相控阵一体化集成印制电路板层叠结构及制板方法
By integrating design and copper paste sintering process, the problems of high-frequency signal loss and interlayer interference in phased array antenna equipment have been solved, achieving low-loss transmission of high-frequency signals and compact design of equipment, reducing production costs and complexity.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- HUNAN SIBEITU TECH CO LTD
- Filing Date
- 2026-04-20
- Publication Date
- 2026-07-17
AI Technical Summary
Existing phased array antenna equipment suffers from high signal loss, low connector reliability, large equipment size, high assembly complexity, high cost, and severe interlayer interference in high-frequency signal transmission scenarios. Furthermore, existing integration solutions have low manufacturing yield and are difficult to mass-produce.
The antenna array and multi-functional board are integrated into one PCB by lamination, eliminating the need for RF and power connectors. It adopts an alternating layered reference ground structure and copper paste sintering process, combined with back-drilling technology, to achieve low-loss transmission of high-frequency signals and electromagnetic shielding.
It significantly improves signal transmission integrity, reduces equipment size and weight, simplifies assembly processes, increases manufacturing yield and equipment stability, reduces production costs, and solves interlayer interference and electromagnetic interference problems.
Smart Images
Figure CN122054451B_ABST