Detection cutting sorting all-in-one machine for strain gauge chip and production process

Abstract

The present application belongs to the technical field of strain gauge chip processing equipment, and particularly relates to a detection, cutting and sorting integrated machine for strain gauge chips and a production process. The integrated machine comprises a feeding device, a detection device, a cutting device and a sorting device arranged in a cabinet. The feeding device comprises a rotating assembly and an adsorption assembly, which are configured to adsorb and position a strain gauge wafer. The detection device is configured to measure the resistance of each strain gauge chip of the strain gauge wafer. The strain gauge wafer after resistance measurement is transferred to the cutting device. The cutting device is configured to cut the strain gauge wafer. The strain gauge wafer after cutting is transferred to the sorting device. The sorting device is configured to sort and adsorb the strain gauge chips and discharge the strain gauge chips. The present application integrates the key processes such as feeding, detection, cutting and sorting in one cabinet, effectively avoids the frequent transfer of wafers and chips in traditional step-by-step operation, and significantly improves the continuity of the production process and the overall processing efficiency.

Description

Technical Field

[0001] This invention belongs to the technical field of strain gauge chip processing equipment, specifically relating to an integrated machine for detecting, cutting, and sorting strain gauge chips and its production process. Background Technology

[0002] As a core component of precision sensing, strain gauge chips involve critical manufacturing processes such as wafer loading, resistance detection, laser cutting, and finished chip sorting. The processing quality of each stage directly determines the performance stability and yield of the sensor. Traditional processing methods generally employ separate equipment such as probe stations, dicing machines, and sorting machines, resulting in frequent transfers of wafers and chips between different devices. This leads to significant breakpoints in process connections, severely insufficient production continuity, and overall processing efficiency that cannot meet the demands of large-scale mass production. Due to the tiny size and precise structure of strain gauge chips, the lack of a unified high-precision coordinate system and collaborative control mechanism among the independent equipment causes significant cumulative errors during repeated loading and positioning of the wafer. This easily leads to technical problems such as poor contact between the resistance probe and the chip, laser cutting path deviation, and sorting and picking misalignment, resulting in decreased processing accuracy and fluctuations in product consistency. Existing testing equipment generally lacks a dedicated probe structure adapted for the four-terminal resistance measurement of strain gauge chips, limiting testing reliability. At the same time, traditional decentralized operation modes rely on manual intervention, resulting in inherent defects such as low efficiency, insufficient accuracy, high losses, and weak automation. To address the aforementioned issues, there is an urgent need for an integrated solution that combines multiple key processes and enables fully automated precision machining. Summary of the Invention

[0003] To overcome the shortcomings of existing technologies, this invention provides an integrated machine and manufacturing process for detecting, cutting and sorting strain gauge chips, which has the advantages of improving strain gauge chip processing efficiency, reducing cumulative errors, and improving product consistency and yield.

[0004] An integrated machine for testing, cutting, and sorting strain gauge chips includes a feeding device, a testing device, a cutting device, and a sorting device, all housed within a cabinet. The feeding device includes a rotating component and an adsorption component. The rotating component is rotatably mounted on a platform of the cabinet, and the adsorption component is fixedly mounted on the top of the rotating component. The adsorption component is configured to adsorb and position the strain gauge wafers. After positioning, the strain gauge wafers are transferred to the detection device. The detection device includes a resistance measurement moving module, a resistance measurement probe module, and a first camera module. The resistance measurement moving module is configured to drive the resistance measurement probe module. The first camera module is located on one side of the resistance measurement probe module and is configured to identify the strain gauge chips of the strain gauge wafer. The resistance measurement probe module is configured to measure the resistance of each strain gauge chip of the strain gauge wafer. After resistance measurement, the strain gauge wafer is transferred to the cutting device. The cutting device includes a cutting moving module and a laser module. The cutting moving module is configured to drive the laser module, and the laser module is configured to cut strain gauge wafers. The cut strain gauge wafers are then transferred to a sorting device. The sorting device includes a sorting moving module, a suction cup module, a second camera module, and a feeding module. The sorting moving module is configured to drive the suction cup module. The second camera module is located on one side of the suction cup module and is configured to identify the cut strain gauge chips. The suction cup module is configured to sort and adsorb the strain gauge chips. The feeding module is configured to receive the sorted strain gauge chips.

[0005] Furthermore, this application also proposes that the rotating assembly includes a turntable and a drive motor, the drive motor is fixedly installed in the cabinet, the turntable is rotatably installed on the platform and is connected to the drive motor for transmission; the detection device, the cutting device and the sorting device are arranged sequentially along the outer circumference of the turntable.

[0006] Furthermore, this application also proposes that a flange mounting hole is provided at the center of the turntable; the adsorption assembly includes a flange pipe, a vent plate, a vent connecting plate, a suction cup plate, and a suction cup mesh plate. The flange pipe is fixedly connected to the drive motor and is located at the center of the turntable; the vent plate is aligned with the flange pipe and located on the upper surface of the turntable, and the vent plate has four vents along its circumferential side; the suction cup plate is connected to the vents through the vent connecting plate; the suction cup mesh plate is located on the top of the suction cup plate; the suction cup plate is provided with vent grooves, and the suction cup mesh plate is provided with mesh holes corresponding to the vent grooves; a negative pressure circuit is formed between the flange pipe, the vent plate, the vent connecting plate, the flange pipe, and the suction cup mesh plate, and the flange pipe is connected to a negative pressure generating device to form a negative pressure adsorption area at the suction cup mesh plate to adsorb strain gauge wafers.

[0007] Furthermore, this application also proposes that the resistance measurement moving module includes a resistance measurement X-axis linear module, a resistance measurement Y-axis linear module, a resistance measurement Z-axis linear module, and a resistance measurement turntable assembly; the resistance measurement X-axis linear module is fixedly mounted on the platform via a resistance measurement module bracket, the resistance measurement Y-axis linear module is slidably connected to the resistance measurement X-axis linear module, the resistance measurement Z-axis linear module is slidably connected to the resistance measurement Y-axis linear module, the resistance measurement turntable assembly is slidably mounted on the resistance measurement Z-axis linear module, and the resistance measurement probe module is mounted below the resistance measurement turntable assembly.

[0008] Furthermore, this application also proposes that the cutting moving module includes a cutting X-axis linear module, a cutting Y-axis linear module, and a cutting Z-axis linear module; the cutting X-axis linear module is fixedly mounted on the platform via a cutting module bracket, the cutting Y-axis linear module is slidably connected to the cutting X-axis linear module, the cutting Z-axis linear module is slidably connected to the cutting Y-axis linear module, and the laser module is slidably connected to the cutting Z-axis linear module; And / or, the cutting device also includes a cutting dust hood and a light source cover. The cutting dust hood is mounted above the strain gauge wafer to be cut via a cantilever plate and is connected to a dust collection device. The light source cover is located on top of the cutting dust hood.

[0009] Furthermore, this application also proposes that the resistance measuring turntable assembly includes a hollow turntable, a turntable module motor, and a turntable mounting flange. The hollow turntable is fixedly mounted on the mounting slide plate of the resistance measuring Z-axis linear module via a turntable mounting plate. The turntable module motor is connected to the hollow turntable via a drive connection. The resistance measuring probe module is connected to the hollow turntable via the turntable mounting flange, so that the resistance measuring probe module rotates along the rotation axis of the hollow turntable. The first camera module includes a first camera bracket, a first industrial camera, and a resistance measurement and positioning light source. The first industrial camera is fixedly mounted on one side of the turntable mounting flange via the first camera bracket, and the resistance measurement and positioning light source is mounted below the first industrial camera via a light source mounting plate. The resistance probe module includes a resistance probe bakelite base and a resistance probe box cover. The resistance probe bakelite base is set at the bottom of the turntable mounting flange through the resistance probe box cover. The resistance probe box cover is provided with a wire insertion slot. The resistance probe bakelite base has several mounting holes and probe units installed in the mounting holes, and the probe units are connected to the resistance probe plug-in plate. The probe unit consists of four probes arranged in two parallel rows. The probe unit is configured to perform electrical function detection on the four contact terminals of the strain gauge chip respectively. The hollow turntable, the turntable mounting flange, and the resistance probe box cover form the wiring channel.

[0010] Furthermore, this application also proposes that the sorting moving module includes a sorting X-axis moving module, a sorting Y-axis moving module, a sorting Z-axis moving module, and a suction cup rotation module, used to drive the suction cup module to achieve three-dimensional movement and drive the suction cup module to rotate around an axis perpendicular to the turntable plane; The suction cup module includes a suction cup rotation module, a suction cup rotation plate, a suction cup assembly, and a suction cup control valve assembly. The suction cup rotation module is mounted on the mounting slider of the sorting Z-axis moving module via a turntable mounting plate. The suction cup assembly is mounted on the bottom of the suction cup rotation module via the suction cup rotation plate. The suction cup control valve assembly is mounted on the sorting Z-axis moving module and is used to control the start and stop of the suction cup assembly. The second camera module includes a second industrial camera and a second camera light source. The second industrial camera is located on the other side of the suction cup rotating plate, and the second camera light source is located below the second industrial camera.

[0011] Furthermore, this application also proposes that the unloading module includes an unloading bin, an empty tray stacking assembly, a full-load tray stacking assembly, a transfer assembly, and a tray drive assembly. The unloading bin is slidably mounted on the cabinet via a bin slide rail, and the bin slide rail is equipped with a clamping cylinder for fixing the unloading bin. The empty tray stacking assembly and the full-load tray stacking assembly are sequentially arranged at the ends of the unloading bin for accommodating empty trays without strain gauge chips and full-load trays with strain gauge chips. The transfer assembly is slidably mounted inside the unloading bin, and the tray drive assembly is connected to the transfer assembly for driving the transfer assembly to remove an empty tray from the empty tray stacking assembly and transfer it to the unloading position of the unloading bin, or to drive the transfer assembly to transfer a full-load tray from the unloading position of the unloading bin to the full-load tray stacking assembly.

[0012] Furthermore, this application also proposes that the empty pallet stacking assembly includes an empty pallet rack, an empty pallet support fork, and a drive cylinder. The empty pallet rack is fixedly installed in the unloading bin, and the empty pallet support fork is installed on opposite sides of the bottom of the empty pallet rack. The empty pallet support fork is driven by the drive cylinder. The empty pallet support fork is configured to retract when the transfer assembly carries the bottom empty pallet, and reset after the bottom empty pallet drops a preset height to support the next bottom empty pallet. The full-load pallet stacking assembly includes a full-load pallet rack and a full-load pallet baffle. The full-load pallet rack is fixedly installed in the unloading hopper, and the full-load pallet baffle is installed on opposite sides of the bottom of the full-load pallet rack. The full-load pallet baffle is an upward-flipping one-way baffle and is configured to receive the full-load pallet lifted by the transfer assembly. The transfer assembly includes a first mounting plate, a second mounting plate, a lifting plate, a lifting cylinder, and lifting rods. The first mounting plate is slidably mounted on the slide rail of the unloading hopper. The second mounting plate is suspended below the first mounting plate via a connecting rod. The lifting cylinder is mounted on the second mounting plate, and its drive end is connected to the lifting plate. The lifting rod is mounted on the lifting plate and passes through both the first and second mounting plates. The lifting cylinder is configured to drive several lifting rods to lift and lower synchronously, for placing the pallet on the first mounting plate or lifting a fully loaded pallet from the first mounting plate.

[0013] Furthermore, this application also proposes a manufacturing process that can be used in the aforementioned integrated inspection, cutting, and sorting machine for strain gauge chips. The manufacturing process includes: A strain gauge wafer is adsorbed and positioned by the feeding device, and the strain gauge wafer is transferred to the detection device. The detection device acquires an image of the strain gauge wafer and identifies the position coordinates of each strain gauge chip on it; the resistance measurement moving module is controlled to drive the resistance measurement probe module to move sequentially to each strain gauge chip for contact resistance measurement, and the strain gauge wafer is transferred to the cutting device through the rotating component. The strain gauge wafers are cut by the cutting device and transferred to the sorting device by the rotating assembly. The sorting device identifies the cut strain gauge chips, and the suction cup module is used to sort and adsorb the strain gauge chips. The feeding module receives the sorted strain gauge chips, and the rotating component rotates to its initial position to receive new strain gauge wafers.

[0014] This invention relates to an integrated inspection, cutting, and sorting machine for strain gauge chips. By integrating key processes such as loading, inspection, cutting, and sorting into a single cabinet, it effectively avoids the frequent transfer of wafers and chips in traditional step-by-step operations, significantly improving the continuity of the production process and overall processing efficiency. This integrated design reduces the cumulative errors caused by repeated loading and positioning, thereby improving the processing accuracy and product consistency of resistance measurement, cutting, and sorting. Furthermore, this integrated machine achieves fully automated operation, reducing reliance on manual intervention and increasing the degree of automation in production. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on the structures shown in these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram showing the structure of the integrated detection, cutting, and sorting machine of the present invention; Figure 2 This is a schematic diagram showing the structure of the feeding device of the present invention; Figure 3 This is a schematic diagram showing the structure of the adsorption component of the present invention; Figure 4 express Figure 3 A magnified schematic diagram of the local structure at point A; Figure 5 A schematic diagram showing the structure of the detection device of the present invention; Figure 6 This is a top view schematic diagram of the detection device of the present invention; Figure 7 This is a schematic diagram showing the structure of the resistance measuring turntable assembly of the present invention; Figure 8 express Figure 7 A magnified view of the structure at point B in the middle, used to show the mounting holes for mounting the probe on the bakelite base of the resistance probe; Figure 9 This is a schematic diagram showing the structure of the cutting device of the present invention; Figure 10 This is a schematic diagram showing the structure of the sorting moving module of the present invention; Figure 11 express Figure 10 A magnified schematic diagram of the structure at point C in the middle; Figure 12 This is a front view schematic diagram of the sorting and moving module of the present invention; Figure 13 This is a schematic diagram showing the structure of the feeding module of the present invention; Figure 14 This is an exploded view of the material feeding module of the present invention. Figure 15 This is a schematic diagram showing the structure of the transfer component of the present invention; Figure 16 This is a schematic diagram showing the structure of the full-load disk stacking assembly of the present invention; Figure 17 This is a schematic diagram showing the structure of the empty disk stacking assembly of the present invention.

[0017] The symbols in the attached image are explained as follows: 1-Feeding device; 11-Rotating assembly; 111-Turntable; 112-Drive motor; 12-Adsorption assembly; 121-Flange pipe; 122-Ventilation plate; 123-Ventilation connection plate; 124-Suction cup plate; 125-Suction cup mesh plate; 2-Detection device; 21-Resistance measuring moving module; 211-Resistance measuring X-axis linear module; 212-Resistance measuring Y-axis linear module; 213-Resistance measuring Z-axis linear module; 214-Resistance measuring turntable assembly; 2141-Hollow turntable; 2142-Turntable module motor; 2143-Turntable mounting flange; 22-Resistance measuring probe module; 221-Resistance measuring probe bakelite base; 222-Resistance measuring probe box cover; 23-First camera module; 231-First camera bracket; 232-First industrial camera; 3-Cutting device; 31-Cutting moving module; 311-Cutting X-axis linear module; 312-Cutting Y-axis linear module; 313-Cutting Z-axis linear module; 32-Laser module; 33-Cutting dust suction hood; 331-Cantilever plate; 34-Light source cover; 4-Sorting device; 41-Sorting moving module; 411-Sorting X-axis moving module; 412-Sorting Y-axis moving module; 413-Sorting Z-axis moving module; 42-Suction cup module; 421-Suction cup rotation module; 422-Suction cup rotation plate; 423-Suction cup assembly; 424-Suction cup control valve assembly; 43-Second camera module; 431-Second industrial camera; 432-Second camera bracket; 44-Unloading module; 441-Unloading bin; 44 2- Empty pallet stacking assembly; 443- Fully loaded pallet stacking assembly; 445- Transfer assembly; 446- Pallet drive assembly; 447- Hopper slide rail; 4421- Empty pallet rack; 4422- Empty pallet support fork; 4423- Drive cylinder; 4431- Fully loaded pallet rack; 4432- Fully loaded pallet baffle; 4451- First mounting plate; 4452- Second mounting plate; 4453- Lifting plate; 4454- Lifting cylinder; 4455- Lifting rod. Detailed Implementation

[0018] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0019] Please refer to Figures 1-17 This embodiment proposes an integrated machine for testing, cutting and sorting strain gauge chips, including a feeding device 1, a testing device 2, a cutting device 3 and a sorting device 4 installed in a cabinet; The feeding device 1 includes a rotating component 11 and an adsorption component 12. The rotating component 11 is rotatably mounted on a platform of the cabinet, and the adsorption component 12 is fixedly mounted on the top of the rotating component 11. The adsorption component 12 is configured to adsorb and position the strain gauge wafers, and the positioned strain gauge wafers are transferred to the detection device 2. The detection device 2 includes a resistance measurement moving module 21, a resistance measurement probe module 22, and a first camera module 23. The resistance measurement moving module 21 is configured to drive the resistance measurement probe module 22. The first camera module 23 is located on one side of the resistance measurement probe module 22 and is configured to identify the strain gauge chips of the strain gauge wafer. The resistance measurement probe module 22 is configured to measure the resistance of each strain gauge chip of the strain gauge wafer. After resistance measurement, the strain gauge wafer is transferred to the cutting device 3. The cutting device 3 includes a cutting moving module 31 and a laser module 32. The cutting moving module 31 is configured to drive the laser module 32. The laser module 32 is configured to cut strain gauge wafers. The cut strain gauge wafers are transferred to the sorting device 4. The sorting device 4 includes a sorting moving module 41, a suction cup module 42, a second camera module 43, and a feeding module 44. The sorting moving module 41 is configured to drive the suction cup module 42. The second camera module 43 is located on one side of the suction cup module 42 and is configured to identify the cut strain gauge chips. The suction cup module 42 is configured to sort and adsorb the strain gauge chips. The feeding module 44 is configured to receive the sorted strain gauge chips.

[0020] This embodiment of the integrated inspection, cutting, and sorting machine for strain gauge chips integrates key processes such as loading, inspection, cutting, and sorting within the same cabinet, achieving fully automated continuous processing of strain gauge wafers from loading to unloading finished chips. This integrated design reduces the frequent transfer of wafers and chips between different devices, lowers the need for manual intervention, and effectively avoids the cumulative errors caused by multiple positioning in traditional step-by-step operation modes, thus improving processing accuracy and product consistency. Simultaneously, through the collaborative work of various functional modules, the production process is optimized, significantly improving overall processing efficiency and meeting the needs of large-scale mass production of strain gauge chips.

[0021] In existing technologies, strain gauge wafers need to be transferred between different processing units during multiple processes, including loading, inspection, dicing, and sorting. However, if a simple linear layout or independent transport mechanism is used between the processing units, the equipment may have a large footprint and the wafers may have long transport paths between different workstations, thus affecting the overall processing efficiency and the compactness of the equipment.

[0022] This embodiment further proposes that the rotating component 11 includes a turntable 111 and a drive motor 112. The drive motor 112 is fixedly installed inside the platform, and the turntable 111 is rotatably installed on the platform and is connected to the drive motor 112 for transmission. The detection device 2, the cutting device 3 and the sorting device 4 are arranged sequentially along the outer circumferential surface of the turntable 111.

[0023] Understandably, the size and shape of the turntable 111 can be designed according to the specifications of the wafers and the number of processing stations required. Its main function is to serve as a carrier, supporting the adsorption assembly 12 that holds the strain gauge wafers and precisely rotating it to different processing stations such as the detection device 2, the cutting device 3, and the sorting device 4. The detection device 2, the cutting device 3, and the sorting device 4 are arranged sequentially along the outer periphery of the turntable 111. This layout means that the main processing units, such as the detection device 2, the cutting device 3, and the sorting device 4, are arranged in a ring or arc around the outer edge of the turntable 111. This ring layout allows the turntable 111 to sequentially deliver the strain gauge wafers to each processing station as it rotates. For example, after the loading device 1 places the wafers onto the adsorption assembly 12 on the turntable 111, the turntable 111 rotates to the area under the detection device 2 for detection. After detection, it continues to rotate to the area under the cutting device 3 for cutting, and finally rotates to the area under the sorting device 4 for sorting.

[0024] In this embodiment, the detection device 2, cutting device 3, and sorting device 4 are sequentially arranged along the outer circumference of the turntable 111, and the turntable 111 is driven to rotate by the drive motor 112, realizing the automated and sequential flow of strain gauge wafers between different processing stations. This ring-shaped layout significantly shortens the transmission distance of wafers between stations, avoids complex linear reciprocating transmission mechanisms, and thus effectively reduces the overall footprint of the equipment, improving its compactness. Simultaneously, the precise rotational positioning capability of the turntable 111 ensures that the wafers can accurately stop at each processing station, guaranteeing the accuracy and efficiency of detection, cutting, and sorting. This integrated design makes the entire detection, cutting, and sorting process smoother and more efficient, significantly improving the production efficiency and automation level of strain gauge chips.

[0025] This embodiment further proposes that the turntable 111 has a flange mounting hole at its center; the adsorption assembly 12 includes a flange pipe 121, a vent plate 122, a vent connecting plate 123, a suction cup plate 124, and a suction cup mesh plate 125. The flange pipe 121 is fixedly connected to the drive motor 112 and is located at the center of the turntable 111; the vent plate 122 is aligned with the flange pipe 121 and located on the upper surface of the turntable 111, and the vent plate 122 has four vents along its circumferential side; the suction cup plate 124... The ventilation connection plate 123 is connected to the ventilation port respectively; the suction cup mesh plate 125 is set on the top of the suction cup plate 124; the suction cup plate 124 is provided with ventilation grooves, and the suction cup mesh plate 125 is provided with mesh corresponding to the ventilation grooves; a negative pressure circuit is formed between the flange pipe 121, the ventilation plate 122, the ventilation connection plate 123, the flange pipe 121 and the suction cup mesh plate 125, and the flange pipe 121 is connected to the negative pressure generating device to form a negative pressure adsorption area at the suction cup mesh plate 125 to adsorb the strain gauge wafer.

[0026] Understandably, the vent plate 122 is aligned with the flange pipe 121 and located on the upper surface of the turntable 111. The vent plate 122 serves as a transition layer for the distribution of negative pressure from the central flange pipe 121 to the outside, and its precise alignment with the flange pipe 121 ensures efficient negative pressure transmission. The vent plate 122 has four vents along its circumferential side, which disperse the negative pressure to multiple points, contributing to a more uniform adsorption force distribution. The suction cup plate 124 is connected to the vents via vent connecting plates 123. The vent connecting plates 123 serve as a further distribution channel for the negative pressure, effectively guiding the negative pressure from the vent plate 122 to the suction cup plate 124, ensuring that the suction cup plate 124 receives sufficient negative pressure. A perforated suction cup plate 125 is located on top of the suction cup plate 124. This perforated suction cup plate 125 is the surface that directly contacts the strain gauge wafer, and its perforation design is crucial for uniform adsorption. The suction cup plate 124 is provided with ventilation grooves, and the suction cup mesh plate 125 is provided with mesh holes corresponding to the ventilation grooves. The ventilation grooves of the suction cup plate 124 and the corresponding mesh holes of the suction cup mesh plate 125 work together to form a fine negative pressure adsorption surface, ensuring that the negative pressure can be applied evenly to the entire bottom surface of the strain gauge wafer, avoiding local stress concentration or uneven adsorption, and providing a good adsorption and fixation effect for the entire wafer or individual chips divided from the wafer.

[0027] In this embodiment, the adsorption component 12 employs a precise negative pressure circuit design. Through the synergistic effect of the flange pipe 121, the vent plate 122, the vent connection plate 123, the suction cup plate 124, and the suction cup mesh plate 125, a uniform and powerful negative pressure adsorption zone is formed at the suction cup mesh plate 125. This design ensures that the strain gauge wafer is stably and accurately positioned on the turntable 111 of the rotating component 11 after being adsorbed. Even when the turntable 111 rotates at high speed or changes positions, it effectively prevents the wafer from shifting, shaking, or falling off. The stable adsorption and precise centering of the wafer greatly improves the accuracy and efficiency of the subsequent resistance measurement by the detection device 2, the laser cutting by the cutting device 3, and the chip sorting by the sorting device 4. It avoids detection errors, poor cutting, or sorting failures caused by inaccurate wafer positioning, thereby significantly improving the automation level and production yield of the entire integrated detection, cutting, and sorting machine.

[0028] This embodiment further proposes a resistance measurement moving module 21, including a resistance measurement X-axis linear module 211, a resistance measurement Y-axis linear module 212, a resistance measurement Z-axis linear module 213, and a resistance measurement turntable assembly 214. The resistance measurement X-axis linear module 211 is fixedly mounted on the platform by a resistance measurement module bracket. The resistance measurement Y-axis linear module 212 is slidably connected to the resistance measurement X-axis linear module 211. The resistance measurement Z-axis linear module 213 is slidably connected to the resistance measurement Y-axis linear module 212. The resistance measurement turntable assembly 214 is slidably mounted on the resistance measurement Z-axis linear module 213. The resistance measurement probe module 22 is mounted below the resistance measurement turntable assembly 214.

[0029] This embodiment refines the resistance measurement moving module 21 into a multi-axis motion system composed of a resistance measurement X-axis linear module 211, a resistance measurement Y-axis linear module 212, a resistance measurement Z-axis linear module 213, and a resistance measurement turntable assembly 214, achieving precise translation and angular rotation of the resistance measurement probe module 22 in three-dimensional space. The sliding connection between the resistance measurement X-axis linear module 211 and the resistance measurement Y-axis linear module 212 allows the probe module to perform high-precision positioning on the horizontal plane, covering any strain gauge chip on the strain gauge wafer. The introduction of the resistance measurement Z-axis linear module 213 ensures vertical accuracy and pressure control when the probe contacts the chip, avoiding damage to the chip and ensuring reliable electrical contact. The resistance measurement turntable assembly 214 allows the resistance measurement probe module 22 to adjust its angle according to the actual arrangement direction of the strain gauge chips, effectively solving the potential angular deviation problem of chips on the wafer and greatly improving the alignment accuracy and efficiency of the probe-chip contact end. In this embodiment, the motion control method combining multi-axis linkage, translation and rotation significantly improves the flexibility, accuracy and automation of the detection device 2 in measuring the resistance of densely arranged strain gauge chips with multiple orientations, thereby ensuring the reliability of the detection results.

[0030] This embodiment further proposes a cutting moving module 31 including a cutting X-axis linear module 311, a cutting Y-axis linear module 312, and a cutting Z-axis linear module 313; the cutting X-axis linear module 311 is fixedly mounted on the platform by a cutting module bracket, the cutting Y-axis linear module 312 is slidably connected to the cutting X-axis linear module 311, the cutting Z-axis linear module 313 is slidably connected to the cutting Y-axis linear module 312, and the laser module 32 is slidably connected to the cutting Z-axis linear module 313.

[0031] Understandably, the X-axis linear cutting module 311, the Y-axis linear cutting module 312, and the Z-axis linear cutting module 313 together constitute the cutting motion module 31, used to achieve precise movement of the laser module 32 in three-dimensional space. The X-axis linear cutting module 311 is responsible for providing linear movement along the X direction, the Y-axis linear cutting module 312 is responsible for providing linear movement along the Y direction, and the Z-axis linear cutting module 313 is responsible for providing linear movement along the Z direction. Specifically, the X-axis linear cutting module 311 can be fixed to the platform, the Y-axis linear cutting module 312 is connected to the X-axis linear cutting module 311 via a slider to achieve movement in the Y direction, and the Z-axis linear cutting module 313 is then connected to the Y-axis linear cutting module 312 via a slider to achieve movement in the Z direction.

[0032] This embodiment configures the cutting moving module 31 into a three-axis linkage structure consisting of a cutting X-axis linear module 311, a cutting Y-axis linear module 312, and a cutting Z-axis linear module 313. This provides the laser module 32 with high-precision and high-stability three-dimensional motion control, thereby achieving precise cutting of the strain gauge wafer and significantly improving cutting quality and efficiency.

[0033] This embodiment further proposes that the cutting device 3 also includes a cutting dust hood 33 and a light source cover 34. The cutting dust hood 33 is installed above the strain gauge wafer to be cut by a cantilever plate 331 and is connected to a dust collection device. The light source cover 34 is disposed on the top of the cutting dust hood 33.

[0034] Understandably, the cutting dust hood 33 is a structure placed over the strain gauge wafer to be cut. Its main function is to effectively collect and isolate cutting debris, fumes, and dust generated during laser cutting. When the dust collection equipment is working, a negative pressure is formed inside the dust hood, which quickly sucks away contaminants generated during cutting, preventing them from spreading to the working area or depositing on the wafer surface and inside the equipment. The cantilever plate 331 is used to support the cutting dust hood 33 and precisely position it above the strain gauge wafer to be cut. The light source cover 34 is placed on top of the cutting dust hood 33. Its function is to protect the laser module 32 or other auxiliary light sources (such as positioning light sources and illumination light sources) used in the cutting process from contamination by dust and fumes generated during cutting. Understandably, the light source cover 34 is made of transparent glass with a low refractive index.

[0035] In this embodiment, the cutting dust hood 33 is mounted above the cutting area via a cantilever plate 331 and connected to a dust collection device. This effectively captures and removes debris and fumes generated during laser cutting, preventing contaminant diffusion, maintaining the cleanliness of the wafer surface, avoiding impact on subsequent sorting, and extending the equipment's lifespan. Furthermore, the inclusion of a light source cover 34 further protects the cutting light source, ensuring its normal operation. These improvements collectively ensure a clean, efficient, and high-precision cutting process, providing high-quality semi-finished products for subsequent chip sorting.

[0036] This embodiment further proposes a resistance measurement turntable assembly 214 including a hollow turntable 2141, a turntable module motor 2142, and a turntable mounting flange 2143. The hollow turntable 2141 is fixedly mounted on the mounting slide plate of the resistance measurement Z-axis linear module 213 via a turntable mounting plate. The turntable module motor 2142 is connected to the hollow turntable 2141 via a drive connection. The resistance measurement probe module 22 is connected to the hollow turntable 2141 via the turntable mounting flange 2143, so that the resistance measurement probe module 22 rotates along the rotation axis of the hollow turntable 2141. The first camera module 23 includes a first camera bracket 231, a first industrial camera 232, and a resistance measurement and positioning light source. The first industrial camera 232 is fixedly mounted on one side of the turntable mounting flange 2143 via the first camera bracket 231, and the resistance measurement and positioning light source is mounted below the first industrial camera 232 via a light source mounting plate. The resistance probe module 22 includes a resistance probe bakelite base 221 and a resistance probe box cover 222. The resistance probe bakelite base 221 is set at the bottom of the turntable mounting flange 2143 through the resistance probe box cover 222. The resistance probe box cover 222 is provided with a wire insertion slot. The resistance probe bakelite base 221 is provided with several probe units, and the probe units are connected to the resistance insertion board. The probe unit consists of four probes arranged in two parallel rows. The probe unit is configured to perform electrical function detection on the four contact ends of the strain gauge chip respectively. The hollow turntable 2141, the turntable mounting flange 2143, and the resistance probe box cover 222 form the wiring channel.

[0037] In this embodiment, when the strain gauge chip on the wafer is subjected to resistance measurement by the detection device 2, the resistance measurement turntable assembly 214 can drive the resistance measurement probe module 22 to perform precise rotational adjustment along the rotation axis of the hollow turntable 2141. This allows the probe module to flexibly adapt to any angle of the strain gauge chip. Even if there is a slight angular deviation in the chip, it can be compensated for by rotation, ensuring that the probe unit achieves precise alignment and reliable contact with the four contact ends of the chip, greatly improving the accuracy and success rate of the detection. At the same time, the first camera module 23 maintains a relatively fixed position with the resistance measurement probe module 22 and provides a clear image through the resistance measurement positioning light source. It can identify the chip position and orientation in real time and accurately, providing visual feedback for the precise positioning of the resistance measurement probe module 22, further improving the automation and efficiency of the detection. Furthermore, the hollow portions of the hollow turntable 2141, the turntable mounting flange 2143, and the resistance probe box cover 222 are coaxial to form a common wiring channel. This provides an integrated and protected path for the internal wiring of the resistance probe module 22, effectively preventing cable entanglement, wear, or signal interference during module movement, thus ensuring the stability of electrical function testing and the reliability of data transmission. This integrated design not only optimizes the structural compactness of the testing device 2 but also significantly improves the accuracy, efficiency, and operational stability of strain gauge chip electrical function testing.

[0038] This embodiment further proposes a sorting moving module 41 including a sorting X-axis moving module 411, a sorting Y-axis moving module 412, a sorting Z-axis moving module 413, and a suction cup rotation module 421, which is used to drive the suction cup module 42 to achieve three-dimensional movement and drive the suction cup module 42 to rotate around an axis perpendicular to the plane of the turntable 111. The suction cup module 42 includes a suction cup rotation module 421, a suction cup rotation plate 422, a suction cup assembly 423, and a suction cup control valve assembly 424. The suction cup rotation module 421 is mounted on the mounting slider of the sorting Z-axis moving module via a turntable mounting plate. The suction cup assembly 423 is mounted on the bottom of the suction cup rotation module 421 via the suction cup rotation plate 422. The suction cup control valve assembly 424 is mounted on the sorting Z-axis moving module and is used to control the start and stop of the suction cup assembly 423.

[0039] The second camera module 43 includes a second industrial camera 431 and a second camera light source. The second industrial camera 431 is located on the other side of the suction cup rotating plate 422, and the second camera light source is located below the second industrial camera 431.

[0040] Understandably, the sorting and moving module 41 enables precise linear displacement of the suction cup module 42 in the horizontal X, horizontal Y, and vertical Z directions. Furthermore, the suction cup rotation module 421 drives the suction cup module 42 to rotate around its vertical axis. The suction cup rotation module 421 typically consists of a rotating platform and a drive motor, allowing the suction cup module 42 to adjust the chip's orientation or angle as needed when gripping or placing the strain gauge chip, thus adapting to placement requirements in different directions. The second industrial camera 431 captures clear images of the strain gauge chip for identifying its precise position and orientation, and for performing necessary quality checks. The second camera light source is positioned below the second industrial camera 431, providing a uniform and stable lighting environment to ensure the camera acquires high-quality images under various lighting conditions, effectively avoiding the influence of shadows and reflections on the identification results.

[0041] This embodiment, through the aforementioned technical solution, enables the sorting moving module 41 to possess X, Y, and Z-axis linear movement capabilities as well as rotational capabilities. This allows the suction cup module 42 to precisely grasp and place the cut strain gauge chips in three-dimensional space, and to adjust the chip's posture as needed. The coordination of the hollow turntable 2141, the turntable module motor 2142, and the suction cup rotating plate 422 within the suction cup module 42, along with the precise control of the suction cup control valve assembly 424, ensures the stability and reliability of chip adsorption and release. Simultaneously, the second camera module 43 can identify and verify the chip's position and status in real time, further improving the accuracy and efficiency of sorting. This multi-degree-of-freedom motion control and visual feedback mechanism greatly enhances the flexibility and adaptability of the sorting device 4, meeting the needs for refined and efficient sorting of strain gauge chips of different specifications and with different test results. It effectively solves the shortcomings of traditional sorting methods in terms of positioning accuracy and flexibility, thereby significantly improving the automation level and production efficiency of the entire integrated detection, cutting, and sorting machine.

[0042] This embodiment further proposes a feeding module 44 including a feeding bin 441, an empty pallet stacking assembly 442, a full-load pallet stacking assembly 443, a transfer assembly 445, and a pallet drive assembly 446. The feeding bin 441 is slidably mounted on the cabinet via a bin slide rail 447, which is equipped with a clamping cylinder for fixing the feeding bin 441. The empty pallet stacking assembly 442 and the full-load pallet stacking assembly 443 are sequentially arranged at the ends of the feeding bin 441. The transfer assembly 445 is used to accommodate empty disks without strain gauge chips and full disks with strain gauge chips. The transfer assembly 445 is slidably disposed in the unloading bin 441. The disk drive assembly 446 is connected to the transfer assembly 445 for driving the transfer assembly 445 to take out the empty disk from the empty disk stacking assembly 442 and transfer it to the unloading position of the unloading bin 441, or to drive the transfer assembly 445 to transfer the full disk from the unloading position of the unloading bin 441 to the full disk stacking assembly 443.

[0043] Understandably, the empty tray stacking assembly 442 is used to store empty trays that have not yet been loaded with strain gauge chips. It can accommodate multiple empty trays and form a stacked structure, and supply them one by one as needed. The full tray stacking assembly 443 is similar to the empty tray stacking assembly 442, and is used to collect and store full trays that have been loaded with strain gauge chips. It can also receive and stack multiple full trays in an orderly manner, awaiting subsequent packaging or transportation processing. The transfer assembly 445 is the key actuator that realizes the movement of the trays inside the unloading module 44. It is slidably set in the unloading bin 441 and usually includes a movable platform or clamping mechanism. It can slide along a preset path inside the unloading bin 441, ensuring the precise transfer of trays between the empty tray stacking assembly 442, the unloading position, and the full tray stacking assembly 443. The pallet drive assembly 446 is used to drive the transfer assembly 445 to remove an empty pallet from the empty pallet stacking assembly 442 and transfer it to the unloading position of the unloading hopper 441, or to drive the transfer assembly 445 to transfer a full pallet from the unloading position of the unloading hopper 441 to the full pallet stacking assembly 443.

[0044] This embodiment achieves continuous reception of sorted chips and automated management of carrier trays. The unloading bin 441 is slidably mounted on the cabinet via a bin slide rail 447 and fixed using a clamping cylinder, ensuring the stability and positioning accuracy of the unloading module 44 during operation. The empty tray stacking assembly 442 and the full tray stacking assembly 443 allow empty trays to be pre-stored and supplied on demand, while full trays can be collected in an orderly manner, thus achieving automated management of the carrier trays. Driven by the carrier tray drive assembly 446, the transfer assembly 445 accurately removes empty trays from the stacking assembly within the unloading bin 441 and delivers them to the unloading position. After chip sorting is completed, the full trays are then transferred from the unloading position to the full tray stacking assembly 443. This design effectively solves the problems of continuous reception of sorted chips and automated management of carrier trays, greatly reducing manual intervention and avoiding production interruptions caused by frequent tray changes. This significantly improves the automation level and production efficiency of the entire integrated inspection, cutting, and sorting machine, ensuring the continuity and stability of the production process.

[0045] This embodiment further proposes an empty pallet stacking assembly 442 including an empty pallet rack 4421, an empty pallet support fork 4422, and a drive cylinder 4423. The empty pallet rack 4421 is fixedly installed in the unloading bin 441. The empty pallet support fork 4422 is installed on opposite sides of the bottom of the empty pallet rack 4421, and the empty pallet support fork 4422 is driven by the drive cylinder 4423. The empty pallet support fork 4422 is configured to retract when the transfer assembly 445 carries the bottom empty pallet, and reset after the bottom empty pallet drops a preset height to support the next bottom empty pallet. The full-load pallet stacking assembly 443 includes a full-load pallet rack 4431 and a full-load pallet baffle 4432. The full-load pallet rack 4431 is fixedly installed in the unloading bin 441, and the full-load pallet baffle 4432 is installed on opposite sides of the bottom of the full-load pallet rack 4431. The full-load pallet baffle 4432 is an upward-flipping one-way baffle and is configured to receive the full-load pallets lifted by the transfer assembly 445. The transfer assembly 445 includes a first mounting plate 4451, a second mounting plate 4452, a lifting plate 4453, a lifting cylinder 4454, and a lifting rod 4455. The first mounting plate 4451 is slidably disposed on the slide rail of the unloading hopper 441. The second mounting plate 4452 is suspended below the first mounting plate 4451 by a connecting rod. The lifting cylinder 4454 is disposed on the second mounting plate 4452, and the driving end of the lifting cylinder 4454 is connected to the lifting plate 4453. The lifting rod 4455 is disposed on the lifting plate 4453 and passes through the first mounting plate 4451 and the second mounting plate 4452. The lifting cylinder 4454 is configured to drive several lifting rods 4455 to lift and lower synchronously, for placing the pallet on the first mounting plate 4451 or lifting a full-load pallet from the first mounting plate 4451.

[0046] Understandably, the empty pallet support fork 4422 is a telescopic rod, installed in pairs, and provides support on both sides of the bottom of the empty pallet after being driven by a cylinder. The drive cylinder 4423 provides an actuator for linear reciprocating motion, and its action is controlled by a pneumatic circuit to ensure rapid response and precise positioning of the support fork, as well as that the retraction and reset actions of the empty pallet support fork 4422 must be precisely coordinated with the pallet picking sequence of the transfer assembly 445. The full-load pallet baffle 4432 is a one-way opening mechanical baffle, usually designed with an upward flipping structure. When the transfer assembly 445 lifts the full-load pallet above the baffle, the baffle automatically flips open to allow the full-load pallet to pass; after the full-load pallet has passed, the baffle resets under the action of gravity or a spring, supporting the full-load pallet. The first mounting plate 4451 is slidably disposed on the slide rail of the unloading hopper 441, serving as a moving carrier for the pallet. The bottom is provided with a slider or roller that cooperates with the slide rail to ensure smooth movement. The second mounting plate 4452 is suspended below the first mounting plate 4451 by a connecting rod, serving as a mounting base for the lifting mechanism. The lifting rod 4455 is disposed on the lifting plate 4453 and passes through the first mounting plate 4451 and the second mounting plate 4452. The lifting rod 4455 extends upward from the lifting plate 4453 to contact and support the pallet. Typically, multiple rods are raised and lowered synchronously to ensure that the pallet is subjected to uniform force.

[0047] In this embodiment, through the above-described technical solution, the cooperation between the empty pallet support fork 4422 and the drive cylinder 4423 in the empty pallet stacking assembly 442 enables precise control of the sequential release of empty pallets. When the transfer assembly 445 is ready to carry the bottom empty pallet, the support fork retracts in time, allowing a single empty pallet to descend; subsequently, the support fork resets, supporting the empty pallet at the second-to-bottom of the stack, thereby achieving stable and orderly separation and removal of empty pallets, effectively avoiding the problem of multiple pallets falling or jamming simultaneously. Simultaneously, the full-load pallet baffle 4432 in the full-load pallet stacking assembly 443 is designed as an upward-flipping unidirectional structure, allowing the transfer assembly 445 to smoothly lift the full-load pallet into position. The baffle automatically opens to receive the pallet and automatically resets its support after the full-load pallet has passed, ensuring reliable stacking of full-load pallets and preventing tipping or damage during the stacking process. In addition, the transfer assembly 445, through the coordinated action of the first mounting plate 4451, the second mounting plate 4452, the lifting plate 4453, the lifting cylinder 4454, and the lifting rod 4455, achieves precise horizontal movement and smooth vertical lifting of the pallet, ensuring accurate transfer of empty pallets from the stacking assembly to the unloading position, and reliable placement of full-load pallets from the unloading position to the stacking assembly.

[0048] This embodiment further proposes a manufacturing process that can be used in the aforementioned integrated inspection, cutting, and sorting machine for strain gauge chips. The manufacturing process includes: S1. A strain gauge wafer is adsorbed and positioned by the feeding device, and the strain gauge wafer is transferred to the detection device; S2. The detection device acquires an image of the strain gauge wafer and identifies the position coordinates of each strain gauge chip on it; the resistance measurement moving module is controlled to drive the resistance measurement probe module to move sequentially to each strain gauge chip for contact resistance measurement, and the strain gauge wafer is transferred to the cutting device through the rotating component. S3. The strain gauge wafer is cut by the cutting device and the cut strain gauge wafer is transferred to the sorting device by the rotating assembly. S4. The cut strain gauge chips are identified by the sorting device, and the strain gauge chips are sorted and adsorbed by the suction cup module. S5. The sorted strain gauge chips are received by the unloading module, and the rotating component is rotated to the initial position to receive new strain gauge wafers.

[0049] The core innovation of this embodiment lies in integrating the feeding, inspection, cutting, and sorting processes into a continuous flow driven by the same rotating component 11, and employing visual recognition and probe measurement for coordinated control. This eliminates process breakpoints and accumulated errors caused by traditional multi-device transfer, thereby improving processing efficiency and product consistency. Specifically, since this production process is based on an integrated machine, the wafer passes through each station sequentially under the drive of the rotating component 11, avoiding repeated feeding and positioning operations and significantly reducing positional deviations caused by mechanical transfer. Simultaneously, the cooperation between the first camera module 23 and the resistance probe module 22 ensures accurate identification of the strain gauge chip's position coordinates and reliable four-terminal resistance measurement. The sorting device 4 uses the second camera module 43 to identify the chip's state after cutting in real time, combined with the precise adsorption of the suction cup module 42, effectively solving the defects of insufficient detection accuracy and chip breakage in traditional methods. Furthermore, the continuous flow mechanism of the rotating component 11 allows for seamless connection between the inspection device 2, the cutting device 3, and the sorting device 4, significantly shortening the process interval time and resulting in a significant improvement in overall processing efficiency compared to traditional step-by-step operation modes. Through the above technical solutions, the production process not only realizes fully automated continuous processing of strain gauge wafers from loading to unloading finished chips, but also fundamentally guarantees product yield and the needs of large-scale mass production through unified coordinate system and equipment collaborative control.

[0050] The above description is merely a preferred embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the inventive concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. An integrated machine for detecting, cutting, and sorting strain gauge chips, characterized in that, This includes a loading device, a detection device, a cutting device, and a sorting device installed inside the cabinet; The feeding device includes a rotating component and an adsorption component. The rotating component is rotatably mounted on a platform of the cabinet, and the adsorption component is fixedly mounted on the top of the rotating component. The adsorption component is configured to adsorb and position the strain gauge wafers, and the positioned strain gauge wafers are transferred to the detection device. The rotating assembly includes a turntable and a drive motor. The drive motor is fixedly installed inside the cabinet. The turntable is rotatably mounted on the platform and is connected to the drive motor for transmission. The detection device, the cutting device, and the sorting device are arranged in a ring along the outer circumference of the turntable. The rotating assembly drives the adsorption assembly to rotate the strain gauge wafers sequentially through the detection station, the cutting station, and the sorting station. The strain gauge wafers are always adsorbed and fixed on the same adsorption assembly throughout the entire processing. The turntable has a flange mounting hole at its center; the adsorption assembly includes a flange tube, a vent plate, a vent connecting plate, a suction cup plate, and a suction cup mesh plate. The flange tube is fixedly connected to the drive motor and is located at the center of the turntable; the vent plate is aligned with the flange tube and located on the upper surface of the turntable, and the vent plate has four vents along its circumferential side; the suction cup plate communicates with the vents through the vent connecting plate; the suction cup mesh plate is located on top of the suction cup plate; the suction cup plate has vent grooves, and the suction cup mesh plate has mesh holes corresponding to the vent grooves; a negative pressure circuit is formed between the flange tube, the vent plate, the vent connecting plate, the flange tube, and the suction cup mesh plate; the flange tube is connected to a negative pressure generating device to form a negative pressure adsorption area at the suction cup mesh plate to adsorb strain gauge wafers or individual chips diced from wafers; The detection device includes a resistance measurement moving module, a resistance measurement probe module, and a first camera module. The resistance measurement moving module is configured to drive the resistance measurement probe module. The first camera module is disposed on one side of the resistance measurement probe module and is configured to identify the strain gauge chips of the strain gauge wafer. The resistance measurement probe module is configured to perform resistance measurement on each strain gauge chip of the strain gauge wafer. The strain gauge wafer after resistance measurement is transferred to the cutting device. The cutting device includes a cutting moving module and a laser module. The cutting moving module is configured to drive the laser module, and the laser module is configured to cut strain gauge wafers. The cut strain gauge wafers are then transferred to the sorting device. The sorting device includes a sorting moving module, a suction cup module, a second camera module, and a feeding module. The sorting moving module is configured to drive the suction cup module. The second camera module is located on one side of the suction cup module and is configured to identify the cut strain gauge chips. The suction cup module is configured to sort and adsorb the strain gauge chips. The feeding module is configured to receive the sorted strain gauge chips.

2. The integrated machine for detecting, cutting, and sorting strain gauge chips as described in claim 1, characterized in that, The resistance measurement moving module includes a resistance measurement X-axis linear module, a resistance measurement Y-axis linear module, a resistance measurement Z-axis linear module, and a resistance measurement turntable assembly. The resistance measurement X-axis linear module is fixedly mounted on the platform via a resistance measurement module bracket. The resistance measurement Y-axis linear module is slidably connected to the resistance measurement X-axis linear module, and the resistance measurement Z-axis linear module is slidably connected to the resistance measurement Y-axis linear module. The resistance measurement turntable assembly is slidably mounted on the resistance measurement Z-axis linear module, and the resistance measurement probe module is located below the resistance measurement turntable assembly.

3. The integrated machine for detecting, cutting, and sorting strain gauge chips as described in claim 2, characterized in that, The cutting moving module includes a cutting X-axis linear module, a cutting Y-axis linear module, and a cutting Z-axis linear module; the cutting X-axis linear module is fixedly mounted on the platform by a cutting module bracket, the cutting Y-axis linear module is slidably connected to the cutting X-axis linear module, the cutting Z-axis linear module is slidably connected to the cutting Y-axis linear module, and the laser module is slidably connected to the cutting Z-axis linear module; And / or, the cutting device further includes a cutting dust hood and a light source cover, wherein the cutting dust hood is mounted above the strain gauge wafer to be cut via a cantilever plate, and the cutting dust hood is connected to a dust collection device; the light source cover is disposed on top of the cutting dust hood.

4. The integrated machine for detecting, cutting, and sorting strain gauge chips as described in claim 2, characterized in that, The resistance measuring turntable assembly includes a hollow turntable, a turntable module motor, and a turntable mounting flange. The hollow turntable is fixedly mounted on the mounting slide plate of the resistance measuring Z-axis linear module via a turntable mounting plate. The turntable module motor is drivenly connected to the hollow turntable. The resistance measuring probe module is connected to the hollow turntable via the turntable mounting flange, so that the resistance measuring probe module rotates along the rotation axis of the hollow turntable. The first camera module includes a first camera bracket, a first industrial camera, and a resistance measurement and positioning light source. The first industrial camera is fixedly mounted on one side of the turntable mounting flange via the first camera bracket, and the resistance measurement and positioning light source is mounted below the first industrial camera via a light source mounting plate. The resistance probe module includes a resistance probe bakelite base and a resistance probe box cover. The resistance probe bakelite base is disposed at the bottom of the turntable mounting flange through the resistance probe box cover. The resistance probe box cover is provided with a wire insertion slot. The resistance probe bakelite base has several mounting holes and probe units installed in the mounting holes, and the probe units are connected to the resistance probe insertion board. The probe unit consists of four probes arranged in two parallel rows. The probe unit is configured to perform electrical function detection on the four contact terminals of the strain gauge chip respectively. The hollow turntable, the turntable mounting flange, and the resistance probe box cover plate form a wiring channel.

5. The integrated machine for detecting, cutting, and sorting strain gauge chips as described in claim 1, characterized in that, The sorting moving module includes a sorting X-axis moving module, a sorting Y-axis moving module, a sorting Z-axis moving module, and a suction cup rotation module, which are used to drive the suction cup module to achieve three-dimensional movement and drive the suction cup module to rotate around an axis perpendicular to the turntable plane; The suction cup module includes a suction cup rotation module, a suction cup rotation plate, a suction cup assembly, and a suction cup control valve assembly. The suction cup rotation module is mounted on the mounting slider of the sorting Z-axis moving module via a turntable mounting plate. The suction cup assembly is mounted on the bottom of the suction cup rotation module via the suction cup rotation plate. The suction cup control valve assembly is mounted on the sorting Z-axis moving module and is used to control the start and stop of the suction cup assembly. The second camera module includes a second industrial camera and a second camera light source. The second industrial camera is located on the other side of the suction cup rotating plate, and the second camera light source is located below the second industrial camera.

6. The integrated machine for detecting, cutting, and sorting strain gauge chips as described in claim 1, characterized in that, The unloading module includes an unloading bin, an empty tray stacking assembly, a full-load tray stacking assembly, a transfer assembly, and a tray drive assembly. The unloading bin is slidably mounted on the cabinet via a bin slide rail, and the bin slide rail is equipped with a clamping cylinder for fixing the unloading bin. The empty tray stacking assembly and the full-load tray stacking assembly are sequentially arranged at the ends of the unloading bin, for accommodating empty trays without strain gauge chips and full-load trays with strain gauge chips. The transfer assembly is slidably mounted inside the unloading bin, and the tray drive assembly is drively connected to the transfer assembly for driving the transfer assembly to remove an empty tray from the empty tray stacking assembly and transfer it to the unloading position of the unloading bin, or driving the transfer assembly to transfer a full-load tray from the unloading position of the unloading bin to the full-load tray stacking assembly.

7. The integrated machine for detecting, cutting, and sorting strain gauge chips as described in claim 6, characterized in that, The empty pallet stacking assembly includes an empty pallet rack, an empty pallet support fork, and a drive cylinder. The empty pallet rack is fixedly installed in the unloading bin. The empty pallet support fork is installed on opposite sides of the bottom of the empty pallet rack, and the empty pallet support fork is driven by the drive cylinder. The empty pallet support fork is configured to retract when the transfer assembly carries the bottom empty pallet, and to reset after the bottom empty pallet drops a preset height to support the next bottom empty pallet. The full-load pallet stacking assembly includes a full-load pallet rack and a full-load pallet baffle; the full-load pallet rack is fixedly installed in the unloading hopper, and the full-load pallet baffle is installed on opposite sides of the bottom of the full-load pallet rack. The full-load pallet baffle is an upward-flipping one-way baffle and is configured to receive the full-load pallets lifted by the transfer assembly. The transfer assembly includes a first mounting plate, a second mounting plate, a lifting plate, a lifting cylinder, and a lifting rod. The first mounting plate is slidably disposed on the slide rail of the unloading hopper. The second mounting plate is suspended below the first mounting plate by a connecting rod. The lifting cylinder is disposed on the second mounting plate, and the drive end of the lifting cylinder is connected to the lifting plate. The lifting rod is disposed on the lifting plate and passes through the first mounting plate and the second mounting plate. The lifting cylinder is configured to drive a plurality of the lifting rods to lift and lower synchronously, for placing the pallet on the first mounting plate or lifting a fully loaded pallet from the first mounting plate.

8. A production process, characterized in that, The integrated inspection, cutting, and sorting machine for strain gauge chips, as described in any one of claims 1-7, comprises the following manufacturing process: A strain gauge wafer is adsorbed and positioned by the feeding device, and the strain gauge wafer is transferred to the detection device; The detection device acquires an image of the strain gauge wafer and identifies the position coordinates of each strain gauge chip on it; the resistance measurement moving module is controlled to drive the resistance measurement probe module to move sequentially to each strain gauge chip for contact resistance measurement, and the strain gauge wafer is transferred to the cutting device through the rotating component. The strain gauge wafers are cut by the cutting device and transferred to the sorting device by the rotating assembly. The sorting device identifies the cut strain gauge chips, and the suction cup module is used to sort and adsorb the strain gauge chips. The feeding module receives the sorted strain gauge chips, and the rotating component rotates to its initial position to receive new strain gauge wafers.

Images