一种基于硅转接板的光电系统级封装模组及寿命预测方法
By embedding a sensor network and a hybrid evaluation system within the silicon adapter board, the internal temperature and stress of the package are monitored in real time. This solves the problems of the invisibility of the internal state of the package and the dynamic model adaptation in the prior art, and achieves high-precision lifetime prediction and thermal-mechanical load balancing, thus extending the service life of the optoelectronic system-level package module.
CN121985828BActive Publication Date: 2026-07-17JIANGNAN UNIV +1
View PDF 2 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- JIANGNAN UNIV
- Filing Date
- 2026-04-08
- Publication Date
- 2026-07-17
Smart Images
Figure CN121985828B_ABST
Abstract
本发明公开了一种基于硅转接板的光电系统级封装模组及寿命预测方法，属于半导体先进封装与可靠性技术领域。将硅转接板配置为集成无源器件与传感网络的功能化微系统载体，在消除封装介质层带来的热阻延迟、实时采集深层互连区域数据的同时，利用内埋阻容网络优化电源完整性；并且设置热隔离槽阻断横向热串扰；基于多物理场时序数据构建物理失效模型和神经网络修正的双驱动混合评估模型，利用长短期记忆网络捕捉并补偿动态电压频率调整工况下的非线性耦合损伤，输出高精度剩余寿命预测值，基于预测结果执行分级动态可靠性管理，通过任务迁移实现模组内部的热‑力负载均衡，从而在保障系统性能的前提下最大化延长光电系统级封装模组的平均使用寿命。
Need to check novelty before this filing date? Find Prior Art