界面结合优异的复合板的制备方法
By performing specific grinding and welding optimization on the surface of the substrate blank, combined with vacuuming and multi-stage heat treatment, the problem of insufficient interfacial bonding strength of the heat-treated composite board was solved, and the shear strength under high temperature conditions and the overall performance of the board were improved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- INST OF RES OF IRON & STEEL JIANGSU PROVINCE
- Filing Date
- 2026-04-13
- Publication Date
- 2026-07-17
AI Technical Summary
In the prior art, the interfacial bonding strength of heat-treated composite plates is insufficient under high temperature conditions, which leads to deterioration of shear strength, mainly due to the increase in the width of the decarburized layer and the formation of brittle and hard phases.
By performing specific grinding treatment on the surface of the substrate blank and optimizing the welding process, combined with vacuuming and multi-stage heat treatment, a metallurgical bond is formed and the width of the decarburized layer is avoided. The wavy surface design is used to control the uneven atomic diffusion and form a serrated interlocking to increase shear strength.
The composite board achieves excellent interfacial bonding under high temperature conditions, with shear strength exceeding 300MPa, uniform residual stress distribution throughout the board, and excellent resistance to intergranular corrosion, meeting the requirements of various corrosion conditions, while reducing production costs.
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