A multi-layer circuit board separation groove processing device

Abstract

The utility model provides a kind of multilayer circuit board separation groove processing device, belong to circuit board manufacturing technical field, device includes cutting device and conveying device;Cutting device includes two groups of cutting components arranged in up and down, and cutting component includes pivot and support block;Two pivots are parallel to each other, and are set in horizontal direction staggered, and pivot each is coaxial array with multiple disc-shaped blades, and the blade on two pivots one-to-one corresponds, and corresponding two blades are in same vertical plane;Two groups of cutting components are set to move synchronously along vertical direction towards or opposite direction, when two groups of cutting components move towards limit position, the lower edge of upper blade is located below upper edge of lower blade, and there is gap between upper and lower corresponding blades.The separation groove processed by the scheme can cut all substrates of multilayer circuit board, prevent residual complete substrate, not only facilitate separation, but also can effectively prevent circuit board delamination.

Description

Technical Field

[0001] This invention belongs to the field of circuit board manufacturing technology, and in particular relates to a multilayer circuit board separation groove processing device. Background Technology

[0002] To facilitate manufacturing and packaging, most small circuit boards are usually formed on the same larger circuit board in a matrix distribution. In order to make it easy to break apart the small circuit boards during use, separation grooves are pre-processed at the connection between adjacent small circuit boards during the manufacturing process.

[0003] Most existing separation methods involve directly cutting grooves to thin the circuit board. However, for multilayer circuit boards, even after cutting the grooves, at least one complete substrate layer remains uncut. During the process of prying open the circuit board, the uncut substrate can easily separate from the adjacent substrates, resulting in the scrapping of the separated small circuit board. Summary of the Invention

[0004] To address the shortcomings of existing technologies, this invention provides a multilayer circuit board separation groove processing device that can cut all substrates, avoid the existence of intact substrates, and maintain the whole board structure of large circuit boards. This not only facilitates separation but also effectively prevents circuit board delamination.

[0005] In order to achieve the objective of this invention, the following solution is proposed:

[0006] A multilayer circuit board separation groove processing device includes a cutting device and a conveying device;

[0007] The cutting device includes two sets of cutting components arranged vertically, each cutting component including a rotating shaft and a support block;

[0008] Two rotating shafts are parallel to each other and staggered in the horizontal direction. Each rotating shaft has multiple disc-shaped blades arranged in a coaxial array, and the blades on the two rotating shafts correspond one-to-one, with the corresponding two blades in the same vertical plane.

[0009] Two sets of cutting components are set to move synchronously in opposite directions along the vertical direction. When the two sets of cutting components move to their extreme positions, the lower edge of the upper blade is below the upper edge of the lower blade, and there is a gap between the corresponding upper and lower blades.

[0010] The support block is used to press the circuit board firmly during the cutting process;

[0011] The conveying device is used to pass the circuit board horizontally through the middle of the two rotating shafts.

[0012] The beneficial effects of this invention are as follows: the separation groove processed by this solution can completely cut through the multilayer circuit board, avoiding the retention of a complete circuit board substrate, thus preventing the circuit board from delaminating during the process of breaking it open; and this solution simultaneously cuts the top and bottom surfaces of the circuit board, resulting in higher processing efficiency. Attached Figure Description

[0013] The accompanying drawings described herein are merely illustrative of selected embodiments, not all possible implementations, and are not intended to limit the scope of the invention.

[0014] Figure 1 A schematic diagram of a preferred structure of the cutting apparatus of this application is shown.

[0015] Figure 2 A schematic diagram of the overall scheme of this application is shown.

[0016] Figure 3 A schematic diagram of the state during the processing of the separation tank in this application is shown.

[0017] Figure 4 It shows Figure 3 A magnified view of a portion of point A in the middle.

[0018] Figure 5 A partial cross-sectional view of the cutting section during the machining of the separation groove is shown.

[0019] The markings in the diagram are: pivot-11, support block-12, connecting rod-121, blade-13, U-shaped frame-14, side plate-141, horizontal plate-142, spring-15, front rail-21, rear rail-22, flat plate-23, mounting frame-3, guide rod-31, top plate-32, bottom plate-33, limit block-34, swing rod-35, connecting rod-36, positioning rod-37, stop rod-38, telescopic device-4, adjusting screw-5. Detailed Implementation

[0020] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the implementation methods of the present invention will be described in detail below with reference to the accompanying drawings. However, the embodiments described in this invention are only some embodiments of the present invention, and not all embodiments.

[0021] like Figures 1 to 3 As shown, a multilayer circuit board separation groove processing device includes a cutting device and a conveying device.

[0022] Specifically, such as Figure 1 As shown, the cutting device includes two sets of cutting components arranged vertically, each including a rotating shaft 11 and a support block 12.

[0023] Specifically, such as Figure 1As shown, the two rotating shafts 11 are parallel to each other and staggered in the horizontal direction. Each cutting component is equipped with a motor, which is used to drive the rotating shaft 11 to rotate. Each rotating shaft 11 is coaxially arrayed with multiple disc-shaped blades 13, and the blades 13 on the two rotating shafts 11 correspond one-to-one, with the corresponding two blades 13 located in the same vertical plane.

[0024] Specifically, such as Figure 1 As shown, the two sets of cutting components are synchronously moved vertically in opposite directions. When the two sets of cutting components move to their extreme positions, the lower edge of the upper blade 13 is below the upper edge of the lower blade 13 to prevent the circuit board from having a complete substrate. There is a gap between the corresponding upper and lower blades 13 to prevent collisions. This gap is the connecting rib left after the circuit board is cut, to maintain the overall structure of the large circuit board. Figure 5 As shown, the connecting ribs formed have a continuous structure along the cutting direction, which can effectively prevent the circuit board from separating on its own during packaging and transfer.

[0025] The two rotating shafts 11 rotate in opposite directions, which can counteract the force along the cutting direction and reduce the risk of the circuit board moving.

[0026] Support block 12 is used to press the circuit board during the cutting process to prevent the circuit board from moving.

[0027] The conveying device is used to pass the circuit board horizontally through the middle of the two rotating shafts 11.

[0028] Combination Figures 1 to 3 As shown, during the separation groove processing, a conveying device feeds the circuit board through the middle of two sets of cutting components; a support block 12 presses the top and bottom surfaces of the circuit board together; the two sets of cutting components move synchronously towards each other, and the rotating shaft 11 drives the blades 13 to rotate at high speed, using the blades 13 of the two sets of cutting components to cut the top and bottom surfaces of the circuit board respectively. After one cut is completed, the two sets of cutting components move in opposite directions, separating the blades 13 from the circuit board and releasing the support block 12. The conveying device moves the circuit board a predetermined distance, and then the next cut is performed. Through multiple cuts, multiple separation grooves can be formed on both sides of the circuit board, and the distance between the separation grooves is equal to the distance between adjacent blades 13 arranged coaxially. Figure 5 As shown, the separation groove processed in this way can completely cut through the multi-layer circuit board, avoiding the presence of intact circuit board substrates, thus preventing the circuit board from delaminating during the process of prying it open. Furthermore, this solution simultaneously cuts the top and bottom surfaces of the circuit board, resulting in higher processing efficiency. During cutting, the pressure exerted on the circuit board by the vertically and vertically positioned, one-to-one corresponding blades 13 can cancel each other out, preventing the circuit board from bending or deforming.

[0029] Preferably, the cutting device is moved vertically as a whole. When processing separation grooves on circuit boards of different thicknesses, the position of the cutting device can be adjusted vertically to adjust the middle position of the two sets of cutting components. This allows the middle position of the two sets of cutting components to actively match the middle layer of the circuit board thickness, thereby ensuring that the blades 13 set on the upper and lower sides can cut the circuit board to the same thickness and avoid inconsistent groove depths on the upper and lower sides of the circuit board.

[0030] Specifically, such as Figure 1 , Figure 3 As shown, the top or bottom of the mounting frame 3 is rotatably equipped with a vertical adjusting screw 5. The adjusting screw 5 is connected to the conveying device through a threaded structure. Specifically, a plate 23 for mounting the adjusting screw 5 can be set at the top or bottom of the conveying device, and the plate 23 is parallel to the conveying surface of the conveying device. The vertical position of the mounting frame 3 can be adjusted by rotating the adjusting screw 5. As a further preferred embodiment, the mounting frame 3 is equipped with a vertical positioning rod 37, which passes through the plate 23 to improve the stability of the mounting frame 3.

[0031] Preferred, such as Figure 2 , Figure 3 As shown, the conveying device includes a front rail 21 and a rear rail 22, and the cutting device is located between the front rail 21 and the rear rail 22.

[0032] Preferred, such as Figure 1 As shown, the cutting assembly includes a U-shaped frame 14. The two ends of the rotating shaft 11 are rotatably connected to the side plates 141 at both ends of the U-shaped frame 14. The horizontal plates 142 of the two U-shaped frames 14 are in a horizontal position. Because the blades 13 on the two rotating shafts 11 need to cut the circuit board, the two rotating shafts 11 must be located between the horizontal plates 142 of the two U-shaped frames 14. The horizontal plate 142 of the lower U-shaped frame 14 is located below the corresponding rotating shaft 11, and the horizontal plate 142 of the upper U-shaped frame 14 is located below the corresponding rotating shaft 11. The cutting device also includes a mounting frame 3, with two vertical guide rods 31 at each end. The upper ends of the four guide rods 31 are connected by a top plate 32, and the lower ends are connected by a bottom plate 33. The side plates 141 at both ends of the U-shaped frame 14 are slidably mounted on the guide rods 31 at both ends of the mounting frame 3. The mounting frame 3 is moved vertically to meet the requirement that the cutting device is moved vertically. This scheme places two sets of cutting components in the same mounting frame 3, which facilitates the overall arrangement and makes the structure more compact.

[0033] Preferred, such as Figure 1 , Figure 5As shown, the support block 12 is located on the connecting rod 121 that passes vertically through the corresponding cutting component's horizontal plate 142. A spring 15 is fitted onto each connecting rod 121, positioned between the support block 12 and the horizontal plate 142. When the spring 15 is in its natural state, the distance between the side of the support block 12 that contacts the circuit board and the axis of the corresponding rotating shaft 11 is greater than the radius of the blade 13. When the support block 12 presses against the circuit board, the spring 15 is compressed. This design utilizes the U-shaped frame 14 to move the rotating shaft 11, while simultaneously moving the support block 12. In the early stages of cutting, as the U-shaped frame 14 moves towards the circuit board, the support block 12 contacts the circuit board before the blade 13, thus pressing the circuit board before the blade 13 contacts it, preventing movement during cutting. This design eliminates the need for a separate mechanism to drive the support block 12, simplifying the overall structure of the cutting component. Furthermore, as the cutting depth increases, the pressing force of the support block 12 on the circuit board also increases, further ensuring the pressing effect. Furthermore, since the cutting device has the function of moving and adjusting in the vertical direction, and the two sets of cutting components also have the function of synchronous adjustment, the support block 12 is installed by using the U-shaped frame 14 for mounting the rotating shaft 11, so that the position of the support block 12 can also be adjusted to adapt to circuit boards of different thicknesses, and to ensure that the pressure of the support block 12 on the circuit board is consistent in the upper and lower positions.

[0034] Preferred, such as Figure 1 , Figure 5 As shown, the support blocks 12 of the two sets of cutting components are arranged in pairs, and the projections of the paired support blocks 12 in the vertical direction at least partially overlap to prevent the circuit board from being squeezed and deformed during the pressing process.

[0035] Preferred, such as Figure 1 As shown, the guide rod 31 is provided with a limiting block 34 at the middle position of the upper and lower side plates 141. When the two sets of cutting components move towards each other to the limit position, the two side plates 141 contact the top and bottom surfaces of the limiting block 34 respectively to restrict the two sets of cutting components from moving further towards each other, thereby preventing the upper and lower corresponding blades 13 from colliding.

[0036] Further preferred, such as Figure 1 , Figure 4As shown, each of the limiting blocks 34 has a swing rod 35 on its outer side. The axis of swing is parallel to the rotating shaft 11 and located in the middle of the swing rod 35. Each end of the swing rod 35 is hinged to a connecting rod 36. The other end of the connecting rod 36 is rotatably connected to two side plates 141 on the same end guide rod 31. The axis of rotation is parallel to the rotating shaft 11, and the positions of the rotatable connections are rotationally symmetrical about the swing axis of the swing rod 35. The bottom or top of the mounting frame 3 is provided with a telescopic device 4 for driving one set of cutting components to move vertically. When the driven cutting component moves vertically, the U-shaped frame 14 will drive the swing rod 35 to swing through the side plates 141 and the corresponding connecting rods 36. The swing rod 35 will also drive the corresponding connecting rod 36 of the other set of cutting components to swing, thereby causing the other set of cutting components to move synchronously. The two sets of cutting components move in opposite directions.

[0037] Preferably, the outer side of the limiting block 34 is provided with a stop bar 38 to limit the extreme position of the swing rod 35, thereby preventing the swing rod 35 and the connecting rod 36 from being on the same straight line and avoiding dead points.

[0038] The above description is merely a preferred embodiment of the present invention and is not intended to be the only or limiting of the invention. Those skilled in the art should understand that various changes or equivalent substitutions made to the present invention without departing from its scope are all within the protection scope of the present invention.

Claims

1. A multilayer circuit board separation groove processing device, characterized in that, Includes cutting equipment and conveying equipment; The cutting device includes two sets of cutting components arranged vertically, each cutting component including a rotating shaft (11) and a support block (12). Two rotating shafts (11) are parallel to each other and staggered in the horizontal direction. Each rotating shaft (11) has multiple disc-shaped blades (13) arranged in a coaxial array. The blades (13) on the two rotating shafts (11) correspond one to one, and the corresponding two blades (13) are in the same vertical plane. The two sets of cutting components are set to move synchronously in opposite directions along the vertical direction. When the two sets of cutting components move to the limit position, the lower edge of the upper blade (13) is located below the upper edge of the lower blade (13), and there is a gap between the corresponding upper and lower blades (13). The support block (12) is used to press the circuit board during the cutting process; The conveying device is used to pass the circuit board horizontally through the middle of the two rotating shafts (11); The cutting assembly includes a U-shaped frame (14), with the two ends of the rotating shaft (11) rotatably connected to the side plates (141) at both ends of the U-shaped frame (14). The horizontal plates (142) of the two U-shaped frames (14) are in a horizontal position. The cutting device also includes a mounting frame (3), with two vertical guide rods (31) at each end. The upper ends of the four guide rods (31) are connected through the top plate (32), and the lower ends are connected through the bottom plate (33). The side plates (141) at both ends of the U-shaped frame (14) are slidably mounted on the guide rods (31) at both ends of the mounting frame (3). The mounting frame (3) is moved in the vertical direction. The guide rod (31) is provided with a limiting block (34) at the middle position of the upper and lower side plates (141). When the two sets of cutting components move to the limit position, the two side plates (141) contact the top and bottom surfaces of the limiting block (34) respectively. Each of the limiting blocks (34) has a swing rod (35) on its outer side. The swing axis is parallel to the rotating shaft (11) and is located in the middle of the swing rod (35). Each end of the swing rod (35) is hinged to a connecting rod (36). The other end of the connecting rod (36) is rotatably connected to two side plates (141) on the same end guide rod (31). The axis of rotation is parallel to the rotating shaft (11), and the position of the rotatable connection is rotatably set opposite to the swing axis of the swing rod (35). The bottom or top of the mounting frame (3) is provided with a telescopic device (4) for driving one of the cutting components to move in the vertical direction.

2. The multilayer circuit board separation groove processing device according to claim 1, characterized in that, The cutting device is set up to move vertically.

3. The multilayer circuit board separation groove processing device according to claim 1, characterized in that, Each cutting component is equipped with a motor, which is used to drive the rotating shaft (11) to rotate.

4. The multilayer circuit board separation groove processing device according to claim 1, characterized in that, The support block (12) is provided on the connecting rod (121) that passes vertically through the horizontal plate (142) of the corresponding cutting component. The connecting rod (121) is fitted with a spring (15). The spring (15) is located between the corresponding support block (12) and the horizontal plate (142). When the spring (15) is in its natural state, the distance between the side of the support block (12) that is used to contact the circuit board and the axis of the corresponding rotating shaft (11) is greater than the radius of the blade (13).

5. The multilayer circuit board separation groove processing device according to claim 4, characterized in that, The support blocks (12) of the two sets of cutting components are set in pairs, and the projections of the paired support blocks (12) in the vertical direction at least partially overlap.

6. The multilayer circuit board separation groove processing device according to claim 1, characterized in that, The top or bottom of the mounting frame (3) is provided with a vertical adjusting screw (5), which is connected to the conveying device through a threaded structure.

7. The multilayer circuit board separation groove processing device according to claim 1, characterized in that, The two rotating shafts (11) rotate in opposite directions.

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