载板结构以及载板结构的制备方法
By setting multiple slots and openings on the substrate of the carrier board structure and integrating multiple driving elements using conductive connections and redistribution layers, the shortcomings of existing carrier board structures in terms of heat dissipation and interconnection density are solved, and the performance of driving elements is improved.
CN122070034BActive Publication Date: 2026-07-17SUZHOU GUOXIAN INNOVATION TECHNOLOGY CO LTD
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Patents(China)
- Current Assignee / Owner
- SUZHOU GUOXIAN INNOVATION TECHNOLOGY CO LTD
- Filing Date
- 2026-04-23
- Publication Date
- 2026-07-17
AI Technical Summary
Technical Problem
The performance of existing carrier board structures cannot meet the requirements, especially in terms of heat dissipation and interconnect density of driving components.
Method used
Multiple first slots and first openings are provided on the substrate of the carrier structure to accommodate driving elements and conductive connections. The integration of multiple driving elements is achieved through a redistribution layer, increasing the interconnection density, while heat dissipation is achieved using a cooling medium.
Benefits of technology
It improves the heat dissipation and interconnection density of the drive components, thereby enhancing their performance.
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Figure CN122070034B_ABST
Abstract
本申请实施例提供一种载板结构以及载板结构的制备方法。载板结构，包括：基板，沿载板结构的厚度方向，基板包括相对的第一表面和第二表面；沿平行于基板所在平面的方向，在第一表面设有至少两个间隔设置第一开槽，在第二表面设有间隔设置的第一开孔、第二开槽，沿载板结构的厚度方向，第一开槽和第一开孔至少部分交叠；至少两个驱动元件，各驱动元件分别设于第一开槽内；导电连接部，设于第二开槽内，且分别连接各驱动元件。在利用导电连接部实现多驱动元件集成的同时，增大互联密度，降低互联路径，并改善了驱动元件散热效果，提高了驱动元件的使用性能。
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