Height-adjustable circuit board repair device

Abstract

The application provides a height-adjustable circuit board repair device, which comprises a machine body, a smoke suction mechanism, a tin wire conveying mechanism, an electric soldering iron mechanism and a lifting conveying track mechanism. The machine body comprises an operation table and a mounting cover frame, and the mounting cover frame is arranged on the operation table. The smoke suction mechanism is arranged on one side of the operation table, the tin wire conveying mechanism is arranged on the mounting cover frame, and the electric soldering iron mechanism is arranged on the side of the operation table corresponding to the smoke suction mechanism. The lifting conveying track mechanism is arranged on the operation table and extends along the length direction of the operation table. The electric soldering iron mechanism can identify the distance to the surface of the circuit board, and the lifting conveying track mechanism can drive the circuit board to ascend or descend relative to the operation table according to the distance identified by the electric soldering iron mechanism. The application can assist the operator to adjust the distance between the circuit board and the electric soldering iron mechanism to a proper welding distance, and reduce the poor contact of electronic components caused by excessive tin melting.

Description

Technical Field

[0001] This invention relates to the field of circuit board manufacturing technology, and more specifically to an adjustable-height circuit board rework device. Background Technology

[0002] The working principle of the laser-guided rework device for circuit boards is mainly based on the high-precision positioning of lasers, combined with optical imaging and automatic control technology, to achieve rapid and accurate rework of defective points on circuit boards.

[0003] The "Online Laser-Guided Rework Equipment" disclosed in Chinese Invention Patent CN109590566B, according to its specification, involves a conveyor track mechanism that transports circuit boards. This mechanism consists of a front fixed track, a rear movable track, a width-adjusting lead screw, a width-adjusting lead screw seat, a width-adjusting guide rod, a linear bearing, a conveyor wheel, and a conveyor belt. A colored laser device is controlled by a Y-motion mechanism and an X-motion mechanism, enabling the colored laser to quickly locate faulty areas and allowing for accurate rework of the circuit board using a repair and soldering mechanism. During the rework process, a fumigation mechanism, consisting of a fumigation mounting block, a fumigation fan, an adjusting guide rod, and a guide rod fixing slide, is activated promptly to ensure that the air around the workbench is not contaminated by smoke and dust.

[0004] However, the aforementioned online laser-guided rework equipment has some shortcomings in actual use: In the existing technology, when reworking circuit boards, the faulty parts of the circuit board are soldered by the repair soldering mechanism. The repair soldering operation mainly involves the operator using a soldering iron to solder the solder wire to the faulty part of the circuit board. However, the experience of the soldering operators varies. When an inexperienced operator performs the operation, the soldering iron may work for too long and the solder wire may melt excessively. At this time, the excessively melted solder may touch or cover adjacent electronic components, which may cause poor contact of electronic components. In addition, the height of electronic components on the circuit board is uneven, and the operator has to repeatedly adjust the height of the soldering iron to find a suitable soldering point, which is very time-consuming and laborious. Therefore, there is a need for a circuit board rework equipment with adjustable height. Summary of the Invention

[0005] The present invention aims to solve at least one of the above-mentioned technical problems by providing an adjustable height circuit board rework device, which can assist operators in adjusting the distance between the circuit board and the soldering iron mechanism to a suitable soldering distance, and promptly avoid contact between the circuit board and the soldering iron and solder wire when excessive solder melt occurs, thereby reducing the situation of poor contact of electronic components caused by excessive solder melt.

[0006] To achieve the above objectives, the technical solution adopted by the present invention is as follows: An adjustable-height circuit board rework device includes a body, a fumigation mechanism, a solder wire conveying mechanism, a soldering iron mechanism, and a lifting and conveying rail mechanism. The body includes an operating table and a mounting bracket, with the mounting bracket mounted on the operating table. The fumigation mechanism is mounted on one side of the operating table and corresponds to the mounting bracket. The solder wire conveying mechanism is mounted on the mounting bracket, and the soldering iron mechanism is mounted on the side of the operating table corresponding to the fumigation mechanism. The lifting and conveying rail mechanism is mounted on the operating table and extends along the length of the operating table, and is used to convey circuit boards along the length of the operating table. The soldering iron mechanism can detect the distance to the surface of the circuit board, and the lifting and conveying rail mechanism can raise or lower the circuit board relative to the operating table according to the distance detected by the soldering iron mechanism.

[0007] Furthermore, the lifting and conveying track mechanism includes a lifting and conveying component and a driving component. One lifting and conveying component is provided on each of the opposite sides of the operating platform, and both extend along the length of the operating platform. The distance from the bottom surface of the lifting and conveying component to the top surface of the operating platform gradually decreases in the direction away from the circuit board. Both lifting and conveying components can rise or fall relative to the operating platform under force. The lifting and conveying components are used to convey the circuit board along the length of the operating platform. The driving component includes a pushing inclined block and a driving part. The side of the pushing inclined block abuts against the bottom surface of the lifting and conveying component. The driving part is connected to the pushing inclined block, and the driving part drives the pushing inclined block to move towards or away from the circuit board.

[0008] Furthermore, the driving component includes a guide component, which includes a connecting rod, a driving plate, and a guide roller. The connecting rod is movably disposed on the operating table and extends along the length direction of the operating table. The driving plate connects the lifting and conveying component and the connecting rod. The guide roller is movably sleeved on the connecting rod. The operating table has a guide rail along the height direction corresponding to the guide roller.

[0009] Furthermore, the lifting conveyor includes a top plate, a bottom inclined plate, a vertical plate, and a conveyor belt assembly. One side of the top plate and the bottom inclined plate are connected to the opposite sides of the vertical plate. The top plate, the bottom inclined plate, and the vertical plate all extend along the length of the operating table. The distance from the bottom surface of the bottom inclined plate to the top surface of the operating table gradually decreases along the direction away from the circuit board. The conveyor belt assembly is installed on the side of the vertical plate facing the other lifting conveyor, and the conveyor belt assembly is used to transport the circuit board along the length of the operating table.

[0010] Furthermore, the lifting and conveying track mechanism also includes a linkage rod, which connects the two lifting and conveying components.

[0011] Furthermore, the soldering iron mechanism includes a soldering iron, an image capture device, and a distance sensor. Both the image capture device and the distance sensor are connected to the soldering iron, and both the image capture device and the distance sensor correspond to the working head of the soldering iron.

[0012] Furthermore, it also includes a height adjustment control system, which includes: Point image library, which stores qualified welding sample images of pre-rework points; An image comparison module is connected to the image acquisition device and the point image library. The image comparison module is used to compare the image obtained by the image acquisition device with the qualified welding sample image in the point image library. The point distance library stores the solidification point of a qualified weld point and the qualified distance of the distance sensor. The distance comparison module is connected to both the point distance database and the distance sensor. The distance comparison module is used to compare the distance obtained by the distance sensor with the qualified distance in the point distance database. A composite processing module is connected to the image comparison module, the distance comparison module and the distance sensor. The composite processing module is used to perform composite processing on the data of the connected modules. A control module is connected to the lifting and conveying rail mechanism. The control module is used to control the lifting and conveying rail mechanism so that the lifting and conveying rail mechanism can drive the circuit board to rise or fall relative to the operating table. The host computer is connected to the composite processing module, the distance sensor, and the control module. After receiving data from the composite processing module and the distance sensor, the host computer generates control commands. The control module receives the control commands from the host computer and controls the corresponding components to complete the operation.

[0013] Furthermore, the height adjustment control system also includes a prompter connected to the control module.

[0014] Furthermore, the height adjustment method of the adjustable-height circuit board rework equipment includes the following steps: S1 The control module controls the lifting and conveying track mechanism to drive the circuit board to rise or fall relative to the operating table. The distance sensor senses the distance of the circuit board in real time and feeds it back to the composite processing module. S2 The composite processing module determines whether the sensing distance is the "optimal distance". When the "yes" data is obtained, the host computer generates a control command and the control module controls the prompter to emit the first prompt sound. S3.1 During the welding process, the image acquisition device acquires images of the soldering iron melting the solder wire in real time. The image comparison module compares the image acquired by the image acquisition device with the qualified welding sample images in the point image library. When the comparison result is determined to be "yes", the determination result is determined to be "pass" in the composite processing module. After the host computer obtains the "pass" result, it generates a control command and controls the lifting and conveying track mechanism to descend through the control module. S3.2 During the soldering process, the distance sensor acquires the distance from the circuit board surface to the distance sensor in real time after the soldering iron melts the solder wire. The distance comparison module compares the distance acquired by the distance sensor with the qualified distance in the point distance library. When the comparison result is determined to be "yes", the determination result is determined to be "pass" in the composite processing module. After the host computer obtains the "pass" result, it generates a control command and controls the lifting and conveying track mechanism to descend through the control module. S3.3 During the welding process, the image comparison module compares the image obtained by the image acquisition component with the qualified welding sample image in the point image library. When the comparison result is determined to be "greater than", the result is determined to be "too large" in the composite processing module. The distance comparison module compares the distance obtained by the distance sensor with the qualified distance in the point distance library. When the comparison result is determined to be "less than", the result is determined to be "too high" in the composite processing module. After obtaining the "too large" or "too high" result, the host computer generates a control command and controls the lifting and conveying track mechanism to accelerate its descent through the control module. After obtaining the "pass" result, the host computer in S4 generates a control command and controls the prompter to emit a second prompt tone through the control module. The second prompt tone prompts the operator to perform the welding operation at the next potential.

[0015] By adopting the above technical solution, the present invention has the following beneficial effects: When using the aforementioned adjustable-height circuit board rework equipment, NG circuit boards are conveyed by upstream equipment to the lifting conveyor rail mechanism and then to the operator's workstation. The lifting conveyor rail mechanism raises or lowers the circuit board relative to the worktable based on the distance identified by the soldering iron mechanism, thereby assisting the operator in adjusting the distance between the circuit board and the soldering iron mechanism to a suitable soldering distance. In the event of excessive solder melting, the contact between the circuit board and the soldering iron and solder wire is avoided in time, reducing the possibility of poor contact of electronic components caused by excessive solder melting. Attached Figure Description

[0016] Figure 1 This is a schematic diagram of an adjustable-height circuit board rework device.

[0017] Figure 2 A schematic diagram of the installation structure for the lifting and conveying track mechanism.

[0018] Figure 3 for Figure 1 A magnified view of point A in the image.

[0019] Figure 4 This is a layout diagram of the height adjustment control system.

[0020] Figure 5 This is a schematic diagram of an adjustable-height circuit board rework device in another embodiment.

[0021] In the attached diagram, 1-body, 11-operating table, 111-guide rail, 12-mounting cover, 2-smoking mechanism, 3-solder wire conveying mechanism, 4-soldering iron mechanism, 41-soldering iron, 42-image capturing device, 43-distance sensor, 44-extension rod, 45-mounting ring, 5-lifting conveyor rail mechanism, 51-lifting conveyor, 511-top plate, 512-bottom inclined plate, 513-vertical plate, 514-conveyor belt kit, 52-drive component, 521-pushing inclined block, 522-drive unit, 523-connecting rod, 524-driving plate, 525-guide roller, 53-linkage rod, 6-height adjustment control system, 61-point image library, 62-image comparison module, 63-point distance library, 64-distance comparison module, 65-composite processing module, 66-control module, 67-host computer, 68-prompt, 100-circuit board. Detailed Implementation

[0022] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0023] It should be noted that when a component is described as "fixed to" another component, it can be directly on the other component or it may be centered within another component. When a component is described as "set to" another component, it can be directly set on the other component or it may be centered within another component. The terms "vertical," "horizontal," "left," "right," and similar expressions used in this article are for illustrative purposes only.

[0024] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to limit the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0025] A preferred embodiment of the present invention provides an adjustable-height circuit board rework device, which is connected after wave soldering and automatic optical inspection equipment, enabling online rework of defective circuit boards 100. After wave soldering, the circuit board 100 is transported to the automatic optical inspection (AOI) equipment via its transport track, and then to the adjustable-height circuit board rework device via its transport track. The automatic optical inspection equipment and the adjustable-height circuit board rework device interface data. Circuit boards 100 that pass the inspection directly flow to the next process from the adjustable-height circuit board rework device, while circuit boards 100 that fail the inspection stop on the track of the adjustable-height circuit board rework device. With the assistance of the various mechanisms of the adjustable-height circuit board rework device, the operator performs rapid and accurate rework of the defective circuit boards 100.

[0026] like Figures 1 to 4 As shown, the height-adjustable circuit board rework equipment includes a body 1, a fumigation mechanism 2, a solder wire conveying mechanism 3, a soldering iron mechanism 4, and a lifting and conveying rail mechanism 5. The body 1 includes an operating table 11 and a mounting bracket 12, with the mounting bracket 12 mounted on the operating table 11. The smoking mechanism 2 is installed on one side of the operating table 11 and corresponds to the mounting bracket 12. The solder wire conveying mechanism 3 is installed on the mounting bracket 12. The soldering iron mechanism 4 is installed on the side of the operating table 11 corresponding to the smoking mechanism 2. Specifically, the body 1, the smoking mechanism 2, the solder wire conveying mechanism 3, and the soldering iron mechanism 4 can all refer to the corresponding components in the "Online Laser Guided Repair Equipment" disclosed in Chinese Invention Patent No. CN109590566B. For example, the structure of the operating table 11 can refer to the structure of the base mechanism, the structure of the mounting bracket 12 can refer to the structure and installation method of components including the support frame, display mechanism, Y-motion mechanism, X-motion mechanism, colored laser device, and outer cover mechanism, the structure of the solder wire conveying mechanism 3 can refer to the installation method of the repair solder wire suspension bracket, repair solder wire and constant temperature table, and the smoking mechanism 2 can refer to the installation method of the smoking mechanism in the invention. It should be emphasized that no improvements have been made to the aforementioned mechanisms in this application. Those skilled in the art can improve the corresponding mechanism layout by referring to the disclosed solutions.

[0027] The lifting and conveying track mechanism 5 is installed on the operating table 11 and extends along the length of the operating table 11. The lifting and conveying track mechanism 5 is used to convey the circuit board 100 along the length of the operating table 11. The soldering iron mechanism 4 can identify the distance to the surface of the circuit board 100, and the lifting and conveying track mechanism 5 can drive the circuit board 100 to rise or fall relative to the operating table 11 according to the distance identified by the soldering iron mechanism 4.

[0028] In this embodiment, the lifting and conveying track mechanism 5 includes a lifting and conveying component 51 and a driving component 52. A lifting and conveying component 51 is provided on each of the opposite sides of the operating table 11, and both extend along the length direction of the operating table 11. The distance from the bottom surface of the lifting and conveying component 51 to the top surface of the operating table 11 gradually decreases along the direction away from the circuit board 100. Both lifting and conveying components 51 can rise or fall relative to the operating table 11 under force. The lifting and conveying component 51 is used to convey the circuit board 100 along the length direction of the operating table 11. Specifically, the lifting conveyor 51 includes a top plate 511, a bottom inclined plate 512, a vertical plate 513, and a conveyor belt assembly 514. One side of the top plate 511 and the bottom inclined plate 512 are connected to the opposite sides of the vertical plate 513. The top plate 511, the bottom inclined plate 512, and the vertical plate 513 all extend along the length of the operating table 11 to form an area for installing the conveyor belt assembly 514. The distance from the bottom surface of the bottom inclined plate 512 to the top surface of the operating table 11 gradually decreases in the direction away from the circuit board 100. The conveyor belt assembly 514 is installed on the side of the vertical plate 513 facing the other lifting conveyor 51. The conveyor belt assembly 514 is used to transport the circuit board 100 along the length of the operating table 11.

[0029] There are two drive units 52, each connected to a lifting conveyor 51. Each drive unit 52 includes a pushing ramp 521 and a drive section 522. The side of the pushing ramp 521 abuts against the bottom surface of the bottom ramp 512 and forms an inclined plane. The drive section 522 is connected to the pushing ramp 521 and employs a cylinder with a speed control valve, specifically two cylinders connected to opposite ends of the pushing ramp 521. The four cylinders of the two drive sections 522 simultaneously drive the corresponding pushing ramp 521 to move towards or away from the circuit board 100.

[0030] When the drive unit 522 drives the pusher block 521 to move closer to the circuit board 100, the pusher block 521 continuously presses against the bottom inclined plate 512. The bottom inclined plate 512, under the thrust, rises relative to the operating table 11, causing the circuit board 100 on the conveyor belt assembly 514 to rise relative to the operating table 11. When the drive unit 522 drives the pusher block 521 to move away from the circuit board 100, the pusher block 521 no longer presses against the bottom inclined plate 512, and the lifting conveyor 51 descends relative to the operating table 11 under its own weight, causing the circuit board 100 on the conveyor belt assembly 514 to descend relative to the operating table 11. By using the pusher block 521 to push the bottom inclined plate 512, the rising or falling of the circuit board 100 relative to the operating table 11 is achieved, making the movement of the circuit board 100 more stable and reducing the possibility of unsolidified solder splattering during movement due to instantaneous displacement.

[0031] In this embodiment, the driving component 52 includes two guide components, one of which is connected to a lifting and conveying component 51. Each guide component includes a connecting rod 523, a driving plate 524, and guide rollers 525. The connecting rod 523 is movably mounted on the operating table 11 and extends along the length of the operating table 11. Specifically, the operating table 11 has a through slot extending through both ends along its length, and the connecting rod 523 is movably disposed in the through slot. The driving plate 524 connects the lifting and conveying component 51 and the connecting rod 523. Specifically, the opposite ends of the driving plate 524 are fixedly connected to a vertical plate 513 and the connecting rod 523. The guide rollers 525 are movably sleeved on the connecting rod 523. Specifically, there are several guide rollers 525, all of which are movably sleeved on the connecting rod 523 and spaced apart along the length of the connecting rod 523. The operating table 11 has a guide rail 111 along the height direction corresponding to the guide roller 525, and the guide roller 525 is movably limited in the guide rail 111. When the lifting conveyor 51 rises or falls relative to the operating table 11, the guide roller 525 rolls up or down in the guide rail 111 under the drive of the connecting rod 523 and the driving plate 524, which can maintain the linearity and stability of the vertical movement of the circuit board 100.

[0032] In this embodiment, the soldering iron mechanism 4 includes a soldering iron 41, an image capture device 42, and a distance sensor 43. Both the image capture device 42 and the distance sensor 43 are connected to the soldering iron 41, and both correspond to the working head of the soldering iron 41. Specifically, an extension rod 44 is fixedly connected to the end of the soldering iron 41 via a collar. A mounting ring 45 is welded to the end of the extension rod 44 away from the soldering iron 41. The image capture device 42 is a portable electron microscope as in the prior art, mounted on the mounting ring 45 with its lens corresponding to the working head of the soldering iron 41. The distance sensor 43 is mounted on the mounting ring 45 with its sensing head corresponding to the working head of the soldering iron 41. The distance sensor 43 can detect the distance to the surface of the circuit board 100.

[0033] In this embodiment, a height adjustment control system 6 is also included, which includes: Point image library 61 stores qualified welding sample images of pre-rework points. The qualified welding sample images are obtained from the image acquisition of the circuit board that has passed inspection. Image comparison module 62 is connected to image acquisition device 42 and point image library 61. Image comparison module 62 is used to compare the image obtained by image acquisition device 42 with the qualified welding sample image in point image library 61. Specifically, when the diameter of the solder point in the image obtained by image acquisition device 42 is greater than the diameter of the qualified welding sample image, there is excessive solder melting, and the comparison result is judged as "greater than". When the diameter of the solder point in the image obtained by image acquisition device 42 is less than or equal to the diameter of the qualified welding sample image, the amount of solder melting is appropriate, and the comparison result is judged as "yes". Point distance library 63 stores the distance between the solidification point of a qualified weld point and the qualified distance of the distance sensor 43. Specifically, the qualified distance L is the distance between the highest point of the solidification point of the qualified weld point sensed by the distance sensor. The distance comparison module 64 is connected to both the point distance library 63 and the distance sensor 43. The distance comparison module 64 is used to compare the distance obtained by the distance sensor 43 with the qualified distance in the point distance library 63. Specifically, X is the real-time distance from the surface of the circuit board 100 to the distance sensor. As the solder wire melts, X gradually decreases. When X < L, the solidification point is too high, and there is excessive solder melting. The comparison result is judged as "less than". When X ≥ L, the amount of solder wire melted is appropriate. The comparison result is judged as "yes". The composite processing module 65 is connected to the image comparison module 62, the distance comparison module 64 and the distance sensor 43. The composite processing module 65 is used to perform composite processing on the data of the connected modules. The control module 66 is connected to the drive unit 522 of the lifting and conveying track mechanism 5. The control module 66 is used to control the drive unit 522 so that the lifting and conveying track mechanism 5 can drive the circuit board 100 to rise or fall relative to the operating table 11. The host computer 67 is connected to the composite processing module 65, the distance sensor 43, and the control module 66. After receiving data from the composite processing module 65 and the distance sensor 43, the host computer 67 generates control commands. The control module 66 is used to receive control commands from the host computer 67 and control the corresponding components to complete the operation.

[0034] In this embodiment, the height adjustment control system 6 further includes a prompter 68, which is connected to the control module 66. The prompter 68 is used to emit a prompting sound to remind the operator to perform the operation.

[0035] In this embodiment, the height adjustment method of the height-adjustable circuit board rework equipment includes the following steps: S1 control module 66 controls drive unit 522 to drive circuit board 100 to rise or fall relative to operating table 11, distance sensor 43 senses distance X of circuit board 100 in real time and feeds it back to composite processing module 65. The S2 composite processing module 65 determines whether the sensing distance is the "optimal distance". Specifically, the "optimal distance" is the distance sensed by the distance sensor 43 when the soldering iron 41 contacts the surface of the circuit board 100 with the solder wire. When the "yes" data is obtained, the host computer 67 generates a control command and the control module 66 controls the prompter 68 to emit a first prompt tone. The first prompt tone prompts the operator to perform the operation of melting the solder wire. S3.1 During the welding process, the image acquisition unit 42 acquires images of the soldering iron 41 after melting the solder wire in real time. The image comparison module 62 compares the image acquired by the image acquisition unit 42 with the qualified welding sample in the point image library 61. When the comparison result is determined to be "yes", the result is determined to be "pass" in the composite processing module 65. After the host computer 67 obtains the "pass" result, it generates a control descent command and controls the lifting and conveying track mechanism 5 to descend through the control module 66. Specifically, the control drive unit 522 drives the inclined block 521 to move away from the circuit board 100. S3.2 During the soldering process, the distance sensor 43 acquires the distance from the surface of the circuit board 100 to the distance sensor 43 in real time after the soldering iron 41 melts the solder wire. The distance comparison module 64 compares the distance acquired by the distance sensor 43 with the qualified distance in the point distance library 63. When the comparison result is determined to be "yes", the result is determined to be "pass" in the composite processing module 65. After the host computer 67 obtains the "pass" result, it generates a control descent command and controls the lifting and conveying track mechanism 5 to descend through the control module 66. Specifically, the control drive unit 522 drives the inclined block 521 to move away from the circuit board 100. During the welding process (S3.3), the image comparison module 62 compares the image obtained by the image acquisition device 42 with the qualified welding sample in the point image library 61. When the comparison result is determined to be "greater than", the result is determined to be "too large" in the composite processing module 65. The distance comparison module 64 compares the distance obtained by the distance sensor 43 with the qualified distance in the point distance library 63. When the comparison result is determined to be "less than", the result is determined to be "too high" in the composite processing module 65. After obtaining the results of "too large" or "too high", or "too large" plus "too high", the host computer 67 generates a control command for rapid descent and controls the lifting and conveying track mechanism 5 to accelerate descent through the control module 66. Specifically, the control drive unit 522 drives the inclined block 521 to move rapidly away from the circuit board 100.

[0036] After the host computer 67 obtains the "pass" result, it generates a control command and controls the prompter 68 to emit a second prompt tone through the control module 66. The second prompt tone prompts the operator to perform the welding operation at the next point.

[0037] In summary, the adjustable-height circuit board rework equipment and corresponding method described in this embodiment can achieve the following technical effects: The lifting and conveying track mechanism 5 moves the circuit board up or down relative to the operating table 11 according to the distance identified by the soldering iron mechanism 4, thereby assisting the operator in adjusting the distance between the circuit board 100 and the soldering iron mechanism 4 to a suitable soldering distance. In the event of excessive solder melting, it promptly avoids contact between the circuit board and the soldering iron and solder wire, reducing the possibility of poor contact of electronic components caused by excessive solder melting.

[0038] It is understood that the number of drive components 52 is not limited to two in this embodiment; in other embodiments, see [link to other embodiments]. Figure 5The system comprises one driving member 52, whose pushing block 521 abuts against the bottom inclined plate 512 of one of the lifting conveyor members 51. The lifting conveyor track mechanism 5 also includes a linkage rod 53, which connects two lifting conveyor members 51 via a drive plate 524. When the driving unit 522 drives the pushing block 521 to move away from or towards the circuit board 100, the corresponding lifting conveyor member 51 rises or falls relative to the operating table 11, and the linkage rod 53 drives the other lifting conveyor member 51 to rise or fall synchronously relative to the operating table 11. In this embodiment, the number of cylinders is relatively reduced, which can reduce the control time error of the control circuit board 100 rising or falling.

[0039] The above description is a detailed description of the preferred embodiments of the present invention. However, the embodiments are not intended to limit the scope of the patent application of the present invention. All equivalent changes or modifications made under the technical spirit of the present invention should fall within the patent scope covered by the present invention.

Claims

1. A height-adjustable circuit board rework device, comprising a body (1), a fumigation mechanism (2), a solder wire conveying mechanism (3), and a soldering iron mechanism (4), wherein the body (1) includes an operating table (11) and a mounting bracket (12), the mounting bracket (12) being mounted on the operating table (11); the fumigation mechanism (2) being mounted on one side of the operating table (11) and corresponding to the mounting bracket (12), the solder wire conveying mechanism (3) being mounted on the mounting bracket (12), and the soldering iron mechanism (4) being mounted on the side of the operating table (11) corresponding to the fumigation mechanism (2), characterized in that: The system includes a lifting and conveying track mechanism (5), which is mounted on the operating table (11) and extends along the length of the operating table (11). The lifting and conveying track mechanism (5) is used to convey the circuit board (100) along the length of the operating table (11). The soldering iron mechanism (4) can identify the distance to the surface of the circuit board (100), and the lifting and conveying track mechanism (5) can drive the circuit board (100) to rise or fall relative to the operating table (11) according to the distance identified by the soldering iron mechanism (4).

2. The adjustable height circuit board rework equipment as described in claim 1, characterized in that: The lifting and conveying track mechanism (5) includes a lifting and conveying component (51) and a driving component (52). One lifting and conveying component (51) is provided on each of the opposite sides of the operating platform (11), and both extend along the length of the operating platform (11). The distance from the bottom surface of the lifting and conveying component (51) to the top surface of the operating platform (11) gradually decreases along the direction away from the circuit board (100). Both lifting and conveying components (51) can rise or fall relative to the operating platform (11) under force. The lifting conveyor (51) is used to convey the circuit board (100) along the length of the operating table (11); the driving member (52) includes a pushing wedge (521) and a driving part (522). The side of the pushing wedge (521) abuts against the bottom surface of the lifting conveyor (51). The driving part (522) is connected to the pushing wedge (521). The driving part (522) drives the pushing wedge (521) to move toward or away from the circuit board (100).

3. The adjustable height circuit board rework equipment as described in claim 2, characterized in that: The driving component (52) includes a guide component, which includes a connecting rod (523), a driving plate (524), and a guide roller (525). The connecting rod (523) is movably mounted on the operating table (11) and extends along the length of the operating table (11). The driving plate (524) connects the lifting conveyor (51) and the connecting rod (523). The guide roller (525) is movably mounted on the connecting rod (523). The operating table (11) has a guide rail (111) corresponding to the guide roller (525) along the height direction.

4. The adjustable height circuit board rework equipment as described in claim 2, characterized in that: The lifting conveyor (51) includes a top plate (511), a bottom inclined plate (512), a vertical plate (513), and a conveyor belt assembly (514). One side of the top plate (511) and the bottom inclined plate (512) are connected to the opposite sides of the vertical plate (513). The top plate (511), the bottom inclined plate (512), and the vertical plate (513) all extend along the length direction of the operating table (11). The distance from the bottom surface of the bottom inclined plate (512) to the top surface of the operating table (11) gradually decreases along the direction away from the circuit board (100). The conveyor belt assembly (514) is installed on the side of the vertical plate (513) facing the other lifting conveyor (51). The conveyor belt assembly (514) is used to convey the circuit board (100) along the length direction of the operating table (11).

5. The adjustable height circuit board rework equipment as described in claim 2, characterized in that: The lifting and conveying track mechanism (5) also includes a linkage rod (53), which connects the two lifting and conveying components (51).

6. The adjustable height circuit board rework equipment as described in claim 1, characterized in that: The soldering iron mechanism (4) includes a soldering iron (41), an image capture device (42), and a distance sensor (43). The image capture device (42) and the distance sensor (43) are both connected to the soldering iron (41), and the image capture device (42) and the distance sensor (43) are both corresponding to the working head of the soldering iron (41).

7. The adjustable-height circuit board rework equipment as described in claim 6, characterized in that, It also includes a height adjustment control system (6), which includes: Point image library (61), which stores qualified welding sample images of pre-rework points; Image comparison module (62), which is connected to the image acquisition device (42) and the point image library (61), is used to compare the image obtained by the image acquisition device (42) with the qualified welding sample in the point image library (61); Point distance library (63), which stores the solidification point of a qualified welding point and the qualified distance between the distance sensor (43); The distance comparison module (64) is connected to both the point distance database (63) and the distance sensor (43). The distance comparison module (64) is used to compare the distance obtained by the distance sensor (43) with the qualified distance in the point distance database (63). The composite processing module (65) is connected to the image comparison module (62), the distance comparison module (64) and the distance sensor (43). The composite processing module (65) is used to perform composite processing on the data of the connected modules. The control module (66) is connected to the lifting and conveying track mechanism (5). The control module (66) is used to control the lifting and conveying track mechanism (5) so that the lifting and conveying track mechanism (5) can drive the circuit board (100) to rise or fall relative to the operating table (11). The host computer (67) is connected to the composite processing module (65), the distance sensor (43), and the control module (66). After receiving data from the composite processing module (65) and the distance sensor (43), the host computer (67) generates control commands. The control module (66) is used to receive control commands from the host computer (67) and control the corresponding components to complete the operation.

8. The adjustable height circuit board rework equipment as described in claim 7, characterized in that: The height adjustment control system (6) also includes a prompter (68) which is connected to the control module (66).

9. The adjustable height circuit board rework equipment as described in claim 8, characterized in that, The height adjustment method of the adjustable-height circuit board rework equipment includes the following steps: S1 The control module (66) controls the lifting and conveying track mechanism (5) to drive the circuit board (100) to rise or fall relative to the operating table (11). The distance sensor (43) senses the distance of the circuit board (100) in real time and feeds it back to the composite processing module (65). The composite processing module (65) of S2 determines whether the sensing distance is the "optimal distance". When the "yes" data is obtained, the host computer (67) generates a control command and controls the prompter (68) to emit a first prompt sound through the control module (66). S3.1 During the welding process, the image acquisition device (42) acquires the image of the soldering iron (41) melting the solder wire in real time. The image comparison module (62) compares the image obtained by the image acquisition device (42) with the qualified welding sample in the point image library (61). When the comparison result is determined to be "yes", the determination result is determined to be "pass" in the composite processing module (65). After the host computer (67) obtains the "pass" result, it generates a control command and controls the lifting and conveying track mechanism (5) to descend through the control module (66). S3.2 During the welding process, the distance sensor (43) acquires the distance from the circuit board (100) surface to the distance sensor (43) in real time after the soldering iron (41) melts the solder wire. The distance comparison module (64) compares the distance acquired by the distance sensor (43) with the qualified distance in the point distance library (63). When the comparison result is determined to be "yes", the determination result is determined to be "pass" in the composite processing module (65). After the host computer (67) obtains the "pass" result, it generates a control command and controls the lifting conveyor track mechanism (5) to descend through the control module (66). S3.3 During the welding process, the image comparison module (62) compares the image obtained by the image acquisition device (42) with the qualified welding sample in the point image library (61). When the comparison result is determined to be "greater than", the result is determined to be "too large" in the composite processing module (65). The distance comparison module (64) compares the distance obtained by the distance sensor (43) with the qualified distance in the point distance library (63). When the comparison result is determined to be "less than", the result is determined to be "too high" in the composite processing module (65). After obtaining the result of "too large" or "too high", the host computer (67) generates a control command and controls the lifting and conveying track mechanism (5) to accelerate its descent through the control module (66). After obtaining the "pass" result, the host computer (67) in S4 generates a control command and controls the prompter (68) to emit a second prompt tone through the control module (66). The second prompt tone prompts the operator to perform the welding operation at the next potential.

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