An electronic device

Abstract

The application provides an electronic device. The electronic device comprises a back cover, a camera decoration assembly, a first antenna and a floor. The back cover comprises a mounting hole, and the camera decoration assembly comprises a metal decoration plate which is mounted in the mounting hole. In the application, the first antenna comprises the metal decoration plate, and the metal decoration plate comprises a slit and a first feeding point. In addition, the metal decoration plate is arranged in a spaced manner with the floor, and the metal decoration plate and the floor enclose a cavity. That is, in the application, the first antenna is a cavity antenna. In the electronic device provided by the application, the first antenna is arranged by using part of the structure of the camera decoration assembly, which is beneficial to improving the integration of the electronic device. In addition, since the signal of the first antenna can be transmitted to the side of the back cover away from other parts of the electronic device, the signal coverage of the electronic device on the side of the back cover can be realized, so that the communication requirement between the electronic device and the communication device on the side can be met, thereby improving the communication performance of the electronic device.

Description

Technical Field

[0001] This application relates to the field of communication technology, and in particular to an electronic device. Background Technology

[0002] With the rapid development of mobile communication technology and the widespread use of smartphones, people have increasingly higher requirements for electronic devices, especially for their communication capabilities.

[0003] Currently, the common antenna solution for all-metal electronic devices is to utilize the non-display area of ​​the screen for antenna placement to achieve the device's communication function. However, because the signal beam of an antenna using the non-display area of ​​the screen primarily covers the space on the side of the screen away from the back cover, the signal beam coverage on the side of the back cover away from the screen is poor. This results in poor communication performance for the electronic device. Summary of the Invention

[0004] The electronic device provided in this application is used to improve the communication performance of electronic devices.

[0005] This application provides an electronic device including a back cover, a camera decorative assembly, a first antenna, and a ground plane. The back cover includes mounting holes, and the camera decorative assembly includes a metal decorative plate mounted in the mounting holes. In this application, the first antenna includes the aforementioned metal decorative plate, which includes a slit and a first feed point. Furthermore, the metal decorative plate and the ground plane are spaced apart, and the metal decorative plate and the ground plane form a cavity. That is, in this application, the first antenna is a cavity antenna. In the electronic device provided by this application, utilizing a portion of the structure of the camera decorative assembly for the first antenna configuration improves the integration of the electronic device. Additionally, since the signal from the first antenna can be transmitted to the side of the back cover away from other parts of the electronic device, signal coverage can be achieved on one side of the back cover, thereby meeting the communication requirements between the electronic device and communication devices on that side, thus improving the communication performance of the electronic device.

[0006] In one possible implementation of this application, the floor includes a circuit board, and at least a portion of the edge of the metal decorative panel is connected to the ground plane of the circuit board. This allows the metal decorative panel and the circuit board to jointly form the cavity of the first antenna, which simplifies the structure of the first antenna and reduces the implementation difficulty of this solution. Furthermore, since the edge of the metal decorative panel is connected to the ground plane of the circuit board, the cavity formed by the metal decorative panel and the circuit board can be larger, which is beneficial to improving the signal transmission performance of the first antenna.

[0007] This application does not limit the connection method between the metal decorative panel and the ground plane of the circuit board. For example, in one possible implementation, at least a portion of the edge of the metal decorative panel is connected to the ground plane of the circuit board via a conductive connector, which includes at least one of conductive foam or metal spring. This improves the connection reliability between the metal decorative panel and the ground plane of the circuit board, thereby enhancing the boundary integrity of the first antenna cavity and thus improving the signal transmission performance of the first antenna.

[0008] In one possible implementation of this application, the projection of the circuit board onto the rear cover covers the mounting holes. This facilitates an increase in the cavity of the first antenna, thereby improving the signal transmission performance of the first antenna.

[0009] In one possible implementation of this application, the metal decorative panel includes a first metal post disposed on the surface of the metal decorative panel facing the circuit board, and the first metal post serves as a first feed point. This facilitates the connection between the first feed point and the radio frequency circuit of the first antenna.

[0010] In another possible implementation of this application, the metal decorative panel may further include a second metal post disposed on the surface of the metal decorative panel facing the circuit board. Additionally, the first antenna includes a tuning circuit connected to the second metal post for adjusting the resonant frequency of the first antenna. This ensures the signal transmission performance of the first antenna within its operating frequency band.

[0011] In one possible implementation of this application, the electronic device further includes a camera module that penetrates the circuit board. The metal decorative plate includes a light-transmitting hole through which the camera module receives light. In other words, this solution allows the camera module and the first antenna to share the cavity space formed by the metal decorative piece and the circuit board, which facilitates a reduction in the size of the camera decorative component, thereby enabling the miniaturization and thinning of the electronic device.

[0012] In one possible implementation of this application, a gap exists between the camera module and the circuit board along the extension direction of the plane containing the circuit board. This gap can be filled with insulating material, and the camera module is connected to the ground. The insulating material can be, but is not limited to, plastic. This allows the insulating material to limit the radial movement of the camera module, thereby improving the installation reliability of the camera module. Furthermore, by filling the gap between the camera module and the circuit board with insulating material, coupling contact between the metal decorative panel and the camera module can be effectively avoided, preventing the metal decorative panel from being grounded through the camera module. This avoids reducing the volume of the first antenna cavity, ensuring the radiation efficiency of the first antenna within the required operating frequency band.

[0013] In one possible implementation of this application, the width of the gap between the camera module and the circuit board satisfies: 0.5mm ≤ d ≤ 1mm. This ensures reliable positioning of the camera module while preventing coupling contact between the metal decorative plate and the camera module, and also facilitates a reduction in the size of the camera decorative assembly.

[0014] In one possible implementation of this application, the electronic device further includes a conductive sheet located on the side of the circuit board facing away from the metal decorative panel. The conductive sheet is connected to the ground plane of the circuit board, and the projection of the conductive sheet onto the circuit board covers the gap between the camera module and the circuit board. This improves the boundary integrity of the first antenna cavity, reducing clutter introduced by the camera module and thus enhancing the performance of the first antenna.

[0015] This application does not limit the specific connection method between the conductive sheet and the ground plane of the circuit board. For example, the conductive sheet and the ground plane of the circuit board can be connected by a conductive connector, which includes at least one of conductive foam or metal spring. This ensures a reliable connection between the conductive sheet and the ground plane of the circuit board, thereby improving the performance of the first antenna.

[0016] In this application, the camera module can be directly or indirectly connected to the ground. For example, in one possible implementation, the camera module is connected to a conductive sheet, and the camera module is connected to the ground plane of the circuit board through the conductive sheet. That is, the camera module is indirectly connected to the ground through the conductive sheet. This also achieves reliable grounding of the camera module, thereby reducing noise introduced by the camera module.

[0017] In one possible implementation of this application, the slots in the metal decorative panel can also be filled with insulating material. This prevents water, dust, or other impurities from entering the electronic device through the slots, thereby improving the reliability of the electronic device.

[0018] In one possible implementation of this application, the slit width d1 satisfies: d1 ≥ 1 mm. This is beneficial for improving the radiation performance of the first antenna.

[0019] Furthermore, this application does not specifically limit the shape or location of the slit; it can be designed according to the signal frequency band supported by the first antenna. For example, the shape and location of the slit can be reasonably designed so that the first antenna can meet the communication requirements of the Wi-Fi 2.4GHz band, the Wi-Fi 5GHz band, or the 1.575GHz band of the Global Positioning System (GPS).

[0020] In one possible implementation of this application, the camera decorative assembly further includes an insulating cover plate, which covers the end of the metal decorative plate located outside the rear cover. This allows the insulating cover plate to serve as an external component of the camera decorative assembly, ensuring the aesthetic appearance of the electronic device while also protecting the first antenna and other components disposed within the camera decorative assembly.

[0021] In one possible implementation of this application, the electronic device further includes a display screen and a second antenna, with the display screen positioned opposite to the back cover. The back cover is metal, and the second antenna is located between the display screen and the back cover, and is used for signal transmission to the side of the display screen opposite to the back cover. With this design, since the signal from the first antenna can be transmitted to the side of the back cover opposite to the display screen, and the signal from the second antenna can also be transmitted to the side of the display screen opposite to the back cover, even with a metal back cover, the complementary coverage of the first and second antennas can still be utilized to meet the multi-angle signal transmission requirements of the electronic device, thereby improving its communication performance.

[0022] In one possible implementation of this application, the electronic device further includes a radio frequency (RF) switch and an RF module. The RF switch includes a first connection terminal, a second connection terminal, and a third connection terminal. The first connection terminal is connected to the RF module, the second connection terminal is connected to a first feed point of the first antenna, and the third connection terminal is connected to a second feed point of the second antenna. This allows the RF switch to control the connection between the first and second connection terminals, thereby switching the connection between the RF module and either the first or second feed point. This, in turn, enables switching between the first and second antennas to meet the signal coverage requirements of the electronic device at different angles.

[0023] In one possible implementation of this application, when the signal strength received by the first antenna is greater than that received by the second antenna, an RF switch controls the first connection terminal to connect to the second connection terminal, and the RF module is used to feed an RF signal to the first feed point. Conversely, when the signal strength received by the second antenna is greater than that received by the first antenna, an RF switch controls the first connection terminal to connect to the third connection terminal, and the RF module is used to feed an RF signal to the second feed point. This allows the electronic device to achieve superior communication performance in different communication scenarios.

[0024] In one possible implementation of this application, the electronic device further includes a radio frequency (RF) module and a combiner. The RF module is connected to a first feed point of the first antenna via the combiner, and the RF module is also connected to a second feed point of the second antenna via the combiner. This scheme allows the energy output from the RF module to be distributed through the combiner to the first feed point of the first antenna and the second feed point of the second antenna, enabling both feed points to simultaneously receive feed signals. This allows both the first and second antennas to be used simultaneously for signal transmission in the same frequency band, resulting in a wider signal beam coverage for the antenna system including both the first and second antennas, potentially achieving 360° omnidirectional signal beam coverage.

[0025] In one possible implementation of this application, the electronic device further includes a frame arranged circumferentially around the electronic device. In this implementation, the back cover is a non-metallic back cover, and the electronic device also includes a third antenna, the radiator of which is disposed on the frame. Using this scheme, the current of the first antenna during operation is mainly confined within its cavity, giving the first antenna a certain degree of directionality. The current of the third antenna during operation is distributed on the ground plane. That is, even when the first and third antennas operate simultaneously, their currents are isolated, thus ensuring both the radiation performance of the first and third antennas and providing a high degree of isolation between them. Attached Figure Description

[0026] Figure 1 A schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 2 A schematic diagram of the structure of an electronic device provided in an embodiment of this application; Figure 3 A partial structural diagram of an electronic device provided in an embodiment of this application; Figure 4 for Figure 3 BB cross-sectional view of the structure shown; Figure 5 This is a schematic diagram of a metal decorative panel provided in an embodiment of this application; Figure 6 A schematic diagram of another partial structure of the electronic device provided in an embodiment of this application; Figure 7a for Figure 6 The diagram shows the current distribution on the metal decorative panel when the first antenna operates in the Wi-Fi 2.4GHz band. Figure 7b for Figure 6 The diagram shows the current distribution on the metal decorative panel when the first antenna operates in the Wi-Fi 4.8GHz band. Figure 7c for Figure 6 The diagram shows the current distribution on the metal decorative panel when the first antenna operates in the Wi-Fi 5GHz band. Figure 8 A schematic diagram showing the effect of the tuning circuit on the resonance adjustment of the first antenna when the first antenna is operating in the Wi-Fi 5GHz band; Figure 9 A schematic diagram illustrating an assembly relationship between a metal decorative panel and a circuit board provided in an embodiment of this application; Figure 10 A schematic diagram of another partial structure of the electronic device provided in an embodiment of this application; Figure 11 for Figure 9 CC cross-sectional view of the structure shown; Figure 12 A cross-sectional view of another structure of the electronic device provided in an embodiment of this application; Figure 13 A schematic diagram of another partial structure of the electronic device provided in an embodiment of this application; Figure 14 This is a schematic diagram of the structure of a conductive sheet provided in an embodiment of this application; Figure 15 Another structural schematic diagram of the electronic device provided in the embodiments of this application; Figure 16a A schematic diagram of the radiation pattern formed by the first antenna; Figure 16b A schematic diagram of the direction of the second horizon formation; Figure 17 A schematic diagram of an antenna system for an electronic device provided in an embodiment of this application; Figure 18a A schematic diagram of a communication scenario for an electronic device provided in an embodiment of this application; Figure 18b A schematic diagram of another communication scenario for the electronic device provided in the embodiments of this application; Figure 19 A schematic diagram of another antenna system for an electronic device provided in an embodiment of this application; Figure 20 A schematic diagram of another antenna system for an electronic device provided in an embodiment of this application; Figure 21 A partial structural diagram illustrating another structure of the electronic device provided in an embodiment of this application; Figure 22 for Figure 21 The diagram shows the antenna performance of an electronic device.

[0027] Figure label: 1000 - Electronic equipment; 100 - Cover plate; 200 - Display screen / module; 2001 - Display area; 2002 - Non-display area; 300 - Printed circuit board; 400 - Mid-frame; 500 - Back cover; 501 - Mounting hole; 600 - Frame; 700 - Camera decorative component; 701 - Insulating cover; 800 - Camera module; 900 - Conductive sheet; 10 - First antenna; 1 - Metal decorative plate; 101 - Overlapping part; 102 - Slit; 103 - First feed point; 1041 - First metal pillar; 1042 - Second metal pillar; 105 - Light-transmitting hole; 2-Ground; 201-Circuit board; 2011-Through hole; 3-Conductive connector; 20-Second antenna; 30-RF module; 40-RF switch; 41-First connection end; 42-Second connection end; 43-Third connection end; 50-Third antenna; 60-Combiner; 2000-Router. Detailed Implementation

[0028] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings. However, the exemplary embodiments can be implemented in many forms and should not be construed as limited to the embodiments set forth herein. The same reference numerals in the figures denote the same or similar structures, and therefore repeated descriptions of them will be omitted. The terms expressing position and direction described in the embodiments of this application are illustrative based on the accompanying drawings, but changes can be made as needed, and all such changes are included within the scope of protection of this application. The accompanying drawings of the embodiments of this application are only for illustrating relative positional relationships and do not represent actual scale.

[0029] It should be noted that specific details are set forth in the following description to facilitate understanding of this application. However, the embodiments of this application can be implemented in many other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the embodiments of this application. Therefore, this application is not limited to the specific embodiments disclosed below.

[0030] The following explains the terminology that may appear in the embodiments of this application.

[0031] Radiator: In an antenna, this is the device used to receive / transmit electromagnetic wave radiation. In some cases, the term "antenna" is narrowly defined as a radiator, which converts guided wave energy from the transmitter into radio waves, or converts radio waves into guided wave energy, for radiating and receiving radio waves. The modulated high-frequency current energy (or guided wave energy) generated by the transmitter is transmitted to the transmitting radiator via a feed line, where it is converted into electromagnetic wave energy of a specific polarization and radiated in the desired direction. The receiving radiator converts the electromagnetic wave energy of a specific polarization from a specific direction in space back into modulated high-frequency current energy, which is then transmitted to the receiver input via a feed line.

[0032] Ground / Plane: This can broadly refer to at least a portion of any grounding layer, ground plane, or grounding metal layer within an electronic device (such as a mobile phone), or at least a portion of any combination of the aforementioned grounding layers, ground planes, or grounding components. "Ground / Plane" can be used for grounding components within an electronic device. In one embodiment, "Ground / Plane" may include any one or more of the following: a grounding layer of the electronic device's circuit board, a ground plane formed by the frame of the electronic device, a grounding metal layer formed by a thin metal film beneath the screen, a conductive grounding layer of a battery, and conductive components or metal parts electrically connected to the aforementioned grounding layer / ground plane / metal layer. In one embodiment, the circuit board may be a printed circuit board (PCB), such as an 8-layer, 10-layer, or 12-14-layer board having 8, 10, 12, 13, or 14 layers of conductive material, or components separated and electrically insulated by dielectric or insulating layers such as glass fiber or polymers.

[0033] Any of the aforementioned grounding layers, ground planes, or grounding metal layers are made of conductive materials. In one embodiment, the conductive material may be any of the following: copper, aluminum, stainless steel, brass and their alloys, copper foil on an insulating substrate, aluminum foil on an insulating substrate, gold foil on an insulating substrate, silver-plated copper, silver-plated copper foil on an insulating substrate, silver foil on an insulating substrate and tin-plated copper, graphite-impregnated cloth, graphite-coated substrates, copper-plated substrates, brass-plated substrates, and aluminum-plated substrates. Those skilled in the art will understand that grounding layers / ground planes / grounding metal layers may also be made of other conductive materials.

[0034] Radio frequency (RF) chips are a combination of all components used for receiving and transmitting radio frequency (RF) signals. They can be considered to include the RF front end and the transceiver. In the case of a receiving antenna, the RF chip can be considered the antenna section from the first amplifier to the front-end transmitter. In a transmitting antenna, the RF chip can be seen as the section after the last power amplifier. In some cases, the RF chip can also be understood as the feed unit. Typically, it is considered part of the antenna system, used to convert radio waves into electrical signals, and vice versa. Antenna design should consider the maximum power transfer capability and efficiency. For this purpose, the antenna feed impedance must be matched to the load resistance. The antenna feed impedance is a combination of resistance, capacitance, and inductance. To ensure maximum power transfer conditions, the two impedances (load resistance and feed impedance) should be matched. This matching can be achieved by considering frequency requirements and antenna design parameters such as gain, directivity, and radiation efficiency.

[0035] In some contexts, the term "power supply / feeding circuit" narrowly refers to a radio frequency integrated circuit (RFIC). A power supply circuit converts radio waves (e.g., RF signals) into electrical signals (e.g., digital signals). It is typically considered part of the RF component.

[0036] In some embodiments, the electronic device may also include a test socket (or, RF socket, or RF test socket). This test socket can be used to insert a coaxial cable to test the characteristics of the RF front-end circuitry or the radiator of the antenna. The RF front-end circuitry can be considered as the circuitry coupled between the test socket and the transceiver.

[0037] In some embodiments, the radio frequency front-end circuit can be integrated into a radio frequency front-end chip in an electronic device, or the radio frequency front-end circuit and the transceiver can be integrated into a radio frequency chip in an electronic device.

[0038] It should be understood that any two feed circuits in the first / second / ...Nth feed circuit of this application can share the same transceiver, for example, by transmitting signals through a radio frequency channel in a transceiver (e.g., a port (pin) of a radio frequency chip); they can also share a radio frequency front-end circuit, for example, by processing signals through a switch or amplifier in a radio frequency front-end.

[0039] It should also be understood that the two feed circuits in the first / second / ...Nth feed circuit of this application typically correspond to two RF test sockets in an electronic device.

[0040] Feed line: Also called a transmission line, it refers to the connection line between the antenna's radio frequency chip and the radiator. Depending on the frequency and form, the transmission line can directly transmit current waves or electromagnetic waves. The connection point on the radiator where it connects to the transmission line is usually called the feed point. Transmission lines include conductive transmission lines, coaxial transmission lines, waveguides, or microstrip lines. Depending on the implementation, transmission lines can include bracket antenna bodies or glass antenna bodies. Depending on the carrier, transmission lines can be made of liquid crystal polymer (LCP), flexible printed circuit boards (FPC), or printed circuit boards (PCBs).

[0041] Resonant frequency: The resonant frequency is also called the resonance frequency. The resonant frequency can have a frequency range, that is, the frequency range in which resonance occurs. The resonant frequency can be a frequency range where the return loss characteristic is less than -6dB. The point of strongest resonance can be called the resonant point, and the frequency corresponding to the resonant point is the center frequency. The return loss characteristic of the center frequency can be less than -20dB. It should be understood that, unless otherwise specified, when the antenna / radiator in this application generates "first / second...resonance," the first resonance should be the fundamental mode resonance generated by the antenna / radiator, or in other words, the lowest frequency resonance generated by the antenna / radiator. It should be understood that the antenna / radiator can generate one or more antenna modes according to a specific design, and each antenna mode can correspond to a fundamental mode resonance.

[0042] Resonant frequency band: The range of resonant frequencies is the resonant frequency band. The return loss characteristics at any frequency point within the resonant frequency band can be less than -6dB or -5dB.

[0043] Communication / Operating Frequency Band: Regardless of the type of antenna, it always operates within a certain frequency range (bandwidth). For example, an antenna supporting the B40 band operates within the frequency range of 2300MHz to 2400MHz, or in other words, its operating frequency band includes the B40 band. The frequency range that meets the specifications can be considered the antenna's operating frequency band. The width of the operating frequency band is called the operating bandwidth. The operating bandwidth of an omnidirectional antenna may reach 3-5% of the center frequency. The operating bandwidth of a directional antenna may reach 5-10% of the center frequency. Bandwidth can be considered as a frequency range on both sides of the center frequency (e.g., the resonant frequency of a dipole), where the antenna characteristics are within the acceptable range of the center frequency.

[0044] The resonant frequency band and the operating frequency band can be the same or different, or their frequency ranges can partially overlap. In one embodiment, the resonant frequency band of the antenna can cover multiple operating frequency bands of the antenna.

[0045] Phase shifter: Located between the radiator and the RF chip, on the connection line between them, it is used to adjust the phase of the signal fed into the radiator. Specifically, the phase of the signal fed into the radiator can be adjusted by changing the electrical length of the connection line between the radiator and the RF chip.

[0046] Medium wavelength: refers to the wavelength of electromagnetic waves propagating in a medium at the operating frequency band. For example, if the operating frequency band is [f1, f2], the corresponding medium wavelength is also the range [w1, w2]. Alternatively, to simplify calculations, the above-mentioned medium wavelength can also refer to the wavelength of electromagnetic waves propagating in the medium at the center frequency f0 of the operating frequency band. In this case, the medium wavelength is a specific value w0.

[0047] Antenna return loss: This can be understood as the ratio of the signal power reflected back to the antenna port after passing through the antenna circuit to the transmit power at the antenna port. The smaller the reflected signal, the larger the signal radiated into space through the antenna, and the higher the antenna's radiation efficiency. Conversely, the larger the reflected signal, the smaller the signal radiated into space through the antenna, and the lower the antenna's radiation efficiency.

[0048] Antenna return loss can be represented by the S11 parameter, which is one of the S-parameters. S11 represents the reflection coefficient, and this parameter characterizes the antenna's transmission efficiency.

[0049] In one embodiment, the S11 diagram can be understood as a schematic diagram representing the resonance generated by the antenna. In one embodiment, the resonance shown in the S11 diagram within the range of -6dB can be understood as the resonant frequency / frequency range / operating frequency band generated by the antenna. The S11 parameter is usually negative. The smaller the S11 parameter, the smaller the antenna return loss, the less energy reflected back by the antenna itself, which means more energy actually enters the antenna, and the higher the antenna radiation efficiency; the larger the S11 parameter, the greater the antenna return loss, and the lower the antenna radiation efficiency.

[0050] It should be noted that in engineering, an S11 value of -6dB is generally used as the standard. When the S11 value of an antenna is less than -6dB, the antenna can be considered to be working normally, or the antenna can be considered to have good transmission efficiency.

[0051] Antenna pattern: also known as radiation pattern. It refers to the graph showing how the relative field strength (normalized modulus) of the antenna's radiated field changes with direction at a certain distance from the antenna. It is usually represented by two mutually perpendicular planar patterns passing through the direction of maximum radiation of the antenna.

[0052] Antenna radiation patterns typically have multiple radiating beams. The beam with the highest radiating intensity is called the main lobe, and the remaining beams are called side lobes. Among the side lobes, the side lobe in the opposite direction to the main lobe is also called the back lobe.

[0053] Radiation efficiency refers to the ratio of the power radiated by an antenna into space (i.e., the power effectively converted into electromagnetic waves) to the active power input to the antenna. The active power input to the antenna equals the antenna's input power minus the power loss. Power loss mainly includes return loss power, ohmic loss power of the metal, and / or dielectric loss power. Both metal loss and dielectric loss are factors affecting radiation efficiency.

[0054] Those skilled in the art will understand that radiation efficiency is generally expressed as a percentage, and there is a corresponding conversion relationship between it and dB. The closer the radiation efficiency is to 0 dB, the better the radiation efficiency of the antenna.

[0055] dB: This stands for decibel, a logarithmic concept with base 10. Decibels are only used to evaluate the proportional relationship between two physical quantities; they themselves have no physical dimensions. For every 10-fold increase in the ratio between two quantities, their difference can be expressed as 10 dB. For example: A = 100, B = 10, C = 5, D = 1, then A / D = 20 dB; B / D = 10 dB; C / D = 7 dB; B / C = 3 dB. That is, a 10 dB difference between two quantities is a 10-fold difference, a 20 dB difference is a 100-fold difference, and so on. A 3 dB difference is a 2-fold difference between the two quantities.

[0056] The term "end" in the context of the main radiator's first / second / third / fourth / grounded / open ends should not be narrowly interpreted as an endpoint or end physically disconnected from other radiators. It can also refer to a segment of the main radiator including the first endpoint, which is the endpoint of the main radiator at the gap. For example, the first end of the main radiator can be considered a segment of the main radiator within a range of one-eighth of a first wavelength from that first endpoint. The first wavelength can be the wavelength corresponding to the operating frequency band of the main radiator, the wavelength corresponding to the center frequency of the operating frequency band, or the wavelength corresponding to the resonant point. In one embodiment, "end / point" can include a connection / coupling region on the radiator that couples to other conductive structures. For example, a feed end / feed point can be a coupling region on the antenna radiator that couples to a feed structure (e.g., a region facing a portion of the feed structure). Similarly, a ground end / grounding point can be a connection / coupling region on the antenna radiator that couples to a ground structure.

[0057] Open and Closed Terminals: In some embodiments, open and closed terminals are, for example, relative to whether or not they are grounded; the closed terminal is grounded, and the open terminal is not grounded. In one embodiment, the open terminal may also be referred to as a floating terminal, a free terminal, an open terminal, or an open-circuit terminal. In one embodiment, the closed terminal may also be referred to as a grounded terminal or a short-circuit terminal. It should be understood that in some embodiments, other conductors can be coupled through the open terminal to transfer coupled energy (which can be understood as transferring current).

[0058] In some embodiments, the open end and the closed end are, for example, relative to other conductors, with the closed end electrically connected to other conductors and the open end not electrically connected to other conductors.

[0059] To put it simply, the "open end" of a radiator can be defined as one end of the radiator that is spaced apart from the floor or coupled to the floor through a capacitive device.

[0060] To put it simply, the "grounding terminal" of a radiator can be understood as: if one end of the radiator is directly connected to the floor or coupled to the floor through an inductive device, it can be regarded as the grounding terminal of the radiator.

[0061] In some embodiments, the understanding of "closed end" can also be from the perspective of current distribution. A closed end or ground end can be understood as a point of high current or low electric field on a radiator. In one embodiment, coupling electronic devices (e.g., inductive devices) through a closed end can maintain the current distribution characteristics of the point of high current / low electric field. In one embodiment, opening a gap at or near the closed end (e.g., filling the gap with insulating material) can maintain the current distribution characteristics of the point of high current / low electric field.

[0062] In some embodiments, the understanding of "open terminal" can also be from the perspective of current distribution. An open terminal or a floating terminal can be understood as a point with a small current or a point with a large electric field on the radiator. In one embodiment, coupling electronic devices (e.g., capacitive devices) through an open terminal can maintain the current distribution characteristics of the point with a small current or a large electric field.

[0063] It should be understood that when an electronic device (e.g., capacitor, inductor, etc.) is coupled at the radiator end of a gap (which, from the perspective of the radiator's structure, resembles a radiator at the opening of an open or suspended end), the radiator end can be a point with a large current / small electric field. In this case, it should be understood that the radiator end at the gap is actually a closed end or a grounded end, etc.

[0064] Capacitance: can be understood as lumped capacitance and / or distributed capacitance. Lumped capacitance includes capacitive components, such as capacitor elements; distributed capacitance (or distributed capacitance) includes the equivalent capacitance formed by two conductive components separated by a certain gap.

[0065] In the embodiments of this application, the wavelength in a certain wavelength mode of the antenna (such as half-wavelength mode, etc.) can refer to the wavelength of the signal radiated by the antenna. It should be understood that the wavelength of the radiated signal in air can be calculated as follows: Wavelength = Speed ​​of light / Frequency, where the frequency is the frequency of the radiated signal. The wavelength of the radiated signal in a medium can be calculated as follows: Wavelength = (Speed ​​of light / ... )) / frequency, where, Let be the relative permittivity of the medium, and be the frequency of the radiated signal.

[0066] Coupling: In this application, it can be understood as indirect coupling, and "coupled connection" can be understood as indirect coupling connection. "Indirect coupling" can be understood as two conductors conducting electricity through a gap / non-contact manner. In one embodiment, indirect coupling can also be called capacitive coupling, for example, signal transmission is achieved by forming an equivalent capacitance through coupling between the gaps between two conductive parts.

[0067] The symmetry (e.g., axial symmetry, or central symmetry), parallelism, perpendicularity, and similarity (e.g., same length, same width, etc.) mentioned in the embodiments of this application are all relative to the current technological level, and not absolute and strict mathematical definitions. There can be a predetermined angular deviation between two mutually parallel or perpendicular structures. In one embodiment, the predetermined threshold can be less than or equal to a threshold of 1 mm, for example, the predetermined threshold can be 0.5 mm or 0.1 mm. In one embodiment, the predetermined angle can be an angle within the range of ±10°, for example, the predetermined angle deviation is ±5°.

[0068] To facilitate understanding of the electronic devices provided in the embodiments of this application, their application scenarios are first introduced below. The electronic devices in the embodiments of this application refer to terminal devices with communication functions. Specifically, they may refer to electronic devices employing one or more of the following communication technologies: Bluetooth (BT) communication technology, Global Positioning System (GPS) communication technology, Wireless Fidelity (Wi-Fi) communication technology, Global System for Mobile Communications (GSM) communication technology, Wideband Code Division Multiple Access (WCDMA) communication technology, Long Term Evolution (LTE) communication technology, 5G communication technology, and other future communication technologies. The electronic devices in the embodiments of this application may include mobile phones, tablets, laptops, smart bracelets, smartwatches, smart helmets, and smart glasses, etc., but this application embodiment is not limited to these.

[0069] Figure 1 This illustration shows a schematic diagram of an electronic device provided in an embodiment of this application. In this embodiment, a mobile phone is used as an example for explanation. Figure 1 As shown, in one embodiment, the electronic device includes a cover 100, a display / module 200, a printed circuit board (PCB) 300, a middle frame 400, and a rear cover 500. It should be understood that in some embodiments, the cover 100 may be a glass cover, or it may be replaced with a cover made of other materials, such as an ultra-thin glass cover, a polyethylene terephthalate (PET) cover, etc. In one embodiment, the cover 100, display 200, middle frame 400, and rear cover 500 can all be considered as part of the housing.

[0070] The cover plate 100 can be set close to the display screen 200, and can be mainly used to protect the display screen 200 from dust.

[0071] In one embodiment, the display screen 200 may include a liquid crystal display (LCD), a light emitting diode (LED) display panel, or an organic light-emitting diode (OLED) display panel, etc., and this application does not limit it.

[0072] The 400mm mid-frame primarily serves to support the entire machine. Figure 1 The diagram shows PCB 300 positioned between the mid-frame 400 and the back cover 500. It should be understood that in one embodiment, PCB 300 may also be positioned between the mid-frame 400 and the display screen 200; this application does not impose any limitations on this. PCB 300 may be made of flame-retardant material (FR-4) dielectric substrate, Rogers dielectric substrate, or a hybrid dielectric substrate of Rogers and FR-4, etc. Here, FR-4 is a designation for a flame-retardant material grade, and Rogers dielectric substrate is a high-frequency board. Electronic components, such as radio frequency chips, are mounted on PCB 300.

[0073] In one embodiment, PCB 300 may include a metal layer. This metal layer can be used to ground electronic components carried on PCB 300, or to ground other components such as bracket antennas, frame antennas, etc. This metal layer may be referred to as a ground plane, grounding plane, or grounding layer. In one embodiment, this metal layer can be formed by etching metal onto the surface of any dielectric substrate in PCB 300. In one embodiment, the grounding metal layer may be located on the side of PCB 300 near the mid-frame 400. In one embodiment, the edge of the printed circuit board PCB 300 can be considered as the edge of its grounding layer. In one embodiment, the metal mid-frame 400 can also be used for grounding the aforementioned components. Electronic devices may also have other ground planes / grounding planes, as previously described, and will not be repeated here.

[0074] The electronic device may also include a battery (not shown in the figure). The battery may be located between the middle frame 400 and the back cover 500, or between the middle frame 400 and the display screen 200, and this application is not limited thereto. In some embodiments, the PCB 300 is divided into a motherboard and a daughterboard, and the battery may be located between the motherboard and the daughterboard. The motherboard may be located between the middle frame 400 and the upper edge of the battery, and the daughterboard may be located between the middle frame 400 and the lower edge of the battery.

[0075] The electronic device may also include a bezel 600, which may be formed of a conductive material such as metal. The bezel 600 may be disposed between the display screen 200 and the back cover 500 and extend circumferentially around the periphery of the electronic device. The bezel 600 may have four sides surrounding the display screen 200 to help secure the display screen 200. In one implementation, the bezel 600 made of a metallic material can be directly used as the metal bezel of the electronic device, forming a metallic bezel appearance suitable for industrial design (ID). In another implementation, the outer surface of the bezel 600 may also be a non-metallic material, such as a plastic bezel, forming a non-metallic bezel appearance suitable for non-metallic ID.

[0076] The mid-frame 400 may include a border 600. The mid-frame 400, including the border 600, is a single unit that supports the electronic components within the device. The cover plate 100 and the rear cover 500 respectively cover the upper and lower edges of the border 600 to form the housing of the electronic device. Alternatively, the border 600 may not be considered part of the mid-frame 400. In one embodiment, the border 600 may be connected to and integrally formed with the mid-frame 400. In another embodiment, the border 600 may include inwardly extending protrusions for connection to the mid-frame 400, for example, via spring clips, screws, welding, etc. In one embodiment, the cover plate 100, the rear cover 500, the border 600, and the mid-frame 400 may be collectively referred to as the housing of the electronic device. It should be understood that "outer shell or housing" can be used to refer to part or all of any one of the cover plate 100, rear cover 500, frame 600 or middle frame 400, or to part or all of any combination of the cover plate 100, rear cover 500, frame 600 or middle frame 400.

[0077] The back cover 500 can be made of metal; it can also be made of non-conductive materials, such as glass or plastic; or it can be made of both conductive and non-conductive materials.

[0078] In one embodiment, the frame 600 can at least partially function as a radiator to receive / transmit radio frequency signals. This portion of the frame acting as a radiator may have gaps between itself and other parts of the middle frame 400, or between itself and the middle frame 400, thereby ensuring a good radiation environment for the radiator. In one embodiment, an aperture may be provided near this portion of the frame acting as a radiator. In one embodiment, the aperture may include an aperture disposed inside the electronic device, for example, an aperture not visible from the external surface of the electronic device. In one embodiment, the internal aperture may be formed by any one or multiple of the middle frame 400, battery, PCB 300, back cover 500, display screen 200, and other internal conductive components; for example, the internal aperture may be formed by a structural component of the middle frame 400. In one embodiment, the aperture may also include a slot / slit / opening on the frame 600. In one embodiment, the slot / slit / opening on the frame 600 may be a slit formed on the frame 600, at which the frame 600 is divided into two parts without a direct connection. In one embodiment, the aperture may further include a slit / gap / aperture provided on the back cover 500 or the display screen 200. In one embodiment, the back cover 500 includes a conductive material, and the aperture provided in the conductive material may communicate with a slit or gap in the frame to form a continuous aperture on the surface of the electronic device.

[0079] In one embodiment, the radiator of the electronic device may also be disposed within the frame 600. The frame 600 comprises a non-conductive material, and the radiator of the antenna may be located within the electronic device and disposed along the frame 600, or the radiator may be at least partially embedded within the non-conductive material of the frame. In one embodiment, the radiator is disposed close to the non-conductive material of the frame 600 to minimize the volume occupied by the radiator and to be closer to the outside of the electronic device, thereby achieving better signal transmission performance. It should be noted that "disposed close to the frame 600" means that the radiator can be disposed tightly against the frame 600, or it can be disposed close to the frame 600, for example, there may be a small gap between the radiator and the frame 600.

[0080] In one embodiment, the radiator of the electronic device may also be disposed within a housing, such as a bracket antenna disposed on a circuit board. Figure 1(Not shown in the image). A gap may exist between the radiator located within the housing and other conductive components inside the housing to ensure a good radiation environment for the radiator. In one embodiment, an aperture may be provided near the radiator. In one embodiment, the aperture may include an aperture located inside the electronic device, for example, an aperture not visible from the external surface of the electronic device. In one embodiment, the internal aperture may be formed by any one or multiple of the frame 600, middle frame 400, battery, PCB 300, back cover 500, display screen 200, and other internal conductive components; for example, the internal aperture may be formed by a structural component of the middle frame 400. In one embodiment, the aperture may also include a slot / slit / opening on the frame 600. In one embodiment, the slot / slit / opening on the frame 600 may be a slit formed on the frame, at which the frame 600 is divided into two parts without a direct connection. In one embodiment, the aperture may also include a slot / slit / opening on the back cover 500 or the display screen 200. In one embodiment, the back cover 500 includes a conductive material, and the apertures formed in the conductive material can communicate with the slots or breaks in the frame to form continuous apertures on the surface of the electronic device. In one embodiment, the apertures on the back cover 500 or the display screen can also be used to house other devices, such as cameras, and / or sensors, and / or microphones, and / or speakers, etc.

[0081] In one embodiment, the antenna can be based on a flexible printed circuit (FPC), a laser-direct-structuring (LDS) antenna, or a microstrip disk antenna (MDA), among other forms. In another embodiment, the antenna can be a transparent or semi-transparent structure embedded within the screen of the electronic device, making it a transparent antenna element embedded within the screen of the electronic device.

[0082] Figure 1 The electronic device is shown only schematically, and the actual shape, size, and construction of these components are not subject to change. Figure 1 limited.

[0083] in addition, Figure 1This is merely an illustrative demonstration of one possible configuration of the electronic device provided in this application. In practical applications, the structure of the electronic device can be adapted to meet specific design requirements. For example, in one possible embodiment, the electronic device may not include the middle frame 400. That is, the cover plate 100, the display screen 200, and the rear cover 500 together form the housing of the electronic device. Other structures of the electronic device can refer to the above embodiment, and will not be described in detail here.

[0084] As discussed above regarding electronic devices, antennas are a crucial component for communication. Typically, the antenna layout must be adapted to the different design requirements of electronic devices. For example, to meet user demands for an all-metal appearance, some electronic devices now use metal for their back covers. Antenna solutions for such devices primarily utilize the non-display area of ​​the screen for signal transmission. However, as the non-display area narrows, antenna performance deteriorates, and the signal is mainly transmitted towards the side of the screen away from the back cover. In other words, the antenna beam mainly covers the space on that side of the screen. Furthermore, as camera modules occupy increasingly larger spaces, antenna placement within the camera module area can be considered. This allows antennas in that area to transmit signals towards the side of the back cover away from the display. Thus, the complementary nature of the signals radiated by antennas in different areas can be utilized to meet the communication requirements of the electronic device.

[0085] In view of this, the electronic device provided in this application improves the communication performance of the electronic device by utilizing the setting area of ​​the camera module for antenna layout. To facilitate understanding of the solution provided in this application, this application will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0086] Figure 2 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. For example... Figure 2 As shown, the electronic device includes a back cover 500 and a camera decorative assembly 700, which is mounted on the back cover 500. The camera decorative assembly 700 can be used to protect the camera module of the electronic device and can also serve as an exterior component to enhance the aesthetics of the electronic device.

[0087] You can continue to refer to Figure 2In some embodiments of this application, the camera decorative assembly 700 includes an insulating cover plate 701, which covers the end of the entire camera decorative assembly 700 located outside the rear cover 500. This ensures the aesthetic appearance of the electronic device while also protecting the camera module and other components installed on the camera decorative assembly 700.

[0088] This application does not limit the material of the insulating cover 701. It can be exemplarily a plate-like structure with good light transmittance, such as a glass cover or a plastic cover, to meet the light transmittance requirements of the camera module, etc.

[0089] Figure 3 This is a partial structural diagram of an electronic device provided in an embodiment of this application. Figure 3 It can be understood as Figure 2 The partial structure shown in the dashed box is a view from direction A after the insulating cover plate 701 has been removed. Additionally, for easier understanding, please refer to... Figure 4 , Figure 4 for Figure 3 The diagram shows a BB cross-sectional view of the structure. In this application, the back cover 500 includes a mounting hole 501. The location of the mounting hole 501 can be selected according to the layout of the camera module in the electronic device, and is not limited here.

[0090] You can continue to refer to Figure 3 and Figure 4 The camera decorative assembly 700 also includes a metal decorative plate 1, which is mounted in the mounting hole 501. It is understood that in some embodiments, the above... Figure 2 The insulating cover 701 shown can be placed over the end of the metal decorative panel 1 located outside the rear cover 500.

[0091] like Figure 4 As shown, the metal decorative panel 1 can be connected to the back cover 500. This application does not limit the connection method between the metal decorative panel 1 and the back cover 500, which can be exemplarily welding or bonding.

[0092] You can continue to refer to Figure 4 In one possible embodiment of this application, the metal decorative panel 1 may further include an overlapping portion 101, which may be disposed opposite to the end face of the rear cover 500 facing the inside of the electronic device. In this way, by connecting the overlapping portion 101 to the end face of the rear cover 500, the connection between the metal decorative panel 1 and the rear cover 500 can be realized, thereby improving the convenience of connecting the metal decorative panel 1 and the rear cover 500.

[0093] This application does not limit the specific arrangement of the metal decorative panel 1. In one possible embodiment, the metal decorative panel 1 may be an integral structural component, which can be exemplarily a die-cast metal structural component or a structural component processed by other possible processes. In addition, the material of the metal decorative panel 1 may be, but is not limited to, aluminum alloy, magnesium-aluminum alloy, or stainless steel, etc., which have good electrical conductivity.

[0094] In the electronic device provided in this application, the aforementioned metal decorative plate 1 can be used for antenna design. For specific implementation, please refer to... Figure 4 The electronic device may include a first antenna 10, which includes the aforementioned metal decorative panel 1. Additionally, the electronic device also includes a floor 2, with the metal decorative panel 1 and floor 2 spaced apart to form a cavity between them, serving as a radiation cavity for the first antenna 10; thus, the first antenna 10 is a cavity antenna.

[0095] exist Figure 4 In the embodiment shown, the floor 2 includes a circuit board 201, and a metal decorative panel 1 is disposed opposite to and spaced apart from the circuit board 201, so that the metal decorative panel 1 and the circuit board 201 are used to jointly form the radiation cavity of the first antenna 10.

[0096] It is understandable that, generally speaking, within a certain range, a larger radiating cavity is more conducive to the signal transmission of the cavity antenna. Therefore, in one possible embodiment of this application, the edge of the metal decorative panel 1 can be connected to the ground layer of the circuit board 201, so that the metal decorative panel 1 is connected to the ground plane 2 of the electronic device through the ground layer of the circuit board 201, thereby grounding the metal decorative panel 1 and forming a sufficiently large radiating cavity between the metal decorative panel 1 and the circuit board 201.

[0097] In some embodiments of this application, at least a portion of the edge of the metal decorative plate 1 can be connected to the ground layer of the circuit board 201, as long as the resonant mode that meets the communication requirements of the first antenna 10 can be generated by using the radiating cavity between the metal decorative plate 1 and the circuit board 201. This also helps to increase the design freedom of the first antenna 10, thereby reducing the implementation difficulty of the solution.

[0098] This application does not limit the specific connection method between the metal decorative panel 1 and the ground layer of the circuit board 201. For example, in some embodiments of this application, such as... Figure 4 As shown, the edge of the metal decorative panel 1 can be connected to the ground layer of the circuit board 201 via a conductive connector 3. The conductive connector 3 may include at least one of conductive foam or metal spring, thereby achieving reliable grounding of the metal decorative panel 1.

[0099] Additionally, it is understood that the area of ​​the ground layer of the circuit board 201 used for connection with the metal decorative panel 1 can be exposed, thereby facilitating the connection between the metal decorative panel 1 and the circuit board 201.

[0100] You can continue to refer to Figure 3 and Figure 4 The metal decorative panel 1 includes a slot 102. In one possible embodiment, while ensuring the structural reliability of the metal decorative panel 1, the width d1 of the slot 102 can be made to satisfy: d1≥1mm, for example, 2mm, 2.5mm or 3mm, etc., so as to improve the radiation performance of the first antenna 10.

[0101] In some embodiments of this application, the slot 102 may be filled with an insulating material, which may be, for example, plastic. The insulating material may be integrally molded with the metal decorative panel 1 using an injection molding process, or it may be installed as a separate structural component within the slot 102. This prevents water, dust, or other impurities from entering the electronic device through the slot 102, thereby improving the reliability of the electronic device.

[0102] In addition, to ensure the appearance, such as Figure 4 As shown, the slit 102 is not attached to the overlap 101 of the metal decorative panel 1. Instead, a gap d2 is left between the slit 102 and the overlap 101, and the gap d2 satisfies: d2≥0.2mm. This effectively avoids the exposure of the insulating material such as plastic filling the slit 102.

[0103] This application does not specifically limit the shape and location of the slit 102 in the metal decorative panel 1. It can be either a regular or irregular shape, and its design can be tailored to the signal frequency band supported by the first antenna 10, enabling the first antenna 10 to generate a resonant mode in the corresponding frequency band, thereby meeting the communication requirements of the first antenna 10. For example, in some embodiments of this application, by rationally designing the shape and location of the slit 102, the first antenna 10 can support the communication requirements of the Wi-Fi 2.4GHz band, the Wi-Fi 5GHz band, or the 1.575GHz band of the Global Positioning System (GPS).

[0104] Since the antenna can only resonate when receiving a feed signal, thus enabling signal transmission, the first antenna 10 may also include a feed point to realize its communication function. For specific implementation, refer to... Figure 5 , Figure 5 This is a schematic diagram of a metal decorative panel provided in an embodiment of this application. Figure 5 This can be understood as the above. Figure 3 and Figure 4 The metal decorative panel 1 shown has a specific structure, and Figure 5 The structure of the metal decorative panel 1 facing the circuit board 201 is shown, that is, the structure of the metal decorative panel 1 facing the inside of the electronic device is shown.

[0105] like Figure 5 As shown, the metal decorative panel 1 also includes a first feed point 103, which can be connected to an RF circuit to receive RF signals from the RF circuit. Since the first feed point 103 is located on the side of the metal decorative panel 1 facing the circuit board 201, that is, within the radiating cavity of the first antenna 10, when the first feed point 103 receives an RF signal, it can utilize the radiating cavity to generate a corresponding resonance, thereby generating a signal in the corresponding frequency band.

[0106] This application does not limit the specific arrangement of the first feed point 103, for example, in Figure 5 In the embodiment shown, the metal decorative panel 1 may include a first metal pillar 1041, which is located on the side surface of the metal decorative panel 1 facing the circuit board 201. The first metal pillar 1041 can serve as a first feed point 103 for connection with the radio frequency circuit of the first antenna 10, thereby feeding radio frequency signals into the first feed point 103 using the radio frequency circuit.

[0107] You can continue to refer to Figure 5 In some other possible embodiments of this application, the metal decorative panel 1 further includes a second metal pillar 1042, which is also located on the side surface of the metal decorative panel 1 facing the circuit board 201. Additionally, the first antenna 10 may also include a tuning circuit ( Figure 5 (not shown in the image), then the second metal pillar 1042 can be connected to the tuning circuit to adjust the resonant frequency of the signal of the first antenna 10, so as to adjust the resonant frequency of the first antenna 10 and thus meet the communication requirements of the first antenna 10.

[0108] It is worth mentioning that, in some embodiments, the first metal pillar 1041 and the second metal pillar 1042 can be integrally formed with other parts of the metal decorative panel 1 to improve the structural reliability of the metal decorative panel 1. In some embodiments, the first metal pillar 1041 and the second metal pillar 1042 can also be connected to other parts of the metal decorative panel 1 by welding or other means to improve the flexibility of the placement of each metal pillar. In addition, besides using metal pillars as circuit connection ports, the metal decorative panel 1 can also use any other possible methods to achieve connection with the circuit, which will not be listed here.

[0109] In some embodiments of this application, the first power supply point 103 of the metal decorative plate 1 can be connected to a connection terminal (such as a spring or a clip) disposed on the circuit board 201, and the connection terminal is also connected to the radio frequency module in the radio frequency circuit through a power supply wire, so that the first power supply point 103 can be used to receive radio frequency signals from the radio frequency module.

[0110] This application does not limit the operating frequency band of the first antenna 10. The first antenna 10 can be tuned in the corresponding operating frequency band by adjusting the tuning circuits of different areas of the metal decorative plate 1. Next, taking the first antenna 10 as a Wi-Fi antenna as an example, the resonant modes that the first antenna 10 can generate will be exemplarily demonstrated.

[0111] Reference Figure 6 , Figure 6 This is a schematic diagram of another partial structure of the electronic device provided in an embodiment of this application. Figure 6 This can be understood as a projected view from outside the back cover (500mm) towards the inside of the electronic device, and in Figure 6 The insulating cover plate is omitted. Additionally, in... Figure 6 In the illustrated embodiment, the first antenna 10 may include a first tuning circuit and a second tuning circuit, wherein the first tuning circuit is used to adjust the resonant frequency of the first antenna 10 when it operates in the Wi-Fi 2.4GHz band, and the second tuning circuit is used to adjust the resonant frequency of the first antenna 10 when it operates in the Wi-Fi 5GHz band. Figure 6 In the diagram, point D represents the connection point between the metal decorative panel 1 and the first tuning circuit, and point E represents the connection point between the metal decorative panel 1 and the second tuning circuit. Thus, when the first feed point 103 of the first antenna 10 receives a Wi-Fi 2.4GHz frequency band radio frequency signal, the resonant mode of the first antenna 10 can be adjusted by the first tuning circuit to enable the first antenna 10 to operate in the Wi-Fi 2.4GHz frequency band. Similarly, when the first feed point 103 of the first antenna 10 receives a Wi-Fi 5GHz frequency band radio frequency signal, the resonant mode of the first antenna 10 can be adjusted by the first tuning circuit to enable the first antenna 10 to operate in the Wi-Fi 5GHz frequency band.

[0112] Additionally, refer to Figure 7a , Figure 7a for Figure 6 The diagram shows the current distribution on the metal decorative panel when the first antenna operates in the Wi-Fi 2.4GHz band. (Source: [Insert source here]) Figure 7a It can be seen that the resonant modes of the Wi-Fi 2.4GHz band are mainly concentrated on the side of the slit 102 near the light-transmitting hole 105, and the two ends of the slit 102 are the half-wavelength current mode with large current and the middle is the half-wavelength current mode with zero current. Figure 7b for Figure 6 The diagram shows the current distribution on the metal decorative panel when the first antenna operates in the Wi-Fi 4.8GHz band. The resonant modes of the Wi-Fi 4.8GHz band are also mainly concentrated on the side of the slit 102 near the light-transmitting hole 105, with large current points at both ends of the slit 102 and a three-wavelength current mode with three zero current points in the middle. Figure 7c for Figure 6 The diagram shows the current distribution on the metal decorative panel when the first antenna operates in the Wi-Fi 5GHz band. Figure 7c It can be seen that the resonant mode of the Wi-Fi 5GHz band is mainly concentrated in the isolated part of the metal decorative panel 1 located in the slot 102, with zero current at both ends and a half-wavelength current mode with a large current in the middle.

[0113] By analyzing the above Figures 7a to 7c As can be understood from the analysis, by adopting the antenna design scheme provided in this application, the resonant mode generated by the first antenna 10 can be adjusted by adjusting the tuning circuit of the area of ​​the metal decorative plate 1 used to excite different current modes, so that the first antenna 10 can be used to support the transmission of signals in the corresponding frequency band to meet the communication requirements of the first antenna 10.

[0114] This application does not limit the specific configuration of the tuning circuit, but it may exemplary include multiple tuning branches and a control switch. The control switch is used to switch the multiple tuning branches so that the metal decorative panel 1 is connected to the floor through different tuning branches. In some possible embodiments, each tuning branch may include a capacitor, an inductor, or a combination of a capacitor and an inductor to adjust the resonant frequency of the first antenna 10 by adjusting at least one of the equivalent capacitance and equivalent inductance of the first antenna 10.

[0115] Figure 8 This diagram illustrates the effect of the tuning circuit on the resonance adjustment of the first antenna when the first antenna is operating in the Wi-Fi 5GHz band. Figure 8 The curves with different line shapes represent the S11 curves of the first antenna 10 with different equivalent capacitances or different equivalent inductances. For example... Figure 8 It can be seen that when the first antenna 10 operates in the Wi-Fi 5GHz band, the resonant frequency of the first antenna 10 in the corresponding operating frequency band can be adjusted by adjusting at least one of the equivalent capacitance and equivalent inductance of the first antenna 10 through the tuning circuit, thereby adjusting the communication performance of the first antenna 10.

[0116] Reference Figure 9 , Figure 9 This is a schematic diagram illustrating an assembly relationship between a metal decorative panel and a circuit board provided in an embodiment of this application. Figure 9This can be understood as being in Figure 5 The structure is based on the existing structure, with the addition of circuit board 201, and Figure 8 A view showing the direction from the circuit board 201 to the metal decorative panel 1. Also, refer to... Figure 4 and Figure 9 In one possible embodiment of this application, the projection of the circuit board 201 on the back cover 500 covers the mounting hole 501 of the back cover 500, which is beneficial to the increase of the radiation cavity of the first antenna 10.

[0117] As described above, the electronic device provided in this application also includes a camera module. (See reference...) Figure 10 , Figure 10 This is a schematic diagram of another partial structure of the electronic device provided in an embodiment of this application. It can be seen that, compared with... Figure 3 Compared to the embodiments shown, Figure 10 The electronic device shown also includes a camera module 800, which may be a camera module or a flash module, etc. Furthermore, this application does not limit the specific number of camera modules 800, for example, in... Figure 10 In the illustrated embodiment, there are two camera modules 800, both of which can be camera modules. In other embodiments of this application, the electronic device may also include both a camera module and a flash module.

[0118] Reference Figure 11 , Figure 11 for Figure 10 The diagram shows a CC cross-sectional view of the structure. In the electronic device provided in this application, the camera module 800 penetrates the circuit board 201. Alternatively, the circuit board 201 includes a through hole 2011, into which the camera module 800 is inserted.

[0119] In addition, such as Figure 10 and Figure 11 As shown, the metal decorative panel 1 also includes a light-transmitting hole 105. The light-incident end of the camera module 800 is located at the light-transmitting hole 105, so that the camera module 800 can receive light through the light-transmitting hole 105, thereby realizing the camera function of the camera module 800. In some other embodiments of this application, the light-incident end of the camera module 800 may also be located at the light-transmitting hole 105, as long as the camera module 800 can receive light through the light-transmitting hole 105.

[0120] You can continue to refer to Figure 11There is a distance d3 between the camera module 800 and the wall of the light-transmitting hole 105. The value of this distance d3 can be designed according to the operating frequency band of the first antenna 10, and generally, the higher the operating frequency band of the first antenna 10, the larger the value of this distance d3. For example, in one possible embodiment, when the first antenna 10 operates in the Wi-Fi 6G frequency band, d3 ≥ 0.8mm.

[0121] In addition, Figure 10 and Figure 11 In the embodiment shown, in order to avoid interference between two adjacent camera modules 800, the width d4 of the portion of the metal decorative panel 1 located between two adjacent camera modules 800 can be made to satisfy: d4≥5mm along the arrangement direction of the two camera modules 800.

[0122] You can continue to refer to Figure 11 In some embodiments of this application, the distance d5 between the slit 102 and the light-transmitting hole 105 of the metal decorative panel 1 can be made to satisfy: d5≥0.6mm. This ensures the feasibility of the processing technology of the metal decorative panel 1 and guarantees the structural reliability of the metal decorative panel 1.

[0123] In the embodiments of this application, such as Figure 11 As shown, a gap exists between the camera module 800 and the circuit board 201 along the extending direction of the plane containing the circuit board 201. This gap can be filled with an insulating material, such as plastic, to limit the radial movement of the camera module 800, thereby improving the installation reliability of the camera module 800. Furthermore, by filling the gap between the camera module 800 and the circuit board 201 with insulating material, coupling contact between the metal decorative plate 1 and the camera module 800 can be effectively avoided, preventing the metal decorative plate 1 from being grounded through the camera module 800. This avoids reducing the volume of the radiation cavity of the first antenna 10, ensuring the radiation efficiency of the first antenna 10 within the required operating frequency band.

[0124] It is worth mentioning that this application does not limit the size of the gap between the camera module 800 and the circuit board 201. In one possible embodiment, the width d of the gap can satisfy: 0.5mm≤d≤1mm, and can be 0.7mm, 0.8mm or 0.95mm, etc., for example. As long as reliable positioning of the camera module 800 is achieved while avoiding coupling contact between the metal decorative plate 1 and the camera module 800, it is acceptable.

[0125] As described above, since part of the camera module 800 is located within the radiating cavity of the first antenna 10, in order to reduce the impact of the camera module 800 on the performance of the first antenna, the camera module 800 is connected to the ground plane of the circuit board 201, thereby grounding the camera module 800.

[0126] This application does not limit the specific connection method between the camera module 800 and the ground layer of the circuit board 201. For example, the camera module 800 can be connected to the ground layer of the circuit board 201 through conductive connectors such as conductive foam or metal springs 3.

[0127] By adopting the electronic device design scheme provided in the above embodiments of this application, the camera module 800 and the first antenna 10 can share the aforementioned radiating cavity for layout. This facilitates the reduction of the size of the camera decorative component 700, thereby enabling the miniaturization and thinning of the electronic device and improving its aesthetic appearance. In particular, when the back cover 500 of the electronic device is a metal back cover, it enhances the metallic appearance of the electronic device.

[0128] It is worth mentioning that, in some possible embodiments of this application, other modules of the electronic device can also be arranged using the radiating cavity of the first antenna 10. For example, the electronic device may also include a microphone module, which can be arranged with reference to the camera module 800, so that the microphone module, the camera module 800 and the first antenna 10 share the radiating cavity, thereby further improving the compactness of the electronic device layout.

[0129] Figure 12 A cross-sectional view of another structure of the electronic device provided in an embodiment of this application. (Compared to the above...) Figure 11 The embodiment shown differs from the one described above in that... Figure 12 In the illustrated embodiment, the electronic device further includes a conductive sheet 900 located on the side of the circuit board 201 facing away from the metal decorative plate 1. The conductive sheet 900 is connected to the ground layer of the circuit board 201, and the projection of the conductive sheet 900 on the circuit board 201 covers the gap between the camera module 800 and the circuit board 201. This improves the boundary integrity of the radiation cavity of the first antenna 10, thereby reducing clutter introduced by the camera module 800 and improving the performance of the first antenna 10.

[0130] As described above, the camera module 800 penetrates the circuit board 201. Therefore, in some embodiments of this application, such as... Figure 12 As shown, a portion of the camera module 800 can also be located on the side of the circuit board 201 away from the metal decorative plate 1. This allows the camera module 800 to be connected to the conductive sheet 900, thereby achieving an indirect connection between the camera module 800 and the grounding layer of the circuit board 201, which is to achieve an indirect connection between the camera module 800 and the ground 2, thus achieving reliable grounding of the camera module 800.

[0131] This application does not limit the material of the conductive sheet 900, which may be, for example, copper foil, steel sheet or circuit board, as long as it can be used to achieve electrical connection.

[0132] Reference Figure 13 , Figure 13 This is a schematic diagram of another partial structure of the electronic device provided in an embodiment of this application. Figure 13 This can be understood as installing the camera module 800 on... Figure 9 The structure shown has a through hole after 2011, and Figure 13 The structure of the circuit board 201 facing away from the metal decorative panel 1 is used to display the structure. Additionally, refer to... Figure 14 , Figure 14 This is a schematic diagram of a conductive sheet provided in an embodiment of this application, and Figure 14 This application illustrates the structure of the conductive sheet 900 facing the circuit board 201. The specific structure of the conductive sheet 900 is not limited to this application; for example, in... Figure 14 In the embodiment shown, the conductive sheet 900 can be a one-piece molded structure.

[0133] Furthermore, this application does not limit the specific connection method between the conductive sheet 900 and the camera module 800. See also... Figures 12 to 14 In some embodiments of this application, the conductive sheet 900 and the camera module 800 may be connected, but are not limited to, via a conductive connector 3. The conductive connector 3 may include at least one of conductive foam or a metal spring, etc., to achieve stable contact between the conductive sheet 900 and the camera module 800, thereby meeting the grounding requirements of the camera module 800. Furthermore, the portion of the conductive sheet 900 located on the periphery of the circuit board 201 around the camera module 800 can be reliably connected via conductive foam, a metal spring, or soldering to ensure the stability of the grounding of the conductive sheet 900.

[0134] The electronic device provided in this application utilizes a portion of the structure of the camera decorative assembly to set up the first antenna 10, which helps to improve the integration of the electronic device. In addition, since the signal of the first antenna 10 can be transmitted to the side of the rear cover 500 away from the display screen 200, it can achieve signal coverage on the side of the rear cover 500 of the electronic device, thereby meeting the communication requirements between the electronic device and the communication device on that side.

[0135] It is understood that the above embodiments only exemplarily show and describe a part of the structure of the camera decorative component. In addition, the camera decorative component may include other possible structures, which will not be listed one by one here.

[0136] Furthermore, as described above, when the back cover 500 of the electronic device is a metal back cover, the electronic device may also include an antenna for transmitting signals to the side of the display screen away from the back cover, thereby increasing the signal coverage range of the electronic device. (Refer to...) Figure 15 , Figure 15 This is another structural schematic diagram of the electronic device provided in the embodiments of this application. Figure 15 The structure of one side of the display screen 200 of the electronic device is used to demonstrate this. In this embodiment, the electronic device also includes a second antenna 20 for transmitting signals to the side of the display screen opposite to the back cover.

[0137] This application does not limit the specific configuration of the second antenna 20. In one possible embodiment, such as Figure 15 As shown, the display screen 200 includes a display area 2001 and a non-display area 2002, with the non-display area 2002 arranged around the periphery of the display area 2001. Additionally, the second antenna 20 is also a cavity antenna, which can be exemplarily located between the display screen 200 and the back cover 500. The second antenna 20 may include a conductive plate with a second feed point, the conductive plate being spaced apart from and connected to a ground plane. Furthermore, the conductive plate may have a slit, at least a portion of which may be located in the non-display area 2002; or it may be located close to the non-display area 2002, for example, with the slit spaced from the edge of the non-display area 2002 at a distance of, for example, less than 5 mm or even less than 2 mm. This satisfies the signal transmission requirements of the second antenna 20.

[0138] The above embodiments are merely illustrative descriptions of one possible configuration of the second antenna 20 of the electronic device provided in this application. However, when the second antenna 20 is a cavity antenna, its configuration is not limited to this. Furthermore, in another possible embodiment of this application, the second antenna 20 may also be, but is not limited to, a wire antenna or other types of antenna, as long as it enables signal transmission to the side of the display screen 200 opposite to the back cover 500.

[0139] Therefore, it can be seen that, by adopting the electronic device design scheme provided in this application, the signal of the first antenna 10 can be transmitted to the side of the rear cover away from the display screen, thereby forming a... Figure 16a The radiation pattern shown. The signal from the second antenna 20 can be transmitted to the side of the display screen away from the back cover to form a radiation pattern as shown. Figure 16b The radiation pattern shown indicates that even in scenarios where the back cover 500 is a metal back cover, the complementary coverage of the first antenna 10 and the second antenna 20 can still be utilized to meet the requirements of multi-angle signal transmission for electronic devices, thereby improving the communication performance of electronic devices.

[0140] It is understood that in this application, the first antenna 10 can be connected to the feed circuit of the electronic device through the first feed point 103, so that the first antenna 10 can be used to receive or transmit signals of a corresponding frequency band, thereby realizing the communication function of the first antenna 10. Similarly, the second antenna 20 can be connected to the feed circuit of the electronic device through the second feed point, so that the second antenna 20 can be used to receive or transmit signals of a corresponding frequency band, thereby realizing the communication function of the second antenna 20. Furthermore, since the signal coverage ranges of the first antenna 10 and the second antenna 20 are complementary, in this application, the connection between the first feed point 103 and the second feed point and the feed circuit can be switched based on a comparison of the signal strengths of the first antenna 10 and the second antenna 20, thereby optimizing the communication performance of the electronic device.

[0141] Reference Figure 17 , Figure 17 This is a schematic diagram of an antenna system for an electronic device provided in an embodiment of this application. Figure 17 The diagram illustrates exemplary placement of the first antenna 10 and the second antenna 20. Additionally, the electronic device includes an RF module 30 and an RF switch 40. The RF switch 40 includes a first connection terminal 41, a second connection terminal 42, and a third connection terminal 43. The first connection terminal 41 is connected to the RF module 30, the second connection terminal 42 is connected to a first feed point of the first antenna 10, and the third connection terminal 43 is connected to a second feed point of the second antenna 20. Thus, the connection between the first connection terminal 41 and the second connection terminal 42 or the third connection terminal 43 can be controlled via the RF switch 40 to switch the connection relationship between the RF module 30 and the first or second feed point.

[0142] In one possible embodiment of this application, when the signal strength received by the first antenna 10 is greater than the signal strength received by the second antenna 20, for example in Figure 18a In the scenario shown, where the electronic device 1000 communicates with the router 2000, and the back cover 500 of the electronic device 1000 faces the router 2000, then... Figure 17 The signal transmission direction of the first antenna 10 shown is towards the router 2000. (Refer to...) Figure 17 The RF switch 40 can control the connection between the first connection terminal 41 and the second connection terminal 42, thus enabling the RF module 30 to feed RF signals to the first feed point. This allows the first antenna 10 to be primarily used for communication within the electronic device 1000, ensuring the communication performance of the electronic device 1000.

[0143] In another possible embodiment of this application, when the signal strength received by the second antenna 20 is greater than the signal strength received by the first antenna 10, for example in Figure 18bIn the scenario shown, where the electronic device 1000 communicates with the router 2000, and the display screen 200 of the electronic device 1000 faces the router 2000, then... Figure 17 The signal transmission direction of the second antenna 20 shown is towards the router 2000. (Refer to...) Figure 17 The RF switch 40 controls the connection between the first connection terminal 41 and the third connection terminal 43, allowing the RF module 30 to feed RF signals to the second feed point. This enables the second antenna 20 to be primarily used for communication within the electronic device 1000, ensuring the communication performance of the electronic device 1000.

[0144] Figure 19 This is a schematic diagram of another antenna system for an electronic device provided in an embodiment of this application. (Similar to the above...) Figure 17 The antenna system shown is different in that... Figure 19 In the illustrated embodiment, the electronic device includes a radio frequency (RF) module 30 and a combiner 60. The RF module 30 is connected to a first feed point of the first antenna 10 via the combiner 60, and the RF module 30 is also connected to a second feed point of the second antenna 20 via the combiner 60. This allows the energy output from the RF module 30 to be distributed through the combiner 60 to the first feed point of the first antenna 10 and the second feed point of the second antenna 20, enabling both to simultaneously receive feed signals. This allows the first antenna 10 and the second antenna 20 to be used simultaneously for signal transmission in the same frequency band, resulting in a wider signal beam coverage of the antenna system including the first antenna 10 and the second antenna 20, potentially achieving 360° omnidirectional signal beam coverage.

[0145] In some embodiments of this application, the combiner 60 can be replaced with a microstrip line, etc. That is, the radio frequency module 30 can be connected to the first feed point of the first antenna 10 and the second feed point of the second antenna 20 through different microstrip lines. It can also distribute the energy output by the radio frequency module 30 to the first feed point of the first antenna 10 and the second feed point of the second antenna 20, so that the first antenna 10 and the second antenna 20 can be used simultaneously for the transmission of signals in the same frequency band.

[0146] Then adopt Figure 19 The antenna system design shown can still meet the requirements of electronic devices for multi-angle signal coverage, thereby ensuring the communication performance of electronic devices.

[0147] In some embodiments of this application, the above-mentioned Figure 17 The illustrated embodiments and Figure 19 The illustrated embodiments are combined. For example, refer to Figure 20 , Figure 20 This is a schematic diagram of another antenna system for an electronic device provided in an embodiment of this application. Figure 20In the illustrated embodiment, the RF switch 40 further includes a fourth connection terminal 44, which is connected to the combiner 60. The combiner 60 is connected to the first feed point of the first antenna 10 and the second feed point of the second antenna 20. Thus, when the RF switch 40 controls the connection between the first connection terminal 41 and the fourth connection terminal 44, the energy output from the RF module 30 can be distributed through the combiner 60 to the first feed point of the first antenna 10 and the second feed point of the second antenna 20, thereby enabling the first antenna 10 and the second antenna 20 to simultaneously transmit signals in the same frequency band.

[0148] Then adopt Figure 20 The antenna system design shown can meet the requirements of electronic devices for multi-angle signal coverage by switching the connection points of the RF switch 40 and the RF module 30, and at the same time, it is also conducive to improving the applicable scenarios of the antenna system of electronic devices.

[0149] Reference Figure 21 , Figure 21 This is a partial structural diagram of another structure of the electronic device provided in an embodiment of this application. In this embodiment, the electronic device 1000 further includes a frame 600, which is arranged circumferentially around the electronic device 1000. In addition, the electronic device 1000 also includes a third antenna 50, the radiator of which is disposed on the frame 600, thus the third antenna 50 is a frame antenna.

[0150] Understandably, the third antenna 50 can theoretically be placed at any position on the frame 600. However, when the operating frequency band of the third antenna 50 is close to that of the first antenna 10, it is necessary to ensure that the first antenna 10 and the third antenna 50 have sufficient isolation to reduce mutual interference between them.

[0151] Reference Figure 22 , Figure 22 for Figure 21 The diagram shows the antenna performance of an electronic device. Figure 22 In the diagram, the solid line represents the S-curve of the first antenna 10, and the dashed line represents the efficiency curve of the first antenna 10; the single-dotted-dashed line represents the S-curve of the third antenna 50, and the double-dotted-dashed line represents the efficiency curve of the third antenna 50. Additionally, the dotted line represents the isolation curve between the first antenna 10 and the third antenna 50. Therefore... Figure 22 It can be seen that by adopting the design scheme of the electronic device provided in this application, while ensuring the radiation performance of the first antenna 10 and the third antenna 50, a high degree of isolation can be achieved between the first antenna 10 and the third antenna 50, for example, the isolation can be greater than 30dB.

[0152] This is because, using the design scheme of the first antenna 10 of the electronic device 1000 provided in this application, the current during operation is mainly confined within its cavity, giving the radiation pattern of the first antenna 10 a certain directionality. The current of the third antenna 50, however, is distributed across the ground plane. In other words, even when the first antenna 10 and the third antenna 50 operate simultaneously, their currents are isolated, thus achieving a high degree of isolation between them. This allows the scheme to be applied to communication scenarios involving different antennas operating in similar frequency bands; for example, the first antenna 10 could be a satellite antenna such as a starburst antenna, and the third antenna 50 could be a Bluetooth antenna.

[0153] It should be noted that in the above embodiments of this application, the material of the back cover 500 of the electronic device is not limited. It can be an all-metal back cover, an all-non-metal back cover, or a back cover that includes both metal and non-metal parts.

[0154] The above embodiments are merely exemplary demonstrations of the specific configuration of the first antenna 10 of the electronic device 1000 provided in this application. Based on the above introduction of the design principle of the first antenna 10, the structure of the first antenna 10 can also be adapted to meet the specific design needs of the actual application scenario. These will not be described one by one here, but they should all be understood to fall within the protection scope of this application.

[0155] It is worth mentioning that, in the various embodiments of this application, unless otherwise specified or in case of logical conflict, the terminology and / or descriptions between different embodiments are consistent and can be referenced by each other, and the technical features in different embodiments can be combined to form new embodiments according to their inherent logical relationship.

[0156] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the scope of the technology disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. An electronic device, characterized in that, The electronic device includes a back cover, a camera trim assembly, a first antenna, and a floor, wherein: The rear cover includes mounting holes; The camera decorative component includes a metal decorative panel, which is mounted in the mounting hole; The first antenna includes the metal decorative plate, which includes a slit and a first feed point. The metal decorative plate is spaced apart from the floor, and the metal decorative plate and the floor form a cavity to serve as the radiation cavity of the first antenna. The floor includes a circuit board, and at least a portion of the edge of the metal decorative panel is connected to the ground layer of the circuit board; The first power supply point is located on the side of the metal decorative panel facing the circuit board.

2. The electronic device as claimed in claim 1, characterized in that, At least a portion of the edge of the metal decorative panel is connected to the ground layer of the circuit board via a conductive connector, the conductive connector comprising at least one of conductive foam or metal spring.

3. The electronic device as described in claim 1 or 2, characterized in that, The projection of the circuit board on the back cover covers the mounting hole.

4. The electronic device as described in claim 1 or 2, characterized in that, The metal decorative panel includes a first metal pillar, which is disposed on the surface of the metal decorative panel facing the circuit board, and the first metal pillar serves as the first power supply point.

5. The electronic device as described in claim 1 or 2, characterized in that, The metal decorative panel further includes a second metal pillar, which is disposed on the surface of the metal decorative panel facing the circuit board; The first antenna further includes a tuning circuit connected to the second metal post, which is used to adjust the resonant frequency of the first antenna.

6. The electronic device as claimed in claim 1 or 2, characterized in that, The electronic device also includes a camera module that extends through the circuit board, and the metal decorative panel includes a light-transmitting hole; the camera module receives light through the light-transmitting hole.

7. The electronic device as claimed in claim 6, characterized in that, Along the extension direction of the plane where the circuit board is located, there is a gap between the camera module and the circuit board, the gap is filled with insulating material, and the camera module is connected to the floor.

8. The electronic device as claimed in claim 7, characterized in that, The width d of the gap satisfies: 0.5mm≤d≤1mm.

9. The electronic device as claimed in claim 7 or 8, characterized in that, The electronic device further includes a conductive sheet located on the side of the circuit board opposite to the metal decorative panel; the conductive sheet is connected to the ground layer of the circuit board, and the projection of the conductive sheet on the circuit board covers the gap between the camera module and the circuit board.

10. The electronic device as claimed in claim 9, characterized in that, The conductive sheet is connected to the ground layer of the circuit board via a conductive connector, which includes at least one of conductive foam or metal spring.

11. The electronic device as claimed in claim 9, characterized in that, The camera module is connected to the conductive sheet, and the camera module is connected to the ground layer of the circuit board through the conductive sheet.

12. The electronic device as claimed in claim 1 or 2, characterized in that, The slit is filled with insulating material.

13. The electronic device as claimed in claim 1 or 2, characterized in that, The width d1 of the slit satisfies: d1≥1mm.

14. The electronic device as claimed in claim 1 or 2, characterized in that, The camera decorative assembly also includes an insulating cover plate, which covers the end of the metal decorative panel located outside the rear cover.

15. The electronic device as claimed in claim 1 or 2, characterized in that, The electronic device also includes a display screen and a second antenna, the display screen being disposed opposite to the back cover; The second antenna is located between the display screen and the back cover, and the second antenna is used to transmit signals to the side of the display screen away from the back cover.

16. The electronic device as claimed in claim 15, characterized in that, The electronic device further includes a radio frequency switch and a radio frequency module. The radio frequency switch includes a first connection terminal, a second connection terminal and a third connection terminal. The first connection terminal is connected to the radio frequency module, the second connection terminal is connected to the first feed point of the first antenna, and the third connection terminal is connected to the second feed point of the second antenna.

17. The electronic device as claimed in claim 16, characterized in that, When the strength of the signal received by the first antenna is greater than the strength of the signal received by the second antenna, the radio frequency switch controls the first connection terminal to connect with the second connection terminal, and the radio frequency module is used to feed radio frequency signals to the first feed point; When the strength of the signal received by the second antenna is greater than the strength of the signal received by the first antenna, the RF switch controls the first connection terminal to connect to the third connection terminal, and the RF module is used to feed an RF signal to the second feed point.

18. The electronic device as claimed in claim 15, characterized in that, The electronic device further includes a radio frequency module and a combiner. The radio frequency module is connected to the first feed point of the first antenna through the combiner, and the radio frequency module is connected to the second feed point of the second antenna through the combiner.

19. The electronic device as claimed in claim 1 or 2, characterized in that, The electronic device further includes a frame, which is arranged circumferentially around the electronic device; The electronic device further includes a third antenna, the radiator of which is disposed on the frame.

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