Full-thickness skin organoids and methods of making the same

By using gradient collagen scaffolds and oxygen tension modulation technology, combined with basement membrane interface reconstruction, a full-thickness skin organoid consisting of epidermis, dermis, and subcutaneous tissue was constructed. This solved the problem of the lack of a complete three-layer structure and gradient simulation in existing technologies, and achieved efficient physiological function simulation and applicability for transdermal drug testing.

CN122097698APending Publication Date: 2026-05-29SHENYANG ZEER TESTING SERVICE CO LTD
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
SHENYANG ZEER TESTING SERVICE CO LTD
Filing Date
2026-03-06
Publication Date
2026-05-29

AI Technical Summary

Technical Problem

Existing technologies lack planar full-thickness skin organoid models that include the complete three-layer structure of epidermis, dermis, and subcutaneous tissue. They also lack in vitro construction strategies that simulate the stiffness gradient and oxygen tension gradient in natural skin, and lack active reconstruction technology for the basement membrane structure at the dermal-epidermal junction. This results in insufficient adhesion and signal transduction functions between the epidermis and dermis.

Method used

Using gradient collagen scaffolds, gradient oxygen tension regulation, and basement membrane interface reconstruction techniques, we constructed a full-thickness skin organoid comprising the subcutaneous tissue layer, dermis, and epidermis. The basement membrane interface was reconstructed using type I and type IV collagen scaffolds and laminin-511. Combined with cell culture under different oxygen tension conditions, we formed a bottom-up stiffness gradient and oxygen concentration gradient.

Benefits of technology

It achieves histological morphology and physiological function close to natural skin, and provides a planar skin model with a complete three-layer structure including epidermis, dermis and subcutaneous tissue. It has good barrier function and mechanical transition, and is suitable for standardized drug transdermal absorption testing.

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Abstract

The application discloses a full-layer skin organoid and a preparation method thereof, and belongs to the field of tissue engineering. The organoid comprises a subcutaneous tissue layer, a dermis layer, a basement membrane interface layer and an epidermis layer stacked from bottom to top. The preparation method comprises the following steps: mixing adipose-derived mesenchymal stem cells and type I collagen, gelating the mixture, and then constructing the subcutaneous tissue layer under a low-oxygen condition; coating fibroblasts and low-concentration collagen on the surface of the subcutaneous tissue layer to construct the dermis layer under a normal-oxygen condition; coating type IV collagen and laminin-511 to reconstruct the basement membrane interface; and inoculating keratinocytes to form the epidermis layer through gas-liquid interface culture. The method realizes the three-layer tissue structure and barrier function close to natural skin through gradient collagen scaffolds, gradient oxygen tension regulation and basement membrane interface reconstruction.
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