Semiconductor centering device and method

Abstract

The application provides a semiconductor centering device and method, which comprises a positioning mechanism including positioning columns, an alignment mechanism including a fixed seat, a plurality of guide rods slidably penetrating through the fixed seat, a correcting member fixed to an end of the guide rods facing the center of a carrier plate, a groove provided in the fixed seat for accommodating the correcting member, and a first elastic member abutting between the fixed seat and the correcting member, the first elastic member being used for applying a pre-tightening force to the correcting member, and a driving mechanism for driving the positioning mechanism and the alignment mechanism to make radial translation relative to the center of the carrier plate, so that the two positioning columns abut against the edges of a wafer and a carrier sheet, and the correcting member is engaged into the missing corners of the wafer and the carrier sheet or abuts against the edges of the wafer and the carrier sheet in the groove. The semiconductor centering device and method disclosed by the application solve the technical problems that the prior art cannot realize missing corner and concentric circle alignment of the wafer and the carrier sheet, and the missing corners and edges of the wafer or the carrier sheet are easy to be damaged.

Description

Technical Field

[0001] This invention relates to the field of semiconductor technology, and more particularly to a semiconductor alignment apparatus and method. Background Technology

[0002] In ultra-thin wafer fabrication, the arc-shaped notch at the wafer edge is a crucial structural marker. The position of the notch corner strictly corresponds to the wafer's crystal orientation, serving as a standard positioning notch to ensure precise matching of pattern and crystal orientation in processes such as photolithography, etching, and ion implantation. In processes such as wafer thinning, temporary bonding-debonding, and wafer transfer, due to the extremely low rigidity of ultra-thin wafers, they cannot be directly transferred and processed. They must be bonded to a glass substrate using temporary bonding adhesive, with the glass providing rigid support for subsequent processes. After the processes are completed, the substrate is debonded and separated. Alignment marks are pre-fabricated on the glass substrate, requiring dual alignment with the wafer's notch corner and wafer center.

[0003] However, in the prior art, when aligning wafers and wafers for notch (i.e., notch corners), if there is a partial misalignment between the notch corner of the wafer or wafer and the alignment device, the alignment device cannot correct the notch corner of the wafer or wafer, and rigid contact is likely to occur, causing chipping of the notch corner of the wafer or wafer. When there is a complete misalignment between the notch corner of the wafer or wafer and the alignment device, and the alignment device directly abuts against the edge of the wafer or wafer, the alignment device is likely to have a rigid collision with the edge of the wafer or wafer, causing edge chipping, and it is impossible to achieve notch corner and concentric circle alignment of the wafer and wafer.

[0004] It should be noted that the above description of the background technology is only for the purpose of providing a clear and complete explanation of the technical solutions of the present invention and facilitating understanding by those skilled in the art. It should not be assumed that the above technical solutions are known to those skilled in the art simply because they have been described in the background section of the present invention. Summary of the Invention

[0005] The purpose of this invention is to disclose a semiconductor alignment device and method to solve the technical problems of existing technologies being unable to achieve corner missing and concentric circle alignment of wafers and wafers, and easily causing corner missing and edge chipping of wafers or wafers.

[0006] To achieve the above objectives, in a first aspect, the present invention provides a semiconductor alignment device for performing notched and concentric circle alignment of a wafer and a carrier, comprising: a carrier disk, two sets of positioning mechanisms and one set of alignment mechanisms, wherein the two sets of positioning mechanisms and one set of alignment mechanisms are arranged around the outside of the carrier disk and are equally angularly distributed around the axis of the carrier disk, and a driving mechanism;

[0007] The positioning mechanism includes a positioning column;

[0008] The alignment mechanism includes: a fixed base, a plurality of guide rods slidably passing through the fixed base, a straightening member fixed to one end of the guide rods facing the center of the carrier plate, a groove formed in the fixed base to receive the straightening member, and a first elastic member abutting between the fixed base and the straightening member, the first elastic member being used to apply a preload force to the straightening member.

[0009] The positioning mechanism and the alignment mechanism are driven by the driving mechanism to make radial translation relative to the center of the carrier, so that the edges of the wafer and the wafer are held by two positioning posts, and the straightening element is engaged in the notch of the wafer and the wafer or in the groove to hold the edges of the wafer and the wafer.

[0010] As a further improvement of the present invention, the end of the guide rod away from the straightening member is provided with an external thread;

[0011] The alignment mechanism further includes an adjusting member with internal threads, the adjusting member being disposed at the end of the guide rod away from the correcting member and abutting against the fixed seat;

[0012] The internal thread of the adjusting member engages with the external thread of the guide rod. Rotating the adjusting member changes its axial position on the guide rod, thereby adjusting the distance between the straightening member and the fixed seat and setting the preload of the first elastic member.

[0013] As a further improvement of the present invention, the fixing base includes: a support portion through which the guide rod passes, and a receiving portion disposed in the support portion and forming the groove;

[0014] The corrective component includes: a connecting portion fixed to one end of the guide rod and connected to the first elastic element, and a corrective column vertically disposed in the connecting portion and receivable within the groove;

[0015] The two positioning posts and the correction post are distributed at equal angles around the axis of the carrier plate.

[0016] As a further improvement of the present invention, the preload of the first elastic member is configured such that when the straightening member abuts against the edge of the wafer or wafer, the straightening member is received in the groove due to the resistance generated by the abutment; when the straightening member moves to a position corresponding to the notch of the wafer or wafer, the preload can drive the straightening member to engage in the notch.

[0017] As a further improvement of the present invention, the semiconductor alignment device further includes: a base disposed axially below the carrier disk, and a fixing ring coaxially disposed below the carrier disk and fixed to the base;

[0018] The alignment mechanism and each of the positioning mechanisms include a transmission component;

[0019] The positioning mechanism further includes a receiving block, and the positioning post is vertically disposed on the receiving block;

[0020] The transmission assembly includes a guide rail disposed outside the fixed ring and extending radially, a slider guided to move radially on the guide rail, and a connecting rod vertically disposed on the slider to connect the fixed seat or the receiving block.

[0021] As a further improvement of the present invention, the semiconductor alignment device further includes: a drive wheel coaxially disposed below the fixed ring, the drive wheel being controlled by the drive mechanism to rotate relative to the base;

[0022] The drive wheel is constructed with three arc-shaped guide grooves that are equally distributed around the axis of the carrier disk. A guide rod is vertically installed on the lower surface of one end of the slider that passes through the fixed ring, and the guide rod passes through the arc-shaped guide groove.

[0023] The drive mechanism drives the drive wheel to rotate, the arc-shaped guide groove pushes the guide rod to make the slider move closer to or away from the center of the carrier plate, and the positioning post and the straightening member move with the slider.

[0024] As a further improvement of the present invention, the semiconductor alignment device further includes: a transmission wheel coaxially disposed below the driving wheel and rotating relative to the base; a first transmission rod vertically disposed on the upper surface of the transmission wheel; a second transmission rod vertically disposed on the lower surface of the driving wheel; and a second elastic member connecting the first transmission rod and the second transmission rod at both ends respectively.

[0025] The driving mechanism includes: a driving unit, a third transmission rod eccentrically disposed with respect to the output shaft of the driving unit, a fourth transmission rod perpendicularly disposed on the lower surface of the transmission wheel, and a push rod, the two ends of which are rotatably connected to the third transmission rod and the fourth transmission rod, respectively.

[0026] The transmission wheel is driven by the driving mechanism. The first transmission rod applies an elastic driving force to the second transmission rod through the second elastic element to drive the driving wheel to rotate, thereby causing the slider to move radially.

[0027] In a second aspect, the present invention also provides a semiconductor alignment method, which uses the semiconductor alignment apparatus as described in any one of the first aspects to perform corner notching and concentric circle alignment of a wafer and a carrier, comprising:

[0028] S1. Place the slide onto the carrier tray;

[0029] S2. Start the drive mechanism to drive the alignment mechanism and the two sets of positioning mechanisms to move towards the center of the carrier plate, so that the positioning post abuts against the first edge of the carrier piece and the straightening piece engages with the first notch of the carrier piece to align the first notch of the carrier piece.

[0030] S3. After the first notch of the carrier is aligned, start the drive mechanism to drive the alignment mechanism and the two sets of positioning mechanisms to move away from the center of the carrier plate so that the corrector can be removed from the first notch of the carrier.

[0031] S4. Place the wafer on the aligned carrier.

[0032] S5. Start the drive mechanism, drive the alignment mechanism and the two sets of positioning mechanisms to move towards the center of the carrier, so that the two positioning posts simultaneously abut against the second edge of the wafer and the first edge of the carrier, and make the straightening element engage with the second notch of the wafer and the first notch of the carrier to align the second notch of the wafer and the first notch of the carrier, so as to achieve concentric circle alignment of the wafer and the carrier.

[0033] As a further improvement of the present invention, the alignment of the first notch of the slide includes:

[0034] S21. When there is a partial offset between the first notch of the carrier and the position of the straightening member, the straightening member can be engaged into the first notch of the carrier under the pre-tightening force of the first elastic member to perform alignment.

[0035] S22. When the first notch of the carrier is completely offset from the position of the straightening member and abuts against the first edge of the carrier, the first elastic member is compressed so that the straightening member is received in the groove.

[0036] The alignment of the second notch of the wafer and the first notch of the carrier includes:

[0037] S51. When there is a partial offset between the second notch of the wafer and the position of the straightening component, the straightening component can be engaged into the second notch of the wafer and the first notch of the carrier under the pre-tightening force of the first elastic component to perform alignment.

[0038] S52. When the second notch of the wafer is completely offset from the position of the corrector and abuts against the second edge of the wafer, the first elastic member is compressed so that the corrector is received in the groove.

[0039] As a further improvement of the present invention, in step S22, when the first notch of the carrier piece is completely offset from the position of the correcting member and abuts against the first edge of the carrier piece, the first elastic member is compressed so that the correcting member is received in the groove, and the method further includes the following steps:

[0040] S221. Start the drive mechanism to drive the alignment mechanism and the two sets of positioning mechanisms to move away from the center of the tray, so as to reset the alignment mechanism and the two sets of positioning mechanisms to the initial avoidance position;

[0041] S222. Readjust the circumferential position of the slide on the carrier disk;

[0042] S223. Repeat step S2;

[0043] In step S52, when the second notch of the wafer is completely offset from the position of the straightening member and abuts against the second edge of the wafer, the first elastic member is compressed so that the straightening member is received in the groove. The step also includes the following steps:

[0044] S521. Start the drive mechanism to drive the alignment mechanism and the two sets of positioning mechanisms to move away from the center of the tray, so as to reset the alignment mechanism and the two sets of positioning mechanisms to the initial avoidance position.

[0045] S522. Readjust the circumferential position of the wafer on the carrier.

[0046] S523. Repeat step S5.

[0047] Compared with the prior art, the beneficial effects of the present invention are:

[0048] When there is a partial offset between the first notch of the carrier and the straightening component, the straightening component will first contact one side wall of the first notch of the carrier and generate a resisting force along the circumference of the carrier at the moment of contact, so as to push the carrier to rotate around its own center. At the same time, the straightening component can drive the guide rod to slide radially back relative to the fixed seat, and the straightening component will retract into the groove and cause the first elastic element to undergo compression deformation, thereby achieving elastic buffering of the force on the straightening component, so as to avoid the straightening component forming rigid contact with the first notch of the carrier and causing the first notch side wall of the carrier to chip.

[0049] When the carrier plate rotates under the circumferential contact force until it is completely aligned with the first notch circumferential position of the straightening component, the circumferential contact force of the straightening component on the first notch of the carrier plate disappears. The compressed first elastic element releases its preload and continues to push the straightening component radially along the guide rod towards the center of the carrier plate, so that the straightening component is embedded in the first notch of the carrier plate and forms a tight fit with both side walls of the first notch of the carrier plate. At this time, the straightening component stops moving, and the circumferential position of the carrier plate is completely defined by the two positioning posts and the straightening component, so as to achieve precise positioning of the first notch of the carrier plate.

[0050] When the first corner of the carrier is completely offset from the straightening component, the straightening component will directly abut against the first edge of the carrier, pushing the straightening component to drive the guide rod to slide radially back relative to the fixed seat, causing the first elastic element to be compressed and deformed, thereby driving the straightening component to retract into the groove for reception, thus achieving elastic buffering of the force on the straightening component, avoiding rigid contact between the straightening component and the first edge of the carrier, and preventing the first edge of the carrier from chipping due to excessive force.

[0051] If there is a partial misalignment between the second notch of the wafer and the straightening component, the straightening component will repeat the elastic straightening process described above for the wafer: first, it contacts one sidewall of the second notch of the wafer to form a circumferential abutment force, pushing the wafer to rotate circumferentially around its center. Finally, under the pre-tightening force of the first elastic component, the straightening component simultaneously embeds into the notch of both the wafer and the wafer, forming a tight fit with both sidewalls of the notch, achieving precise alignment of the notch of the wafer and the wafer. Simultaneously, the two positioning posts simultaneously abut against the second edge of the wafer and the first edge of the wafer. Based on the geometric principle of "three points determining the center of a circle," the radial position of the wafer and the wafer is limited, while forcing the centers of the wafer and the wafer to automatically align, achieving concentric circle alignment of the wafer and the wafer. This ultimately completes the precise alignment of the center of the wafer and the notch with the notch. During this process, the first elastic component also provides elastic buffering for the straightening component, preventing rigid contact between the straightening component and the second notch or second edge of the wafer, which could cause chipping of the second notch or second edge. Attached Figure Description

[0052] Figure 1 This is a schematic diagram of the semiconductor alignment device disclosed in this invention;

[0053] Figure 2 This is a schematic diagram showing the connection between the connecting rod and the fixed base;

[0054] Figure 3 This is a schematic diagram showing how the two ends of the push rod are rotatably connected to the third and fourth transmission rods, respectively.

[0055] Figure 4 This is a bottom view of the semiconductor alignment device disclosed in this invention;

[0056] Figure 5 An explosive diagram of the alignment mechanism;

[0057] Figure 6 This is a schematic diagram of the overall alignment mechanism;

[0058] Figure 7 A schematic diagram of the first notch of the positioning piece for the correction component;

[0059] Figure 8 A schematic diagram showing the straightening element housed within the groove and abutting against the first edge of the carrier;

[0060] Figure 9 Flow chart of the semiconductor alignment method disclosed by the present invention. Detailed implementation manners

[0061] The present invention will be described in detail below in conjunction with the embodiments shown in the drawings. However, it should be noted that these embodiments are not limitations to the present invention. Any equivalent transformation or substitution in terms of function, method, or structure made by those of ordinary skill in the art based on these embodiments shall fall within the protection scope of the present invention.

[0062] The drawings in the present invention are not strictly drawn to actual scale, and the specific dimensions of each structure can be determined according to actual needs. The drawings described in the present invention are only schematic diagrams of the structure. The lines shown in the drawings included in the specification of the present invention can be understood as components having a certain actual thickness.

[0063] Please refer to Figures 1 to 9 A specific implementation manner of a semiconductor alignment device and method disclosed.

[0064] Refer to Figures 1 to 3 As shown, in this embodiment, the semiconductor alignment device 100 is used to perform notch (i.e., Notch) and concentric circle alignment (i.e., the center of the wafer coincides with the center of the carrier 200) on the wafer and the carrier 200.

[0065] In this embodiment, the present invention is described by taking the same diameter of the wafer and the carrier 200 as an example; the wafer is provided with a second notch (not shown) having the same structure and size as the first notch 201 of the carrier 200, and a second edge (not shown) adapted to the contour of the first edge 202 of the carrier 200.

[0066] The semiconductor alignment device 100 includes: a carrier plate 11, two groups of positioning mechanisms 20 and one group of alignment mechanisms 30. The two groups of positioning mechanisms 20 and one group of alignment mechanisms 30 are disposed outside the carrier plate 11 and are equally angularly distributed at 120° around the axis of the carrier plate 11, and a driving mechanism 40; the positioning mechanism 20 includes positioning posts 21; the alignment mechanism 30 includes: a fixed seat 31, a plurality of guide rods 32 slidably passing through the fixed seat 31, a correction member 33 fixed to one end of the guide rod 32 facing the center of the carrier plate 11, a groove 34 opened in the fixed seat 31 to accommodate the correction member 33, and a first elastic member 35 abutted between the fixed seat 31 and the correction member 33. The first elastic member 35 is used to apply a pre-tightening force to the correction member 33; the positioning mechanism 20 and the alignment mechanism 30 are driven by the driving mechanism 40 to perform a radial translation movement relative to the center of the carrier plate 11, so that the two positioning posts 21 abut against the edges of the wafer and the carrier 200, and the correction member 33 is engaged with the notch of the wafer and the carrier 200 or abuts against the edges of the wafer and the carrier 200 in the groove 34.

[0067] In the process of aligning a wafer (not shown) and a carrier 200 with notched corners and concentric circles, the semiconductor alignment device 100 disclosed in this invention first places the carrier 200 on the carrier disk 11, then activates the drive mechanism 40 to drive two sets of positioning mechanisms 20 and one set of alignment mechanisms 30 to move synchronously radially toward the center of the carrier disk 11 until both positioning posts 21 abut against the first edge 202 of the carrier 200. The positioning posts 21 only provide radial restraint for the carrier 200, preventing radial displacement, but allowing circumferential rotation around its own center.

[0068] like Figure 7 As shown, simultaneously, the straightening member 33 approaches the first notch 201 region of the carrier 200. If there is a partial offset between the first notch 201 of the carrier 200 and the straightening member 33, the straightening member 33 will first contact one side wall (not shown) of the first notch 201 of the carrier 200, and generate a contact force along the circumference of the carrier 200 at the moment of contact. This circumferential contact force can provide power for the circumferential rotation of the carrier 200, so as to push the carrier 200 to rotate around its own center. Because the positioning post 21 abuts against the first edge 202 of the carrier 200, thereby limiting the radial position of the carrier 200, this circumferential contact force will not cause the carrier 200 to shift radially.

[0069] After the circumferential abutment force is transmitted to the straightening member 33, the straightening member 33 can drive the guide rod 32 to slide radially back relative to the fixed seat 31 (i.e., away from the center of the carrier 200). The straightening member 33 also retracts towards the inside of the groove 34, causing the first elastic member 35 (e.g., a coil spring) to undergo compression deformation. This provides elastic buffering for the straightening member 33, preventing rigid contact between the straightening member 33 and the first notch 201 of the carrier 200, which could cause chipping of the sidewall of the first notch 201. During the rotation of the carrier 200, the straightening member 33 continuously slides along the sidewall of the first notch 201. During this sliding process, the first elastic member 35 remains in an elastically compressed state, continuously applying a preload to the straightening member 33, ensuring continuous contact between the straightening member 33 and the sidewall of the first notch 201 of the carrier 200. This guarantees a stable and reliable straightening process for the first notch 201 of the carrier 200, reducing jamming.

[0070] When the carrier plate 200 rotates under the action of the circumferential abutment force until the circumferential position of the first notch 201 is completely aligned with the straightening member 33, the circumferential abutment force of the straightening member 33 on the first notch 201 of the carrier plate 200 disappears, the compressed first elastic member 35 releases its pre-tightening force, and continues to push the straightening member 33 to move radially along the guide rod 32 toward the center of the carrier plate 11, so that the straightening member 33 is embedded in the first notch 201 of the carrier plate 200 and forms a tight fit with both side walls of the first notch 201 of the carrier plate 200. At this time, the straightening member 33 stops moving, and the circumferential position of the carrier plate 200 is completely defined by the two positioning posts 21 and the straightening member 33, so as to achieve precise positioning of the first notch 201 of the carrier plate 200. Meanwhile, after the aforementioned corrective member 33 is engaged in place within the first notch 201 of the carrier piece 200, the first elastic member 35 remains in a pre-tightened state (i.e., an elastically compressed state), providing a continuous pre-tightening force to the carrier piece 200 and preventing the carrier piece 200 from shifting circumferentially.

[0071] like Figure 8 As shown, if the first notch 201 of the carrier 200 is completely offset from the straightening member 33, the straightening member 33 will directly abut against the first edge 202 of the carrier 200. Because the positioning post 21 abuts against the first edge 202 of the carrier 200, thus limiting the radial position of the carrier 200, the straightening member 33 is subjected to a radial reaction force from the first edge 202 of the carrier 200. This reaction force overcomes the preload applied to the straightening member 33 by the first elastic member 35, pushing the straightening member 33 to drive the guide rod 32 relative to the fixed seat. 31 slides radially back (i.e., away from the center of the carrier 200), causing the first elastic member 35 to be compressed and deformed, which in turn drives the straightening member 33 to retract into the groove 34 for reception. Although the straightening member 33 retracts into the groove 34, it still maintains contact with the first edge 202 of the carrier 200, thereby achieving elastic buffering of the force on the straightening member 33, avoiding rigid contact between the straightening member 33 and the first edge 202 of the carrier 200, and preventing the first edge 202 of the carrier 200 from chipping due to excessive force.

[0072] Subsequently, the drive mechanism 40 drives the two sets of positioning mechanisms 20 and the one set of alignment mechanisms 30 to retreat to the initial clearance position. After readjusting the circumferential position of the wafer 200, the above-mentioned positioning steps for the first notch 201 of the wafer 200 are repeated until the first notch 201 of the wafer 200 is accurately positioned. After the first notch 201 of the wafer 200 is accurately positioned, the drive mechanism 40 is activated, driving the two sets of positioning mechanisms 20 and the one set of alignment mechanisms 30 to move synchronously in a radial direction away from the center of the carrier tray 11 until the straightening member 33 completely exits from the first notch 201 of the wafer 200, the positioning post 21 moves away from the first edge 202 of the wafer 200, and all mechanisms (i.e., the two sets of positioning mechanisms 20 and the one set of alignment mechanisms 30) are reset to the initial clearance position, reserving an unobstructed and contactless operating space for wafer loading, and the wafer 200 remains in the positioned notch state.

[0073] After the wafer is smoothly stacked on the carrier 200 with the notched corner precisely positioned, the drive mechanism 40 is activated again, driving the two sets of positioning mechanisms 20 and one set of alignment mechanisms 30 to move synchronously radially toward the center of the carrier 11 until both positioning posts 21 abut against the edges of the wafer and the carrier 200. At this point, the wafer and the carrier 200 are both radially positioned by the two positioning posts 21 and can only rotate synchronously around their respective centers.

[0074] The corrector 33 approaches the second notched area of ​​the wafer synchronously. If there is a partial offset between the second notched area of ​​the wafer and the corrector 33, the corrector 33 will repeat the elastic correction process performed on the wafer 200 as described above: first, it contacts one side wall of the second notched area of ​​the wafer to form a circumferential abutment force, pushing the wafer to rotate circumferentially around its center. Finally, under the pre-tightening force of the first elastic element 35, the corrector 33 simultaneously embeds into the notched area of ​​both the wafer and the wafer 200, forming a tight fit and abutment with both sides of the notched area of ​​the wafer and the wafer 200, achieving precise alignment of the notched area of ​​the wafer and the wafer 200. At the same time, the two positioning posts 21 simultaneously abut against the second edge of the wafer and the first edge 202 of the wafer 200. Based on the geometric principle of "three points determine the center of the circle", the radial position of the wafer and the wafer 200 is limited, while forcing the centers of the wafer and the wafer 200 to automatically align, achieving concentric circle alignment of the wafer and the wafer 200. Finally, precise alignment of the center and notched corner of the wafer with the carrier 200 is achieved. After the notched corner of the wafer and carrier 200 are engaged, the first elastic element 35 remains in a pre-tightened state, achieving circumferential locking of the notched corner. At the same time, the positioning post 21 continuously abuts against the edges of the two, achieving radial locking of their centers. During this process, the first elastic element 35 can also provide elastic buffering for the force on the straightening element 33, so as to avoid rigid contact between the straightening element 33 and the second notched corner of the wafer, which would cause the sidewall of the second notched corner of the wafer to chip.

[0075] If the second notch of the wafer is completely misaligned with the corrector 33, the corrector 33 will abut against the second edge of the wafer and compress the first elastic member 35. The corrector 33 will be housed within the groove 34, and although it retracts into the groove 34, it will still maintain contact with the second edge of the wafer. During this process, the first elastic member 35 can also provide elastic buffering for the corrector 33 under stress, preventing rigid contact between the corrector 33 and the second edge of the wafer, and preventing edge chipping due to excessive force. Subsequently, the drive mechanism 40 drives the two sets of positioning mechanisms 20 and one set of alignment mechanisms 30 to retract to the initial avoidance position, readjusts the circumferential position of the wafer, and repeats the above steps until the precise alignment of the center and notch of the wafer with the carrier 200 is achieved.

[0076] After the precise alignment of the center and notched corner of the carrier 200 and the wafer is completed, the drive mechanism 40 is activated to drive the two sets of positioning mechanisms 20 and the one set of alignment mechanisms 30 to move radially back to the initial avoidance position, thus completing the entire alignment process of the center and notched corner of the carrier 200 and the wafer. The wafer and carrier 200 on the carrier 11 can be transferred as a whole to subsequent bonding, thinning and other processes.

[0077] It should be noted that in this embodiment, "pre-tightening force" refers to the elastic clamping force that the first elastic element 35 continuously applies to the straightening element 33 in the direction of the center of the carrier disk 11, based on its pre-compressed elastic deformation state, after the first elastic element 35 is assembled and before the straightening element 33 has come into contact with the carrier 200 or the wafer.

[0078] In some examples, the circumferential position of the carrier 200 (or wafer) is readjusted by a robotic arm (not shown) that the carrier 200 (or wafer) is finely circumferentially adjusted until the first notch 201 of the carrier 200 (or the second notch of the wafer) corresponds to the position of the straightener 33.

[0079] In some examples, there are preferably two guide rods 32, which are spaced apart and parallel to each other and pass through the fixed base 31 to form a stable and non-wobbling radial sliding guide for the straightening member 33.

[0080] In some examples, the parameter Figure 5 and Figure 6 As shown, the end of the guide rod 32 away from the straightening member 33 is configured with an external thread (not shown); the alignment mechanism 30 also includes an adjusting member 36 with an internal thread (not shown), the adjusting member 36 is disposed at the end of the guide rod 32 away from the straightening member 33 and abuts against the fixed seat 31; the internal thread of the adjusting member 36 engages with the external thread of the guide rod 32, and rotating the adjusting member 36 changes the axial direction of the adjusting member 36 on the guide rod 32. Figure 6The guide rod 32 is positioned in the direction indicated by the axis P, so as to adjust the distance L between the straightening member 33 and the fixed seat 31 and set the preload of the first elastic member 35.

[0081] Through the threaded engagement of the adjusting component 36 and the guide rod 32, the distance L between the straightening component 33 and the fixed base 31 can be precisely adjusted by rotating the adjusting component 36. This allows for flexible setting of the preload of the first elastic component 35, enabling the preload to be adaptively matched according to the material, thickness, and specifications of the carrier 200 and the wafer. This ensures that the preload is sufficient to drive the straightening component 33 to achieve continuous contact with the missing corner sidewalls of the wafer and the carrier 200, ensuring the alignment and correction of the missing corner offset of the wafer and the carrier 200. At the same time, it avoids excessive preload causing edge chipping of the wafer or the carrier 200, while also preventing insufficient preload leading to insufficient contact force of the straightening component 33 and correction failure. Meanwhile, by adjusting the spacing L, the initial extension position and radial sliding stroke of the corrector 33 can be limited, so that the first elastic element 35 always works within a reasonable elastic deformation range, avoiding excessive compression and failure of the elastic element, and improving the structural stability and service life of the alignment mechanism 30. This adjustable preload structure also allows the present invention to adapt to the alignment requirements of various specifications of semiconductor workpieces (such as wafers), and can complete the debugging of different working conditions without changing parts, significantly improving the versatility and on-site debugging convenience of the present invention, and ensuring the accuracy and stability of the wafer and carrier 200 corner correction and concentric circle alignment process.

[0082] In some examples, the parameter Figure 5 and Figure 6 As shown, the preload of the first elastic member 35 is configured such that when the straightening member 33 abuts against the edge of the wafer or substrate 200, the straightening member 33 is received in the groove 34 due to the resistance generated by the abutment; when the straightening member 33 moves to a position corresponding to the notch of the wafer or substrate 200, the preload can drive the straightening member 33 to engage in the notch.

[0083] The preload is set to be less than the resistance generated when the straightener 33 abuts against the edge of the wafer or wafer 200. This ensures that when the corner of the wafer 200 or wafer is completely offset from the straightener 33, and the straightener 33 directly abuts against the edge of the wafer 200 or wafer, the abutment resistance can easily overcome the preload, pushing the straightener 33 into the groove 34 for reception. At the same time, the straightener 33 remains in contact with the edge of the wafer 200 or wafer, and the elastic deformation of the first elastic element 35 achieves force buffering, effectively preventing the straightener 33 from forming rigid contact with the edge of the wafer 200 or wafer, preventing the edge of the wafer 200 or wafer from chipping due to overload, thereby improving the yield of the wafer 200 and wafer.

[0084] The preload is synchronously set to be sufficient to drive the corrector 33 to engage with the notch, so that when the carrier 200 or wafer rotates to the position corresponding to its notch and the corrector 33, the circumferential abutment force on the corrector 33 disappears. At this time, the first elastic element 35 releases the preload, which can stably drive the corrector 33 to extend towards the notch of the carrier 200 or wafer, ensuring that the corrector 33 is accurately engaged in the notch and tightly adheres to the side walls on both sides of the notch, thus achieving accurate positioning and correction of the notch. This avoids problems such as the corrector 33 not being able to engage effectively or the adhesion force being insufficient due to insufficient preload, which could lead to correction jamming or positioning deviation, and ensures the stability and accuracy of the notch correction process.

[0085] In some examples, the parameter Figure 1 , Figure 5 and Figure 6 As shown, the fixing base 31 includes: a support portion 311 through which the guide rod 32 passes, and a receiving portion 312 disposed in the support portion 311 and forming a groove 34; the straightening member 33 includes: a connecting portion 331 fixed to one end of the guide rod 32 and connected to the first elastic member 35, and a straightening column 332 vertically disposed in the connecting portion 331 and receivable in the groove 34; the two positioning columns 21 and the straightening column 332 are distributed at an equal angle of 120° around the axis Q of the carrier plate 11.

[0086] The support portion 311 provides a through-hole for the guide rod 32, offering radial sliding guidance to ensure that the guide rod 32 drives the straightening member 33 to move only radially along the carrier 11. This avoids circumferential swaying, reduces jamming, and prevents problems such as corner misalignment and uneven force caused by guide offset. Furthermore, the support portion 311 contains a linear bearing 37, which is fixed to the support portion 311 via an interference fit. The guide rod 32 slidably passes through the linear bearing 37, providing high-precision, low-friction radial sliding guidance for the guide rod 32. The groove 34 in the receiving portion 312 adapts to the shape and sliding stroke of the straightening post 332. When the carrier 200 or wafer experiences a complete corner offset, the retracted straightening post 332 can be smoothly received. This provides a stable receiving space for the straightening post 332 and, in conjunction with the first elastic member 35, provides elastic buffering under force, preventing rigid contact between the straightening post 332 and the edge of the carrier 200 or wafer, thus preventing edge chipping. Meanwhile, the support part 311 and the housing part 312 can be integrated into one structure to improve the structural strength of the fixed base 31 and extend the service life of the alignment mechanism 30.

[0087] The connecting part 331 is fixed to one end of the guide rod 32 and connected to the first elastic element 35, forming a force transmission path from the guide rod 32, the connecting part 331 to the first elastic element 35, ensuring that the preload of the first elastic element 35 can be stably transmitted to the straightening post 332. At the same time, the contact force from the carrier 200 or wafer on the straightening post 332 can also be transmitted in the opposite direction to the first elastic element 35, achieving elastic buffering. The straightening post 332 is vertically arranged on the connecting part 331. Its vertical structure can accurately fit the corner and edge sidewall contour of the carrier 200 or wafer, ensuring that when the corner is offset, the straightening post 332 can form effective contact with one sidewall of the corner to generate a stable circumferential contact force. When the straightening post 332 is aligned with the corner, it can quickly engage into the corner and fit tightly with both sidewalls of the corner, achieving precise positioning and circumferential locking of the corner, avoiding problems such as loose engagement and positioning offset caused by angular deviation of the straightening post 332.

[0088] The equiangular distribution design ensures that the two positioning posts 21 and one correction post 332 provide uniform and symmetrical radial support to the wafer 200 or wafer. This effectively prevents radial displacement or tilting of the wafer 200 or wafer caused by excessive force on one side, ensuring reliable radial positioning of the wafer 200 or wafer by the positioning posts 21. Simultaneously, the equiangular distribution conforms to the geometric principle of "three points determining the center of a circle." During the concentric circle alignment stage between the wafer and the wafer 200, the two positioning posts 21 and the correction post 332 simultaneously radially support the edges of the wafer 200 and wafer, quickly calibrating the geometric center of the wafer 200 and wafer. This ensures precise coincidence of the center of the wafer 200 and wafer, improving the efficiency and accuracy of concentric circle alignment. Furthermore, the equidistant distribution allows the circumferential correction force of the correction column 332 to be applied evenly to the carrier 200 or wafer, promoting the smooth circumferential rotation of the carrier 200 or wafer. This prevents the carrier 200 or wafer from getting stuck or shifting during the correction process, ensuring the stability of the corner correction. At the same time, it balances the forces on the carrier 200 and wafer during the entire positioning and correction process, further reducing the risk of damage to the carrier 200 and wafer and improving production yield.

[0089] It should be noted that the notch in this embodiment refers to the positioning groove formed by cutting on the wafer and carrier 200, which can be V-shaped or U-shaped. The shape of the correction post 332 of the present invention is adapted to the contour of both V-shaped and U-shaped notches, and can realize the engagement, positioning and correction of notches of both shapes. Figure 7 and Figure 8 The examples shown all use a U-shaped notch.

[0090] In some examples, the parameter Figures 1 to 4As shown, the semiconductor alignment device 100 further includes: a base 12 axially disposed below the carrier 11, and a retaining ring 13 coaxially disposed below the carrier 11 and fixed to the base 12; the alignment mechanism 30 and each positioning mechanism 20 include a transmission assembly 50; the positioning mechanism 20 further includes a receiving block 22, and a positioning post 21 is vertically disposed on the receiving block 22; the transmission assembly 50 includes a guide rail 51 disposed outside the retaining ring 13 and extending radially, a slider 52 guided to move radially on the guide rail 51, and a connecting rod 53 vertically disposed on the slider 52 to connect the retaining base 31 or the receiving block 22.

[0091] The base 12 and the fixing ring 13 are arranged coaxially along the axial direction, providing stable support and mounting reference for the entire transmission assembly 50, positioning mechanism 20, and alignment mechanism 30. This ensures that each component maintains coaxiality and positional accuracy relative to the axis of the carrier 11, reducing the risk of deviation in the movement trajectory of the positioning post 21 and the straightening member 33 due to installation reference deviation. This ensures the concentric circle alignment and corner alignment accuracy of the wafer 200 and the wafer. The guide rail 51 and slider 52 in the transmission assembly 50 cooperate to form a high-precision radial linear guide structure, enabling the positioning mechanism 20 and the alignment mechanism 30 to move stably radially along the carrier 11, avoiding circumferential and lateral wobbling. This ensures that the movement direction of the positioning post 21 and the straightening member 33 always points radially toward the center of the carrier 11, improving the consistency and movement accuracy of the wafer 200 and wafer alignment process. The connecting rod 53 vertically connects the slider 52 to the fixed seat 31 or the receiving block 22, which can stably transmit the radial movement of the slider 52 to the positioning mechanism 20 and the alignment mechanism 30, ensuring direct and efficient power transmission, reducing jamming, lag or wobble during the movement, and making the extension and retraction of the positioning column 21 and the straightening component 33 more sensitive and reliable.

[0092] In some examples, the parameter Figures 1 to 4 As shown, the semiconductor alignment device 100 further includes: a drive wheel 14 coaxially disposed below the fixing ring 13, the drive wheel 14 being controlled by the drive mechanism 40 to rotate relative to the base 12; the drive wheel 14 is constructed with three arc-shaped guide grooves 141 equally distributed around the axis of the carrier disk 11, a guide rod 54 is vertically disposed on the lower surface of one end of the slider 52 passing through the fixing ring 13, and the guide rod 54 passes through the arc-shaped guide grooves 141; the drive mechanism 40 drives the drive wheel 14 to rotate, the arc-shaped guide grooves 141 push the guide rod 54, so that the slider 52 moves closer to or away from the center of the carrier disk 11, and the positioning post 21 and the straightening member 33 move with the slider 52.

[0093] The drive mechanism 40 drives the drive wheel 14 to rotate. Through the cooperation of the arc-shaped guide groove 141 and the guide rod 54, the circumferential rotational motion is converted into the radial linear motion of the slider 52, the positioning post 21, and the straightening element 33. This ensures that the extension and retraction actions of each mechanism (i.e., the two sets of positioning mechanisms 20 and the one set of alignment mechanisms 30) are responsive and executed in place, avoiding transmission lag or jamming. The three arc-shaped guide grooves 141 are distributed at equal angles around the axis Q of the carrier plate 11, which can simultaneously push the three guide rods 54, so that the two sets of positioning mechanisms 20 and the one set of alignment mechanisms 30 move radially at the same speed, synchronously, and in the same direction. This ensures that the positioning post 21 and the straightening element 33 always maintain a relative position of three points at equal angles, avoiding the eccentricity of the carrier plate 200 or wafer and uneven force due to asynchronous movement, and further ensuring the concentric circle alignment and corner alignment accuracy of the carrier plate 200 and the wafer. The arc-shaped guide groove 141 constrains the radial movement stroke and speed of the guide rod 54, ensuring uniform and stable radial movement of the positioning post 21 and the straightening member 33. This guarantees balanced resistance to the edges of the wafer 200 or wafer and precisely controls the engagement position of the positioning post 21 and the straightening member 33, preventing edge chipping of the wafer 200 or wafer due to impact contact. Only one drive mechanism 40 and drive wheel 14 are needed to synchronously drive two sets of positioning mechanisms 20 and one set of alignment mechanisms 30, simplifying the overall transmission structure of the invention, reducing assembly errors and control complexity caused by independent drive components, lowering equipment failure rate and debugging difficulty, while improving the compactness and space utilization of the invention to meet the design requirements of miniaturization and integration of semiconductor equipment.

[0094] In some examples, the parameter Figures 1 to 4 As shown, the semiconductor alignment device 100 further includes: a transmission wheel 15 coaxially disposed below the drive wheel 14 and rotating relative to the base 12; a first transmission rod 161 vertically disposed on the upper surface of the transmission wheel 15; a second transmission rod 162 vertically disposed on the lower surface of the drive wheel 14; and a second elastic element 163 (e.g., a tension spring) connecting the first transmission rod 161 and the second transmission rod 162 at both ends respectively. The drive mechanism 40 includes: a drive unit 41; a third transmission rod 42 eccentrically disposed with respect to the output shaft of the drive unit 41; a fourth transmission rod 44 vertically disposed on the lower surface of the transmission wheel 15; and a push rod 45, the two ends of which are rotatably connected to the third transmission rod 42 and the fourth transmission rod 44 respectively. The transmission wheel 15 is driven by the drive mechanism 40, and the first transmission rod 161 applies an elastic driving force to the second transmission rod 162 through the second elastic element 163 to drive the drive wheel 14 to rotate, thereby causing the slider 52 to move radially. The transmission wheel 15 protrudes to form a transmission block 151, and the first transmission rod 161 is vertically disposed on the transmission block 151.

[0095] The rotational motion output by the drive unit (e.g., servo motor) 41 is converted into reciprocating linear motion via the third transmission rod 42, push rod 45, and fourth transmission rod 44. This motion drives the transmission block 151 to drive the transmission wheel 15 to rotate reciprocally. The drive wheel 14 is then driven to rotate via the first transmission rod 161, the second elastic element 163, and the second transmission rod 162. This motion is ultimately converted into radial linear motion of the slider 52, the positioning post 21, and the straightening element 33. The first transmission rod 161 applies an elastic driving force to the second transmission rod 162 via the second elastic element 163, making the rotation of the drive wheel 14 a flexible drive. This effectively buffers the rigid impacts and vibrations generated during the start-up, shutdown, and transmission of the drive unit 41. It prevents the transmission impact from being directly transmitted to the positioning post 21 and the straightening element 33, thus preventing them from rigidly colliding with the edge of the wafer 200 or wafer. This reduces the risk of edge chipping of the wafer 200 or wafer from the power source, further improving the yield of the wafer 200 or wafer. Simultaneously, it ensures that power is evenly transmitted to the drive wheel 14. Combined with three equally angled arc-shaped guide grooves 141, this ensures that the two sets of positioning mechanisms 20 and one set of alignment mechanisms 30 always maintain synchronous, constant speed, and radial movement in the same direction, maintaining balanced force at three points. This ensures the concentric circle alignment and corner alignment accuracy between the carrier 200 and the wafer from the power transmission perspective, avoiding eccentricity and positioning misalignment of the carrier 200 and the wafer due to uneven transmission. When the positioning post 21 or the straightening element 33 abuts against the edge of the carrier 200 or the wafer, the second elastic element 163 can generate adaptive elastic deformation, keeping the holding force of the positioning post 21 and the straightening element 33 on the carrier 200 or the wafer gentle and balanced. This adapts to minor errors in the size and position of the carrier 200 or the wafer, improving the operational stability and fault tolerance of the invention.

[0096] In some examples, the parameter Figure 1 As shown, the edge of the carrier tray 11 has three clearance grooves 111, which are distributed at equal angles around the axis of the carrier tray 11 and correspond one-to-one with two positioning posts 21 and one straightening element 33. Each clearance groove 111 allows the corresponding positioning post 21 or straightening element 33 to move radially. The three clearance grooves 111 provide radial clearance space for the corresponding positioning post 21 and straightening element 33, avoiding structural interference between the positioning post 21 and straightening element 33 and the carrier tray 11 during radial extension and retraction, and ensuring smooth radial extension and retraction of the positioning post 21 and straightening element 33. By opening the clearance grooves 111 on the edge of the carrier tray 11, the positioning post 21 and straightening element 33 can be arranged closer to the edge of the wafer 200 and the wafer, shortening the radial movement stroke, accelerating the response speed of positioning and straightening actions, and improving the overall alignment efficiency.

[0097] Based on this, the present invention also provides a semiconductor alignment method, which uses the semiconductor alignment device 100 disclosed above to perform corner-cutting and concentric circle alignment of the wafer and the carrier 200. (See reference...) Figure 9As shown, the semiconductor alignment method includes the following steps S1 to S5.

[0098] S1. Place the slide 200 on the tray 11.

[0099] S2. Start the drive mechanism 40, drive the alignment mechanism 30 and the two sets of positioning mechanisms 20 to move towards the center of the carrier plate 11, so that the positioning post 21 abuts against the first edge 202 of the carrier plate 200 and the straightening member 33 engages with the first notch 201 of the carrier plate 200 to align the first notch 201 of the carrier plate 200.

[0100] The drive mechanism 40 is activated, driving the two sets of positioning mechanisms 20 and one set of alignment mechanisms 30 to move synchronously radially toward the center of the carrier plate 11 until both positioning posts 21 abut against the first edge 202 of the carrier plate 200. The positioning posts 21 only provide radial restraint to the carrier plate 200, preventing radial displacement, but allowing it to rotate circumferentially around its own center. Simultaneously, the straightening member 33 approaches the first notched corner 201 area of ​​the carrier plate 200.

[0101] In some examples, aligning the first notch 201 of the slide 200 includes:

[0102] S21. When there is a partial offset between the first notch 201 of the carrier 200 and the position of the straightening member 33, the straightening member 33 can be engaged into the first notch 201 of the carrier 200 under the pre-tightening force of the first elastic member 35 to perform alignment.

[0103] If there is a partial offset between the first notch 201 of the carrier 200 and the straightening member 33, the straightening member 33 will first contact one sidewall (not shown) of the first notch 201 of the carrier 200, and generate a circumferential abutment force at the moment of contact. This circumferential abutment force can provide power for the circumferential rotation of the carrier 200, so as to push the carrier 200 to rotate around its own center. Since the positioning post 21 abuts against the first edge 202 of the carrier 200 to limit the radial position of the carrier 200, this circumferential abutment force will not cause the carrier 200 to shift radially. After the circumferential contact force is transmitted to the straightening member 33, the straightening member 33 can drive the guide rod 32 to slide radially back relative to the fixed seat 31 (i.e., away from the center of the carrier 200). The straightening member 33 also retracts towards the inside of the groove 34, causing the first elastic member 35 to undergo compressive deformation. This provides elastic buffering of the force on the straightening member 33, preventing rigid contact between the straightening member 33 and the first notch 201 of the carrier 200, which could cause chipping of the sidewall of the first notch 201. During the rotation of the carrier 200, the straightening member 33 continuously slides along the sidewall of the first notch 201 of the carrier 200. During this sliding process, the first elastic member 35 remains in an elastically compressed state, continuously applying a preload to the straightening member 33. This ensures that the straightening member 33 maintains continuous contact with the sidewall of the first notch 201 of the carrier 200, guaranteeing a stable and reliable straightening process and reducing jamming. When the carrier plate 200 rotates under the action of the circumferential abutment force until the circumferential position of the first notch 201 is completely aligned with the straightening member 33, the circumferential abutment force of the straightening member 33 on the first notch 201 of the carrier plate 200 disappears, the compressed first elastic member 35 releases its pre-tightening force, and continues to push the straightening member 33 to move radially along the guide rod 32 toward the center of the carrier plate 11, so that the straightening member 33 is embedded in the first notch 201 of the carrier plate 200 and forms a tight fit with both side walls of the first notch 201 of the carrier plate 200. At this time, the straightening member 33 stops moving, and the circumferential position of the carrier plate 200 is completely defined by the two positioning posts and the straightening member 33, so as to achieve precise positioning of the first notch 201 of the carrier plate 200. Meanwhile, after the aforementioned corrective member 33 is engaged in place within the first notch 201 of the carrier piece 200, the first elastic member 35 remains in a pre-tightened state (i.e., an elastically compressed state), providing a continuous pre-tightening force to the carrier piece 200 and preventing the carrier piece 200 from shifting circumferentially.

[0104] S22. When the first notch 201 of the carrier 200 is completely offset from the position of the corrector 33 and abuts against the first edge 202 of the carrier 200, the first elastic member 35 is compressed so that the corrector 33 is received in the groove 34.

[0105] If the first notch 201 of the carrier 200 is completely offset from the straightening member 33, the straightening member 33 will directly abut against the first edge 202 of the carrier 200. Since the positioning post 21 abuts against the first edge 202 of the carrier 200, thus limiting the radial position of the carrier 200, the straightening member 33 is subjected to a radial reaction force from the first edge 202 of the carrier 200. This reaction force overcomes the preload applied to the straightening member 33 by the first elastic member 35, pushing the straightening member 33 to drive the guide rod 32 relative to the fixed seat 31. The first elastic element 35 is compressed and deformed by sliding radially (i.e., away from the center of the carrier 200), which in turn causes the straightening element 33 to retract into the groove 34 for reception. Although the straightening element 33 retracts into the groove 34, it still maintains contact with the first edge 202 of the carrier 200, thereby achieving elastic buffering of the force on the straightening element 33, avoiding rigid contact between the straightening element 33 and the first edge 202 of the carrier 200, and preventing the first edge 202 of the carrier 200 from chipping due to excessive force.

[0106] In some examples, in step S22, when the first notch 201 of the carrier 200 is completely offset from the position of the straightening member 33 and abuts against the first edge 202 of the carrier 200, the first elastic member 35 is compressed so that the straightening member 33 is received in the groove 34, and the step further includes the following steps:

[0107] S221. Start the drive mechanism 40 to drive the alignment mechanism 30 and the two sets of positioning mechanisms 20 to move away from the center of the carrier plate 11, so as to reset the alignment mechanism 30 and the two sets of positioning mechanisms 20 to the initial avoidance position.

[0108] S222. Readjust the circumferential position of the slide 200 on the carrier disk 11.

[0109] S223. Repeat step S2 until the first notch 201 of the carrier 200 is accurately positioned.

[0110] S3. After the first notch 201 of the carrier 200 is aligned, the drive mechanism 40 is activated to drive the alignment mechanism 30 and the two sets of positioning mechanisms 20 to move away from the center of the carrier plate 11, so that the corrector 33 is removed from the first notch 201 of the carrier 200.

[0111] After the first notch 201 of the wafer 200 is precisely positioned, the drive mechanism 40 is activated to drive the two sets of positioning mechanisms 20 and the one set of alignment mechanisms 30 to move synchronously in a radial direction away from the center of the carrier 11 until the straightening member 33 completely exits from the first notch 201 of the wafer 200, the positioning post 21 moves away from the first edge 202 of the wafer 200, and all mechanisms (i.e., the two sets of positioning mechanisms 20 and the one set of alignment mechanisms 30) are reset to the initial avoidance position, reserving an unobstructed and contactless operating space for wafer loading, and the wafer 200 remains in the positioned notch state.

[0112] S4. Place the wafer on the aligned carrier 200.

[0113] S5. Start the drive mechanism 40, drive the alignment mechanism 30 and the two sets of positioning mechanisms 20 to move towards the center of the carrier 11, so that the two positioning posts 21 simultaneously abut against the second edge of the wafer and the first edge 202 of the carrier 200, and make the straightening member 33 engage with the second notch of the wafer and the first notch 201 of the carrier 200 to align the second notch of the wafer and the first notch 201 of the carrier 200, so as to achieve concentric circle alignment of the wafer and the carrier 200.

[0114] The drive mechanism 40 is restarted, driving the two sets of positioning mechanisms 20 and one set of alignment mechanisms 30 to move radially and synchronously toward the center of the carrier 11 until both positioning posts 21 abut against the edges of the wafer and the substrate 200. At this point, the wafer and the substrate 200 are both radially positioned by the two positioning posts 21 and can only rotate synchronously around their respective centers. The straightening element 33 synchronously approaches the second notched corner area of ​​the wafer.

[0115] In some examples, alignment of the second notch of the wafer and the first notch 201 of the carrier 200 includes:

[0116] S51. When there is a partial offset between the second notch of the wafer and the position of the straightening member 33, the straightening member 33 can be engaged into the second notch of the wafer and the first notch 201 of the carrier 200 under the pre-tightening force of the first elastic member 35 to perform alignment.

[0117] If there is a partial misalignment between the second notch of the wafer and the straightening member 33, the straightening member 33 will repeat the elastic straightening process described above for the wafer 200: first, it will contact one side wall of the second notch of the wafer to form a circumferential abutment force, pushing the wafer to rotate circumferentially around its center. Finally, under the pre-tightening force of the first elastic member 35, the straightening member 33 will simultaneously embed into the notch of both the wafer and the wafer 200, forming a tight fit and abutment with both sides of the notch of the wafer and the wafer 200, achieving precise alignment of the notch of the wafer and the wafer 200. At the same time, the two positioning posts 21 will simultaneously abut against the second edge of the wafer and the first edge 202 of the wafer 200. Based on the geometric principle of "three points determine the center of the circle", the radial position of the wafer and the wafer 200 will be limited, while forcing the centers of the wafer and the wafer 200 to automatically align, achieving concentric circle alignment of the wafer and the wafer 200. Finally, precise alignment of the center and notched corner of the wafer with the carrier 200 is achieved. After the notched corner of the wafer and carrier 200 are engaged, the first elastic element 35 remains in a pre-tightened state, achieving circumferential locking of the notched corner. At the same time, the positioning post 21 continuously abuts against the edges of the two, achieving radial locking of their centers. During this process, the first elastic element 35 can also provide elastic buffering for the force on the straightening element 33, so as to avoid rigid contact between the straightening element 33 and the second notched corner of the wafer, which would cause the sidewall of the second notched corner of the wafer to chip.

[0118] S52. When the second notch of the wafer is completely offset from the position of the corrector 33 and abuts against the second edge of the wafer, the first elastic member 35 is compressed so that the corrector 33 is received in the groove 34.

[0119] If the second notch of the wafer is completely offset from the corrector 33, the corrector 33 will abut against the second edge of the wafer and compress the first elastic member 35. The corrector 33 is housed in the groove 34. Although the corrector 33 retracts into the groove 34, it still maintains contact with the second edge of the wafer. During this process, the first elastic member 35 can also provide elastic buffering for the corrector 33 under stress, preventing the corrector 33 from forming rigid contact with the second edge of the wafer and preventing the second edge of the wafer from chipping due to excessive force.

[0120] In some examples, in step S52, when the second notch of the wafer is completely offset from the position of the corrector 33 and abuts against the second edge of the wafer, the first elastic member 35 is compressed so that the corrector 33 is received in the groove 34, and the step further includes the following steps:

[0121] S521. Start the drive mechanism 40 to drive the alignment mechanism 30 and the two sets of positioning mechanisms 20 to move away from the center of the carrier plate 11, so as to reset the alignment mechanism 30 and the two sets of positioning mechanisms 20 to the initial avoidance position.

[0122] S522. Readjust the circumferential position of the wafer on the carrier 200.

[0123] S523. Repeat step S5 until the center and notch of the carrier 200 and the wafer are precisely aligned. After the precise alignment of the center and notch of the carrier 200 and the wafer is completed, start the drive mechanism 40 to drive the two sets of positioning mechanisms 20 and the one set of alignment mechanisms 30 to move radially back to the initial avoidance position, completing the entire alignment process of the center and notch of the carrier 200 and the wafer. The wafer and carrier 200 on the carrier 11 can be transferred as a whole to subsequent bonding, thinning and other processes.

[0124] The detailed descriptions listed above are merely specific descriptions of feasible embodiments of the present invention, and are not intended to limit the scope of protection of the present invention. All equivalent embodiments or modifications made without departing from the spirit of the present invention should be included within the scope of protection of the present invention.

[0125] Furthermore, it should be understood that although this specification describes embodiments, not every embodiment contains only one independent technical solution. This narrative style is merely for clarity. Those skilled in the art should consider the specification as a whole, and the technical solutions in each embodiment can also be appropriately combined to form other embodiments that can be understood by those skilled in the art.

Claims

1. A semiconductor alignment device for performing corner notching and concentric circle alignment of a wafer and a carrier. Its features are, include: The carrier disk, two sets of positioning mechanisms and one set of alignment mechanisms are arranged around the outside of the carrier disk and are distributed at equal angles around the axis of the carrier disk, and a drive mechanism. The positioning mechanism includes a positioning column; The alignment mechanism includes: a fixed base, a plurality of guide rods slidably passing through the fixed base, a straightening member fixed to one end of the guide rods facing the center of the carrier plate, a groove formed in the fixed base to receive the straightening member, and a first elastic member abutting between the fixed base and the straightening member, the first elastic member being used to apply a preload force to the straightening member. The positioning mechanism and the alignment mechanism are driven by the driving mechanism to make radial translation relative to the center of the carrier, so that the edges of the wafer and the wafer are held by two positioning posts, and the straightening element is engaged in the notch of the wafer and the wafer or in the groove to hold the edges of the wafer and the wafer.

2. The semiconductor alignment device according to claim 1, characterized in that, The end of the guide rod away from the straightening element is configured with an external thread; The alignment mechanism further includes an adjusting member with internal threads, the adjusting member being disposed at the end of the guide rod away from the correcting member and abutting against the fixed seat; The internal thread of the adjusting member engages with the external thread of the guide rod. Rotating the adjusting member changes its axial position on the guide rod, thereby adjusting the distance between the straightening member and the fixed seat and setting the preload of the first elastic member.

3. The semiconductor alignment device according to claim 1, characterized in that, The fixing base includes: a support portion through which the guide rod passes, and a receiving portion disposed in the support portion and forming the groove; The corrective component includes: a connecting portion fixed to one end of the guide rod and connected to the first elastic element, and a corrective column vertically disposed in the connecting portion and receivable within the groove; The two positioning posts and the correction post are distributed at equal angles around the axis of the carrier plate.

4. The semiconductor alignment device according to claim 2, characterized in that, The preload of the first elastic element is configured such that when the straightening element abuts against the edge of the wafer or wafer, the straightening element is received in the groove due to the resistance generated by the abutment; when the straightening element moves to a position corresponding to the notch of the wafer or wafer, the preload can drive the straightening element to engage in the notch.

5. The semiconductor alignment device according to claim 1, characterized in that, The semiconductor alignment device further includes: a base arranged axially below the carrier disk, and a fixing ring coaxially disposed below the carrier disk and fixed to the base; The alignment mechanism and each of the positioning mechanisms include a transmission component; The positioning mechanism further includes a receiving block, and the positioning post is vertically disposed on the receiving block; The transmission assembly includes a guide rail disposed outside the fixed ring and extending radially, a slider guided to move radially on the guide rail, and a connecting rod vertically disposed on the slider to connect the fixed seat or the receiving block.

6. The semiconductor alignment device according to claim 5, characterized in that, The semiconductor alignment device further includes: a drive wheel coaxially disposed below the fixed ring, the drive wheel being controlled by the drive mechanism to rotate relative to the base; The drive wheel is constructed with three arc-shaped guide grooves that are equally distributed around the axis of the carrier disk. A guide rod is vertically installed on the lower surface of one end of the slider that passes through the fixed ring, and the guide rod passes through the arc-shaped guide groove. The drive mechanism drives the drive wheel to rotate, the arc-shaped guide groove pushes the guide rod to make the slider move closer to or away from the center of the carrier plate, and the positioning post and the straightening member move with the slider.

7. The semiconductor alignment device according to claim 6, characterized in that, The semiconductor alignment device further includes: a transmission wheel coaxially disposed below the drive wheel and rotating relative to the base; a first transmission rod vertically disposed on the upper surface of the transmission wheel; a second transmission rod vertically disposed on the lower surface of the drive wheel; and a second elastic member connecting the first transmission rod and the second transmission rod at both ends respectively. The driving mechanism includes: a driving unit, a third transmission rod eccentrically disposed with respect to the output shaft of the driving unit, a fourth transmission rod perpendicularly disposed on the lower surface of the transmission wheel, and a push rod, the two ends of which are rotatably connected to the third transmission rod and the fourth transmission rod, respectively. The transmission wheel is driven by the driving mechanism. The first transmission rod applies an elastic driving force to the second transmission rod through the second elastic element to drive the driving wheel to rotate, thereby causing the slider to move radially.

8. A semiconductor alignment method, comprising using the semiconductor alignment apparatus according to any one of claims 1 to 7 to perform corner-cutting and concentric circle alignment of a wafer and a carrier, characterized in that, include: S1. Place the slide onto the carrier tray; S2. Start the drive mechanism to drive the alignment mechanism and the two sets of positioning mechanisms to move towards the center of the carrier plate, so that the positioning post abuts against the first edge of the carrier piece and the straightening piece engages with the first notch of the carrier piece to align the first notch of the carrier piece. S3. After the first notch of the carrier is aligned, start the drive mechanism to drive the alignment mechanism and the two sets of positioning mechanisms to move away from the center of the carrier plate so that the corrector can be removed from the first notch of the carrier. S4. Place the wafer on the aligned carrier. S5. Start the drive mechanism, drive the alignment mechanism and the two sets of positioning mechanisms to move towards the center of the carrier, so that the two positioning posts simultaneously abut against the second edge of the wafer and the first edge of the carrier, and make the straightening element engage with the second notch of the wafer and the first notch of the carrier to align the second notch of the wafer and the first notch of the carrier, so as to achieve concentric circle alignment of the wafer and the carrier.

9. The semiconductor alignment method according to claim 8, characterized in that, The alignment of the first notch of the slide includes: S21. When there is a partial offset between the first notch of the carrier and the position of the straightening member, the straightening member can be engaged into the first notch of the carrier under the pre-tightening force of the first elastic member to perform alignment. S22. When the first notch of the carrier is completely offset from the position of the straightening member and abuts against the first edge of the carrier, the first elastic member is compressed so that the straightening member is received in the groove. The alignment of the second notch of the wafer and the first notch of the carrier includes: S51. When there is a partial offset between the second notch of the wafer and the position of the straightening component, the straightening component can be engaged into the second notch of the wafer and the first notch of the carrier under the pre-tightening force of the first elastic component to perform alignment. S52. When the second notch of the wafer is completely offset from the position of the corrector and abuts against the second edge of the wafer, the first elastic member is compressed so that the corrector is received in the groove.

10. The semiconductor alignment method according to claim 9, characterized in that, In step S22, when the first notch of the carrier piece is completely offset from the position of the corrector and abuts against the first edge of the carrier piece, the first elastic member is compressed so that the corrector is received in the groove. The step also includes the following steps: S221. Start the drive mechanism to drive the alignment mechanism and the two sets of positioning mechanisms to move away from the center of the tray, so as to reset the alignment mechanism and the two sets of positioning mechanisms to the initial avoidance position; S222. Readjust the circumferential position of the slide on the carrier disk; S223. Repeat step S2; In step S52, when the second notch of the wafer is completely offset from the position of the straightening member and abuts against the second edge of the wafer, the first elastic member is compressed so that the straightening member is received in the groove. The step also includes the following steps: S521. Start the drive mechanism to drive the alignment mechanism and the two sets of positioning mechanisms to move away from the center of the tray, so as to reset the alignment mechanism and the two sets of positioning mechanisms to the initial avoidance position. S522. Readjust the circumferential position of the wafer on the carrier. S523. Repeat step S5.

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