Encapsulating electronic devices with liquid thermal interface materials

Abstract

An electronic device (11) includes: (i) an integrated circuit (IC) die (22) mounted on a substrate (25); (ii) a cap (33) having first and second surfaces (32, 34) facing each other and one or more openings (66) formed through the cap between the first and second surfaces, the cap disposed over the IC die to form a space (23) between the IC die and the first surface (32) of the cap, the one or more openings configured to effect transfer of fluid through the cap; (iii) a liquid thermal interface material (TIM) (44) filling the space and configured to conduct heat from the IC die to the cap; and (iv) a stop structure (54) extending from the first surface of the cap, the stop structure comprising a sidewall (55) configured to receive the liquid TIM at least in a space between the IC die and the first surface of the cap.

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