A method for preparing a nanoscale densified tungsten-copper alloy

Abstract

The application is a preparation method of nanoscale densified tungsten-copper alloy, which comprises the following steps: chromium ion implantation is performed on tungsten powder, and then a copper-titanium composite layer is sprayed to obtain modified tungsten powder; a certain amount of modified tungsten powder and copper powder are mixed by using an ultrasonic-assisted double-planetary mixer to obtain mixed powder; the mixed powder is formed into a blank; and the blank is vacuum sintered to obtain a copper-tungsten alloy. The modified tungsten powder forms a tungsten-chromium solid solution through chromium ion implantation, improves the surface activity and diffusion capacity of tungsten, solves the problem of poor mutual solubility of tungsten and copper, and provides a metallurgical reaction active site; titanium in the copper-titanium composite layer forms Ti-W and Ti-Cu phases to construct an interface transition layer, converts mechanical occlusion into metallurgical bonding to enhance the interface strength, and improves wettability to help liquid copper fill the gap. The ultrasonic-assisted double-planetary mixer breaks the agglomeration of nano powder through vibration and revolution and rotation, enhances powder contact to realize uniform mixing, and cooperates with the copper-titanium composite layer to reduce the copper-tungsten interface energy and ensure uniform composition.

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