Parameter information adjusting method, device and system, storage medium and electronic device

Abstract

Embodiments of the present application provide a parameter information adjustment method and device, a system, a storage medium and an electronic device, wherein the method comprises: obtaining a first current temperature and a first target temperature of an inertial measurement unit of a target device; determining a first temperature difference value of the first current temperature and the first target temperature, and determining a first control strategy of a system-level chip of the target device according to the first temperature difference value; and adjusting parameter information of the system-level chip according to the first control strategy. Through the above embodiments, the problem that an external heating device occupies printed circuit board layout space and increases hardware cost in the related art is solved.

Description

Technical Field

[0001] This application relates to the field of information technology, and more specifically, to a method, apparatus and system for adjusting parameter information, a storage medium and an electronic device. Background Technology

[0002] In modern mobile devices, the Inertial Measurement Unit (IMU) is a key component for attitude sensing, and its performance and accuracy directly affect the stability and reliability of the device. However, IMU chips are extremely sensitive to changes in ambient temperature; even small temperature fluctuations can cause significant drift in the sensor's zero-bias parameters, thus severely impairing the accuracy of the measurement results.

[0003] In related technologies, dedicated heating devices such as external heating resistors and thermocouples are typically used, along with proportional-integral-derivative (PID) control algorithms to regulate the temperature of the IMU chip. Although this method can stabilize the IMU temperature to a certain extent, introducing heating devices and related components requires additional space on the printed circuit board (PCB) and also increases hardware costs.

[0004] Regarding the issue that external heating devices occupy printed circuit board layout space and increase hardware costs in related technologies, no effective solution has yet been proposed.

[0005] Therefore, it is necessary to improve the relevant technology to overcome the aforementioned defects. Summary of the Invention

[0006] This application provides a method, apparatus, system, storage medium, and electronic device for adjusting parameter information, in order to at least solve the problem in the related art that external heating devices occupy printed circuit board layout space and increase hardware costs.

[0007] According to one embodiment of this application, a method for adjusting parameter information is provided, comprising: acquiring a first current temperature and a first target temperature of an inertial measurement unit of a target device; determining a first temperature difference between the first current temperature and the first target temperature, and determining a first control strategy of a system-on-a-chip (SoC) of the target device based on the first temperature difference; and adjusting the parameter information of the SoC based on the first control strategy.

[0008] In an exemplary embodiment, determining a first control strategy for the system-on-a-chip (SoC) of the target device based on the first temperature difference includes: determining the magnitude relationship between the first current temperature and the first target temperature, and the magnitude relationship between the current operating frequency and the operating frequency threshold of the SoC; when the first current temperature is less than the first target temperature and the current operating frequency is less than the operating frequency threshold, determining an adjustment value for the operating frequency of the SoC corresponding to the first temperature difference using a first control algorithm; and when the first current temperature is less than the first target temperature and the current operating frequency is equal to the operating frequency threshold, determining an adjustment value for the number of kernels to be started by the SoC corresponding to the first temperature difference using a second control algorithm.

[0009] In an exemplary embodiment, determining a first control strategy for the system-on-a-chip (SoC) of the target device based on the first temperature difference includes: determining the magnitude relationship between the first current temperature and the first target temperature, and the magnitude relationship between the first temperature difference and a first temperature difference threshold; when the first current temperature is less than the first target temperature and the first temperature difference is less than or equal to the first temperature difference threshold, determining an adjustment value for the operating frequency of the SoC corresponding to the first temperature difference using a first control algorithm; when the first current temperature is less than the first target temperature and the first temperature difference is greater than the first temperature difference threshold, determining an adjustment value for the number of kernels to be started by the SoC corresponding to the first temperature difference using a second control algorithm; or, determining a preset operating frequency and a preset number of kernels to be started by the SoC.

[0010] In an exemplary embodiment, after determining the magnitude relationship between the first current temperature and the first target temperature, the method further includes: when the first current temperature is greater than the first target temperature, determining an adjustment value for the rotational speed of the air outlet device corresponding to the first temperature difference using a third control algorithm, wherein the target device includes the air outlet device.

[0011] In an exemplary embodiment, before determining the first control strategy of the system-on-a-chip of the target device based on the first temperature difference, the method further includes: establishing a correspondence between the heat generation power of the system-on-a-chip and the temperature change of the inertial measurement unit; determining the weights of target items in the first control algorithm and the second control algorithm based on the correspondence, wherein the target items are determined based on the temperature difference.

[0012] In one exemplary embodiment, obtaining the first target temperature of the inertial measurement unit of the target device includes at least one of the following:

[0013] Determine the preset requirements for the inertial measurement unit, and determine the first target temperature based on the preset requirements;

[0014] The operating time of the target device is determined. If the operating time is greater than the operating time threshold, a first temperature of the inertial measurement unit is determined and the first temperature is determined as the first target temperature.

[0015] The temperature fluctuation value of the inertial measurement unit is determined. If the fluctuation value is less than or equal to the fluctuation value threshold, a second temperature and a third temperature of the inertial measurement unit are determined, and the average value of the second temperature and the third temperature is determined as the first target temperature, wherein the difference between the second temperature and the third temperature is the fluctuation value.

[0016] In one exemplary embodiment, adjusting the parameter information of the system-on-a-chip according to the first control strategy includes: acquiring a second current temperature and a second target temperature of the system-on-a-chip; determining a second temperature difference between the second current temperature and the second target temperature, and determining a second control strategy for the system-on-a-chip of the target device based on the second temperature difference; and adjusting the parameter information of the system-on-a-chip according to the first control strategy and the second control strategy.

[0017] According to another embodiment of this application, a parameter information adjustment device is provided, comprising: an acquisition module for acquiring a first current temperature and a first target temperature of an inertial measurement unit of a target device; a determination module for determining a first temperature difference between the first current temperature and the first target temperature, and determining a first control strategy of the system-on-a-chip of the target device based on the first temperature difference; and an adjustment module for adjusting the parameter information of the system-on-a-chip based on the first control strategy.

[0018] According to another embodiment of this application, a parameter information adjustment system is provided for the steps in any of the above method embodiments, comprising: a printed circuit board, a control unit, an inertial measurement unit, and a system-on-a-chip (SoC), wherein the inertial measurement unit and the SoC are located on the printed circuit board, and the inertial measurement unit and the SoC are connected through a target thermally conductive material; the control unit is connected to the inertial measurement unit and the SoC via a wired or wireless means.

[0019] In one exemplary embodiment, where placement of thermally conductive material is permitted on the printed circuit board, the target thermally conductive material is placed on the printed circuit board, and the system-on-a-chip is connected to the target thermally conductive material via an array of thermally conductive vias; where placement of thermally conductive material is permitted on the printed circuit board, the target thermally conductive material is placed outside the printed circuit board.

[0020] According to yet another embodiment of this application, a computer-readable storage medium is also provided, wherein a computer program is stored therein, and the computer program is configured to perform the steps in any of the above method embodiments when it is run.

[0021] According to yet another embodiment of this application, an electronic device is also provided, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0022] According to yet another embodiment of this application, a computer program product is also provided, including a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0023] This application obtains a first current temperature and a first target temperature of the inertial measurement unit (IMU) of a target device; determines a first temperature difference between the first current temperature and the first target temperature; and determines a first control strategy for the system-on-a-chip (SoC) of the target device based on the first temperature difference. The parameter information of the SoC is then adjusted according to the first control strategy. In this embodiment, the SoC is used as a "heater" for the inertial measurement unit by utilizing the heat naturally generated during operation. The performance control strategy of the SoC is determined by calculating the temperature difference between the current temperature of the IMU and the preset target temperature in real time, thereby regulating the heat generated by the SoC. This embodiment eliminates the need for any additional heating elements or complex temperature control circuits in the device; instead, it optimizes the thermal management of the SoC through software algorithms, achieving temperature control of the inertial measurement unit. This significantly saves PCB space and reduces manufacturing costs, thus solving the problem of external heating devices occupying PCB layout space and increasing hardware costs. Attached Figure Description

[0024] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or related technologies, the accompanying drawings used in the description of the embodiments or related technologies will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort.

[0026] Figure 1This is a hardware structure block diagram of a computer device for a method of adjusting parameter information according to an embodiment of this application;

[0027] Figure 2 This is a flowchart of a method for adjusting parameter information according to an embodiment of this application;

[0028] Figure 3 This is a schematic diagram (a) of a parameter information adjustment system according to an embodiment of this application;

[0029] Figure 4 This is a schematic diagram (II) of a parameter information adjustment system according to an embodiment of this application;

[0030] Figure 5 This is a structural block diagram of a parameter information adjustment device according to an embodiment of this application. Detailed Implementation

[0031] The embodiments of this application will be described in detail below with reference to the accompanying drawings and examples.

[0032] It should be noted that the terms "first," "second," etc., in the specification, claims, and drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0033] The methods and embodiments provided in this application can be executed in a computer device or similar computing device. Taking running on a computer device as an example, Figure 1 This is a hardware structure block diagram of a computer device for a parameter information adjustment method according to an embodiment of this application. For example... Figure 1 As shown, a computer device may include one or more ( Figure 1 Only one is shown in the diagram. A processor 102 (which may include, but is not limited to, a microcontroller unit (MCU) or a field-programmable gate array (FPGA)) and a memory 104 for storing data are also shown. The computer device may further include a transmission device 106 for communication functions and an input / output device 108. Those skilled in the art will understand that… Figure 1 The structure shown is for illustrative purposes only and does not limit the structure of the computer device described above. For example, the computer device may also include components that are more... Figure 1 The more or fewer components shown, or having the same Figure 1 The different configurations shown.

[0034] The memory 104 can be used to store computer programs, such as application software programs and modules, like the computer program corresponding to the parameter information adjustment method in this embodiment. The processor 102 executes various functional applications and data processing by running the computer program stored in the memory 104, thus implementing the above-described method. The memory 104 may include high-speed random access memory and may also include non-volatile memory, such as one or more magnetic storage devices, flash memory, or other non-volatile solid-state memory. In some instances, the memory 104 may further include memory remotely located relative to the processor 102, and these remote memories can be connected to computer devices via a network. Examples of such networks include, but are not limited to, the Internet, corporate intranets, local area networks, mobile communication networks, and combinations thereof.

[0035] The transmission device 106 is used to receive or send data via a network. Specific examples of the network described above may include a wireless network provided by a communication provider for the computer equipment. In one example, the transmission device 106 includes a Network Interface Controller (NIC), which can connect to other network devices via a base station to communicate with the Internet. In another example, the transmission device 106 may be a Radio Frequency (RF) module used for wireless communication with the Internet.

[0036] This embodiment provides a method for adjusting parameter information. Figure 2 This is a flowchart of a method for adjusting parameter information according to an embodiment of this application, such as... Figure 2 As shown, the process includes the following steps:

[0037] Step S202: Obtain the first current temperature and the first target temperature of the inertial measurement unit of the target device;

[0038] Step S202 obtains the real-time temperature (i.e., the first current temperature) of the IMU chip using a temperature sensor integrated inside the IMU. An ideal target temperature (i.e., the first target temperature) can also be determined based on the IMU's operating temperature range.

[0039] Step S204: Determine the first temperature difference between the first current temperature and the first target temperature, and determine the first control strategy of the system-on-a-chip of the target device based on the first temperature difference;

[0040] After determining the current temperature of the IMU and the target temperature, the difference between the two (i.e., the first temperature difference) is calculated. Based on the first temperature difference, it is determined whether the heat output of the SOC needs to be increased or decreased. If the IMU temperature is lower than the target temperature, the control strategy includes, but is not limited to: increasing the operating frequency of the SOC or activating more cores to increase the heat output of the SOC; if the IMU temperature is too high, the control strategy includes, but is not limited to: decreasing the SOC frequency or reducing core usage, while increasing the speed of the cooling fan to reduce the heat output of the SOC.

[0041] Step S206: Adjust the parameter information of the system-on-a-chip according to the first control strategy.

[0042] Through the above steps, the first current temperature and the first target temperature of the inertial measurement unit (IMU) of the target device are obtained; a first temperature difference between the first current temperature and the first target temperature is determined, and a first control strategy for the system-on-a-chip (SoC) of the target device is determined based on the first temperature difference; the parameter information of the SoC is adjusted according to the first control strategy. In this embodiment, the SoC is used as a "heater" for the inertial measurement unit by utilizing the heat naturally generated by the SOC during operation. By real-time acquisition of the current temperature of the IMU and the preset target temperature, the calculated temperature difference determines the performance control strategy of the SOC to regulate the heat generated by the SOC. That is, this embodiment does not require adding any additional heating elements or complex temperature control circuits to the device, but instead optimizes the thermal management of the SOC through software algorithms to achieve temperature control of the inertial measurement unit. This greatly saves PCB space and reduces manufacturing costs, thus solving the problem that external heating devices occupy printed circuit board layout space and increase hardware costs.

[0043] Optionally, the above embodiments also avoid electromagnetic interference problems during the switching process of the heating circuit, thereby improving the signal quality of the IMU and the overall performance stability of the device.

[0044] Optionally, determining a first control strategy for the system-on-a-chip (SoC) of the target device based on the first temperature difference includes: determining the relationship between the first current temperature and the first target temperature, and the relationship between the current operating frequency and the operating frequency threshold of the SoC; when the first current temperature is less than the first target temperature and the current operating frequency is less than the operating frequency threshold, determining an adjustment value for the operating frequency of the SoC corresponding to the first temperature difference using a first control algorithm; and when the first current temperature is less than the first target temperature and the current operating frequency is equal to the operating frequency threshold, determining an adjustment value for the number of kernels to be started by the SoC corresponding to the first temperature difference using a second control algorithm.

[0045] In this embodiment, corresponding control strategies are adopted according to different temperature and frequency conditions:

[0046] When the IMU temperature is low and the SOC frequency has not reached its upper limit, the first control algorithm calculates the adjustment value of the SOC operating frequency to moderately increase the heat generation of the SOC, thereby raising the IMU temperature to the target level.

[0047] When the IMU temperature is low but the SOC frequency has reached its limit, meaning that further increasing the frequency cannot increase heat generation, the control algorithm switches to a second control algorithm, which increases heat generation by adjusting the number of SOC cores started.

[0048] It should be noted that the first and second control algorithms mentioned above can be PID control algorithms.

[0049] For example, suppose the system detects that the current IMU temperature is 35℃, the target temperature is set to 40℃, and the current SOC operating frequency is 1.5GHz, with a frequency threshold of 2.0GHz. Since the current temperature is lower than the target temperature and the current operating frequency is lower than the frequency threshold, the first control algorithm calculates an adjustment value for the operating frequency, increasing the SOC's operating frequency to 1.8GHz to increase heat generation and bring the IMU temperature closer to the target temperature. If at another moment the SOC's operating frequency has reached the 2.0GHz upper limit (equal to the frequency threshold), but the IMU temperature is still lower than the target temperature, the second control algorithm determines an adjustment value for the number of cores to be started, for example, increasing it from the current 4-core running state to a 6-core running state, thereby further increasing the SOC's heat generation and accelerating the process of the IMU temperature reaching the target temperature.

[0050] In this embodiment, a System-on-a-Chip (SOC) is used as a controllable heat source to achieve efficient and flexible temperature control of the IMU without relying on additional hardware. This not only saves valuable internal space and reduces hardware costs, but also avoids electromagnetic interference and energy consumption issues that may arise from traditional heating devices.

[0051] Optionally, determining a first control strategy for the system-on-a-chip (SoC) of the target device based on the first temperature difference includes: determining the relationship between the first current temperature and the first target temperature, and the relationship between the first temperature difference and a first temperature difference threshold; when the first current temperature is less than the first target temperature and the first temperature difference is less than or equal to the first temperature difference threshold, determining an adjustment value for the operating frequency of the SoC corresponding to the first temperature difference using a first control algorithm; when the first current temperature is less than the first target temperature and the first temperature difference is greater than the first temperature difference threshold, determining an adjustment value for the number of kernels to be started by the SoC corresponding to the first temperature difference using a second control algorithm; or, determining a preset operating frequency and a preset number of kernels to be started by the SoC.

[0052] In this embodiment, when the first temperature difference is small, i.e., the current temperature of the IMU is slightly lower than the target temperature but does not exceed the preset threshold, the operating frequency of the SOC is adjusted through the first control algorithm. This fine-tuning of the operating frequency precisely controls the heat generated by the SOC, avoiding excessive temperature fluctuations. Furthermore, because the temperature difference is small, it does not significantly affect the performance of the SOC.

[0053] When the initial temperature difference is large, exceeding the preset temperature difference threshold, the IMU needs to rapidly increase its temperature to meet operational requirements. In this case, a second control algorithm adjusts the number of cores started by the SOC. Compared to adjusting the operating frequency, increasing the number of cores can more quickly increase the SOC's heat generation, thus bringing the IMU temperature to the target range more rapidly.

[0054] When the first temperature difference is large, in addition to adjusting through the control algorithm, this embodiment also provides a scheme to set the SOC preset operating frequency and preset number of cores. That is, by setting the SOC operating frequency and core number in advance, the control logic can be simplified, the heat generation of the SOC can be increased more quickly, and the IMU temperature can be brought to the target range more quickly.

[0055] The control strategy in this embodiment takes into account the influence of the temperature difference on the control method. By intelligently selecting to adjust the operating frequency or the number of cores, and setting preset parameters, dynamic and precise control of the IMU temperature is achieved. This not only overcomes the space cost and energy consumption problems of traditional heating solutions, but also improves the system's response speed and energy utilization efficiency.

[0056] Optionally, after determining the magnitude relationship between the first current temperature and the first target temperature, the method further includes: when the first current temperature is greater than the first target temperature, determining the adjustment value of the rotation speed of the air outlet device corresponding to the first temperature difference through a third control algorithm, wherein the target device includes: the air outlet device.

[0057] In some situations, such as when the equipment is used in high-temperature environments or when the SOC generates excessive heat under high-intensity tasks, the IMU may overheat, affecting its measurement accuracy and the overall performance of the equipment. Therefore, when the IMU temperature exceeds the target temperature, increasing the speed of the exhaust device (such as a cooling fan) can accelerate heat dissipation, thereby lowering the IMU temperature and ensuring that the IMU operates within its optimal temperature range.

[0058] When the current temperature of the IMU is detected to exceed its target temperature, the temperature difference is calculated, and a third control algorithm is used to determine the adjustment amount of the cooling fan speed based on the temperature difference. Optionally, the fan speed is controlled using pulse width modulation (PWM) technology.

[0059] Optionally, before determining the first control strategy of the system-on-a-chip of the target device based on the first temperature difference, the method includes: establishing a correspondence between the heat generation power of the system-on-a-chip and the temperature change of the inertial measurement unit; and determining the weight of the target item in the first control algorithm and the second control algorithm based on the correspondence, wherein the target item is determined based on the temperature difference.

[0060] In this application embodiment, the correlation between SOC heating power and IMU temperature change is quantified through experiments or model establishment. This correlation can be understood as: the rate and magnitude of IMU temperature rise when heating power increases; and the rate and magnitude of IMU temperature drop when heating power decreases, in relation to the temperature rise.

[0061] When the first control algorithm and the second control algorithm are PID algorithms, the target term refers to the components of the control output, including the proportional term (P), integral term (I), and derivative term (D).

[0062] Proportional term (P): Directly adjusts the control output based on the magnitude of the current temperature deviation. The proportional term is used to quickly respond to deviations, but it may not be able to completely eliminate them.

[0063] Integral term (I): Cumulative deviation, used to eliminate steady-state error. The integral term is introduced to address potential long-term deviations from proportional control, ensuring that the IMU temperature eventually stabilizes at the target temperature.

[0064] The derivative term (D) predicts the trend of the deviation based on the rate of change of the temperature deviation, allowing for early adjustment of the control strategy. The purpose of the derivative term is to prevent overreaction in the control action and avoid temperature oscillations.

[0065] In this scheme, the weight of the objective item is determined by the correspondence between the SOC heating power and the IMU temperature change. For example:

[0066] When the temperature deviation is small, more emphasis may be placed on the weight of the proportional term, and a rapid response may be achieved by fine-tuning the SOC operating frequency.

[0067] When the temperature difference persists, the weight of the integral term increases to ensure long-term temperature stability.

[0068] When the temperature difference changes rapidly, the weight of the differential term is increased to respond in advance and avoid temperature oscillations.

[0069] Alternatively, by fitting experimental data, the weight combination of proportional, integral, and derivative terms under different temperature deviations can be found to achieve better temperature control. Another approach is to use machine learning models, such as neural networks, to predict the trend of IMU temperature change under different SOC heating power, thereby automatically adjusting the weights of each term in the PID control algorithm.

[0070] Optionally, the first target temperature of the inertial measurement unit of the target device is obtained, including at least one of the following:

[0071] Determine the preset requirements for the inertial measurement unit, and determine the first target temperature based on the preset requirements;

[0072] The operating time of the target device is determined. If the operating time is greater than the operating time threshold, a first temperature of the inertial measurement unit is determined and the first temperature is determined as the first target temperature.

[0073] The temperature fluctuation value of the inertial measurement unit is determined. If the fluctuation value is less than or equal to the fluctuation value threshold, a second temperature and a third temperature of the inertial measurement unit are determined, and the average value of the second temperature and the third temperature is determined as the first target temperature, wherein the difference between the second temperature and the third temperature is the fluctuation value.

[0074] In this embodiment, the first target temperature can be determined based on the IMU's own technical specifications and performance requirements. For example, IMU manufacturers typically provide a range of operating parameters, including an optimal operating temperature range. By setting preset requirements, the ideal operating temperature of the IMU, i.e., the first target temperature, can be determined.

[0075] Optionally, during device operation, the actual operating temperature of the IMU will change with the changes in time and workload. However, the IMU can reach a stable operating state after long-term operation. Therefore, when the device operating time exceeds the operating time threshold, the current actual temperature of the IMU is determined and used as the first target temperature.

[0076] Optionally, the temperature of the IMU may be affected by various factors during operation, causing it to fluctuate. When the temperature fluctuation is relatively stable, that is, when the fluctuation value is less than or equal to a preset fluctuation value threshold, the average of the two temperature values ​​of the IMU (the second temperature and the third temperature) can be used to determine the first target temperature.

[0077] Optionally, adjusting the parameter information of the system-on-a-chip according to the first control strategy includes: obtaining a second current temperature and a second target temperature of the system-on-a-chip; determining a second temperature difference between the second current temperature and the second target temperature, and determining a second control strategy for the system-on-a-chip of the target device based on the second temperature difference; and adjusting the parameter information of the system-on-a-chip according to the first control strategy and the second control strategy.

[0078] In this embodiment, both the temperature status of the IMU and the temperature information of the SOC (System-on-Chip), i.e., the second current temperature, can be acquired, and a second target temperature can be determined based on preset requirements or a dynamic strategy. The difference between the second current temperature and the second target temperature (the second temperature difference) is calculated. For example, if the SOC temperature is too high, it may be necessary to reduce heat generation to avoid negatively impacting the IMU temperature; if the SOC temperature is too low, it may be necessary to appropriately increase the temperature to maintain the constant temperature environment required by the IMU.

[0079] Based on the second temperature difference, a second control strategy is dynamically generated. This strategy may include, but is not limited to, adjusting parameters such as the SOC's operating frequency, number of cores, power management, and cooling fan speed. Finally, the SOC's parameter information is comprehensively adjusted based on the first control strategy (used to adjust the IMU temperature to the first target temperature) and the second control strategy (used to adjust the SOC temperature to the second target temperature).

[0080] The dual-layer control strategy enables dynamic temperature balance between the SOC and IMU, ensuring the stability and reliability of the system under complex operating conditions.

[0081] To better understand the process of adjusting the above parameter information, the following describes the implementation method of adjusting the above parameter information in conjunction with optional embodiments, but it is not intended to limit the technical solution of the embodiments of this application.

[0082] This embodiment provides a parameter information adjustment system, such asFigure 4 As shown, this includes: in a multilayer PCB design, the layout distance between the SOC chip and the IMU chip is controlled within a certain range. A copper foil thermal conductive area is arranged in the middle layer of the PCB substrate, and a thermal via array is set below the SOC to connect the SOC area and the IMU area.

[0083] This embodiment also provides a parameter information adjustment system, such as Figure 5 As shown, this includes: in multilayer PCB design, the layout distance between the SOC chip and the IMU chip is controlled within a certain range. When it is inconvenient to place a large area of ​​thermally conductive copper foil inside the PCB substrate, a thermal bridge formed by a material with high thermal conductivity, such as copper foil, aluminum substrate, or thermally conductive silicone, can be used outside the two chips.

[0084] The temperature sensor is integrated into both the SOC chip and the IMU chip, both offering high measurement accuracy. The cooling fan uses pulse width modulation (PWM) to dynamically adjust its speed.

[0085] This embodiment provides a method for adjusting parameter information, which includes the following steps:

[0086] Step 1: Set the target temperature.

[0087] Optionally, an ideal target temperature T_target can be set according to the IMU's operating characteristics and accuracy requirements. After the system starts up, the target temperature is dynamically adjusted based on the IMU's current temperature to adapt to environmental changes. For example, the target temperature can be set based on the current IMU temperature after the device has been running for a certain period of time (which can be determined based on the actual product's temperature rise stabilization time).

[0088] Step 2: Collect IMU temperature and SOC operating status data.

[0089] The current temperatures T_imu and T_soc of the IMU and SOC are periodically collected (e.g., every 100ms) using integrated temperature sensors. Key parameters such as the SOC's operating frequency f, number of kernels launched n, CPU utilization u, and cooling fan speed v are monitored in real time.

[0090] Step 3: Calculate the temperature deviation.

[0091] Calculate the deviation between the current temperature of the IMU and the target temperature, ΔT = T_target - T_imu.

[0092] Step 4: Adjust parameters using a PID control algorithm.

[0093] If ΔT indicates that the IMU temperature deviates from the target, the PID control algorithm is triggered. The PID control algorithm includes a proportional term (P), an integral term (I), and a derivative term (D).

[0094] The proportional term (P) adjusts the relevant parameters of the SOC proportionally based on the current temperature deviation ΔT. For example, when ΔT is large, the operating frequency f of the SOC is appropriately increased or the number of cores started n is increased to increase heat generation; conversely, the frequency is decreased or the number of cores started is reduced. The proportionality coefficient K_p is used to adjust the strength of the proportional term.

[0095] Integral term (I): Integrates the temperature deviation over a period of time to eliminate the steady-state error of the system. The integral coefficient K_i determines the degree of influence of the integral term. By continuously accumulating the deviation, the SOC parameter is gradually adjusted to make the IMU temperature closer to the target temperature.

[0096] The differential term (D) predicts future temperature trends based on the rate of change of temperature deviation, adjusting the SOC parameter in advance to avoid temperature overshoot or oscillation. The differential coefficient K_d is used to adjust the sensitivity of the differential term.

[0097] Output SOC parameter adjustment amount ΔP=K_p ΔT+K_i ΔTdt+K_d d(ΔT) / dt, to achieve the target temperature.

[0098] By combining SOC operating status data, the operating frequency, number of cores, CPU utilization, and fan speed of the SOC are adjusted collaboratively through ΔP.

[0099] Step 5: Implement the control strategy.

[0100] Based on the calculated ΔP, adjust the SOC parameters through the SOC performance status adjustment interface. Adjust the cooling fan speed accordingly through the fan control interface. For example, if increased heat generation is needed, prioritize increasing the operating frequency; if the frequency has reached its limit, consider increasing the number of kernels launched or increasing CPU utilization; when heat generation is excessive, appropriately increase the cooling fan speed to enhance heat dissipation.

[0101] Step 6: Strategy configuration and optimization.

[0102] The application layer can adjust PID parameters through the thermal management strategy configuration interface to optimize the isothermal control effect. It monitors ambient temperature and operating status, adjusting the control strategy as needed to adapt to different scenarios. Changes in SOC parameters are fed back to the temperature management driver module. Steps 2 through 5 are repeated, continuously and dynamically adjusted until the IMU temperature stabilizes near the target temperature, with fluctuations controlled within the allowable error range.

[0103] Real-time monitoring of SOC and IMU temperatures ensures they do not exceed safe thresholds. If an abnormal temperature is detected, protective mechanisms are activated, such as reducing SOC load or increasing fan speed. Once the IMU temperature stabilizes, temperature changes continue to be monitored, and SOC parameters are fine-tuned to maintain a constant temperature.

[0104] By following the steps above, the thermal balance between the SOC and IMU can be managed automatically and intelligently, ensuring that the IMU operates at the optimal temperature while minimizing the negative impact on SOC performance, power consumption, and heat dissipation.

[0105] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods according to the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the related technology, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as read-only memory (ROM), random access memory (RAM), magnetic disk, optical disk), and includes several instructions to cause a terminal device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0106] This embodiment also provides a parameter information adjustment device, which is used to implement the above embodiments and preferred embodiments; details already described will not be repeated. As used below, the term "module" can be a combination of software and / or hardware that implements a predetermined function. Although the device described in the following embodiments is preferably implemented in software, hardware implementation, or a combination of software and hardware, is also possible and contemplated.

[0107] Figure 5 This is a structural block diagram of a parameter information adjustment device according to an embodiment of this application, such as... Figure 5 As shown, the device includes:

[0108] The acquisition module 52 is used to acquire the first current temperature and the first target temperature of the inertial measurement unit of the target device;

[0109] The determining module 54 is used to determine a first temperature difference between the first current temperature and the first target temperature, and to determine a first control strategy of the system-on-a-chip of the target device based on the first temperature difference.

[0110] The adjustment module 56 is used to adjust the parameter information of the system-on-a-chip according to the first control strategy.

[0111] The aforementioned device acquires the first current temperature and the first target temperature of the inertial measurement unit (IMU) of the target device; determines the first temperature difference between the first current temperature and the first target temperature; and determines the first control strategy of the system-on-a-chip (SoC) of the target device based on the first temperature difference. The parameter information of the SoC is then adjusted according to the first control strategy. In this embodiment, the SoC is used as a "heater" for the IMU by utilizing the heat naturally generated during IMU operation. The performance control strategy of the IMU is determined by calculating the temperature difference between the current temperature of the IMU and the preset target temperature in real time, thereby regulating the heat generated by the IMU. This embodiment eliminates the need for any additional heating elements or complex temperature control circuits in the device; instead, it optimizes the thermal management of the IMU through software algorithms, achieving temperature control of the inertial measurement unit. This significantly saves PCB space and reduces manufacturing costs, thus solving the problem of external heating devices occupying printed circuit board layout space and increasing hardware costs.

[0112] In an exemplary embodiment, a determining module is configured to determine the magnitude relationship between the first current temperature and the first target temperature, and the magnitude relationship between the current operating frequency and the operating frequency threshold of the system-on-a-chip; when the first current temperature is less than the first target temperature and the current operating frequency is less than the operating frequency threshold, a first control algorithm is used to determine an adjustment value for the operating frequency of the system-on-a-chip corresponding to the first temperature difference; when the first current temperature is less than the first target temperature and the current operating frequency is equal to the operating frequency threshold, a second control algorithm is used to determine an adjustment value for the number of cores to be started of the system-on-a-chip corresponding to the first temperature difference.

[0113] In an exemplary embodiment, a determining module is configured to determine the magnitude relationship between the first current temperature and the first target temperature, and the magnitude relationship between the first temperature difference and the first temperature difference threshold; when the first current temperature is less than the first target temperature and the first temperature difference is less than or equal to the first temperature difference threshold, determine an adjustment value for the operating frequency of the system-on-a-chip corresponding to the first temperature difference using a first control algorithm; when the first current temperature is less than the first target temperature and the first temperature difference is greater than the first temperature difference threshold, determine an adjustment value for the number of kernels to be started by the system-on-a-chip corresponding to the first temperature difference using a second control algorithm; or, determine a preset operating frequency and a preset number of kernels to be started by the system-on-a-chip.

[0114] In an exemplary embodiment, a determining module is configured to determine, via a third control algorithm, an adjustment value for the rotational speed of the air outlet device corresponding to the first temperature difference when the first current temperature is greater than the first target temperature, wherein the target device includes the air outlet device.

[0115] In an exemplary embodiment, a determining module is configured to establish a correspondence between the heat generation power of the system-on-a-chip and the temperature change of the inertial measurement unit; and to determine the weights of target items in the first control algorithm and the second control algorithm based on the correspondence, wherein the target items are determined based on the temperature difference.

[0116] In one exemplary embodiment, the acquisition module is used for at least one of the following:

[0117] Determine the preset requirements for the inertial measurement unit, and determine the first target temperature based on the preset requirements;

[0118] The operating time of the target device is determined. If the operating time is greater than the operating time threshold, a first temperature of the inertial measurement unit is determined and the first temperature is determined as the first target temperature.

[0119] The temperature fluctuation value of the inertial measurement unit is determined. If the fluctuation value is less than or equal to the fluctuation value threshold, a second temperature and a third temperature of the inertial measurement unit are determined, and the average value of the second temperature and the third temperature is determined as the first target temperature, wherein the difference between the second temperature and the third temperature is the fluctuation value.

[0120] In one exemplary embodiment, the adjustment module is configured to acquire a second current temperature and a second target temperature of the system-on-a-chip; determine a second temperature difference between the second current temperature and the second target temperature; determine a second control strategy for the system-on-a-chip of the target device based on the second temperature difference; and adjust the parameter information of the system-on-a-chip based on the first control strategy and the second control strategy.

[0121] This embodiment also provides a parameter information adjustment system, including: a printed circuit board, a control unit, an inertial measurement unit, and a system-on-a-chip (SoC), wherein the inertial measurement unit and the SoC are located on the printed circuit board, and the inertial measurement unit and the SoC are connected through a target thermally conductive material; the control unit is connected to the inertial measurement unit and the SoC via a wired or wireless means.

[0122] Optionally, such as Figure 3As shown, where thermally conductive material can be placed on the printed circuit board, the target thermally conductive material is placed on the printed circuit board, and the system-on-a-chip is connected to the target thermally conductive material through an array of thermally conductive vias; as... Figure 4 As shown, where it is permissible to place thermally conductive material on the printed circuit board, the target thermally conductive material is placed outside the printed circuit board.

[0123] The target thermally conductive material placed inside the printed circuit board can be an internal thermally conductive copper foil; the target thermally conductive material placed outside the printed circuit board can be a copper foil, an aluminum substrate, or thermally conductive silicone.

[0124] It should be noted that the above modules can be implemented by software or hardware. For the latter, they can be implemented in the following ways, but are not limited to: all the above modules are located in the same processor; or, the above modules are located in different processors in any combination.

[0125] Embodiments of this application also provide a computer-readable storage medium storing a computer program, wherein the computer program is configured to execute the steps in any of the above method embodiments when run.

[0126] Optionally, in this embodiment, the storage medium may be configured to store program code for performing the following steps:

[0127] S1, acquire the first current temperature and the first target temperature of the inertial measurement unit of the target device;

[0128] S2, determine a first temperature difference between the first current temperature and the first target temperature, and determine a first control strategy for the system-on-a-chip of the target device based on the first temperature difference;

[0129] S3, adjust the parameter information of the system-on-a-chip according to the first control strategy.

[0130] In one exemplary embodiment, the aforementioned computer-readable storage medium may include, but is not limited to, various media capable of storing computer programs, such as a USB flash drive, read-only memory (ROM), random access memory (RAM), portable hard disk, magnetic disk, or optical disk.

[0131] Embodiments of this application also provide an electronic device, including a memory and a processor, wherein the memory stores a computer program and the processor is configured to run the computer program to perform the steps in any of the above method embodiments.

[0132] In one exemplary embodiment, the electronic device may further include a transmission device and an input / output device, wherein the transmission device is connected to the processor and the input / output device is connected to the processor.

[0133] Optionally, in this embodiment, the processor can be configured to perform the following steps via a computer program:

[0134] S1, acquire the first current temperature and the first target temperature of the inertial measurement unit of the target device;

[0135] S2, determine a first temperature difference between the first current temperature and the first target temperature, and determine a first control strategy for the system-on-a-chip of the target device based on the first temperature difference;

[0136] S3, adjust the parameter information of the system-on-a-chip according to the first control strategy.

[0137] Embodiments of this application also provide a computer program product, which includes a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0138] Embodiments of this application also provide another computer program product, including a non-volatile computer-readable storage medium storing a computer program that, when executed by a processor, implements the steps in any of the above method embodiments.

[0139] Embodiments of this application also provide a computer program that includes computer instructions stored in a computer-readable storage medium; a processor of a computer device reads the computer instructions from the computer-readable storage medium and executes the computer instructions, causing the computer device to perform the steps in any of the above method embodiments.

[0140] Optionally, in this embodiment, the processor can be configured to perform the following steps via a computer program:

[0141] S1, acquire the first current temperature and the first target temperature of the inertial measurement unit of the target device;

[0142] S2, determine a first temperature difference between the first current temperature and the first target temperature, and determine a first control strategy for the system-on-a-chip of the target device based on the first temperature difference;

[0143] S3, adjust the parameter information of the system-on-a-chip according to the first control strategy.

[0144] Specific examples in this embodiment can be found in the examples described in the above embodiments and exemplary implementations, and will not be repeated here.

[0145] Obviously, those skilled in the art should understand that the modules or steps of this application described above can be implemented using general-purpose computing devices. They can be centralized on a single computing device or distributed across a network of multiple computing devices. They can be implemented using computer-executable program code, and thus can be stored in a storage device for execution by a computing device. In some cases, the steps shown or described can be performed in a different order than those presented here, or they can be fabricated as separate integrated circuit modules, or multiple modules or steps can be fabricated as a single integrated circuit module. Thus, this application is not limited to any particular combination of hardware and software.

[0146] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A method for adjusting parameter information, characterized in that, include: Obtain the first current temperature and the first target temperature of the inertial measurement unit of the target device; Determine a first temperature difference between the first current temperature and the first target temperature, and determine a first control strategy for the system-on-a-chip of the target device based on the first temperature difference; The system-on-a-chip parameter information is adjusted according to the first control strategy; The first control strategy for the system-on-a-chip of the target device, determined based on the first temperature difference, includes: Determine the relationship between the first current temperature and the first target temperature, and the relationship between the first temperature difference and the first temperature difference threshold. When the first current temperature is less than the first target temperature and the first temperature difference is less than or equal to the first temperature difference threshold, the adjustment value of the operating frequency of the system-on-a-chip corresponding to the first temperature difference is determined by the first control algorithm. When the first current temperature is less than the first target temperature and the first temperature difference is greater than the first temperature difference threshold, the adjustment value of the number of kernels to be started by the system-on-a-chip corresponding to the first temperature difference is determined by the second control algorithm; or, the preset operating frequency of the system-on-a-chip and the preset number of kernels to be started by the system-on-a-chip are determined.

2. The method according to claim 1, characterized in that, Determining a first control strategy for the system-on-a-chip of the target device based on the first temperature difference includes: Determine the relationship between the first current temperature and the first target temperature, as well as the relationship between the current operating frequency and the operating frequency threshold of the system-on-a-chip; When the first current temperature is less than the first target temperature and the current operating frequency is less than the operating frequency threshold, the adjustment value of the operating frequency of the system-on-a-chip corresponding to the first temperature difference is determined by the first control algorithm. When the first current temperature is less than the first target temperature and the current operating frequency is equal to the operating frequency threshold, the second control algorithm determines the adjustment value of the number of kernels to be started for the system-on-a-chip corresponding to the first temperature difference.

3. The method according to claim 2, characterized in that, After determining the relationship between the first current temperature and the first target temperature, the method further includes: When the first current temperature is greater than the first target temperature, the adjustment value of the rotation speed of the air outlet device corresponding to the first temperature difference is determined by the third control algorithm, wherein the target device includes the air outlet device.

4. The method according to claim 2, characterized in that, Before determining the first control strategy of the system-on-a-chip of the target device based on the first temperature difference, the method further includes: Establish the correspondence between the heat generation power of the system-on-a-chip and the temperature change of the inertial measurement unit; The weights of the target items in the first control algorithm and the second control algorithm are determined according to the correspondence, wherein the target items are determined based on the temperature difference.

5. The method according to claim 1, characterized in that, The first target temperature of the inertial measurement unit of the target device is obtained, including at least one of the following: Determine the preset requirements for the inertial measurement unit, and determine the first target temperature based on the preset requirements; The operating time of the target device is determined. If the operating time is greater than the operating time threshold, a first temperature of the inertial measurement unit is determined and the first temperature is determined as the first target temperature. The temperature fluctuation value of the inertial measurement unit is determined. If the fluctuation value is less than or equal to the fluctuation value threshold, a second temperature and a third temperature of the inertial measurement unit are determined, and the average value of the second temperature and the third temperature is determined as the first target temperature, wherein the difference between the second temperature and the third temperature is the fluctuation value.

6. The method according to claim 1, characterized in that, Adjusting the parameter information of the system-on-a-chip according to the first control strategy includes: Obtain the second current temperature and the second target temperature of the system-on-a-chip; Determine a second temperature difference between the second current temperature and the second target temperature, and determine a second control strategy for the system-on-a-chip of the target device based on the second temperature difference; The system-on-a-chip parameter information is adjusted according to the first control strategy and the second control strategy.

7. A parameter information adjustment device, characterized in that, include: The acquisition module is used to acquire the first current temperature and the first target temperature of the inertial measurement unit of the target device; The determination module is used to determine a first temperature difference between the first current temperature and the first target temperature, and to determine a first control strategy of the system-on-a-chip of the target device based on the first temperature difference. An adjustment module is used to adjust the parameter information of the system-on-a-chip according to the first control strategy; The determining module is further configured to: determine the magnitude relationship between the first current temperature and the first target temperature, and the magnitude relationship between the first temperature difference and the first temperature difference threshold; when the first current temperature is less than the first target temperature and the first temperature difference is less than or equal to the first temperature difference threshold, determine an adjustment value for the operating frequency of the system-on-a-chip corresponding to the first temperature difference using a first control algorithm; when the first current temperature is less than the first target temperature and the first temperature difference is greater than the first temperature difference threshold, determine an adjustment value for the number of kernels to be started by the system-on-a-chip corresponding to the first temperature difference using a second control algorithm; or, determine a preset operating frequency and a preset number of kernels to be started by the system-on-a-chip.

8. A parameter information adjustment system, characterized in that, For performing the method according to any one of claims 1 to 6, comprising: The system comprises a printed circuit board, a control unit, an inertial measurement unit, and a system-on-a-chip (SoC), wherein the inertial measurement unit and the SoC are located on the printed circuit board and are connected by a target thermally conductive material. The control unit is connected to the inertial measurement unit and the system-on-a-chip via wired or wireless means.

9. The system according to claim 8, characterized in that, include: Where thermally conductive material is permissible to be placed on the printed circuit board, the target thermally conductive material is placed on the printed circuit board, and the system-on-a-chip is connected to the target thermally conductive material through an array of thermally conductive vias; Where thermally conductive material is permitted to be placed on the printed circuit board, the target thermally conductive material is placed outside the printed circuit board.

10. A computer-readable storage medium, characterized in that, The computer-readable storage medium includes a stored program, wherein the program, when executed, performs the method of any one of claims 1 to 6.

11. An electronic device comprising a memory and a processor, characterized in that, The memory stores a computer program, and the processor is configured to execute the method of any one of claims 1 to 6 through the computer program.

12. A computer program product, comprising a computer program, characterized in that, When the computer program is executed by a processor, it implements the method of any one of claims 1 to 6.

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