Preparation method of liquid metal conductive film
CN122071784APending Publication Date: 2026-05-22NINGBO INST OF MATERIALS TECH & ENG CHINESE ACAD OF SCI
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Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NINGBO INST OF MATERIALS TECH & ENG CHINESE ACAD OF SCI
- Filing Date
- 2024-11-22
- Publication Date
- 2026-05-22
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Figure CN122071784A_ABST
Abstract
The preparation method of the liquid metal conductive film comprises the steps that target liquid metal is selected, and the melting point and the freezing point of the target liquid metal are measured through a thermal analysis method; according to the measurement results of the melting point and the freezing point, cyclic heat treatment is conducted on the target liquid metal, and an over-cryogenic melt is obtained; selecting a substrate on which target liquid metal is deposited, and carrying out cleaning, drying and hydrophilic treatment on the surface of the substrate; carrying out cooling treatment on the substrate according to the determination result of the freezing point; and evaporating and depositing the over-cryogenic melt on a cooled substrate through vacuum thermal evaporation to form the liquid metal conductive film. The preparation method is simple and controllable, the problems that liquid metal is large in surface tension, an oxidation film is likely to be generated, and the liquid metal is difficult to spread on the substrate to form the conductive film can be solved, and the prepared conductive film is applied to the fields of flexible electronics, electronic skin, flexible display and the like.
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