A heat dissipation device

CN122094015APending Publication Date: 2026-05-26SHANGHAI QIANSHI TECH CO LTD

Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHANGHAI QIANSHI TECH CO LTD
Filing Date
2026-02-14
Publication Date
2026-05-26

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Abstract

This application discloses a heat dissipation device, comprising: at least two liquid cooling plates, each liquid cooling plate having a working fluid channel, and each liquid cooling plate including a first end face and a second end face disposed opposite to each other, and a third end face adjacent to the first end face and the second end face; the first end face being used to attach to the component to be cooled; an inlet and an outlet, disposed on the second end face of the same liquid cooling plate; and a deformable metal tube, the two ends of which are respectively connected to the working fluid channel of the corresponding liquid cooling plate on the third end face of the different liquid cooling plates, and the inlet, the working fluid channel of the liquid cooling plate, the metal tube connecting the different liquid cooling plates, and the outlet forming a liquid cooling channel, the liquid cooling channel flowing through each liquid cooling plate, and the metal tube deforming under uneven stress. This structure can improve the heat exchange efficiency of the liquid cooling plates while enhancing the applicability of the heat dissipation device in different scenarios.
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Description

Technical Field

[0001] This application relates to the field of electronic device technology, and in particular to a heat dissipation device. Background Technology

[0002] With the development of electronic technology, components on circuit boards generate heat during operation, which can affect the performance and stability of electronic devices. Therefore, how to solve the heat dissipation problem of various components on circuit boards has received increasing attention.

[0003] In existing technologies, heat dissipation of components on circuit boards is typically achieved through methods such as air cooling and liquid cooling. However, air cooling often falls short of the heat dissipation efficiency required for high-power components, while liquid cooling usually requires auxiliary equipment such as piping systems. When components requiring heat dissipation are distributed across various areas of the circuit board and the available space for piping within the electronic device is limited, existing heat dissipation devices are poorly suited to meet actual heat dissipation needs. Therefore, improving the heat exchange efficiency of liquid cooling plates while enhancing the applicability of heat dissipation devices in different scenarios has become an urgent problem to be solved. Summary of the Invention

[0004] The main technical problem addressed by this application is to provide a heat dissipation device that can improve the heat exchange efficiency of liquid cooling plates while enhancing the applicability of the heat dissipation device in different scenarios.

[0005] To address the aforementioned technical problems, the first aspect of this application provides a heat dissipation device, comprising: at least two liquid cooling plates, an inlet, an outlet, and a deformable metal tube. The liquid cooling plates have working fluid channels within them, and each liquid cooling plate includes a first end face and a second end face disposed opposite to each other, as well as a third end face adjacent to the first and second end faces. The first end face is used to adhere to the component to be cooled. The inlet and outlet are located on the second end face of the same liquid cooling plate. Both ends of the metal tube are connected to the working fluid channels of the corresponding liquid cooling plates at their respective third end faces. The inlet, the working fluid channels of the liquid cooling plates, the metal tube connecting the different liquid cooling plates, and the outlet form a liquid cooling channel that flows through each liquid cooling plate. The metal tube deforms under uneven stress.

[0006] This design incorporates at least two liquid cooling plates, connected by deformable metal tubes that link the working fluid channels of each plate, creating a liquid cooling channel that allows fluid to flow through all the plates. This facilitates adjustments to the layout of the liquid cooling plates and metal tubes based on the specific application requirements. Furthermore, liquid cooling plates without inlets and outlets have lower space requirements within the target equipment, enhancing the applicability of the heat dissipation device in various scenarios. Additionally, since the first end face of the liquid cooling plate is used to attach to the component to be cooled, and the inlet and outlet are located on the second end face of the same plate, other liquid cooling plates without inlets and outlets... The liquid cooling plates, connected by metal tubes, allow the working fluid to flow within the channels. Without increasing the complexity of the piping system, the first end faces of at least two liquid cooling plates can be used to attach the heat-dissipating element. This helps the heat dissipation device adapt to elements of different shapes, sizes, and numbers. Furthermore, the deformation of the metal tubes under uneven stress allows for adaptation to the varying shapes, sizes, and numbers of elements attached to the heat dissipation device, or to the design tolerances of the heat dissipation device itself. Compared to a single liquid cooling plate, the larger contact area with the heat-dissipating element absorbs heat, thereby improving the heat exchange efficiency of the liquid cooling plate. Therefore, while improving the heat exchange efficiency of the liquid cooling plate, the applicability of the heat dissipation device in different scenarios is enhanced.

[0007] The liquid cooling plate includes a working fluid inlet and a working fluid outlet. The third end face of the liquid cooling plate has a first hole exposing the working fluid inlet and a second hole exposing the working fluid outlet. One end of the metal tube is connected to the first hole of the first liquid cooling plate and the other end is connected to the second hole of the second liquid cooling plate. The metal tube is sealed to the third end face of the first liquid cooling plate and the third end face of the second liquid cooling plate, respectively. The first liquid cooling plate and the second liquid cooling plate are two different liquid cooling plates.

[0008] Therefore, one end of the metal tube is connected to the first hole on the third end face of the first liquid cooling plate for exposing the working fluid inlet, and the other end is connected to the second hole on the third end face of the second liquid cooling plate for exposing the working fluid outlet. The working fluid can flow between the liquid cooling plates in the heat dissipation device through the connection of the metal tube, forming a complete liquid cooling channel. The metal tube is sealed to the third end face of the first liquid cooling plate and the third end face of the second liquid cooling plate respectively, which can prevent working fluid leakage while reducing additional connection joints.

[0009] The metal tube has flow channel fins inside, which include several independent fin units. The fin units are arranged alternately inside the metal tube. One end of the fin unit is connected to the inner wall of the metal tube, and the other end of the fin unit is not in contact with the inner wall of the metal tube.

[0010] Therefore, the flow channel fins, which are composed of fin units that are connected to the inner wall of the metal tube at one end and do not contact the inner wall of the metal tube at the other end, can improve the heat dissipation efficiency of the working fluid in the metal tube by means of fin units that are arranged alternately inside the metal tube without affecting the deformation of the metal tube itself as much as possible.

[0011] The metal tube has an internal wall with a first tube wall end face and a second tube wall end face that are arranged opposite to each other. The fin unit includes a first fin unit connected to the first tube wall end face and a second fin unit connected to the second tube wall end face. The first fin unit and the second fin unit are arranged alternately along a preset direction, which is parallel to the flow direction of the working fluid inside the metal tube.

[0012] Therefore, by setting the finned units as a first finned unit connected to the end face of the first tube wall and a second finned unit connected to the end face of the second tube wall, and by arranging the first finned unit and the second finned unit alternately in a preset direction parallel to the flow direction of the working fluid inside the metal tube, the heat exchange efficiency between the working fluid and the inner wall of the metal tube and the finned units can be further improved, and the heat dissipation effect can be enhanced.

[0013] The heat dissipation device further includes a fixing component, comprising a first fixing member and an elastic member. The first fixing member is used to fix the liquid cooling plate to the target device on which the heat dissipation device is to be installed. The elastic member is disposed between the first fixing member and the second end face along the elastic compression direction. The elastic member is used to provide elastic pressure to the liquid cooling plate after the liquid cooling plate is attached to the heat dissipation element.

[0014] Therefore, the fixing assembly composed of the first fixing member and the elastic member can fix the heat dissipation device to the target equipment, improve the maintainability of the heat dissipation device, and when the liquid cooling plate is attached to the element to be dissipated on the first end face, the elastic member can provide elastic pressure to the liquid cooling plate. In the case that the heat dissipation device is attached to the element to be dissipated, causing uneven force on the heat dissipation device as a whole, it can prevent the heat dissipation device from deforming or being damaged due to uneven force, which helps to improve the stability and practicality of the heat dissipation device.

[0015] The heat dissipation device also includes a mounting bracket and a second fixing component. The mounting bracket includes a fourth end face and a fifth end face arranged opposite to each other. The liquid cooling plate is mounted on the fourth end face through the second fixing component, and the first end face of the liquid cooling plate is farther away from the mounting bracket than the second end face. The fixing component is mounted on the fifth end face, and the elastic element is compressed and elastically connected between the first fixing component and the fifth end face. The first fixing component is used to fix the heat dissipation device to the target device.

[0016] Therefore, by setting up a mounting bracket and a second fixing component, the liquid cooling plate can be installed on the fourth end face of the mounting bracket, and the first end face being far away from the mounting bracket helps to fit the component to be cooled. The fixing component is installed on the fifth end face of the mounting bracket, providing stable support for the entire heat dissipation device. The mounting bracket is fixed to the target device by the first fixing component, which can improve the overall structural stability of the heat dissipation device, and also facilitate the installation and disassembly of the heat dissipation device, thus improving the ease of use.

[0017] The mounting bracket includes at least one mounting plate, which is used to fix at least one liquid cooling plate and to fix the heat dissipation device to the target device by means of a fixing component.

[0018] Therefore, by setting at least one mounting plate, the installation layout of the heat dissipation device in the target device can be adjusted according to the heat dissipation requirements of the actual scenario, and the stability of the heat dissipation device during operation can be improved, reducing the possibility of displacement or damage to the heat dissipation device due to vibration or external force.

[0019] The mounting plate used for fixing the inlet and outlet liquid cooling plates has a first opening. The inlet and outlet liquid cooling plates are liquid cooling plates with an outlet and an inlet. The first opening is used to expose at least the inlet and outlet.

[0020] Therefore, the mounting plate used to fix the liquid cooling plate with the liquid outlet and liquid inlet has openings, which can prevent the mounting plate from blocking the liquid inlet and liquid outlet, so that the working fluid can smoothly enter the liquid cooling channel through the liquid inlet and flow out through the liquid outlet after flowing through each liquid cooling plate. This ensures the normal operation and heat dissipation effect of the heat dissipation device. In addition, the openings on the mounting plate facilitate the connection and maintenance of the liquid inlet and liquid outlet, which can improve the maintainability of the heat dissipation device.

[0021] The mounting bracket includes mounting plates that are fixedly connected to each liquid cooling plate, and each mounting plate has a first opening.

[0022] Therefore, when the mounting bracket adopts a design that fixes the mounting plates to each liquid cooling plate separately, it helps to use standardized production mounting plates in the mounting bracket. With the heat dissipation device operating normally through the first opening, a corresponding number of standardized mounting plates can be used according to actual needs to adapt to the heat dissipation requirements of different scenarios and improve the versatility and practicality of the heat dissipation device.

[0023] The liquid cooling plate is provided with a fixing part that matches the fixing component, and the fixing part is used to connect the fixing component.

[0024] Therefore, by setting a fixing part on the liquid cooling plate that matches the fixing component, the liquid cooling plate can be fixedly installed in the target equipment based on the fixing component, reducing assembly complexity. Attached Figure Description

[0025] Figure 1 This is a top view of an embodiment of the heat dissipation device of this application; Figure 2 This is a bottom view of an embodiment of the heat dissipation device of this application; Figure 3 This is a top view of another embodiment of the heat dissipation device of this application; Figure 4 This is a top view of yet another embodiment of the heat dissipation device of this application; Figure 5 This is a cross-sectional view of an embodiment of the heat dissipation device of this application; Figure 6 This is a side view of an embodiment of the metal pipe in the heat dissipation device of this application; Figure 7 This is a side view of another embodiment of the metal pipe in the heat dissipation device of this application; Figure 8 This is a top view of another embodiment of the heat dissipation device of this application; Figure 9 This is a schematic diagram of a structural embodiment of the heat dissipation device mounting bracket of this application. Detailed Implementation

[0026] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0027] Please refer to the following: Figure 1 and Figure 2 , Figure 1 This is a top view of an embodiment of the heat dissipation device 10 of this application. Figure 2 This is a bottom view of an embodiment of the heat dissipation device 10 of this application. Figure 1 and Figure 2As shown, the heat dissipation device 10 includes: at least two liquid cooling plates 11, a liquid inlet 12, a liquid outlet 13, and a deformable metal tube 14. The liquid cooling plates 11 are provided with working fluid channels, and the liquid cooling plates 11 include a first end face D1 and a second end face D2 arranged opposite to each other, and a third end face D3 adjacent to the first end face D1 and the second end face D2. The first end face D1 is used to attach to the component to be cooled (not shown). The liquid inlet 12 and the liquid outlet 13 are located on the second end face D2 of the same liquid cooling plate 11. The two ends of the deformable metal tube 14 are respectively connected to the working fluid channels of the corresponding liquid cooling plates 11 on the third end face D3 of different liquid cooling plates 11. The liquid inlet 12, the working fluid channels of the liquid cooling plates 11, the metal tube 14 connected between different liquid cooling plates 11, and the liquid outlet 13 form a liquid cooling channel. The liquid cooling channel flows through each liquid cooling plate 11, and the metal tube 14 deforms under uneven stress. The above structure, by setting at least two liquid cooling plates 11 and using deformable metal tubes 14 to connect the working fluid channels of different liquid cooling plates 11, forms a liquid cooling channel that can flow through each liquid cooling plate 11. This helps the heat dissipation device 10 to adjust the layout of the liquid cooling plates 11 and metal tubes 14 according to the heat dissipation requirements in the actual application scenario. Moreover, the liquid cooling plates 11 without inlet 12 and outlet 13 have relatively lower requirements for the available space in the target equipment, thereby improving the applicability of the heat dissipation device 10 in different scenarios. At the same time, since the first end face D1 of the liquid cooling plate 11 is used to attach to the component to be cooled, and the inlet 12 and outlet 13 are located on the second end face D2 of the same liquid cooling plate 11, other liquid cooling plates 11 without inlet 12 and outlet 13 are not required to attach to the component to be cooled. The liquid cooling plates 11 at outlet 13 and outlet 2 can be connected to the working fluid via metal pipe 14, allowing the working fluid to flow within the working fluid channel. This allows for the bonding of the heat dissipation element to the first end face D1 of at least two liquid cooling plates 11 without increasing the complexity of the piping system. This helps the heat dissipation device 10 adapt to heat dissipation elements of different shapes, sizes, and numbers. Furthermore, the deformation of the metal pipe 14 under uneven stress allows for adaptation to heat dissipation elements of different shapes, sizes, and numbers bonded within the heat dissipation device 10, or to the design tolerances of the heat dissipation device 10 itself. The larger bonding area with the heat dissipation element compared to a single liquid cooling plate 11 absorbs heat from the heat dissipation element, thereby improving the heat exchange efficiency of the liquid cooling plates 11. Therefore, while improving the heat exchange efficiency of the liquid cooling plates 11, the applicability of the heat dissipation device 10 in different scenarios can be enhanced.

[0028] It should be noted that the type of component to be cooled is not limited in this application, such as electronic components like chips and chip modules.

[0029] In one implementation scenario, the liquid cooling plate 11 has a working fluid flow channel. The heat generated by the component to be cooled is carried away by the flow of the working fluid (such as coolant) in the working fluid flow channel. Specifically, the design of the working fluid flow channel can be optimized according to the actual heat dissipation requirements. For example, a tortuous flow channel or a flow channel structure with densely packed heat dissipation teeth can be used to increase the heat exchange area and improve the heat dissipation efficiency. The specific type of working fluid is not limited in this application.

[0030] Please refer to the following: Figure 1 , Figure 1 The dashed lines in the diagram represent the flow direction of the working fluid in the liquid cooling channel formed by the inlet 12, the working fluid flow channel of the liquid cooling plate 11, the metal pipe 14 connecting different liquid cooling plates 11, and the outlet 13. Specifically, the working fluid flows in from the inlet 12, flows along the working fluid flow channel in the liquid cooling plate 11, is transferred between different liquid cooling plates 11 through the metal pipe 14, and finally flows out from the outlet 13, forming a complete working fluid flow path.

[0031] In a specific implementation scenario, the liquid cooling plate 11 is made of materials such as copper or aluminum alloy.

[0032] In a specific implementation scenario, the liquid cooling plates 11 in the heat dissipation device 10 are made of the same material, such as copper liquid cooling plates or aluminum alloy liquid cooling plates, etc. This application does not limit them. The specifications of the liquid cooling plates 11 in the heat dissipation device 10 can be the same or different. For example, some liquid cooling plates 11 adopt larger sizes to enhance heat dissipation capacity, and some liquid cooling plates 11 adopt smaller sizes to adapt to compact space layout.

[0033] In one implementation scenario, the liquid inlet 12 of the heat dissipation device 10 is used to introduce the working fluid into the working fluid flow channel in the liquid cooling plate 11 provided with the liquid inlet 12. Specifically, the working fluid flow channel in the liquid cooling plate 11 includes a working fluid inlet end and a working fluid outlet end, and the liquid inlet 12 is connected to the working fluid inlet end of the working fluid flow channel in the liquid cooling plate 11.

[0034] Please see Figure 3 , Figure 3 This is a top view of another embodiment of the heat dissipation device 10 of this application. (See attached image.) Figure 3 As shown, the liquid inlet 12 includes a liquid inlet connector that is connected to the working fluid inlet pipe 21.

[0035] In a specific implementation scenario, the liquid cooling plate 11 with a liquid inlet 12 has a hole for the liquid inlet end that connects the liquid inlet 12 and the working fluid flow channel. The diameter of the channel can be set according to the actual heat dissipation requirements. The liquid inlet connector and the hole can be fixed at the hole by means of threaded connection, interference fit, etc., to ensure that the working fluid can flow into the working fluid flow channel from the liquid inlet connector.

[0036] In one implementation scenario, the liquid outlet 13 in the heat dissipation device 10 is used to draw the working fluid, after heat exchange, out from the working fluid flow channel within the liquid cooling plate 11, which is provided with the liquid outlet 13. Specifically, the liquid outlet 13 is connected to the working fluid outlet end of the working fluid flow channel within the liquid cooling plate 11.

[0037] In a specific implementation scenario, the liquid outlet 13 includes a liquid outlet connector connected to the working fluid outlet pipe 22.

[0038] In a specific implementation scenario, the liquid cooling plate 11 with a liquid outlet 13 has a hole for the liquid outlet end of the working fluid that connects the liquid outlet 13 and the working fluid flow channel. The diameter of the hole is set according to the actual heat dissipation requirements. The liquid outlet connector and the channel can be fixed by means of threaded connection, interference fit, etc., to ensure that the working fluid can flow out from the working fluid flow channel through the liquid outlet connector.

[0039] In one implementation scenario, the metal tube 14 is a hollow tubular structure, and its inner diameter, length and shape can be set according to the specific requirements of the heat dissipation device 10. The metal tube 14 can be a round tube, a square tube, a bent tube, etc., to ensure that the working fluid can flow between different liquid cooling plates 11.

[0040] In a specific implementation scenario, the metal tube 14 deforms under uneven stress. Specifically, when subjected to stress, such as uneven stress caused by the heat dissipation device 10 fitting with components of different shapes and sizes or its own design tolerances, the metal tube 14 can undergo elastic or plastic deformation to adapt to this change, avoiding damage due to stress concentration and ensuring the unobstructed flow of the liquid cooling channel. Specifically, the metal tube 14 can use a wall thickness within a preset range to achieve appropriate deformation under stress. For example, when the metal tube is made of copper or aluminum alloy, its wall thickness can be set within the range of 0.5mm to 2mm. This ensures both the strength of the metal tube 14 and allows it to deform under uneven stress, thus adapting to the needs of the heat dissipation device 10 in different application scenarios. This structure not only improves the reliability and durability of the heat dissipation device 10 but also allows it to be applied more flexibly in various complex environments.

[0041] In a specific implementation scenario, when several liquid cooling plates 11 in the heat dissipation device 10 press against components of different heights, for example, when two liquid cooling plates 11 in the heat dissipation device 10 press against two chips of different heights respectively, the height requirements can be met by the deformation of the metal tube 14.

[0042] In a specific implementation scenario, when the actual production of relevant components in the heat dissipation device 10 has small tolerances, the assembly requirements of several liquid cooling plates can be met by the deformation generated by the metal tube 14.

[0043] In a specific implementation scenario, the material of the metal tube 14 is the same as that of the liquid cooling plate 11. For example, if the liquid cooling plate 11 is a copper cooling plate, then the metal tube 14 is a hollow copper tube; if the liquid cooling plate 11 is an aluminum alloy cooling plate, then the metal tube 14 is a hollow aluminum alloy tube.

[0044] Please refer to the following: Figure 1 and Figure 3 ,like Figure 1 and Figure 3 As shown, in different implementation scenarios, the length of the metal tube 14 can be adjusted according to the layout of the liquid cooling plate 11 in the heat dissipation device 10 and the heat dissipation requirements. For example, when it is necessary to cover a large heat dissipation area or when the distance between multiple heat dissipation components is far, a longer metal tube 14 can be used; while when it is only necessary to heat a single high-power heat dissipation component or when the distance between multiple heat dissipation components is short, a shorter metal tube 14 can be selected.

[0045] In one implementation scenario, the working fluid flow channel inside the liquid cooling plate 11 includes a working fluid inlet end and a working fluid outlet end. The third end face D3 of the liquid cooling plate 11 has a first hole (not shown) exposing the working fluid inlet end and a second hole (not shown) exposing the working fluid outlet end. One end of the metal tube 14 is connected to the first hole of the first liquid cooling plate and the other end is connected to the second hole of the second liquid cooling plate. The metal tube 14 is sealed to the third end face D3 of the first liquid cooling plate and the third end face D3 of the second liquid cooling plate, respectively. The first liquid cooling plate and the second liquid cooling plate are two different liquid cooling plates 11. In the above structure, one end of the metal tube 14 is connected to the first hole opened on the third end face D3 of the first liquid cooling plate to expose the working fluid inlet end, and the other end is connected to the second hole opened on the third end face D3 of the second liquid cooling plate to expose the working fluid outlet end. The working fluid can flow between the liquid cooling plates 11 in the heat dissipation device 10 through the connection of the metal tube 14, forming a complete liquid cooling channel. The metal tube 14 is sealed to the third end face D3 of the first liquid cooling plate and the third end face D3 of the second liquid cooling plate respectively to prevent working fluid leakage.

[0046] It should be noted that the first liquid cooling plate and the second liquid cooling plate are used to distinguish different liquid cooling plates 11, and do not limit the number or position of the liquid cooling plates 11. The heat dissipation device 10 may contain more than two liquid cooling plates 11, and each liquid cooling plate 11 is connected to the others in sequence through a metal pipe 14.

[0047] In a specific implementation scenario, when the heat dissipation device 10 includes at least three liquid cooling plates 11, based on a series path, the working fluid outlet end of the third end face D3 of the first liquid cooling plate 11 is connected to the working fluid inlet end of the second liquid cooling plate 11 through a metal pipe 14. The working fluid outlet end of the second liquid cooling plate 11 is then connected to the working fluid inlet end of the third liquid cooling plate 11 through another metal pipe 14, and so on, until the working fluid outlet end of the last liquid cooling plate 11 is connected to the working fluid inlet end of the third end face D3 of the first liquid cooling plate 11 through a metal pipe 14, forming a series liquid cooling channel.

[0048] In a specific implementation scenario, the connection between the metal tube 14 and the liquid cooling plate 11 is sealed, such as by welding or using a sealing ring, to prevent the working fluid from leaking and to ensure the stable operation of the heat dissipation device 10.

[0049] In a specific implementation scenario, the outer surface of the metal pipe 14 can also be treated with anti-corrosion measures, such as galvanizing or spraying anti-corrosion paint, to prevent the metal pipe 14 from corroding and further extend the service life of the heat dissipation device 10.

[0050] Please see Figure 4 , Figure 4 This is a top view of yet another embodiment of the heat dissipation device 10 of this application. (See attached image.) Figure 4 As shown, the heat dissipation device 10 has heat dissipation fins 15 on the second end face D2 of at least one liquid cooling plate 11 that does not have a liquid inlet 12 and a liquid outlet 13. Specifically, the heat dissipation fins 15 are usually made of metal, such as aluminum or copper, which have good thermal conductivity. Their shape can be sheet-like, needle-like, or columnar, etc., to increase the heat dissipation area and improve the heat dissipation efficiency. The above structure, by providing heat dissipation fins 15 on the second end face D2 of at least one liquid cooling plate 11 that does not have a liquid inlet 12 and a liquid outlet 13, can increase the heat dissipation area, accelerate airflow, and thus more effectively dissipate the heat in the heat dissipation device 10, further enhancing the heat dissipation effect of the heat dissipation device 10.

[0051] In a specific implementation scenario, the heat dissipation fins 15 are fixed to the second end face D2 of the liquid cooling plate 11 by means of machining, die casting, welding, riveting, or fastener connection, ensuring thermal contact with the liquid cooling plate 11, thereby effectively transferring heat from the liquid cooling plate 11 to the surrounding environment. Furthermore, the layout and density of the heat dissipation fins 15 can be adjusted according to actual heat dissipation requirements. For example, the number or density of heat dissipation fins 15 can be increased in areas with higher heat dissipation requirements to further improve the heat dissipation effect.

[0052] Please see Figure 5 , Figure 5 This is a cross-sectional view of an embodiment of the heat dissipation device 10 of this application. Figure 5As shown, the metal tube 14 has flow channel fins 141 inside. The flow channel fins 141 include several independent fin units 1411, which are staggered inside the metal tube 14. One end of each fin unit 1411 is connected to the inner wall of the metal tube 14, while the other end is not in contact with the inner wall of the metal tube 14. This structure, based on the flow channel fins 141 formed by the fin units 1411, one end of which is connected to the inner wall of the metal tube 14 and the other end of which is not in contact with the inner wall of the metal tube 14, can improve the heat dissipation efficiency of the working fluid inside the metal tube 14 by means of the staggered fin units 1411, without significantly affecting the deformation of the metal tube 14 itself.

[0053] In a specific implementation scenario, the shape, size, and quantity of the fin unit 1411 can be set according to the actual heat dissipation requirements. For example, the fin unit 1411 can be cylindrical, thin-plate, or other shapes, and the flow channel fin 141 can contain several different types of fin units 1411. In addition, the arrangement of the fin units 1411 can be staggered, such as spiral arrangement or matrix arrangement, and is not limited in this application.

[0054] Please see Figure 6 , Figure 6 This is a side view of an embodiment of the metal pipe 14 in the heat dissipation device 10 of this application. Figure 6 As shown, the inner wall of the metal tube 14 includes a first tube wall end face G1 and a second tube wall end face G2 disposed opposite to each other. The finned unit 1411 includes a first finned unit 1412 connected to the first tube wall end face G1 and a second finned unit 1413 connected to the second tube wall end face G2. The first finned unit 1412 and the second finned unit 1413 are staggered along a preset direction, which is parallel to the flow direction of the working fluid inside the metal tube 14. This structure, by setting the finned unit 1411 as a first finned unit 1412 connected to the first tube wall end face G1 and a second finned unit 1413 connected to the second tube wall end face G2, and staggering the first finned unit 1412 and the second finned unit 1413 along a preset direction parallel to the flow direction of the working fluid inside the metal tube 14, can further improve the heat exchange efficiency between the working fluid and the inner wall of the metal tube 14 and the finned unit 1411, thus enhancing the heat dissipation effect.

[0055] Please see Figure 7 , Figure 7 This is a side view of another embodiment of the metal pipe 14 in the heat dissipation device 10 of this application. (See attached image.) Figure 7As shown, as another possible implementation, the fin units 1411 in the metal tube 14 are all connected to the same tube wall end face of the metal tube 14, for example, they are all connected to the first tube wall end face G1, and a certain distance is maintained between adjacent fin units 1411 to form a flow channel gap extending along the axial direction of the metal tube 14.

[0056] In a specific implementation scenario, the finned units 1411 are arranged uniformly inside the metal tube 14, or they can be arranged non-uniformly, which is not limited in this application.

[0057] In a specific implementation scenario, the end face of the metal tube 14 can be either a flat surface or an arc surface, and this application does not impose any restrictions on it.

[0058] It should be noted that the arrangement of the flow channel fins 141 inside the metal tube 14 is only a possible implementation and does not limit the structure of the metal tube 14.

[0059] Please refer to the following: Figure 8 , Figure 8 This is a top view of yet another embodiment of the heat dissipation device 10 of this application. (See attached image.) Figure 8 As shown, the heat dissipation device 10 also includes a fixing component 16. Specifically, the fixing component 16 includes a first fixing member 161 and an elastic member 162. The first fixing member 161 is used to fix the liquid cooling plate 11 to the target device (not shown) to which the heat dissipation device 10 is to be installed. The elastic member 162 is disposed between the first fixing member 161 and the second end face D2 along the elastic compression direction. The elastic member 162 is used to provide elastic pressure to the liquid cooling plate 11 after the liquid cooling plate 11 is attached to the heat dissipation component. The above structure, based on the fixing assembly 16 composed of the first fixing member 161 and the elastic member 162, can fix the heat dissipation device 10 to the target device, improve the maintainability of the heat dissipation device 10, and when the liquid cooling plate 11 is attached to the first end face D1 of the liquid cooling plate 11 to be cooled, the elastic member 162 provides elastic pressure to the liquid cooling plate 11. In the case that the heat dissipation device 10 is attached to the component to be cooled, causing uneven force on the heat dissipation device 10, it can prevent the heat dissipation device 10 from deforming or being damaged due to uneven force, which helps to improve the stability and practicality of the heat dissipation device 10.

[0060] In one implementation scenario, the first fastener 161 is specifically a fastener such as a bolt or screw. Specifically, when the first fastener 161 is a bolt, its mounting part is provided with a threaded structure for engaging with the threaded hole on the target device to achieve a stable installation of the liquid cooling plate 11.

[0061] In one implementation scenario, the elastic element 162 is specifically made of an elastic material such as a spring or elastic rubber. One end of it is fixedly connected to the first fixing element 161, and the other end is connected to the liquid cooling plate 11. Specifically, the elastic element 162 and the liquid cooling plate 11 can be directly connected or indirectly connected. When the first end face D1 of the liquid cooling plate 11 is in contact with the component to be cooled, the elastic element 162 is compressed, generating elastic force, providing stable elastic pressure to the liquid cooling plate 11.

[0062] In a specific implementation scenario, the elastic element 162 is specifically a spring, a leaf spring, etc. Specifically, in the implementation scenario where the elastic element 162 is specifically a spring, the spring is arranged around the first fixing element 161 and the second end face D2.

[0063] In a specific implementation scenario, different liquid cooling plates 11 of the heat dissipation device 10 are used to bond with different heat dissipation components. Since different heat dissipation components have different clamping pressure requirements with the heat dissipation device 10, when the heat dissipation device 10 bonds with different heat dissipation components, elastic elements 162 with different elastic coefficients are set according to the different clamping force requirements of the heat dissipation components. This provides appropriate elastic pressure to each liquid cooling plate 11, avoiding the use of the same elastic element 162 design for heat dissipation components with different clamping requirements, which would result in insufficient clamping force and thus inability to meet heat dissipation requirements. This ensures the stable operation of the heat dissipation device 10 under complex working conditions. For example, when the clamping pressure requirement of a heat dissipation component bonded to a certain liquid cooling plate 11 is high, the elastic element 162 at the corresponding position is set to have a relatively high elastic coefficient to absorb excessive pressure through elastic deformation. Conversely, when the clamping pressure requirement of a heat dissipation component bonded to a certain liquid cooling plate 11 is low, the elastic element 162 at the corresponding position is set to have a relatively low elastic coefficient to maintain overall force balance. The above structure can simultaneously adapt to the heat dissipation needs of multiple heat dissipation components with different fastening pressure requirements, thereby improving the reliability of equipment operation while ensuring heat dissipation efficiency.

[0064] In a specific implementation scenario, the fixing component 16 includes several sets of first fixing members 161 and elastic members 162. Each set of first fixing members 161 and elastic members 162 can be respectively set at corresponding positions of different liquid cooling plates 11 to form a multi-point support structure. In addition, multiple sets of fixing components 16 independently undertake the support task of the corresponding liquid cooling plates 11, and absorb the pressure differences caused by the contact of different liquid cooling plates 11 with the components to be cooled through the elastic deformation of the elastic members 162. For example, fixing components 16 are respectively set at the four corners of a single liquid cooling plate 11, which not only ensures the overall structural stability, but also avoids stress concentration at the connection of the metal tube 14 due to uneven local stress. The above structure can be applied to scenarios that need to cool multiple electronic components of different weights at the same time, and can effectively extend the service life of the heat dissipation device 10.

[0065] It should be noted that the specific type of the target device to be installed with the heat dissipation device 10 is not limited in this application, such as a host, server chassis or industrial control cabinet, etc.

[0066] Please refer to the following: Figure 8 ,like Figure 8 As shown, the heat dissipation device 10 further includes: a mounting bracket 17 and a second fixing member 18. The mounting bracket 17 includes a fourth end face D4 and a fifth end face D5 disposed opposite to each other. The liquid cooling plate 11 is mounted on the fourth end face D4 through the second fixing member 18, and the first end face D1 of the liquid cooling plate 11 is farther away from the mounting bracket 17 than the second end face D2. The fixing component 16 is mounted on the fifth end face D5, and the elastic member 162 is compressed and elastically connected between the first fixing member 161 and the fifth end face D5. The first fixing member 161 is used to fix the heat dissipation device 10 to the target device. The above structure, by setting the mounting bracket 17 and the second fixing member 18, allows the liquid cooling plate 11 to be installed on the fourth end face D4 of the mounting bracket 17, and the first end face D1 being far away from the mounting bracket 17 helps to fit the component to be cooled. The fixing component 16 is installed on the fifth end face D5 of the mounting bracket 17, providing a stable support for the entire heat dissipation device 10. The mounting bracket 17 is fixed to the target device by the first fixing member 161, which can improve the overall structural stability of the heat dissipation device 10, and also facilitate the installation and disassembly of the heat dissipation device 10, thus improving the convenience of use.

[0067] In a specific implementation scenario, the second fastener 18 can be connected by bolts, screws or clips to fix the liquid cooling plate 11 to the fourth end face D4 of the mounting bracket 17.

[0068] In a specific implementation scenario, the material of the mounting bracket 17 can be different from that of the liquid cooling plate 11. For example, the mounting bracket 17 can be made of a material that is cheaper than the liquid cooling plate 11, such as stainless steel or engineering plastics, which reduces manufacturing costs while ensuring structural strength and simplifies the installation of the heat dissipation device 10. The shape of the mounting bracket 17 can be customized according to the installation space of the target equipment, such as using an L-shaped, U-shaped, or frame structure to adapt to the internal layout of equipment with different shapes.

[0069] In a specific implementation scenario, the fourth end face D4 of the mounting bracket 17 is provided with a positioning boss or groove, which cooperates with the corresponding structure on the liquid cooling plate 11 to achieve assembly positioning and prevent displacement during installation; the fifth end face D5 is provided with a reinforcing rib or hollow design, which improves the structural rigidity while reducing the overall weight.

[0070] In a specific implementation scenario, the mounting bracket 17 includes at least one mounting plate 171, which is used to fix at least one liquid cooling plate 11 and to fix the heat dissipation device 10 to the target device via the fixing assembly 16. This structure, by providing at least one mounting plate 171, allows for adjustment of the installation layout of the heat dissipation device 10 in the target device according to the actual heat dissipation requirements of the scenario, improves the stability of the heat dissipation device 10 during operation, and reduces the possibility of displacement or damage to the heat dissipation device 10 due to vibration or external forces.

[0071] In a specific implementation scenario, the mounting plate 171, used to fixably connect the liquid cooling plate 11 with the liquid outlet 13 and the liquid inlet 12, has a first opening K1. The first opening K1 is used to expose at least the liquid inlet 12 and the liquid outlet 13. With the above structure, the mounting plate 171, with the first opening K1, prevents the mounting plate 171 from obstructing the liquid inlet 12 and the liquid outlet 13, allowing the working fluid to smoothly enter the liquid cooling channel through the liquid inlet 12 and flow out through the liquid outlet 13 after passing through each of the liquid cooling plates 11. This ensures the normal operation and heat dissipation effect of the heat dissipation device 10. Furthermore, the first opening K1 on the mounting plate 171 facilitates connection and maintenance of the liquid inlet 12 and the liquid outlet 13, improving the maintainability of the heat dissipation device 10.

[0072] Please see Figure 9 , Figure 9 This is a schematic diagram of the structure of an embodiment of the heat dissipation device 10 mounting bracket 17 of this application. Figure 9 As shown, the mounting bracket 17 includes a mounting plate 171. The mounting plate 171 has a first opening K1 for exposing the liquid cooling plate 11 with the liquid outlet 13 and the liquid inlet 12. The mounting plate 171 does not have any other openings.

[0073] In another specific implementation scenario, the mounting plate 171 also has a second opening (not shown), which is used to expose the liquid cooling plate 11 that does not have an outlet or inlet. Specifically, the second opening can expose the second end face D2 of the liquid cooling plate 11. In the above structure, when the mounting bracket 17 includes only one mounting plate 171, the mounting plate 171 not only has an inlet 12 and an outlet 13 for exposing the liquid cooling port 12 and the outlet 13, but also has a second opening for exposing the second end face D2 of the liquid cooling plate 11 that does not have an outlet 12 and an inlet 13, thereby improving the maintainability of the heat dissipation device 10.

[0074] In a specific implementation scenario, the shape and size of the first opening K1 and the second opening on the mounting plate 171 used to expose the liquid inlet 12 and the liquid outlet 13 can be the same or different, and can be set according to actual needs. For example, different shapes such as round, square or rectangular can be used to adapt to the installation requirements of liquid cooling plates 11 of different specifications.

[0075] In a specific implementation scenario, the edge of the first opening K1 can be provided with a flange or a reinforcing rib structure to ensure smooth flow of the working fluid while improving the overall strength of the mounting plate 171 and preventing structural weakening caused by the first opening K1.

[0076] Please refer to the following: Figure 8 ,like Figure 8 As shown, the mounting bracket 17 includes mounting plates 171 that are respectively fixedly connected to each liquid cooling plate 11, and each mounting plate 171 has a first opening K1. With this structure, when the mounting bracket 17 is designed with mounting plates 171 that are respectively fixedly connected to each liquid cooling plate 11, it facilitates the use of standardized mounting plates 171 in the mounting bracket 17. While ensuring the normal operation of the heat dissipation device 10 through the first opening K1, a corresponding number of standardized mounting plates can be used according to actual needs to adapt to the heat dissipation requirements of different scenarios, thereby improving the versatility and practicality of the heat dissipation device 10.

[0077] In a specific implementation scenario, the mounting plates 171 fixedly connected to each liquid cooling plate 11 are of the same specification. This standardized design simplifies the production process and reduces manufacturing costs, while also facilitating quick replacement of damaged components during later maintenance. For example, if a mounting plate 171 deforms due to long-term use, it can be directly replaced with a spare plate of the same specification, eliminating the need for custom-made special dimensions. Furthermore, increasing the number of mounting plates 171 expands the coverage of the heat dissipation system, meeting the heat dissipation requirements of new equipment.

[0078] In a specific implementation scenario, the mounting bracket 17 includes several mounting plates 171, and the specifications of each mounting plate 171 are not entirely the same. For example, the mounting bracket 17 may include a mounting plate 171 used only for fixing and connecting one liquid cooling plate 11 and a mounting plate 171 used for fixing and connecting multiple liquid cooling plates 11, and the specifications and dimensions of the mounting plates 171 used for fixing and connecting multiple liquid cooling plates 11 are also not entirely the same. This structure, by using a combination of mounting plates 171 of different specifications, can flexibly adapt to liquid cooling plates 11 of different sizes and quantities, meeting the heat dissipation requirements of complex equipment layouts.

[0079] In another specific implementation scenario, the mounting bracket 17 includes mounting plates 171 that are fixedly connected to each liquid cooling plate 11. The mounting plate 171 connected to the liquid cooling plate 11 with liquid outlet 12 and liquid inlet 13 has a first opening K1, while the mounting plate 171 connected to the liquid cooling plate 11 without liquid outlet 12 and liquid inlet 13 does not have an opening.

[0080] In one implementation scenario, without the mounting bracket 17, the liquid cooling plate 11 has a fixing part (not shown) that matches the fixing component 16. One end of the fixing component 16 is connected to the liquid cooling plate 11, and the other end is connected to the target device to fix the heat dissipation device 10 to the target device. With the above structure, the liquid cooling plate 11 has a fixing part that matches the fixing component 16, enabling the liquid cooling plate 11 to be fixedly installed in the target device based on the fixing component 16.

[0081] The above description is merely an embodiment of this application and does not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A heat dissipation device, characterized in that, include: At least two liquid cooling plates, each liquid cooling plate having a working fluid flow channel, and each liquid cooling plate having a first end face and a second end face disposed opposite to each other, and a third end face adjacent to the first end face and the second end face, wherein the first end face is used to attach to the component to be cooled. The liquid inlet and liquid outlet are located on the second end face of the same liquid cooling plate; A deformable metal tube has its two ends connected to the working fluid channels of the corresponding liquid cooling plates at the third end faces of the different liquid cooling plates. The inlet, the working fluid channels of the liquid cooling plates, the metal tube connecting the different liquid cooling plates, and the outlet form a liquid cooling channel. The liquid cooling channel flows through each of the liquid cooling plates, and the metal tube deforms under uneven stress.

2. The heat dissipation device according to claim 1, characterized in that, The working fluid flow channel within the liquid cooling plate includes a working fluid inlet end and a working fluid outlet end. The third end face of the liquid cooling plate has a first hole exposing the working fluid inlet end and a second hole exposing the working fluid outlet end. One end of the metal tube is connected to the first hole of the first liquid cooling plate and the other end is connected to the second hole of the second liquid cooling plate. The metal tube is sealed to the third end face of the first liquid cooling plate and the third end face of the second liquid cooling plate, respectively. The first liquid cooling plate and the second liquid cooling plate are two different liquid cooling plates.

3. The heat dissipation device according to claim 1, characterized in that, The metal tube is provided with flow channel fins, which include several independent fin units. The fin units are arranged alternately inside the metal tube. One end of each fin unit is connected to the inner wall of the metal tube, and the other end of each fin unit is not in contact with the inner wall of the metal tube.

4. The heat dissipation device according to claim 3, characterized in that, The inner wall of the metal tube includes a first tube wall end face and a second tube wall end face that are arranged opposite to each other. The fin unit includes a first fin unit connected to the first tube wall end face and a second fin unit connected to the second tube wall end face. The first fin unit and the second fin unit are arranged alternately along a preset direction, which is parallel to the flow direction of the working fluid inside the metal tube.

5. The heat dissipation device according to claim 1, characterized in that, The heat dissipation device also includes: The fixing component includes a first fixing member and an elastic member. The first fixing member is used to fix the liquid cooling plate to the target device on which the heat dissipation device is to be installed. The elastic member is disposed between the first fixing member and the second end face along the elastic compression direction. The elastic member is used to provide elastic pressure to the liquid cooling plate after the liquid cooling plate is attached to the heat dissipation element.

6. The heat dissipation device according to claim 5, characterized in that, The heat dissipation device also includes: The mounting bracket includes a fourth end face and a fifth end face arranged opposite to each other. The liquid cooling plate is mounted on the fourth end face by the second fastener. The first end face of the liquid cooling plate is farther away from the mounting bracket than the second end face. The fixing component is mounted on the fifth end face. The elastic element is compressed and elastically connected between the first fastener and the fifth end face. The first fastener is used to fix the heat dissipation device to the target device.

7. The heat dissipation device according to claim 6, characterized in that, The mounting bracket includes at least one mounting plate for fixing at least one of the liquid cooling plates and for fixing the heat dissipation device to the target device by means of the fixing assembly.

8. The heat dissipation device according to claim 5, characterized in that, The mounting plate for fixing the inlet and outlet liquid cooling plates has a first opening. The inlet and outlet liquid cooling plates are liquid cooling plates with the outlet and the inlet. The first opening is used to expose at least the inlet and the outlet.

9. The heat dissipation device according to claim 8, characterized in that, The mounting bracket includes mounting plates that are fixedly connected to each of the liquid cooling plates, and each of the mounting plates has the first opening.

10. The heat dissipation device according to claim 5, characterized in that, The liquid cooling plate is provided with a fixing part that matches the fixing component, and the fixing part is used to connect the fixing component.