Coaxial line assembly for semiconductor package
By introducing coaxial cable components into the semiconductor package, including a center bonding line, a dielectric layer, and a grounding material layer, the reliability of the bonding line and signal crosstalk issues are resolved, thereby improving the reliability and high-speed performance of the package.
CN122094545APending Publication Date: 2026-05-26SANDISK TECHNOLOGIES LLC
View PDF 0 Cites 0 Cited by
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- SANDISK TECHNOLOGIES LLC
- Filing Date
- 2025-04-15
- Publication Date
- 2026-05-26
Smart Images
Figure CN122094545A_ABST
Abstract
The semiconductor package includes: a substrate; a contact pad which is formed on the substrate; and a ground pad formed on the substrate, adjacent to the contact pad. The semiconductor package also includes a die mounted on the substrate adjacent to the contact pad. The die includes a top surface and a die contact pad, the die contact pad being formed on the top surface. In addition, the semiconductor package includes a coaxial line assembly extending between the contact pad and the die contact pad of the die. The coaxial line assembly includes: a bond wire contacting the contact pad and the die contact pad and extending between the contact pad and the die contact pad; a dielectric material surrounding the bond wire; and a ground material surrounding the dielectric material.
Need to check novelty before this filing date? Find Prior Art