Liquid ejecting head, ejecting head module, and device for ejecting liquid

CN122008696APending Publication Date: 2026-05-12RICOH CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
RICOH CO LTD
Filing Date
2025-09-09
Publication Date
2026-05-12

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Abstract

The invention provides a liquid ejecting head, a head module, and an apparatus for ejecting liquid, which can excellently restrain reduction of liquid ejecting performance. A liquid ejecting head (1) includes: a MEMS component (10) as a substrate component having at least a nozzle that ejects a liquid, a flow path that communicates with the nozzle, and a piezoelectric element; and a frame member (5) that is bonded to the MEMS component (10) by means of an adhesive. The frame member (5) and the MEMS component (10) have a bonded region bonded by an adhesive and a non-bonded region that is not bonded by the adhesive between the frame member (5) and the MEMS component (10). The joining region is provided at least around an upper part (20a) that shares the supply flow path main flow and an upper part (20b) that shares the recovery flow path main flow, which are communication parts of the frame member (5), and at the end of the frame member (5). In addition, all the non-joint regions (9b) are not embedded by the components, and form hollow portions having predetermined voids.
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