一种电路板上元器件精密温控方法
By combining multi-dimensional state synchronous sampling and a thermal resistance-capacity observer model with an inverse physical model, the problems of sensor response lag and insufficient control accuracy in the temperature control scheme of circuit board components are solved, achieving high-precision temperature control and improving the dynamic response and long-term stability of the system.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INST OF HIGH ENERGY PHYSICS CHINESE ACAD OF SCI
- Filing Date
- 2026-04-09
- Publication Date
- 2026-07-17
AI Technical Summary
Existing temperature control solutions for circuit board components suffer from problems such as sensor response lag, insufficient control accuracy, and temperature overshoot caused by thermal inertia. These issues make it difficult to meet temperature control requirements, especially when the load changes rapidly or high precision is required.
By using multi-dimensional state synchronous sampling, combined with a discretized thermal resistance-thermal capacity observer model and an inverse physical model, the virtual junction temperature is calculated. A control strategy combining feedforward and feedback is adopted, and the instantaneous thermal power is calculated using the load current. A vertical heat conduction channel is constructed to reduce parasitic thermal resistance, thereby achieving precise temperature control of the components.
It significantly improves the dynamic response speed and control accuracy of the temperature control system, reduces temperature overshoot, ensures the model accuracy and robustness of the temperature control algorithm during long-term operation, and optimizes temperature stability and system energy efficiency.
Smart Images
Figure CN122002689B_ABST