to move, causing the sliding members 32 to separate from the rotating plates 31, thereby releasing the limitation on the rotating plates 31. A second spring 33 is provided between the sliding members 32 and the fourth pipe 29.
[0034] When blockage occurs in the inner flow channel 601, the corresponding sensor detects a pressure change, and then the third motor 26 starts. The output shaft of the third motor 26 drives the corresponding rotating disk 5 to rotate 180° via a gear ring, thereby replacing the nozzle 6 in use. The replaced nozzle 6 is connected to the connecting head 28. At this time, the corresponding solenoid valve opens, and the airflow from the air supply device enters the connecting shell 27. The corresponding sliding member 32 moves under the pressure of the airflow and compresses the adjacent second spring 33. After the sliding member 32 separates from the rotating plate 31, the rotating plate 31 rotates under the blowing of the airflow. The airflow passes through the rotating plate 31. The rotation of the nozzle 1 transforms into a pulsed airflow, which then enters the connecting head 28 and then the nozzle 6 to impact the impurities blocking the inner flow channel 601, thereby clearing the impurities. After cleaning, the corresponding solenoid valve on the fourth pipe 29 closes, the sliding member 32 loses the thrust of air pressure, and returns to its original position under the action of the second spring 33. When the rotating plate 31 rotates to its original position, it is blocked by the sliding member 32 and stops rotating. The cleaned impurities enter the fifth pipe 30 and then enter the debris box. This achieves the pre-cleaning of the nozzle 6 without stopping the machine, thereby maintaining the continuous etching of the circuit board and ensuring the efficiency of the circuit board etching.
[0035] The above description is merely an embodiment of the present invention and is not intended to limit the present invention. All equivalent substitutions made within the principles of the present invention should be included within the scope of protection of the present invention. Contents not described in detail in this invention are existing technologies known to those skilled in the art.
Claims
1. A circuit board etching device with self-cleaning function, comprising a body (1), a conveying assembly (2) disposed on the body (1), and a first support (3) fixedly connected inside the body (1), characterized in that, It also includes equally spaced fixed disks (4), all of which are fixedly connected to the first bracket (3). Each fixed disk (4) is rotatably connected to a rotating disk (5). Each rotating disk (5) is fixedly connected to a nozzle (6) that is circumferentially equally spaced and passes through it. Each nozzle (6) is provided with an inner flow channel (601) and an outer flow channel (602). Each fixed disk (4) is provided with a connecting groove (401) that communicates with the outer flow channel (602). Each fixed disk (4) is fixedly connected to a first pipe (7), which is connected to a... The adjacent inner flow channels (601) are connected, all the fixed plates (4) are fixedly connected to the second pipe (8), all the connecting grooves (401) are connected to the second pipe (8), the body (1) is fixedly connected to the second bracket (9), the second bracket (9) is fixedly connected to the drain shell (10), the drain shell (10) is connected to the third pipe (11), the first pipe (7) and the second pipe (8) are respectively connected to the liquid supply device and the gas supply device, the third pipe (11) is connected to the etching liquid collection tank, and the etching liquid collection tank is connected to the negative pressure device; The body (1) has two third brackets (12) fixed inside. The two third brackets (12) are rotatably connected to a rotating frame (13). The rotating frame (13) is fixed with absorbent cotton (14) evenly distributed in the circumferential direction. The absorbent cotton (14) is used to wipe the etching liquid remaining on the circuit board. A first motor (15) is fixed on one of the third brackets (12). The output shaft of the first motor (15) is fixed to the rotating frame (13). Two of the third brackets (12) are rotatably connected to a threaded rod (16) and fixed to a straight rod (17). The straight rod (17) is slidably connected to a movable frame (18) that is threaded to the threaded rod (16). A second motor (19) is fixedly connected to one of the third brackets (12). The output shaft of the second motor (19) is fixedly connected to the threaded rod (16). The movable frame (18) is slidably connected to two sliding blocks (20). The sliding blocks (20) are rotatably connected to rollers (21). The rollers (21) are used to squeeze out the etching solution in the absorbent cotton (14). A first spring (22) is provided between the sliding blocks (20) and the movable frame (18).
2. The circuit board etching equipment with self-cleaning function according to claim 1, characterized in that, The body (1) is fixedly connected to a fourth bracket (23), the fourth bracket (23) is fixedly connected to a water guide (24), the water guide (24) is hinged to a water guide plate (25), and the water guide plate (25) is used to guide the etching liquid squeezed out from the absorbent cotton (14).
3. The circuit board etching equipment with self-cleaning function according to claim 1, characterized in that, The fixed disk (4) is fixedly connected to a third motor (26), and the third motor (26) is driven by a gear ring to the adjacent rotating disk (5). A sensor is provided at the connection between the first pipe (7) and the adjacent inner flow channel (601).
4. The circuit board etching equipment with self-cleaning function according to claim 3, characterized in that, The fixed plate (4) is fixedly connected to a connecting shell (27), the connecting shell (27) is connected to a connecting head (28), the connecting head (28) is used to connect to the corresponding nozzle (6), the connecting shells (27) are evenly distributed and are connected to a fourth pipe (29), the fourth pipe (29) is connected to the air supply device, the fourth pipe (29) is provided with an evenly distributed solenoid valve, and the solenoid valve of the fourth pipe (29) corresponds one-to-one with the connecting shell (27).
5. The circuit board etching equipment with self-cleaning function according to claim 4, characterized in that, The fixed plate (4) is provided with a connecting hole, which is connected to the corresponding inner flow channel (601). The connecting holes on the fixed plate (4) that are evenly distributed are connected to the fifth pipe (30), which is connected to the miscellaneous box.
6. The circuit board etching equipment with self-cleaning function according to claim 5, characterized in that, The connecting shell (27) is rotatably connected to a rotating plate (31), which is used to pulse the airflow passing through the connecting shell (27).
7. The circuit board etching equipment with self-cleaning function according to claim 6, characterized in that, The fourth pipe (29) is slidably connected with equally spaced sliding members (32), which are used to limit the adjacent rotating plate (31). A second spring (33) is provided between the sliding member (32) and the fourth pipe (29).
8. A circuit board etching device with self-cleaning function according to claim 2, characterized in that, The projections of the water guide plate (25) and the water guide component (24) on the horizontal plane partially overlap, and the water guide plate (25) is located on the upper side of the water guide component (24).