A chip soldering method

Abstract

This application discloses a chip soldering method, comprising: providing a metal frame and a chip to be soldered; selecting a solder wire of a preset diameter, and using a soldering tip with a wire diameter corresponding to the preset diameter to clamp the solder wire; melting the solder wire to form solder and coating it onto the chip pad area of ​​the metal frame, and measuring the solder thickness at multiple measurement points on the chip pad area, and calculating the average thickness and thickness uniformity parameters; when the average thickness and the thickness uniformity parameters are both within a preset range, heating the chip pad area to a preset temperature; and mounting and soldering the chip to be soldered onto the chip pad area. According to the chip soldering method of this application, the probability of chip failure can be significantly reduced.

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