Temporary fixing and separating device and method for semiconductor component
By using a light source module to irradiate light between the semiconductor component and the temporary carrier, and by connecting the modified protective layer and the optical control layer, the semiconductor component can be easily separated, solving the cumbersome separation process in the prior art, improving processing efficiency and reducing costs.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- USUN TECH CO LTD
- Filing Date
- 2024-11-15
- Publication Date
- 2026-05-22
AI Technical Summary
In existing semiconductor manufacturing processes, the separation of semiconductor components from temporary carriers is a complex process, especially the handling of optical control layers and connecting materials during etching, photolithography, and annealing, which affects processing efficiency and cost.
A temporary fixing and separation device for semiconductor components is adopted. Light is shone from the direction of the temporary carrier by the light source module, which penetrates the optical control layer and indirectly modifies the protective layer, so that the connection between the protective layer and the optical control layer is lost, thereby realizing the simple separation of the semiconductor components.
It simplifies the processing steps of optical control layers and bonding materials, saves operation time and costs, and improves the efficiency of semiconductor component separation.
Smart Images
Figure CN122073976A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to a temporary fixing and separation device and method for semiconductor components. Background Technology
[0002] In modern semiconductor manufacturing, after a semiconductor component is tested, if subsequent processing such as cutting, etching, or packaging is required, the semiconductor component is usually temporarily fixed to a temporary carrier (such as a glass substrate) using a bonding material in order to facilitate handling and maintain its stability. After a series of processing steps are completed, the bonding material is removed by means of heating, ultraviolet light, or solvents, and the semiconductor component is removed from the temporary carrier, thus separating the semiconductor component for subsequent process steps.
[0003] However, in semiconductor manufacturing processes such as etching, photolithography, annealing, and inspection, to prevent light interference from these processes from damaging the semiconductor components, an optical control material (such as an electroplated metal layer) is typically placed between the semiconductor component and the temporary carrier. This material reduces interference by absorbing or reflecting light. The semiconductor component is then fixed to the optical control layer of the temporary carrier using a bonding material for subsequent processing. Therefore, when separating the semiconductor component from the temporary carrier, both the optical control layer and the bonding material must be processed separately, making the entire process complex. Summary of the Invention
[0004] Therefore, in view of the above deficiencies, the main objective of the present invention is to provide a temporary fixing and separation device and method for semiconductor components.
[0005] The present invention provides a temporary fixing and separating device for semiconductor components, comprising: a temporary carrier, an optical control layer attached to the temporary carrier to reduce the impact or damage of unexpected light on the semiconductor component, a protective layer for bonding the semiconductor component to the optical control layer, and a light source module capable of emitting a light source; the light source is incident from the direction of the temporary carrier and penetrates the temporary carrier to irradiate the optical control layer, indirectly modifying the protective layer which has the function of fixing the semiconductor component, and causing the connection between the protective layer and the optical control layer to be lost.
[0006] The present invention provides a method for temporarily fixing and separating a semiconductor component, the steps of which include: using the aforementioned temporary fixing and separating device, a semiconductor component in a fixed state is subjected to light from a light source module from the direction of a temporary carrier, the light penetrating the temporary carrier and irradiating the optical control layer; when the protective layer and the optical control layer lose their connection effect, the semiconductor component is peeled off from the temporary carrier.
[0007] This invention uses a light source to irradiate the optical control layer, indirectly modifying the protective layer that serves to fix the semiconductor component and causing it to lose its connection with the optical control layer. This achieves the effect of detaching the semiconductor component from the temporary carrier for the next stage of the manufacturing process. This simplifies the processing steps for the optical control layer and connecting materials, saving time and costs in the separation process after the semiconductor component is bonded. Attached Figure Description
[0008] Figure 1 This is a schematic diagram of the temporary fixing and separation device for semiconductor components according to the present invention.
[0009] Figure 2 This is a diagram showing the light source illumination path of the temporary fixing and separation device for semiconductor components according to the present invention.
[0010] Explanation of reference numerals in the attached figures: 1-Temporary fixing and separation device for semiconductor components; 11-Temporary carrier; 12-Optical control layer; 13-Protective layer; 14-Light source module; 2-Semiconductor component. Detailed Implementation
[0011] To achieve the above objectives and effects, the technical means and structure of the present invention, as well as the implementation methods, are described in detail below with reference to the accompanying drawings, so as to facilitate a complete understanding.
[0012] Please see Figure 1 As shown in the figure, it is a schematic diagram of the device of the present invention. As can be clearly seen from the figure, the present invention is a temporary fixing and separation device 1 for semiconductor components, including a temporary carrier 11, an optical control layer 12 attached to the temporary carrier 11 to reduce the impact or damage of unexpected light on the semiconductor components, a protective layer 13 to fix the semiconductor components 2 on the optical control layer 12, and a light source module 14 capable of emitting light sources.
[0013] The temporary carrier 11 is a glass substrate or sapphire substrate, which are materials with good mechanical strength, high stability and do not obstruct the passage of light.
[0014] When the semiconductor component 2 is subjected to processes such as etching, photolithography, annealing, and inspection, the processing light will irradiate the device from one side of the semiconductor component 2. The optical control layer 12 is used to reduce the impact or damage of unexpected light on the semiconductor component or other components to prevent interference with the process. The optical control layer 12 used to reduce the impact or damage of unexpected light on the semiconductor component is a metal (such as chromium, titanium, nickel, iron, aluminum or their alloys), metal oxide, polymer material, carbon black, dye, pigment, etc.
[0015] The protective layer 13 serves to protect the semiconductor component 2 by preventing corrosion and isolating it from environmental factors. Through processing methods such as baking and curing, the semiconductor component 2 is fixed to the optical control layer 12 of the temporary carrier 11 via the protective layer 13. The protective layer 13 is made of polyethylene terephthalate (PET), polyimide (PI), or other polymer materials.
[0016] The light emitted by the light source module 14 enters from the direction of the temporary carrier 11 when separated. After penetrating the temporary carrier 11, the light shines on the optical control layer 12, indirectly changing the protective layer 13, which serves to fix the semiconductor component 2, and causing the protective layer 13 and the optical control layer 12 to lose their connection. The light source may be infrared or ultraviolet light.
[0017] Please see Figure 2 As shown, this is a light source illumination path diagram of the present invention. In the fixed state, the semiconductor component 2 is fixed above the optical control layer 12 of the temporary carrier 11 by the protective layer 13. The semiconductor component 2 is a semiconductor component to be etched, a semiconductor component to be photolithographically etched, a semiconductor component to be inspected, or a semiconductor component awaiting processing.
[0018] When the semiconductor component 2 in its fixed state is to be separated and removed, the light source module 14 emits light. The light enters from the direction of the temporary carrier 11, penetrates the temporary carrier 11, and irradiates the optical control layer 12. This indirectly changes the protective layer 13, which has the function of fixing the semiconductor component 2. At this time, the interfacial bonding force at the bonding point between the protective layer 13 and the optical control layer 12 decreases, and the connection between the protective layer 13 and the optical control layer 12 is lost. As a result, the semiconductor component 2 is peeled off from the temporary carrier 11, so as to proceed to the next stage of the manufacturing process.
[0019] In an embodiment of the present invention, the temporary carrier 11 is a glass substrate, the optical control layer 12 is a titanium-copper metal thin film, and the protective layer 13 is polyimide (PI). The semiconductor component 2 is fixed to the optical control layer 12 (titanium-copper metal thin film) electroplated on the temporary carrier 11 (glass substrate) by the protective layer 13 (PI), thus achieving a fixed state. When it is desired to separate and remove the fixed semiconductor component 2, the light source module 14 emits light rays that irradiate and penetrate the temporary carrier 11 (glass substrate) and irradiate the optical control layer 12 (titanium-copper metal thin film). This indirectly modifies the protective layer 13 (PI), which serves to fix the semiconductor component 2, and causes the interface between the protective layer 13 and the optical control layer 12 to lose its bonding effect. At this time, the interfacial bonding force at the adhesion point between the polyimide (PI) and the titanium-copper metal thin film decreases, causing it to peel off from the interface, thereby achieving the effect of separating the semiconductor component 2 from the temporary carrier 11 (glass substrate).
[0020] The present invention discloses a method for temporarily fixing and separating a semiconductor component, the steps of which include: using a semiconductor component temporary fixing and separating device 1, a semiconductor component 2 in a fixed state is subjected to light from a light source module 14 from the direction of a temporary carrier 11, the light penetrating the temporary carrier 11 and irradiating an optical control layer 12; when the protective layer 13 and the optical control layer 12 lose their connection effect, the semiconductor component 2 is peeled off from the temporary carrier 11.
[0021] In summary, the temporary fixing and separation device for semiconductor components described above in this invention can indeed achieve its function and purpose when in use, and therefore this invention is indeed a highly practical creation.
Claims
1. A temporary fixing and separating device for semiconductor components, characterized in that, include: A temporary carrier, an optical control layer attached to the temporary carrier to reduce the impact or damage of unexpected light on semiconductor components, a protective layer for bonding semiconductor components to the optical control layer, and a light source module capable of emitting a light source; the light source is incident from the direction of the temporary carrier and penetrates the temporary carrier to irradiate the optical control layer, indirectly altering the protective layer which has the function of fixing semiconductor components, and causing the protective layer and the optical control layer to lose their connection function.
2. The temporary fixing and separating device for semiconductor components as described in claim 1, characterized in that: The temporary carrier is a glass substrate or a sapphire substrate that does not obstruct the passage of light.
3. The temporary fixing and separating device for semiconductor components as described in claim 1, characterized in that: The optical control layer used to reduce the impact or damage of unwanted light on semiconductor components is a metal thin film, metal oxide, polymer material, carbon black, dye, or pigment.
4. The temporary fixing and separating device for semiconductor components as described in claim 1, characterized in that: The protective layer is made of polyethylene terephthalate (PET) or polyimide (PI) polymer material, used to prevent corrosion and isolate environmental factors, and to fix semiconductor components to the optical control layer.
5. The temporary fixing and separating device for semiconductor components as described in claim 1, characterized in that: The temporary carrier is a glass substrate, the optical control layer is a titanium-copper metal thin film, and the protective layer is polyimide (PI).
6. The temporary fixing and separating device for semiconductor components as described in claim 1, characterized in that: The light source of this light source module is either infrared or ultraviolet light.
7. A method for temporarily fixing and separating semiconductor components, characterized in that: step include: Using the semiconductor component temporary fixing and separation device as described in claim 1, a semiconductor component in a fixed state is subjected to light from a light source module directed from the direction of a temporary carrier. The light penetrates the temporary carrier and irradiates the optical control layer. When the protective layer and the optical control layer lose their connection, the semiconductor component is peeled off from the temporary carrier.
8. The method for temporary fixation and separation of semiconductor components as described in claim 7, characterized in that: The temporary carrier is a glass substrate or a sapphire substrate that does not obstruct the passage of light.
9. The method for temporary fixation and separation of semiconductor components as described in claim 7, characterized in that: The optical control layer is a thin metal film, metal oxide, polymer material, carbon black, dye, or pigment used to reduce the impact or damage of unwanted light on semiconductor components.
10. The method for temporary fixation and separation of semiconductor components as described in claim 7, characterized in that: The protective layer is made of polyethylene terephthalate (PET) or polyimide (PI) polymer material, used to prevent corrosion and isolate environmental factors, and to fix semiconductor components to the optical control layer.
11. The method for temporary fixation and separation of semiconductor components as described in claim 7, characterized in that: The temporary carrier is a glass substrate, the optical control layer is a titanium-copper metal thin film, and the protective layer is polyimide (PI).
12. The method for temporary fixation and separation of semiconductor components as described in claim 7, characterized in that: The light source of this light source module is either infrared or ultraviolet light.