一种制备高结合强度复合FPC的方法及其FPC结构
By using magnetron sputtering and magnetic field-assisted metal deposition processes to form a nickel-chromium alloy layer in an FPC, combined with magnetic field-assisted pulse electroplating, the problem of insufficient copper-aluminum bonding strength was solved, resulting in a copper-aluminum composite substrate with high bonding strength, which improves signal transmission and structural stability.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- ZHEJIANG YILIAN ELECTRONICS CO LTD
- Filing Date
- 2026-04-21
- Publication Date
- 2026-07-17
AI Technical Summary
The copper-aluminum bonding strength in existing FPCs is insufficient, and delamination and separation can easily occur due to differences in thermal expansion coefficients, changes in ambient temperature and humidity, or mechanical bending, affecting signal transmission reliability and welding performance.
A nickel-chromium alloy layer is formed on the surface of an aluminum substrate using magnetron sputtering and magnetic field-assisted metal deposition processes. The metallurgical bonding between the copper layer and the nickel-chromium alloy layer is controlled by a magnetic field to form a copper-nickel-chromium-aluminum three-layer structure. Combined with magnetic field-assisted pulse electroplating, the copper layer and the aluminum substrate are directionally deposited to form a dense metallurgical bonding interface.
It significantly improves the interfacial bonding strength, enhances the conductivity and weldability of copper-aluminum composite substrates, ensures signal transmission stability and structural stability, adapts to bending and vibration conditions, and improves the yield and process compatibility of the finished product.
Smart Images
Figure CN122069651B_ABST