Thermal management for circuit components
By using heat-conducting components and heat dissipation structures to form a thermal path on the bottom surface of the circuit board and repeatedly connecting it to the cooling device, the problem of low cooling efficiency of high-power computing components on the bottom surface of the circuit board is solved, achieving efficient cooling and space saving.
CN122094058APending Publication Date: 2026-05-26MELLANOX TECHNOLOGIES LTD(IL)
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Patent Information
- Application Number
- CN202511754843.5
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Priority Date
- 2024-11-26
- Filing Date
- 2025-11-26
- Publication Date
- 2026-05-26
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Figure CN122094058A_ABST
Abstract
This disclosure relates to thermal management for circuit components. A system includes one or more computing units disposed on a first side of a circuit board within a server chassis. The system also includes a cooling device at least partially disposed on a second side of the circuit board opposite the first side. The system further includes a thermally conductive component configured to transfer heat from a first computing unit among the one or more computing units to the cooling device. The thermally conductive component includes a body coupled to the one or more computing units. The body is generally parallel to the circuit board. The thermally conductive component also includes a heat dissipation structure extending from the body. The heat dissipation structure extends from the first side of the circuit board to the second side of the circuit board and is coupled to the cooling device.
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