Printed Circuit Board

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By employing a conductive pillar structure consisting of a barrier layer, a seed layer, and a plating layer on a printed circuit board, the reliability problem caused by the microcircuit undercut phenomenon is solved, and the loss characteristics of the conductor layer and the uniformity of the conductive pillars are improved, thereby enhancing the stability of signal transmission.

CN122094014APending Publication Date: 2026-05-26SAMSUNG ELECTRO MECHANICS CO LTD

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Patent Information

Authority / Receiving Office: CN · China
Patent Type: Applications(China)
Current Assignee / Owner: SAMSUNG ELECTRO MECHANICS CO LTD
Filing Date: 2025-07-30
Publication Date: 2026-05-26

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Abstract

This disclosure provides a printed circuit board. The printed circuit board includes an insulating layer and conductive pillars disposed on the insulating layer. The conductive pillars include a barrier layer, a seed layer disposed on the barrier layer, and a plating layer disposed on the seed layer.

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