一种基于SVPWM控制的IGBT模块无功老化测试方法
By introducing SVPWM control and a thermally sensitive electrical parameter monitoring model, the problems of current accuracy deviation and insufficient junction temperature monitoring in IGBT module aging tests are solved, achieving efficient and accurate aging tests and improving the equivalence and reliability of the tests.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SILKWORM COCOON RES GROUP CHINESE INST OF TEST TECH
- Filing Date
- 2026-04-13
- Publication Date
- 2026-07-17
AI Technical Summary
Existing IGBT module aging tests suffer from issues such as current accuracy deviations due to open-loop control, excessive energy loss, insufficient real-time junction temperature monitoring, and poor equivalence in replicating on-board operating conditions.
A closed-loop control strategy based on SVPWM control and a thermally sensitive electrical parameter monitoring model are adopted, combined with a multi-station synchronous test platform, to achieve high-precision current closed-loop control and real-time junction temperature monitoring. Through space vector pulse width modulation algorithm and parasitic parameter extraction technology, a reactive power circulation loop is constructed for aging test.
It achieves high-precision aging testing of IGBT modules, reduces energy consumption, improves the equivalence and repeatability of test data, accurately monitors junction temperature changes, shortens the test cycle, and improves the reliability assessment accuracy of IGBT modules.
Smart Images
Figure CN122017517B_ABST