集成式晶圆进仓前预处理设备
The integrated pre-processing equipment for wafers entering the warehouse with a three-layer vertical structure enables simultaneous linkage between dust removal and defect detection, solving the problems of low equipment space utilization and poor detection accuracy in existing technologies, and improving the processing yield and equipment adaptability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- WUXI SHANGJI SEMICON TECH CO LTD
- Filing Date
- 2026-04-09
- Publication Date
- 2026-07-17
AI Technical Summary
The lack of integrated pre-processing equipment for wafers before they enter the warehouse in the current technology leads to the decentralized operation of dust removal and defect detection, which is inefficient and has low equipment space utilization, affecting the accuracy of detection and the yield of processed products.
The integrated wafer pre-processing equipment adopts a three-layer vertical structure. The dust removal mechanism is located on the upper layer, the defect detection device is located on the middle layer, and the conveying mechanism is located on the lower layer. Non-direct imaging is achieved through the cooperation of mirrors and cameras. Dust removal is carried out simultaneously during the conveying process. Multiple sets of nozzles and a negative pressure system are used to ensure the cleanliness of the wafer surface.
Significantly reduces equipment footprint, increases integration, improves defect detection accuracy and yield, and ensures processing precision in subsequent processes.
Smart Images
Figure CN122003115B_ABST