Leveling mechanism and semiconductor apparatus

Abstract

The application discloses a leveling mechanism and a semiconductor device. The leveling mechanism comprises a first connecting piece, a second connecting piece, an active leveling unit and a passive leveling unit. The first connecting piece comprises a first horizontal plate, a second horizontal plate and a web, and a through hole is formed in the first horizontal plate. The second connecting piece is arranged on the opening side of the first connecting piece and comprises a first mounting surface, a second mounting surface and a connecting arm. The second mounting surface is connected with a piece to be leveled. The active leveling unit comprises an adjusting rod, the adjusting rod passes through the through hole of the first horizontal plate, and the end of the adjusting rod is adjustably abutted against the first mounting surface. The elastic piece of the passive leveling unit is arranged between the first horizontal plate and the first mounting surface in a pre-pressing state. In the application, the piece to be leveled is accurately adjusted to a horizontal state by the active leveling unit before operation, so that the operation precision and quality are ensured. During operation, the elastic piece of the passive leveling unit is used for realizing flexible self-adaptive adjustment, resolving local contact stress and preventing a substrate from being damaged due to overload. The single leveling mechanism is used for simultaneously considering active pose calibration and passive self-adaptive buffering.

Description

Technical Field

[0001] This application relates to the field of semiconductor equipment technology, and more particularly to leveling mechanisms and semiconductor equipment. Background Technology

[0002] In existing semiconductor equipment (such as bonding equipment), high-precision substrate leveling is crucial for bonding quality. However, current equipment generally suffers from the following problems: on the one hand, it is difficult to simultaneously achieve active leveling before bonding and dynamic leveling during bonding using a single device; on the other hand, real-time leveling is usually not possible during bonding, leading to localized pre-contact between the upper and lower substrates. This non-uniform contact easily causes stress concentration under high-pressure bonding conditions, resulting in damage to the upper and lower substrates or pressure pads, severely impacting bonding yield. Therefore, a novel leveling mechanism is urgently needed that can not only perform high-precision active leveling before bonding but also respond in real-time during bonding and maintain uniform pressure distribution, thereby effectively avoiding localized contact and improving bonding accuracy and reliability. Summary of the Invention

[0003] This application provides a leveling mechanism and a semiconductor device. In this application, the stroke of the adjusting rod is adjusted by an active leveling unit, changing the force-bearing position of the first mounting surface. This, in turn, drives the second mounting surface and the upper pressure plate to move via a connecting arm, ensuring the upper pressure plate reaches a horizontal state before bonding, thus achieving high-precision bonding. During passive leveling, a pre-compressed elastic element is placed between the first horizontal plate and the first mounting surface. When the upper pressure plate moves downward and contacts the lower pressure plate, if localized pre-contact occurs, the resulting upward reaction force will push the second connecting member upward, releasing the pre-compressed potential energy of the elastic element. This process utilizes the elastic deformation of the elastic element to absorb localized impacts, providing flexible buffering and adaptive adjustment capabilities, effectively dispersing contact stress, and preventing damage to the upper and lower substrates or pressure plates due to excessive localized stress, thereby ensuring bonding accuracy and equipment safety.

[0004] To achieve the above objectives, according to a first aspect of this application, a leveling mechanism is provided, comprising: The first connecting member includes a first horizontal plate and a second horizontal plate arranged in parallel, and a web plate connecting the two. A through hole is provided on the first horizontal plate. The second connector is disposed on the open side of the first connector, including a first mounting surface and a second mounting surface disposed in parallel, and a connecting arm connecting the two. The second mounting surface is connected to the leveling component, and the first mounting surface is disposed parallel to and opposite to the first horizontal plate. The active leveling unit includes at least one adjusting rod, which corresponds to one of the through holes on the first horizontal plate, and its end passes through the through hole on the first horizontal plate and adjustably abuts against the first mounting surface. The passive leveling unit includes an elastic element, which is disposed in a pre-compressed state between the first horizontal plate and the first mounting surface. The two ends of the elastic element abut against the first horizontal plate and the first mounting surface, respectively.

[0005] Furthermore, the adjusting rod includes a first adjusting rod and a second adjusting rod; The elastic element is positioned between the first adjusting rod and the second adjusting rod.

[0006] Furthermore, the active leveling unit also includes a locking element; The locking element is fitted around the outer periphery of the adjusting rod to fix its position.

[0007] Furthermore, the elastic element can be any one of a spring, an elastic rubber block, or an elastic sheet.

[0008] Furthermore, the leveling mechanism also includes a guide unit; The guide unit includes an elastic spring, one end of which is connected to a first mounting surface and the other end of which is connected to a second cross plate.

[0009] Furthermore, the first horizontal plate, the second horizontal plate, and the web plate of the first connector are integrally formed. The first mounting surface, the second mounting surface, and the connecting arm of the second connector are integrally formed.

[0010] Furthermore, the first connector has a C-shaped structure; The second connector has a Z-shaped structure.

[0011] According to a second aspect of this application, a semiconductor device is provided, the semiconductor device comprising: The leveling mechanism as described above; The part to be leveled is fixedly connected to the second mounting surface of the leveling mechanism so that the leveling mechanism can perform active and passive leveling of the part to be leveled. An electric press, connected to the workpiece to be leveled, is used to drive the workpiece to move and apply pressure to it. The support frame is connected to the leveling mechanism via a bellows assembly and connecting rods.

[0012] Furthermore, the connecting rod includes a first section and a second section along the axial direction; The bellows assembly is coaxially sleeved on the outer periphery of the second section; The bellows assembly includes a first connecting end, a second connecting end, and a bellows. The first connecting end is connected to a support frame, and the second connecting end is fixedly connected to a cavity that houses the component to be leveled.

[0013] Furthermore, it includes three leveling mechanisms, which are distributed 120° apart circumferentially; There are three connecting rods and three bellows assemblies, and the three connecting rods are connected to the three leveling mechanisms in a one-to-one correspondence. The three bellows assemblies are coaxially sleeved on the outer periphery of the three connecting rods.

[0014] Furthermore, the support frame is provided with mounting holes, which are configured to allow the electric press to pass through, so that the output end of the electric press extends to the bottom of the support frame and connects to the part to be leveled.

[0015] Furthermore, it also includes a linear guide rail and a slider that is slidably mounted on the linear guide rail; The slider is fixedly connected to the support frame, and is used to enable the support frame and the bellows assembly, connecting rod, and leveling component connected to the support frame to move linearly along the linear guide rail.

[0016] The leveling mechanism in this application embodiment, through the above technical solution, has at least the following beneficial effects: The integrated design adopted in this application, during active leveling, involves the adjusting rod of the active leveling unit passing through a through hole and abutting against the first mounting surface. By adjusting the stroke of the adjusting rod, the force-bearing point position of the first mounting surface can be changed, thereby driving the second mounting surface and the upper pressure plate to move via the connecting arm, so that the upper pressure plate reaches a horizontal state before bonding, thus achieving high-precision bonding. During passive leveling, a pre-compressed elastic element is placed between the first horizontal plate and the first mounting surface. When the upper pressure plate moves down and contacts the lower pressure plate, if local pre-contact occurs, the resulting upward reaction force will push the second connecting member upward, releasing the pre-compression potential energy of the elastic element. This process utilizes the elastic deformation of the elastic element to absorb local impacts, providing flexible buffering and adaptive adjustment capabilities, effectively dispersing contact stress, preventing damage to the upper and lower substrates or upper and lower pressure plates due to excessive local stress, thereby ensuring bonding accuracy and equipment safety. On the one hand, the active leveling unit precisely adjusts the workpiece to a horizontal state before operation, ensuring high-precision and high-quality bonding from the source. On the other hand, the passive leveling unit uses elastic elements to achieve flexible adaptive adjustment during bonding, effectively relieving local contact stress and preventing damage to the substrate or pressure plate due to overload. This allows a single leveling mechanism to simultaneously handle active pose calibration before bonding and passive adaptive buffering during bonding. The technical solution of this application realizes leveling functionality throughout the entire bonding process, overcoming the problem of difficulty in implementing real-time manual intervention during bonding pressurization, and improving the reliability and stability of the equipment.

[0017] Other features and advantages of this application will be described in detail in the following detailed description section. Attached Figure Description

[0018] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] To gain a more complete understanding of this application and its beneficial effects, the following description will be provided in conjunction with the accompanying drawings, wherein the same reference numerals in the following description denote the same parts.

[0020] Figure 1 This is one of the structural schematic diagrams of the leveling mechanism provided by the present invention; Figure 2 This is the second schematic diagram of the leveling mechanism provided by the present invention; Figure 3 This is one of the structural schematic diagrams of a semiconductor device using the leveling mechanism provided by the present invention; Figure 4 This is the second schematic diagram of the structure of a semiconductor device using the leveling mechanism provided by the present invention.

[0021] Explanation of reference numerals in the attached figures: 1-Leveling mechanism; 2-First connecting piece; 21-First transverse plate; 211-First through hole; 212-Second through hole; 22-Second transverse plate; 23-Web plate; 3-Second connector; 31-First mounting surface; 32-Second mounting surface; 33-Connecting arm; 4-Active leveling unit; 41-First adjusting rod; 42-Second adjusting rod; 43-First locking element; 44-Second locking element; 5-Passive leveling unit; 51-Elastic element; 6-Guide unit; 61-Elastic spring; 7-Connecting rod; 71-First section; 8-Bellwall assembly; 81-First connecting end; 82-Second connecting end; 83-Bellwall; 9-Electric Press; 10-Part to be leveled; 11-Lower pressure plate; 12-Support frame; 13-Outer frame; 14-Linear guide rail; 15-Slider; 16-Semiconductor equipment. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0023] In the description of this application, it should be understood that the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship according to the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0024] The terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Therefore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this application, unless otherwise stated, "a plurality of" means two or more.

[0025] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection, a direct connection, or an indirect connection through an intermediate medium; or they can refer to the internal communication between two components. Those skilled in the art can understand the specific meaning of the above terms in this application based on the specific circumstances.

[0026] This application provides a leveling mechanism and a semiconductor device, which will be described in detail below. It should be noted that the order of description of the following embodiments is not intended to limit the preferred order of the embodiments of this application. Furthermore, the descriptions of each embodiment have their own emphasis; parts not described in detail in a certain embodiment can be referred to in the relevant descriptions of other embodiments.

[0027] like Figure 1 and Figure 2As shown, the leveling mechanism 1 of this application includes a first connecting member 2, a second connecting member 3, an active leveling unit 4, and a passive leveling unit 5. The first connecting member 2 includes a first horizontal plate 21 and a second horizontal plate 22 arranged in parallel, and a web plate 23 connecting the two. A through hole is provided on the first horizontal plate 21. The second connecting member 3 is located on the open side of the first connecting member 2, including a first mounting surface 31 and a second mounting surface 32 arranged in parallel, and a connecting arm 33 connecting the two. The second mounting surface 32 is connected to the part to be leveled, and the first mounting surface 31 is arranged parallel to and opposite to the first horizontal plate 21. The active leveling unit 4 includes at least one adjusting rod, each corresponding to a through hole on the first horizontal plate 21. Its end passes through the through hole on the first horizontal plate 21 and adjustably abuts against the first mounting surface 31. The passive leveling unit 5 includes an elastic member 51, which is pre-compressed between the first horizontal plate 21 and the first mounting surface 31. Both ends of the elastic member 51 abut against the first horizontal plate 21 and the first mounting surface 31, respectively.

[0028] In this technical solution, taking the leveling mechanism 1 applied to bonding operations as an example, it illustrates how it achieves active leveling of the workpiece to be leveled (such as the upper pressure plate adsorbing the substrate) before bonding and passive leveling during the bonding process. Structurally, the first connecting member 2 consists of a parallel first horizontal plate 21, a second horizontal plate 22, and a web plate 23 connecting the two, which together form an opening, and the first horizontal plate 21 has a through hole. The second connecting member 3 consists of a parallel first mounting surface 31, a second mounting surface 32, and a connecting arm 33. The second connecting member 3 extends into the opening of the first connecting member 2, so that the first mounting surface 31 is adjacent to the web plate 23, and the second mounting surface 32 is fixedly connected to the upper pressure plate. During the active leveling process, the adjusting rod of the active leveling unit 4 passes through the through hole and abuts against the first mounting surface 31. By adjusting the stroke of the adjusting rod, the force-bearing point position of the first mounting surface 31 can be changed, which in turn drives the second mounting surface 32 and the upper pressure plate to move via the connecting arm 33, so that the upper pressure plate reaches a horizontal state before bonding, thereby achieving high-precision bonding. During passive leveling, the pre-compressed elastic element 51 is placed between the first horizontal plate 21 and the first mounting surface 31. When the upper pressure plate moves down and contacts the lower pressure plate, if local premature contact occurs, the resulting upward reaction force will push the second connecting member 3 up, releasing the pre-compression potential energy of the elastic element 51. This process utilizes the elastic deformation of the elastic element 51 to absorb local impacts, providing flexible buffering and adaptive adjustment capabilities, effectively dispersing contact stress, and preventing damage to the upper and lower substrates or upper and lower pressure plates due to excessive local stress, thereby ensuring bonding accuracy and equipment safety.

[0029] Therefore, the integrated design adopted in this application enables a single leveling mechanism 1 to simultaneously perform active pose calibration before bonding and passive adaptive buffering during bonding. On the one hand, the active leveling unit 4 precisely adjusts the workpiece to be leveled to a horizontal state before operation, ensuring high-precision and high-quality bonding from the source. On the other hand, the passive leveling unit 5 uses elastic elements to achieve flexible adaptive adjustment during bonding, effectively mitigating local contact stress and preventing damage to the substrate or pressure plate due to overload. This solution realizes leveling functionality throughout the entire bonding process, overcoming the difficulty of real-time manual intervention during bonding pressurization, and improving the reliability and stability of the equipment.

[0030] It is understood that in this embodiment, the number of through holes on the first horizontal plate 21 corresponds one-to-one with the number of adjusting rods included in the active leveling unit 4. That is, each adjusting rod passes through an independent through hole to ensure that each adjusting rod can adjust its position independently and without interference.

[0031] like Figure 1 and Figure 2 As shown, the adjusting rod includes a first adjusting rod 41 and a second adjusting rod 42. An elastic element 51 is disposed between the first adjusting rod 41 and the second adjusting rod 42.

[0032] In this technical solution, the first horizontal plate 21 has a first through hole 211 and a second through hole 212. Correspondingly, the active leveling unit 4 is equipped with a first adjusting rod 41 and a second adjusting rod 42, wherein the first adjusting rod 41 passes through the first through hole 211 and abuts against the first mounting surface 31, and the second adjusting rod 42 passes through the second through hole 212 and abuts against the first mounting surface 31. The elastic element 51 is placed between the two adjusting rods, and preferably, the first adjusting rod 41 and the second adjusting rod 42 are symmetrically arranged about the elastic element 51. This symmetrical structure of the double adjusting rods forms a stable multi-point adjustment system: during the active leveling process, the two adjusting rods work together to effectively counteract the tilting torque that is easily generated by single-point drive, ensuring that the position adjustment of the first mounting surface 31 is smoother, more uniform, and more controllable. This not only improves the repeatability of the upper pressure plate horizontal calibration, but also enhances the anti-interference capability of the system during the fine-tuning process, thereby ensuring the initial leveling quality before bonding.

[0033] It is understood that in this application, the first adjusting rod 41 and the second adjusting rod 42 are made of the same material and have the same length and outer diameter. This uniform design helps ensure that the two adjusting rods maintain a high degree of consistency in terms of stress deformation, coefficient of thermal expansion, and mechanical properties, thereby providing balanced support force and synchronous adjustment response during the coordinated leveling of the two adjusting rods, further improving the leveling accuracy. In addition, this application supports diverse adjustment strategies: the first adjusting rod 41 and the second adjusting rod 42 can be adjusted synchronously to achieve rapid overall convergence; or they can be adjusted independently in steps according to actual working conditions to complete the fine calibration of complex postures. This flexible operation method improves the adaptability of the leveling mechanism to different initial error states, ensuring the efficiency and accuracy of the leveling process.

[0034] like Figure 1 and Figure 2 As shown, the active leveling unit 4 also includes a locking component, which is sleeved on the outer periphery of the adjusting rod to fix the position of the adjusting rod.

[0035] In this technical solution, the active leveling unit 4 includes a first locking member 43 and a second locking member 44. The first locking member 43 is sleeved on the outer periphery of the first adjusting rod 41, and the second locking member 44 is sleeved on the outer periphery of the second adjusting rod 42. During active leveling, by adjusting the stroke of the two adjusting rods, the first mounting surface 31 is driven to change its position, thereby calibrating the upper pressure plate to a horizontal state. Then, the first locking member 43 and the second locking member 44 are immediately tightened to rigidly lock the axial position of the two adjusting rods, eliminating the risk of loosening of the adjusting rods due to equipment vibration, and ensuring that the obtained leveling accuracy remains unchanged in the subsequent bonding process.

[0036] It is understood that in this application, the first locking member 43 and the second locking member 44 are configured as standard parts with the same specifications. Specifically, they are manufactured from the same material and have the same inner diameter. This design not only ensures that the thread fit between the locking member and the corresponding adjusting rod (first adjusting rod 41, second adjusting rod 42) is consistent, but also ensures that when the same locking torque is applied, the axial clamping force and frictional resistance generated by the two are highly synchronized, thereby effectively avoiding unilateral loosening or uneven stress caused by differences in locking performance, and improving the reliability of the overall structure.

[0037] like Figure 1 and Figure 2 As shown, the elastic element 51 can be any one of a spring, an elastic rubber block, or an elastic sheet.

[0038] In this technical solution, the core function of the elastic element 51 is to store and release pre-compression potential energy through elastic deformation, thereby achieving the flexible buffering effect required for passive leveling. In specific implementations, the elastic element 51 can take various structural forms, including traditional metal coil springs, elastic rubber blocks with high damping characteristics, or compact elastic sheets (such as disc springs). Any of these elastic elements can be adapted to the leveling mechanism of this application to meet the differentiated requirements for stiffness, stroke, and damping characteristics under different working conditions.

[0039] like Figure 1 and Figure 2 As shown, the leveling mechanism 1 also includes a guide unit 6. The guide unit 6 includes an elastic spring 61, one end of which is connected to the first mounting surface 31, and the other end is connected to the second horizontal plate 22.

[0040] In this technical solution, the two ends of the elastic spring 61 are respectively connected to the second horizontal plate 22 of the first connecting member 2 and the first mounting surface 31 of the second connecting member 3, and the main body of the spring is parallel to the second horizontal plate 22 and the first mounting surface 31. While allowing vertical elastic displacement, the elastic spring 61 provides tangential torsional stiffness, restricts the rotational freedom of the leveling mechanism 1 in the horizontal plane, prevents circumferential deflection of the upper pressure plate, improves the motion accuracy of the upper pressure plate, and thus ensures the alignment accuracy and yield of the bonding process. Preferably, the elastic spring 61 in this application is a wave spring to achieve better load-bearing capacity and torsional resistance within a compact space.

[0041] like Figure 1 and Figure 2 As shown, the first mounting surface 31 is arranged parallel to the first horizontal plate 21. The first horizontal plate 21, the second horizontal plate 22, and the web plate 23 of the first connector 2 are integrally formed. The first mounting surface 31, the second mounting surface 32, and the connecting arm 33 of the second connector 3 are integrally formed.

[0042] In this technical solution, the first mounting surface 31 and the first horizontal plate 21 are designed to be parallel to each other, ensuring that the corresponding working surfaces of the first connecting member 2 and the second connecting member 3 remain parallel and aligned, providing stable geometric guidance for the leveling action. Preferably, the first connecting member 2 (including the first horizontal plate 21, the second horizontal plate 22, and the web plate 23) and the second connecting member 3 (including the first mounting surface 31, the second mounting surface 32, and the connecting arm 33) are both integrally molded. This design not only simplifies the manufacturing process and reduces assembly complexity, but more importantly, it eliminates the connection interface between components, thereby improving the overall rigidity and integrity of the structure. This allows the leveling mechanism to effectively resist bending and torsional deformation under high-pressure bonding conditions, ensuring dimensional stability and high reliability during long-term use.

[0043] Furthermore, it is understood that this application is not limited to a one-piece molded structure. Depending on the actual working conditions and manufacturing requirements, the first connector 2 and the second connector 3 can also be designed as a split-type splicing structure. That is, the main components of each connector (such as cross plates, web plates, mounting surfaces, etc.) can be manufactured separately and then connected to form a whole by welding or fasteners. This design provides greater manufacturing flexibility and is suitable for applications with small-batch customization or high requirements for the replaceability of individual components.

[0044] like Figure 1 and Figure 2 As shown, the first connector 2 has a C-shaped structure, and the second connector 3 has a Z-shaped structure. The second connector 3 is configured to be disposed within the C-shaped opening of the first connector 2. Preferably, the second connector 3 adopts a Z-shaped geometric design, wherein the connecting arm 33 is perpendicular to the first mounting surface 31 and the second mounting surface 32. This vertical structure design effectively ensures the stable transmission of torque in the vertical direction, providing a reliable geometric basis for the smooth operation of the leveling mechanism 1.

[0045] like Figure 3 and Figure 4 As shown, in some embodiments of this application, a semiconductor device 16 is also provided. The semiconductor device 16 includes a leveling mechanism 1, a component to be leveled 10, an electric press 9, and a support frame 12. The component to be leveled 10 is fixedly connected to the second mounting surface 32 of the leveling mechanism 1, so that the leveling mechanism 1 can perform active and passive leveling of the component to be leveled 10. The electric press 9 is connected to the component to be leveled 10 and is used to drive the component to be leveled 10 to move and provide pressure to the component to be leveled 10. The support frame 12 is connected to the leveling mechanism 1 through a bellows assembly 8 and a connecting rod 7.

[0046] In this technical solution, the electric press 9 serves as the power source, driving the workpiece 10 to be leveled (such as the upper pressure plate) to move vertically and contact the lower pressure plate 11 to apply pressure, thereby completing the bonding. The leveling mechanism 1 is integrated into the workpiece 10, providing active calibration leveling before bonding and flexible buffer adaptive leveling during the bonding process. The bellows assembly 8 and connecting rod 7 are connected to the leveling mechanism 1 to balance the force distribution on the workpiece 10, preventing swaying, tilting, or attitude deflection of the workpiece 10 due to eccentric loads or lateral disturbances during the pressure application by the electric press 9. This ensures that the motion trajectory of the workpiece 10 is precisely controllable throughout the bonding process, achieving a high-precision, high-stability bonding process. Furthermore, since the leveling mechanism 1 in the semiconductor device 16 has the same technical features as the aforementioned leveling mechanism 1, both can solve the same technical problems and achieve the same technical effects.

[0047] like Figure 3 and Figure 4As shown, the connecting rod 7 includes a first section 71 and a second section along the axial direction. The bellows assembly 8 is coaxially sleeved on the outer periphery of the second section. The bellows assembly 8 includes a first connecting end 81, a second connecting end 82, and a bellows 83. The first connecting end 81 is connected to the support frame 12, and the second connecting end 82 is fixedly connected to the cavity housing the leveling component 10.

[0048] In this technical solution, the second connecting end 82 of the bellows assembly 8 is rigidly connected to the cavity (not shown in the figure) of the semiconductor device, enclosing the first section 71 of the connecting rod 7, the leveling mechanism 1, and the part to be leveled 10 inside the cavity to create a vacuum working space that meets the requirements of the bonding process. Simultaneously, the bellows assembly 8 is tightly fitted around the outer periphery of the second section 72 of the connecting rod 7, sealing off any gas leakage channels that may arise due to mechanical fit gaps, preventing external air from intruding and disrupting the cavity vacuum. This ensures that the bonding process is carried out in a pure and stable vacuum environment, improving bonding accuracy and product yield.

[0049] like Figure 3 and Figure 4 As shown, the semiconductor device 16 includes three leveling mechanisms 1, which are distributed circumferentially at 120° intervals. There are three connecting rods 7 and three bellows assemblies 8, and the three connecting rods 7 are connected to the three leveling mechanisms 1 in a one-to-one correspondence. The three bellows assemblies 8 are coaxially sleeved on the outer periphery of the three connecting rods 7.

[0050] In this technical solution, if the series combination of the bellows assembly 8, the connecting rod 7, and the leveling mechanism 1 is defined as a leveling support unit, then the semiconductor device 16 of this application employs three such units. These three units are evenly arranged at 120° intervals along the circumference of the part to be leveled 10. This three-point symmetrical architecture can avoid internal stress caused by over-constraint and also ensure the uniform distribution of bonding pressure on the surface of the part to be leveled 10. During the leveling process of the semiconductor device, its posture stability and anti-deflection capability can be improved, and it can easily cope with the precision alignment requirements under heavy load conditions, providing a solid mechanical foundation for high-quality bonding.

[0051] like Figure 3 and Figure 4 As shown, the support frame 12 has mounting holes configured to allow the electric press 9 to pass through, so that the output end of the electric press 9 extends to the bottom of the support frame 12 and connects to the leveling component 10.

[0052] In this technical solution, the electric press 9 passes through the mounting hole of the support frame 12 and is directly connected to the part to be leveled 10, realizing direct axial drive and precise pressure loading of the part to be leveled 10. Furthermore, the working stroke and pressure output threshold of the electric press 9 can be configured as needed, allowing users to flexibly set them according to the specific specifications of the actual bonding process (such as temperature, material, thickness, etc.). This adjustable parameter mechanism ensures that the equipment can accurately match diverse process windows, maximizing the applicability and production efficiency of the equipment while ensuring bonding quality.

[0053] like Figure 3 and Figure 4 As shown, the semiconductor device 16 also includes a linear guide rail 14 and a slider 15 slidably mounted on the linear guide rail 14. The slider 15 is fixedly connected to the support frame 12 and is used to enable the support frame 12 and the bellows assembly 8, connecting rod 7, and leveling component 10 connected to the support frame 12 to move linearly along the linear guide rail 14.

[0054] In this technical solution, the linear guide rail 14 is mounted on the outer frame 13, and the slider 15 is slidably mounted on the linear guide rail 14 and supports the support frame 12. Through this guiding mechanism, the support frame 12 can drive the downstream bellows assembly 8, connecting rod 7, leveling mechanism 1, and the component to be leveled 10 to perform high-precision linear reciprocating motion along the axis of the linear guide rail 14. The introduction of the linear guide rail 14 restricts the unexpected lateral displacement and attitude deflection of the component to be leveled 10, ensuring the straightness and stability of the movement trajectory of the component to be leveled 10, reducing the impact of mechanical motion errors on bonding accuracy, and ensuring the bonding quality and yield of the final product.

[0055] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions in other embodiments.

[0056] In the description of this specification, specific features, structures, materials, or characteristics may be combined in any suitable manner in one or more embodiments or examples.

[0057] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of protection of the claims. Furthermore, specific examples have been used in the specification to illustrate the principles and implementation methods of this application. The description of the above embodiments is only for the purpose of helping to understand the method and core ideas of this application, and the content of this specification should not be construed as a limitation of this application.

Claims

1. A leveling mechanism, characterized in that, include: The first connector includes a first horizontal plate and a second horizontal plate arranged in parallel, and a web plate connecting the two. The first horizontal plate has a through hole. The first connector has a C-shaped structure. The first horizontal plate is located below the second horizontal plate. The second connector is disposed on the open side of the first connector, including a first mounting surface and a second mounting surface arranged in parallel, and a connecting arm connecting the two. The second mounting surface is connected to the leveling component, and the first mounting surface is arranged parallel to and opposite to the first horizontal plate. The second connector has a Z-shaped structure. The first mounting surface is closer to the second horizontal plate than the second mounting surface. The active leveling unit includes at least one adjusting rod, which corresponds to one-to-one with the through holes on the first horizontal plate, and its end passes through the through holes on the first horizontal plate and adjustably abuts against the first mounting surface. A passive leveling unit includes an elastic element, which is disposed in a pre-compressed state between the first horizontal plate and the first mounting surface, with both ends of the elastic element abutting against the first horizontal plate and the first mounting surface, respectively. The guide unit includes an elastic spring, one end of which is connected to the first mounting surface and the other end of which is connected to the second cross plate.

2. The leveling mechanism according to claim 1, characterized in that, The adjusting rod includes a first adjusting rod and a second adjusting rod; The elastic element is disposed between the first adjusting rod and the second adjusting rod.

3. The leveling mechanism according to claim 1, characterized in that, The active leveling unit also includes a locking element; The locking element is sleeved on the outer periphery of the adjusting rod to fix the position of the adjusting rod.

4. The leveling mechanism according to claim 1, characterized in that, The elastic element is any one of a spring, an elastic rubber block, or an elastic sheet.

5. The leveling mechanism according to claim 1, characterized in that, The first horizontal plate, the second horizontal plate, and the web plate of the first connector are integrally formed. The first mounting surface, the second mounting surface, and the connecting arm of the second connector are integrally formed.

6. A semiconductor device, characterized in that, include: The leveling mechanism according to any one of claims 1 to 5; The component to be leveled is fixedly connected to the second mounting surface of the leveling mechanism, so that the active and passive leveling of the component to be leveled can be performed by the leveling mechanism. An electric press, connected to the component to be leveled, is used to drive the component to be leveled to move vertically and to provide pressure to the component to be leveled; A support frame is disposed above the leveling mechanism and connected to the leveling mechanism via a corrugated pipe assembly and a connecting rod. The connecting rod includes a first section and a second section along the axial direction. The corrugated pipe assembly is coaxially sleeved on the outer periphery of the second section. The corrugated pipe assembly includes a first connecting end, a second connecting end, and a corrugated pipe. The first connecting end is connected to the support frame, and the second connecting end is fixedly connected to the cavity that houses the component to be leveled.

7. The semiconductor device according to claim 6, characterized in that, It includes three leveling mechanisms, which are distributed circumferentially at 120° intervals; There are three connecting rods and three bellows assemblies, and the three connecting rods are connected to the three leveling mechanisms in a one-to-one correspondence. The three bellows assemblies are coaxially sleeved on the outer periphery of the three connecting rods.

8. The semiconductor device according to claim 6, characterized in that, The support frame has mounting holes configured for the electric press to pass through, so that the output end of the electric press extends to the bottom of the support frame and connects to the leveling component.

9. The semiconductor device according to claim 6, characterized in that, It also includes a linear guide rail and a slider slidably mounted on the linear guide rail; the linear guide rail is arranged vertically. The slider is fixedly connected to the support frame, and is used to enable the support frame and the corrugated pipe assembly, the connecting rod, and the leveling component connected to the support frame to move linearly along the linear guide rail.

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