Cache device of semiconductor wafer storage box

Abstract

The invention discloses a cache device of a semiconductor wafer storage box, and relates to the field of semiconductor wafers. The device comprises a storage box, the storage box is filled with filling cotton, placing grooves are evenly formed in the filling cotton, a plurality of protection bases are placed in the placing grooves, connecting structures are arranged among the protection bases, storage grooves are formed in the upper ends of the protection bases, and clamping structures are arranged in the storage grooves. Ejecting structures are arranged in the protection bases, semiconductor wafers are fixed in the protection bases through clamping structures, the protection bases are spliced into a whole through connecting structures, the semiconductor wafers can be protected conveniently, the integrated protection bases are inserted into the containing grooves, and under the action of filling cotton, the semiconductor wafers can be placed in the containing grooves, so that the semiconductor wafers can be placed in the containing grooves. The overall buffering and damping effect is further enhanced, vibration and impact energy transmitted by the outside is effectively absorbed, and mutual collision or position deviation caused by shaking of the protection seats is prevented.

Description

Technical Field

[0001] This invention belongs to the field of semiconductor wafer technology, and in particular relates to a cache device for a semiconductor wafer storage cassette. Background Technology

[0002] Semiconductor wafers are the substrate material used to manufacture integrated circuits (chips). They are extremely thin, highly flat, and nearly perfect circular single-crystal silicon wafers (or other semiconductor materials, such as gallium arsenide). All chips are manufactured on these wafers through a series of complex processes, including photolithography, etching, and doping. Currently, semiconductor wafers are commonly placed and secured using dedicated storage boxes during storage. However, while these boxes provide some protection and fixation for the wafers, the varying diameters of different wafer models coupled with the fixed internal storage space necessitate the use of different boxes for different wafer sizes. This design limitation prevents the same box from being compatible with wafers of various diameters, significantly reducing flexibility and efficiency. Furthermore, in actual storage operations, the relatively simple design of the storage boxes often makes wafer insertion and removal inconvenient and cumbersome, increasing worker time and increasing the risk of scratches on the wafer surface due to friction or collisions during frequent access, thus affecting quality and subsequent performance.

[0003] To address these issues, we provide a cache device for a semiconductor wafer memory cassette. Summary of the Invention

[0004] The purpose of this invention is to provide a buffer device for a semiconductor wafer storage box, which can solve the problem that existing semiconductor wafers are mostly placed inside the storage box during storage. Although the semiconductor wafers can be fixed, the storage space inside the storage box is fixed because the semiconductor wafers have different diameters. This leads to the need to use different storage boxes to store semiconductor wafers, and it is impossible to fix semiconductor wafers of different diameters. This has certain limitations in use. Moreover, placing and removing the wafers during storage is troublesome and can easily scratch the semiconductor wafers.

[0005] To solve the above-mentioned technical problems, the present invention is achieved through the following technical solution: This invention relates to a buffer device for a semiconductor wafer storage box, comprising a storage box, the interior of which is filled with filling cotton, and the interior of the filling cotton is uniformly provided with placement grooves, the placement grooves are provided with multiple protective seats, the multiple protective seats are provided with a connecting structure, the upper end of the protective seat is provided with a storage groove, the storage groove is provided with a clamping structure, and the protective seat is provided with a top material structure.

[0006] The present invention is further configured such that the clamping structure includes an adjustment groove, the adjustment groove is formed inside the protective seat, the adjustment groove is annular, and two slide rods are fixedly installed on both sides inside the adjustment groove, and a movable seat is slidably installed between the two slide rods.

[0007] The invention is further configured such that a clamping spring is movably sleeved on the surface of the slide rod, one end of the clamping spring is fixedly connected to the movable seat, the other end of the clamping spring is fixedly connected to the inner wall of the adjustment groove, a clamping rod is fixedly installed in the middle of one side of the movable seat, one end of the clamping rod extends into the interior of the storage groove and is fitted with a clamping piece, and rubber pads are provided on both sides of the clamping piece, the clamping piece being L-shaped.

[0008] The invention is further configured such that movable slots are provided on both sides of the lower end of the adjustment slot, the movable slots are located below the movable seat, a movable block is movably inserted inside the movable slot, the upper end of the movable block is fixedly connected to the movable seat, and the lower end of the movable block extends to the outside of the protective seat and is equipped with a connecting frame.

[0009] The present invention is further configured such that a connecting seat is fixedly installed at the lower end of the protective seat, an adjusting ring is movably sleeved on the outer side of the connecting seat, and movable connecting rods are movably installed on both sides of the surface of the adjusting ring. One end of the movable connecting rod is movably connected to the connecting frame, and a push ring is fixedly installed at the lower end of the adjusting ring.

[0010] The present invention is further configured such that the top material structure includes a perforation, the perforation has a surface with a storage groove evenly opened, a rubber pin is movably inserted inside the perforation, the upper end of the rubber pin is on the same horizontal line as the lower end inside the storage groove, an adjusting plate is fixedly installed at the lower end of the rubber pin, and a return spring connected to the adjusting plate and the inner wall of the connecting seat is sleeved on the surface of the rubber pin.

[0011] The present invention is further configured such that sliding grooves are provided on both sides of the surface of the connecting seat, a slider passes through the inside of the sliding groove, one end of the slider is fixedly connected to the inner ring of the adjusting ring, and a top plate is movably mounted on the connecting seat, the top plate being fixedly connected to one end of the slider.

[0012] The present invention is further configured such that the connecting structure includes a connecting ring, both sides of the surface of the connecting ring are provided with insertion ports, both sides of the lower end of the connecting ring are provided with limiting grooves, the insertion ports and the limiting grooves are perpendicularly distributed, and the positions of the two limiting grooves are opposite.

[0013] The present invention is further configured such that the diameter of the connecting seat is equal to the inner diameter of the connecting ring, the inner diameter of the connecting ring is greater than the diameter of the storage groove, connecting blocks are fixedly installed on both sides of the lower end of the connecting seat, the width of the connecting block is equal to the width of the socket, the thickness of the connecting block is equal to the width of the limiting groove, and the connecting block cooperates with the socket and the limiting groove.

[0014] The invention is further configured such that a movable groove is provided on one side of the upper end of the limiting groove, a movable block is movably installed inside the movable groove, a locking spring is fixedly installed on the upper end of the movable block, a locking block is fixedly installed on the lower end of the movable block, the locking block is in the shape of a right trapezoid, a control groove is provided on one side of the movable groove, an adjusting block connected to the movable block passes through the control groove, and a locking hole that cooperates with the locking block is provided on the upper end of the connecting block.

[0015] The present invention has the following beneficial effects: 1. In this invention, the semiconductor wafer is fixed inside the protective base by a clamping structure. The protective bases are assembled into a whole by a connecting structure, which facilitates the protection of the semiconductor wafer. The whole protective base is inserted into the placement slot. With the help of the filling cotton, the overall buffering and shock absorption effect is further enhanced, effectively absorbing the vibration and impact energy transmitted from the outside, preventing the protective bases from colliding with each other or shifting their position due to shaking. At the same time, the filling cotton is closely attached to the outer wall of the protective base, providing uniform support for each protective base, ensuring that the semiconductor wafer fixed by the clamping structure in the storage slot is always in a stable state, avoiding damage such as scratches, bumps or breakage caused by external forces. This achieves all-round safety protection for the semiconductor wafer and meets its high-precision protection requirements during storage and transportation.

[0016] 2. In this invention, when the push ring is pulled upward, the adjusting ring moves upward synchronously along the connecting seat. Through the transmission action of the movable connecting rod, the connecting frame drives the moving block to slide outward along the moving groove. The moving seat then compresses the clamping spring and moves along the slide rod. The clamping rod drives the clamping piece to retract towards the inside of the adjusting groove, and the clamping space of the storage groove is opened, making it convenient for workers to quickly put in or take out semiconductor wafers. After the push ring is released, the elastic potential energy of the clamping spring is released, pushing the moving seat to reset. The clamping piece re-clamps the wafer. The rubber pads on both sides of the clamping piece can not only increase the contact friction with the wafer to prevent the wafer from slipping during storage or transportation, but also avoid direct hard contact between the clamping piece and the wafer surface, effectively protecting the precision circuit layer of the wafer from scratches. 3. In this invention, when the adjusting ring moves upward to the position of the adjusting plate, the adjusting ring drives the top plate to move upward through the slider and fits against the adjusting plate. At this time, the minimum distance between the clamping pieces is greater than 300 mm, so that the clamping block is disengaged from the semiconductor wafer. As the adjusting ring continues to move upward, the top plate drives the adjusting plate to move upward, and the adjusting plate drives the rubber pin to move upward. The rubber pin lifts the semiconductor wafer upward, which facilitates the quick extraction of the semiconductor wafer. Under the action of the reset spring, the rubber pin can return to its original position, which facilitates the repeated use of the overall structure. 4. In this invention, when multiple protective seats need to be assembled into a whole, the operator can align the socket of the connecting ring of the lower protective seat with the connecting block of the upper protective seat, insert the connecting block into the socket, and then rotate the protective seat clockwise. The connecting block slides along the limiting groove. Since the locking block is in the shape of a right-angled trapezoid, the connecting block will squeeze the locking block during the sliding process, causing it to contract upward and compress the locking spring. When the connecting block is completely slid into the end of the limiting groove, the elastic potential energy of the locking spring is released, pushing the movable block to reset. The locking block is embedded in the locking hole at the upper end of the connecting block, realizing a stable connection between the two protective seats. If the protective seats need to be disassembled, simply move the adjusting block in the control groove to drive the movable block upward to compress the locking spring, causing the locking block to disengage from the locking hole. Then, rotate the protective seat counterclockwise to remove the connecting block from the socket. This connection structure is easy to operate and has high overall rigidity after connection, which can effectively prevent relative displacement of the protective base during storage or transportation. Combined with the cushioning and shock absorption effect of the filling cotton, it further ensures the storage safety of semiconductor wafers. In addition, the size matching design of the connecting ring and the connecting base ensures that the gap between the protective bases after assembly is uniform, avoiding damage to the wafers due to excessive local stress caused by uneven gaps. After multiple protective bases are connected into a whole by this structure, they can be placed into the storage box slot at the same time, which greatly improves the utilization rate of the storage box space, and also facilitates the unified management and transfer of batch wafers by staff.

[0017] Of course, any product implementing this invention does not necessarily need to achieve all of the advantages described above at the same time. Attached Figure Description

[0018] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a schematic diagram of the internal structure of the storage box of the present invention; Figure 2 This is a schematic diagram of the assembly and connection structure of the protective base of the present invention; Figure 3This is a schematic diagram of the protective base structure in the device of the present invention; Figure 4 This is a schematic diagram of the bottom structure of the protective base in the device of the present invention; Figure 5 This is a cross-sectional view of the protective base portion in the device of the present invention; Figure 6 For the present invention Figure 5 Schematic diagram of the enlarged structure of A in the middle; Figure 7 This is a schematic diagram of a half-section of the side of the protective base in the device of the present invention; Figure 8 For the present invention Figure 7 Schematic diagram of the enlarged structure of B.

[0020] The attached diagram lists the components represented by each number as follows: 100. Storage box; 110. Filling cotton; 111. Placement slot; 200. Protective seat; 201. Storage slot; 210. Connecting ring; 211. Insertion port; 212. Limiting slot; 213. Movable slot; 214. Locking spring; 215. Movable block; 216. Locking block; 217. Control slot; 218. Adjusting block; 220. Connecting seat; 221. Connecting block; 222. Locking hole; 230. Moving slot; 231. Adjusting slot; 240. Adjusting ring; 241. Movable connecting rod; 242. Connecting frame; 243. Slide rod; 244. Clamping spring; 245. Moving seat; 246. Moving block; 250. Top plate; 251. Slider; 252. Adjusting plate; 253. Return spring; 254. Rubber ejector pin; 300. Clamping rod; 310. Clamping piece; 311. Rubber pad. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] like Figure 1 and Figure 2 As shown, a buffer device for a semiconductor wafer storage box includes a storage box 100. The storage box 100 is filled with filling cotton 110. Placement slots 111 are evenly opened inside the filling cotton 110. Multiple protective seats 200 are placed inside the placement slots 111. A connecting structure is provided between the multiple protective seats 200. A storage slot 201 is opened at the upper end of the protective seat 200. In this embodiment, the semiconductor wafer is fixed inside the protective base 200 by a clamping structure. The protective bases 200 are assembled into a whole by a connecting structure, which facilitates the protection of the semiconductor wafer. The whole protective base 200 is inserted into the placement slot 111. With the help of the filling cotton 110, the overall buffering and shock absorption effect is further enhanced, effectively absorbing the vibration and impact energy transmitted from the outside, and preventing the protective bases 200 from colliding with each other or shifting their position due to shaking. At the same time, the filling cotton 110 fits tightly against the outer wall of the protective base 200, providing uniform support for each protective base 200, ensuring that the semiconductor wafer fixed by the clamping structure in the storage slot 201 is always in a stable state, avoiding damage such as scratches, bumps or breakage caused by external forces, thereby achieving all-round safety protection for the semiconductor wafer and meeting its high-precision protection requirements during storage and transportation.

[0023] like Figures 3 to 6 As shown, a buffer device for a semiconductor wafer storage cassette includes a storage slot 201 with a clamping structure inside. The clamping structure includes an adjustment slot 231, which is annular in shape and located inside a protective base 200. Two sliding rods 243 are fixedly mounted on both sides of the adjustment slot 231. A movable base 245 is slidably mounted between the two sliding rods 243. A clamping spring 244 is movably sleeved on the surface of each sliding rod 243. One end of the clamping spring 244 is fixedly connected to the movable base 245, and the other end is fixedly connected to the inner wall of the adjustment slot 231. A clamping rod 300 is fixedly mounted in the middle of one side of the movable base 245. One end of the clamping rod 300 extends into the storage slot 201 and is fitted with a clamping piece 310. Rubber pads 311 are provided on both sides of the plate 310. The clamping plate 310 is L-shaped. Movable grooves 230 are provided on both sides of the lower end of the adjusting groove 231. The moving grooves 230 are located below the moving seat 245. A moving block 246 is movably inserted inside the moving groove 230. The upper end of the moving block 246 is fixedly connected to the moving seat 245. The lower end of the moving block 246 extends to the outside of the protective seat 200 and is equipped with a connecting frame 242. A connecting seat 220 is fixedly installed at the lower end of the protective seat 200. An adjusting ring 240 is movably sleeved on the outside of the connecting seat 220. Movable connecting rods 241 are movably installed on both sides of the surface of the adjusting ring 240. One end of the movable connecting rod 241 is movably connected to the connecting frame 242. A push ring is fixedly installed at the lower end of the adjusting ring 240. In this embodiment, when the push ring is pulled upward, the adjusting ring 240 moves upward synchronously along the connecting seat 220. Through the transmission action of the movable connecting rod 241, the connecting frame 242 drives the moving block 246 to slide outward along the moving groove 230. The moving seat 245 then compresses the clamping spring 244 and moves along the slide rod 243. The clamping rod 300 drives the clamping piece 310 to retract inward to the adjusting groove 231, and the clamping space of the storage groove 201 is opened, making it convenient for workers to quickly put in or take out semiconductor wafers. After the push ring is released, the elastic potential energy of the clamping spring 244 is released, pushing the moving seat 245 to reset. The clamping piece 310 re-clamps the wafer. The rubber pads 311 on both sides of the clamping piece 310 can not only increase the contact friction with the wafer to prevent the wafer from slipping during storage or transportation, but also prevent the clamping piece 310 from directly contacting the wafer surface, effectively protecting the precision circuit layer of the wafer from scratches. The minimum distance between the two symmetrically distributed clamping tabs 310 is less than 150 mm, while the maximum unilateral movement of the clamping tabs 310 is greater than 75 mm. This design gives the clamping mechanism a wide adjustment range and good adaptability. By flexibly adjusting the position of the clamping tabs 310, the device can firmly clamp various sizes of wafers commonly found on the market, such as 6-inch (approximately 150 mm), 8-inch (200 mm), and 12-inch (300 mm), ensuring both operational convenience and improved equipment compatibility and processing efficiency.

[0024] like Figure 7 As shown, a buffer device for a semiconductor wafer storage cassette includes a top-loading structure inside a protective base 200. The top-loading structure includes a perforation, and the surface of the perforation is uniformly provided with storage slots 201. A rubber pin 254 is movably inserted inside the perforation. The upper end of the rubber pin 254 is on the same horizontal line as the lower end inside the storage slot 201. An adjustment plate 252 is fixedly installed at the lower end of the rubber pin 254. A reset spring 253 is sleeved on the surface of the rubber pin 254 and connected to the adjustment plate 252 and the inner wall of the connecting base 220. Sliding grooves are provided on both sides of the surface of the connecting base 220. A slider 251 passes through the inside of the sliding groove. One end of the slider 251 is fixedly connected to the inner ring of the adjustment ring 240. A top plate 250 is movably installed on the connecting base 220. The top plate 250 is fixedly connected to one end of the slider 251. In this embodiment, when the adjusting ring 240 moves upward and reaches the position of the adjusting plate 252, the adjusting ring 240 drives the top plate 250 to move upward by means of the slider 251 mechanism on it, until the top plate 250 and the adjusting plate 252 are in complete contact and tightly fitted. At this position, the gap between the clamping pieces 310 widens, with a minimum distance exceeding 300 mm. This ensures that the clamping blocks can be safely separated from the semiconductor wafer, avoiding any scratches or damage to the wafer. As the adjusting ring 240 moves further upward, the top plate 250 continues to rise, thereby pulling the adjusting plate 252 upward as well. The adjusting plate 252 then pushes the rubber ejector pin 254 below upward. The upward movement of the rubber ejector pin 254 smoothly lifts the semiconductor wafer, removing it from the worktable. This allows the operator to easily and quickly remove the wafer, improving production efficiency. After the lifting operation is completed, under the elastic restoring force of the return spring 253, the rubber ejector pin 254 automatically returns to its initial position, preparing for the next operation. This ensures that the entire device can be reused repeatedly, extending the equipment's lifespan.

[0025] like Figure 5 and Figure 8 As shown, a buffer device for a semiconductor wafer storage cassette includes a connecting ring 210. Both sides of the connecting ring 210 have insertion slots 211, and both sides of the lower end of the connecting ring 210 have limiting grooves 212. The insertion slots 211 and the limiting grooves 212 are perpendicularly distributed, and the two limiting grooves 212 are in opposite positions. The diameter of the connecting seat 220 is equal to the inner diameter of the connecting ring 210, and the inner diameter of the connecting ring 210 is larger than the diameter of the storage slot 201. Connecting blocks 221 are fixedly installed on both sides of the lower end of the connecting seat 220. The width of the connecting blocks 221 is equal to the width of the insertion slots 211, and the thickness of the connecting blocks 221 is equal to the width of the insertion slots 211. The width of the limiting groove 212 is equal. The connecting block 221 cooperates with the socket 211 and the limiting groove 212. A movable groove 213 is opened on one side of the upper end of the limiting groove 212. A movable block 215 is movably installed inside the movable groove 213. A locking spring 214 is fixedly installed on the upper end of the movable block 215. A locking block 216 is fixedly installed on the lower end of the movable block 215. The locking block 216 is in the shape of a right trapezoid. A control groove 217 is opened on one side of the movable groove 213. An adjusting block 218 connected to the movable block 215 passes through the control groove 217. A locking hole 222 that cooperates with the locking block 216 is opened on the upper end of the connecting block 221. In this embodiment, when multiple protective seats 200 need to be assembled into a whole, the operator can align the insertion port 211 of the connecting ring 210 of the lower protective seat 200 with the connecting block 221 of the upper protective seat 200, insert the connecting block 221 into the insertion port 211, and then rotate the protective seat 200 clockwise. The connecting block 221 slides along the limiting groove 212. Since the locking block 216 is in the shape of a right trapezoid, the connecting block 221 will squeeze the locking block 216 during the sliding process, causing it to contract upward and compress the locking spring 214. When the connecting block 221 is completely slid into the end of the limiting groove 212, the elastic potential energy of the locking spring 214 is released, pushing the movable block 215 to reset. The locking block 216 is embedded in the locking hole 222 at the upper end of the connecting block 221, realizing a stable connection between the two protective seats 200. If the protective base 200 needs to be disassembled, simply move the adjusting block 218 in the control slot 217 to drive the movable block 215 upward to compress the locking spring 214, causing the locking block 216 to disengage from the locking hole 222. Then, rotate the protective base 200 counterclockwise to remove the connecting block 221 from the insertion port 211. This connection structure is easy to operate and has high overall rigidity after connection, which can effectively prevent the protective base 200 from relative displacement during storage or transportation. Combined with the cushioning and shock absorption effect of the filling cotton 110, it further ensures the storage safety of semiconductor wafers. In addition, the size matching design of the connecting ring 210 and the connecting base 220 ensures that the gap between the protective bases 200 after assembly is uniform, avoiding damage to the wafers due to excessive local stress caused by uneven gaps. After multiple protective bases 200 are connected into a whole through this structure, they can be placed into the placement slot 111 of the storage box 100 at the same time, which greatly improves the utilization rate of the space inside the storage box 100, and also facilitates the unified management and transportation of batch wafers by the staff.

[0026] In the description of this specification, references to terms such as "an embodiment," "example," "specific example," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of the invention. In this specification, illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0027] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to the specific implementations described. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. A buffer device for a semiconductor wafer memory cell, comprising a memory cell (100), characterized in that: The storage box (100) is filled with filling cotton (110), and the filling cotton (110) has evenly spaced placement slots (111), and multiple protective seats (200) are placed inside the placement slots (111). A connecting structure is provided between the multiple protective seats (200), and a storage groove (201) is provided at the upper end of the protective seat (200). A clamping structure is provided inside the storage groove (201), and a top material structure is provided inside the protective seat (200).

2. The buffer device for a semiconductor wafer storage cassette according to claim 1, characterized in that: The clamping structure includes an adjustment groove (231), which is located inside the protective seat (200). The adjustment groove (231) is annular, and two slide rods (243) are fixedly installed on both sides inside the adjustment groove (231). A movable seat (245) is slidably installed between the two slide rods (243).

3. The buffer device for a semiconductor wafer storage cassette according to claim 2, characterized in that: A clamping spring (244) is movably sleeved on the surface of the slide rod (243). One end of the clamping spring (244) is fixedly connected to the movable seat (245), and the other end of the clamping spring (244) is fixedly connected to the inner wall of the adjustment groove (231). A clamping rod (300) is fixedly installed in the middle of one side of the movable seat (245). One end of the clamping rod (300) extends into the interior of the storage groove (201) and is fitted with a clamping piece (310). Rubber pads (311) are provided on both sides of the clamping piece (310), and the clamping piece (310) is L-shaped.

4. The buffer device for a semiconductor wafer storage cassette according to claim 3, characterized in that: The lower end of the adjustment groove (231) is provided with two movable grooves (230) on both sides. The movable grooves (230) are located below the movable seat (245). A movable block (246) is movably inserted inside the movable groove (230). The upper end of the movable block (246) is fixedly connected to the movable seat (245). The lower end of the movable block (246) extends to the outside of the protective seat (200) and is equipped with a connecting bracket (242).

5. The buffer device for a semiconductor wafer storage cassette according to claim 4, characterized in that: A connecting seat (220) is fixedly installed at the lower end of the protective seat (200). An adjusting ring (240) is movably sleeved on the outer side of the connecting seat (220). Movable connecting rods (241) are movably installed on both sides of the surface of the adjusting ring (240). One end of the movable connecting rod (241) is movably connected to the connecting frame (242). A push ring is fixedly installed at the lower end of the adjusting ring (240).

6. The buffer device for a semiconductor wafer storage cassette according to claim 5, characterized in that: The top material structure includes a perforation, and the perforation is uniformly provided with the surface of the storage groove (201). A rubber pin (254) is movably inserted inside the perforation. The upper end of the rubber pin (254) and the lower end inside the storage groove (201) are on the same horizontal line. An adjusting plate (252) is fixedly installed at the lower end of the rubber pin (254). A return spring (253) is sleeved on the surface of the rubber pin (254) and connected to the inner wall of the adjusting plate (252) and the connecting seat (220).

7. The buffer device for a semiconductor wafer storage cassette according to claim 6, characterized in that: The connecting seat (220) has grooves on both sides of its surface. A slider (251) passes through the inside of the groove. One end of the slider (251) is fixedly connected to the inner ring of the adjusting ring (240). A top plate (250) is movably mounted on the connecting seat (220). The top plate (250) is fixedly connected to one end of the slider (251).

8. The buffer device for a semiconductor wafer storage cassette according to claim 4, characterized in that: The connection structure includes a connecting ring (210), with a socket (211) on both sides of the surface of the connecting ring (210), and a limiting groove (212) on both sides of the lower end of the connecting ring (210). The socket (211) and the limiting groove (212) are vertically distributed, and the two limiting grooves (212) are in opposite positions.

9. The buffer device for a semiconductor wafer storage cassette according to claim 8, characterized in that: The diameter of the connecting seat (220) is equal to the inner diameter of the connecting ring (210). The inner diameter of the connecting ring (210) is greater than the diameter of the storage groove (201). Connecting blocks (221) are fixedly installed on both sides of the lower end of the connecting seat (220). The width of the connecting block (221) is equal to the width of the socket (211). The thickness of the connecting block (221) is equal to the width of the limiting groove (212). The connecting block (221) cooperates with the socket (211) and the limiting groove (212).

10. The buffer device for a semiconductor wafer storage cassette according to claim 9, characterized in that: A movable groove (213) is provided on one side of the upper end of the limiting groove (212). A movable block (215) is movably installed inside the movable groove (213). A locking spring (214) is fixedly installed on the upper end of the movable block (215). A locking block (216) is fixedly installed on the lower end of the movable block (215). The locking block (216) is in the shape of a right trapezoid. A control groove (217) is provided on one side of the movable groove (213). An adjusting block (218) connected to the movable block (215) passes through the inside of the control groove (217). A locking hole (222) that cooperates with the locking block (216) is provided on the upper end of the connecting block (221).

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