Parallelism adjustment assembly, bonding device and thermo-compression bonding apparatus
By combining the constraint part of the base and the connecting structure with the adaptable curved surface, the problems of structural size and complexity of traditional bonding devices are solved, and precise attitude adjustment and efficient bonding of the pressing head are achieved.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- LEISHEN TECH (SHENZHEN) CO LTD
- Filing Date
- 2026-04-14
- Publication Date
- 2026-06-19
AI Technical Summary
When traditional bonding devices adjust their orientation using a rotating shaft mechanism, the overall size of the device and the number of components increase significantly, affecting the alignment accuracy and bonding quality between the chip and the substrate.
By employing a parallelism adjustment component, the rolling and pitching motions of the pressing head are achieved through the cooperation of the base and the constraint part of the connecting structure with the adapting curved surface, reducing dependence on the rotating shaft and lowering the overall structural size and complexity.
It enables precise attitude adjustment of the bonding head, improves the alignment accuracy and bonding quality between the chip and the substrate, and reduces the overall structural size and complexity of the device.
Smart Images

Figure CN122055038B_ABST